VS-ST180SPbF Series Datasheet

VS-ST180SPbF Series
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Vishay Semiconductors
Phase Control Thyristors
(Stud Version), 200 A
FEATURES
• Center amplifying gate
• International standard case TO-209AB (TO-93)
• Hermetic metal case with ceramic insulator 
(Also available with glass-metal seal up to
1200 V)
• Compression bonded encapsulation for heavy duty
operations such as severe thermal cycling
TO-209AB (TO-93)
• Designed and qualified for industrial level
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
PRODUCT SUMMARY
TYPICAL APPLICATIONS
IT(AV)
200 A
VDRM/VRRM
400 V, 800 V, 1200 V, 1600 V, 2000 V
VTM
1.75 V
IGT
150 mA
TJ
-40 °C to 125 °C
Package
TO-209AB (TO-93)
Diode variation
Single SCR
• DC motor controls
• Controlled DC power supplies
• AC controllers


MAJOR RATINGS AND CHARACTERISTICS
PARAMETER
TEST CONDITIONS
IT(AV)
TC
IT(RMS)
ITSM
I2t
A
85
°C
314
A
5000
60 Hz
5230
50 Hz
125
60 Hz
114
Typical
TJ
UNITS
200
50 Hz
VDRM/VRRM
tq
VALUES
A
kA2s
400 to 2000
V
100
μs
-40 to 125
°C
IDRM/IRRM MAXIMUM
AT TJ = TJ MAXIMUM
mA
ELECTRICAL SPECIFICATIONS
VOLTAGE RATINGS
TYPE
NUMBER
VS-ST180S
VOLTAGE
CODE
VDRM/VRRM, MAXIMUM REPETITIVE PEAK
AND OFF-STATE VOLTAGE
V
VRSM, MAXIMUM
NON-REPETITIVE PEAK VOLTAGE
V
04
400
500
08
800
900
12
1200
1300
16
1600
1700
20
2000
2100
30
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Document Number: 94397
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VS-ST180SPbF Series
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ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
Maximum average on-state current
at case temperature
Maximum RMS on-state current
Maximum peak, one-cycle
non-repetitive surge current
IT(AV)
IT(RMS)
ITSM
TEST CONDITIONS
180° conduction, half sine wave
314
No voltage
reapplied
100 % VRRM 
reapplied
4200
t = 10 ms
t = 8.3 ms
t = 10 ms
t = 8.3 ms
Maximum
I2t
for fusing
I2t
°C
5000
t = 10 ms
I2t
A
85
t = 10 ms
t = 8.3 ms
No voltage
reapplied
5230
Sinusoidal half wave,
initial TJ = TJ maximum
100 % VRRM 
reapplied
125
114
88
t = 0.1 to 10 ms, no voltage reapplied
1250
(16.7 % x  x IT(AV) < I <  x IT(AV)), TJ = TJ maximum
1.08
High level value of threshold voltage
VT(TO)2
(I >  x IT(AV)), TJ = TJ maximum
1.14
Low level value of on-state slope resistance
rt1
(16.7 % x  x IT(AV) < I <  x IT(AV)), TJ = TJ maximum
1.18
High level value of on-state slope resistance
rt2
(I >  x IT(AV)), TJ = TJ maximum
1.14
Ipk = 570 A, TJ = 125 °C, tp = 10 ms sine pulse
1.75
VTM
IH
Maximum (typical) latching current
IL
TJ = TJ maximum, anode supply 12 V resistive load
kA2s
81
VT(TO)1
Maximum on-state voltage
A
4400
Low level value of threshold voltage
Maximum holding current
UNITS
200
DC at 76 °C case temperature
t = 8.3 ms
Maximum I2t for fusing
VALUES
600
1000 (300)
kA2s
V
m
V
mA
SWITCHING
PARAMETER
Maximum non-repetitive rate of rise
of turned-on current
SYMBOL
dI/dt
TEST CONDITIONS
Gate drive 20 V, 20 , tr  1 μs
TJ = TJ maximum, anode voltage  80 % VDRM
VALUES
UNITS
1000
A/μs
Typical delay time
td
Gate current 1 A, dIg/dt = 1 A/μs
Vd = 0.67 % VDRM, TJ = 25 °C
1.0
Typical turn-off time
tq
ITM = 300 A, TJ = TJ maximum, dI/dt = 20 A/μs, 
VR = 50 V, dV/dt = 20 V/μs, gate 0 V 100 , tp = 500 μs
100
SYMBOL
TEST CONDITIONS
VALUES
UNITS
μs
BLOCKING
PARAMETER
Maximum critical rate of rise
of off-state voltage
dV/dt
TJ = TJ maximum linear to 80 % rated VDRM
500
V/μs
Maximum peak reverse and 
off-state leakage current
IRRM,
IDRM
TJ = TJ maximum, rated VDRM/VRRM applied
30
mA
Revision: 11-Mar-14
Document Number: 94397
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VS-ST180SPbF Series
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Vishay Semiconductors
TRIGGERING
PARAMETER
Maximum peak gate power
Maximum average gate power
SYMBOL
PGM
PG(AV)
Maximum peak positive gate current
IGM
Maximum peak positive gate voltage
+ VGM
Maximum peak negative gate voltage
- VGM
VALUES
TEST CONDITIONS
TYP.
