80-M3072PA300SC-K836F30 target datasheet MiniSkiiP® DUAL 3 650 V / 300 A Features ● ● ● ● MiniSkiiP® 3 Dual housing Half bridge topology Trench IGBT and CAL diode chip technology Integrated NTC sensor Solderless spring contact mounting system Schematic Target applications ● ● ● ● Industrial Drives Power Supply Solar UPS Types ● 80-M3072PA300SC-K836F30 Maximum Ratings Tj = 25 °C, unless otherwise specified Parameter Symbol Condition Value Unit 650 V 237 A 900 A 380 W Half Bridge Switch Collector-emitter voltage Collector current V CES IC T j = T jmax T s =80 °C Repetitive peak collector current I CRM t p limited by T jmax Total power dissipation P tot T j = T jmax Gate-emitter voltage V GES Short circuit ratings Maximum Junction Temperature Copyright Vincotech T s =80 °C ±20 V t SC Tj ≤ 150 °C 6 µs V CC VGE = 15 V 360 V 175 °C T jmax 1 18 Apr. 2016 / Revision1. 80-M3072PA300SC-K836F30 target datasheet Maximum Ratings Tj = 25 °C, unless otherwise specified Parameter Symbol Condition Value Unit 650 V T s = 80 °C 274 A Half Bridge FWD Peak repetitive reverse voltage Continuous (direct) forward current V RRM IF T j = T jmax Surge (non-repetitive) forward current I FSM 50 Hz, tp = 10 ms T j = 150 °C 2200 A Total power dissipation P tot T j = T jmax T s = 80 °C 339 W Maximum junction temperature T jmax 175 °C Storage temperature T stg -40…+125 °C Operation temperature under switching condition T jop -40…(T jmax - 25) °C 4000 V Creepage distance min. 12,7 mm Clearance min. 12,7 mm Module Properties Thermal Properties Isolation Properties Isolation voltage Comparative Tracking Index Copyright Vincotech V isol DC Test Voltage CTI tp = 2 s > 200 2 18 Apr. 2016 / Revision1. 80-M3072PA300SC-K836F30 target datasheet Characteristic Values Parameter Symbol Conditions VCE [V] VGE [V] VDS [V] VGS [V] VF [V] Value IC [A] ID [A] IF [A] Tj [°C] Unit Min Typ Max 5,1 5,8 6,4 25 1,45 1,9 150 1,70 Half Bridge Switch Static Gate-emitter threshold voltage V GE(th) Collec tor-emitter saturation voltage V CEsat V GE=V CE 0,0048 15 300 25 V V Collec tor-emitter c ut-off current I CES 0 650 25 15,2 µA Gate-emitter leakage c urrent I GES 20 0 25 1200 nA Internal gate resistance Input capacitance 1 rg 18480 C ies f=1 MHz Reverse transfer capac itance Ω 0 25 25 pF 548 C res Thermal Thermal resistance junc tion to sink R th(j-s) Thermal grease thickness ≤ 50 µm λ = 1 W /mK 0,25 K/W Half Bridge FWD Static Forward voltage VF Reverse leakage c urrent IR 218 650 25 1,30 150 1,24 25 1,62 240 150 68000 V µA Thermal Thermal resistance junc tion to sink R th(j-s) Thermal grease thickness ≤ 50 µm λ = 1 W /mK 0,28 K/W 5 kΩ Thermistor Rated resistance R Deviation of R 100 ΔR/R Power dissipation P 25 R 100 = 493 Ω 100 Power dissipation constant -5 +5 % 25 245 mW 25 1,4 mW/K B-value B(25/50) Tol. ±2% 25 3375 K B-value B(25/100) Tol. ±2% 25 3437 K Vincotech NTC Reference Copyright Vincotech K 3 18 Apr. 2016 / Revision1. 80-M3072PA300SC-K836F30 target datasheet Ordering Code & Marking Version with std lid and without thermal paste (black V35990-K32-T-*-PM) NN-NNNNNNNNNNNNNN TTTTTTTVV WWYY VIN LLLLL SSSS Text Datamatrix Ordering Code 80-M3072PA300SC-K836F30-/0A/ Name Type&Ver Date code VIN&Lot Serial NN-NNNNNNNNNNNNNN TTTTTTTVV WWYY Vin LLLLL SSSS Type&Ver Lot number Serial Date code TTTTTTTVV LLLLL SSSS WWYY Outline Copyright Vincotech 4 18 Apr. 2016 / Revision1. 80-M3072PA300SC-K836F30 target datasheet Pinout Identification ID Component Voltage Current Function T11, T12 IGBT 650 V 300 A Half Brdige Switch D11, D12 Diode 650 V 300 A Half Brdidge FWD Rt Thermistor Copyright Vincotech Comment Thermistor 5 18 Apr. 2016 / Revision1. 80-M3072PA300SC-K836F30 target datasheet Packaging instruction Standard pac kaging quantity (SPQ) 48 >SPQ Standard <SPQ Sample Handling instruction Handling instructions for MiniSkiiP® 3 packages see vinc otec h.com website. Package data Package data for MiniSkiiP® 3 Dual packages see vinc otech.com website. UL recognition and file number This device is certified according to UL 1557 standard, UL file number E192116. For more information see vincotec h.com website. Document No.: Date: 80-M3072PA300SC-K836F30-T1-14 18 Apr. 2016 Modification: Pages DISCLAIMER The information, specifications, procedures, methods and recommendations herein (together “information”) are presented by Vincotech to reader in good faith, are believed to be accurate and reliable, but may well be incomplete and/or not applicable to all conditions or situations that may exist or occur. Vincotech reserves the right to make any changes without further notice to any products to improve reliability, function or design. No representation, guarantee or warranty is made to reader as to the accuracy, reliability or completeness of said information or that the application or use of any of the same will avoid hazards, accidents, losses, damages or injury of any kind to persons or property or that the same will not infringe third parties rights or give desired results. It is reader’s sole responsibility to test and determine the suitability of the information and the product for reader’s intended use. LIFE SUPPORT POLICY Vincotech products are not authorised for use as critical components in life support devices or systems without the express written approval of Vincotech. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in labelling can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Copyright Vincotech 6 18 Apr. 2016 / Revision1.