TJ = TJ maximum, tp  5 ms
10
TJ = TJ maximum, f = 50 Hz, d% = 50
2.0
TJ = TJ maximum, tp  5 ms
3.0
IGT
TJ = 25 °C
TJ = - 40 °C
DC gate voltage required to trigger
VGT
DC gate current not to trigger
IGD
DC gate voltage not to trigger
VGD
TJ = 25 °C
TJ = 125 °C
V
180
-
90
150
40
-
2.9
-
1.8
3.0
1.2
TJ = TJ maximum
A
5.0
Maximum required gate trigger/
current/voltage are the lowest
value which will trigger all units
12 V anode to cathode applied
TJ = 125 °C
Maximum gate current/voltage
not to trigger is the maximum
value which will not trigger any
unit with rated VDRM anode to
cathode applied
UNITS
W
20
TJ = TJ maximum, tp  5 ms
TJ = - 40 °C
DC gate current required to trigger
MAX.
mA
V
10
mA
0.25
V
VALUES
UNITS
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
Maximum operating junction
temperature range
SYMBOL
TEST CONDITIONS
TJ
-40 to 125
Maximum storage temperature range
TStg
-40 to 150
Maximum thermal resistance,
junction to case
RthJC
Maximum thermal resistance,
case to heatsink
RthC-hs
DC operation
0.105
Mounting surface, smooth, flat and greased
0.04
Non-lubricated threads
31
(275)
Lubricated threads
24.5
(210)
°C
K/W
Mounting torque, ± 10 %
Approximate weight
280
Case style
See dimensions - link at the end of datasheeet
N·m
(lbf in)
g
TO-209AB (TO-93)
RthJC CONDUCTION
CONDUCTION ANGLE
SINUSOIDAL
CONDUCTION
RECTANGULAR
CONDUCTION
180°
0.015
0.012
120°
0.019
0.020
90°
0.025
0.027
60°
0.036
0.037
30°
0.060
0.060
TEST CONDITIONS
UNITS
TJ = TJ maximum
K/W
Note
• The table above shows the increment of thermal resistance RthJC when devices operate at different conduction angles than DC
Revision: 11-Mar-14
Document Number: 94397
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-ST180SPbF Series
Vishay Semiconductors
Maximum Allowable Case Temperature (°C)
Maximum Allowable Case Temperature (°C)
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130
ST180S Series
RthJC (DC) = 0.105 K/ W
120
110
Conduc tion Angle
100
30°
60°
90°
120°
90
180°
80
0
40
80
120
160
200
240
130
ST180S Series
R thJC (DC) = 0.105 K/ W
120
110
Conduc tion Period
100
90
30°
80
120°
180°
DC
70
0
50
100
150
200
250
300
350
Average On-state Current (A)
Average On-state Current (A)
Fig. 1 - Current Ratings Characteristics
Fig. 2 - Current Ratings Characteristics
350
08
0.
W
K/
K/
W
K/
W
ta
el
-D
RMSLimit
0.4
K/
W
150
Conduc tion Angle
0.5
K/ W
0.8
K/ W
1.2 K
/W
100
ST180SSeries
TJ = 125°C
50
R
200
=
0.3
K/
W
A
0.
2
W
K/
250
0.
16
hS
Rt
180°
120°
90°
60°
30°
300
1
0.
Maximum Average On-state Power Loss (W)
60°
90°
0
0
40
80
120
160
200
240
25
Average On-state Current (A)
50
75
100
125
Maximum Allowable Ambient Temperature (°C)
Maximum Average On-state Power Loss (W)
Fig. 3 - On-State Power Loss Characteristics
500
DC
180°
120°
90°
60°
30°
450
400
350
300
R
0.
1
0.
16
250
RMSLimit
200
Conduction Period
150
100
ST180SSeries
TJ = 125°C
50
th
SA
=
K/
W
0.
08
K/
W
0.2
K/
W
0.3
K/ W
0.4
K/ W
0.5
K/ W
0.8 K
/W
K/
W
-D
el
ta
R
1.2 K/ W
0
0
40
80
120 160 200 240 280 320
25
Average On-state Current (A)
50
75
100
125
Maximum Allowable Ambient Temperature (°C)
Fig. 4 - On-State Power Loss Characteristics
Revision: 11-Mar-14
Document Number: 94397
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VS-ST180SPbF Series
Vishay Semiconductors
4800
Peak Half Sine Wave On-state Current (A)
Peak Half Sine Wave On-state Current (A)
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At Any Rated Load Condition And With
Rated VRRM Applied Following Surge.
4400
Initial TJ = 125°C
@ 60 Hz 0.0083 s
4000
@ 50 Hz 0.0100 s
3600
3200
2800
2400
ST180SSeries
2000
1
10
100
5500
Maximum Non Repetitive Surge Current
Versus Pulse Train Duration. Control
5000 Of Conduction May Not Be Maintained.
Initial TJ = 125°C
4500
No Voltage Reapplied
Rated VRRM Reapplied
4000
3500
3000
2500
ST180SSeries
2000
0.01
0.1
1
Pulse Train Duration (s)
Number Of Equal Amplitude Half Cycle Current Pulses (N)
Fig. 5 - Maximum Non-Repetitive Surge Current
Fig. 6 - Maximum Non-Repetitive Surge Current
Instantaneous On-state Current (A)
10000
TJ = 25°C
TJ = 125°C
1000
ST180SSeries
100
0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6
Instantaneous On-state Voltage (V)
Transient Thermal Impedance Z thJC (K/ W)
Fig. 7 - On-State Voltage Drop Characteristics
1
Steady State Value
RthJC = 0.105 K/ W
(DC Operation)
0.1
0.01
ST180S Series
0.001
0.001
0.01
0.1
1
10
Square Wave Pulse Duration (s)
Fig. 8 - Thermal Impedance ZthJC Characteristics
Revision: 11-Mar-14
Document Number: 94397
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VS-ST180SPbF Series
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Rec tangular gate pulse
a) Recommended load line for
rated di/ dt : 20V, 10ohms; tr<=1 µs
b) Rec ommended load line for
<=30% rated di/ dt : 10V, 10ohms
10
tr<=1 µs
(b)
VGD
IGD
0.1
0.001
(1) PGM = 10W,
(2) PGM = 20W,
(3) PGM = 40W,
(4) PGM = 60W,
= 4ms
= 2ms
= 1ms
= 0.66ms
(a)
(1)
Device: ST180S Series
0.01
tp
tp
tp
tp
Tj=-40 °C
1
Tj=25 °C
Tj=125 °C
Instantaneous Gate Voltage (V)
100
0.1
(2)
(3) (4)
Frequency Limited by PG(AV)
1
10
100
Instantaneous Gate Current (A)
Fig. 9 - Gate Characteristics
ORDERING INFORMATION TABLE
Device code
VS-
ST
18
0
S
20
P
0
-
PbF
1
2
3
4
5
6
7
8
9
10
1
-
Vishay Semiconductors product
2
-
Thyristor
3
-
Essential part number
4
-
0 = Converter grade
5
-
S = Compression bonding stud
6
-
Voltage code x 100 = VRRM (see Voltage Ratings table)
7
-
P = Stud base 3/4"-16UNF2A threads
8
-
0 = Eyelet terminals (gate and auxiliary cathode leads)
9
-
1 = Fast-on terminals (gate and auxiliary cathode leads)
V = Glass-metal seal (only up to 1200 V)
None = Ceramic housing (over 1200 V)
10
-
None = Standard production
PbF = Lead (Pb)-free
Note: For metric device M16 x 1.5 contact factory
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?95082
Revision: 11-Mar-14
Document Number: 94397
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Outline Dimensions
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Vishay Semiconductors
TO-209AB (TO-93)
DIMENSIONS in millimeters (inches)
7)
MI
N.
4 (0.16) MAX.
19 (0.75) MAX.
(0.
3
8.5 (0.33) DIA.
C.S. 0.4 mm2
(0.0006 s.i.)
Red cathode
White gate
Red shrink
38.5 (1.52)
MAX.
16 (0.63) MAX.
White shrink
220 (8.66) ± 10 (0.39)
Red silicon rubber
90 (3.54) MIN.
210 (8.26) ± 10 (0.39)
22
Flexible leads
C.S. 25 mm2
(0.039 s.i.)
( 0.
86
)M
9.5
4.3 (0.17) DIA.
IN
.
Glass metal seal
Fast-on terminals
AMP. 280000-1
REF-250
28.5 (1.12) MAX. DIA.
27.5 (1.08) MAX.
SW 32
3/4"-16UNF-2A (1)
35 (1.38) MAX.
19 (0.75) MAX.
)M
IN
.
4 (0.16) MAX.
37
8.5 (0.33) DIA.
C.S. 0.4 mm2
(0.006 s.i.)
Red cathode
White gate
White shrink
16 (0.63) MAX.
38.5 (1.52)
MAX.
Red shrink
.
IN
(0.
22
220 (8.66) ± 10 (0.39)
Red silicon rubber
90 (3.54) MIN.
210 (8.26) ± 10 (0.39)
Flexible leads
C.S. 25 mm2
(0.039 s.i.)
86
9.5
(0.
4.3 (0.17) DIA.
)M
Ceramic housing
27.5 (1.08) MAX. DIA.
27.5 (1.08) MAX.
SW 32
3/4"-16UNF-2A (1)
35 (1.38) MAX.
Note
(1) For metric device: M16 x 1.5 - length 21 (0.83) maximum
Revision: 05-Mar-12
Document Number: 95082
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