Data Sheet

Pressure
Freescale Semiconductor
+
MPX2100
Rev 10, 10/2008
100 kPa On-Chip Temperature
Compensated and Calibrated
Silicon Pressure Sensors
MPX2100
Series
0 to 100 kPa (0 to 14.5 psi)
40 mV Full Scale Span
(Typical)
The MPX2100 series devices silicon piezoresistive pressure sensors
providing a highly accurate and linear voltage output directly proportional to
the applied pressure. The sensor is a single, monolithic silicon diaphragm
with the strain gauge and a thin-film resistor network integrated on-chip.
The chip is laser trimmed for precise span and offset calibration an
temperature compensation.
Application Examples
•
•
•
•
•
•
Features
•
•
•
•
•
Temperature Compensated Over 0°C to +85°C
Available in Absolute, Differential and Gauge Configurations
Easy to Use Chip Carrier Package Options
Ratiometric to Supply Voltage
±0.25% Linearity (MPX2100D Series)
Pump/Motor Controllers
Robotics
Level Indicators
Medical Diagnostics
Pressure Switching
Barometers
ORDERING INFORMATION
Package
Case
Device Name
Options
No.
Unibody Package (MPX2100 Series)
MPX2100A
Tray
344
MPX2100D
Tray
344
MPX2100AP
Tray
344B
MPX2100GP
Tray
344B
MPX2100DP
Tray
344C
MPX2100GVP
Tray
344D
MPX2100ASX
Tray
344F
None
# of Ports
Single
Dual
Gauge
•
•
Pressure Type
Differential
Absolute
•
•
•
•
•
•
•
MPX2100A
MPX2100D
•
•
Device
Marking
MPX2100AP
MPX2100GP
•
MPX2100DP
•
MPX2100GVP
•
MPX2100A
PACKAGES
MPX2100A/D
CASE 344-15
MPX2100AP/GP
CASE 344B-01
MPX2100DP
CASE 344C-01
© Freescale Semiconductor, Inc., 2002, 2008. All rights reserved.
MPX2100GVP
CASE 344D-01
MPX2100ASX
CASE 344F-01
Pressure
Figure 1 shows a block diagram of the internal circuitry on the stand-alone pressure sensor chip.
VS
3
Thin Film
Temperature
Compensation
and Calibration
Circuitry
Sensing
Element
2
+VOUT
4 -V
OUT
1
GND
Figure 1. Temperature Compensated Pressure Sensor Schematic
Voltage Output versus Applied Differential Pressure
The differential voltage output of the sensor is directly
proportional to the differential pressure applied.
The absolute sensor has a built-in reference vacuum. The
output voltage will decrease as vacuum, relative to ambient,
is drawn on the pressure (P1) side.
The output voltage of the differential or gauge sensor
increases with increasing pressure applied to the pressure
side (P1) relative to the vacuum side (P2). Similarly, output
voltage increases as increasing vacuum is applied to the
vacuum side (P2) relative to the pressure side (P1).
MPX2100
2
Sensors
Freescale Semiconductor
Pressure
Operating Characteristics
Table 1. Operating Characteristics
(VS = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2)
Characteristics
Symbol
Min
Typ
Max
Unit
Pressure Range(1)
POP
0
—
100
kPa
Supply Voltage(2)
VS
—
10
16
Vdc
Supply Current
Io
—
6.0
—
mAdc
VFSS
38.5
40
41.5
mV
Voff
-1.0
-2.0
—
—
1.0
2.0
mV
ΔV/ΔP
—
0.4
—
mV/kPa
—
—
-0.25
-1.0
—
—
0.25
1.0
%VFSS
Pressure Hysteresis(5) (0 to 100 kPa)
—
—
±0.1
—
%VFSS
Temperature Hysteresis(5) (-40°C to +125°C)
—
—
±0.5
—
%VFSS
TCVFSS
-1.0
—
1.0
%VFSS
TCVoff
-1.0
—
1.0
mV
Input Impedance
Zin
1000
—
2500
Ω
Output Impedance
Zout
1400
—
3000
Ω
Response Time(6) (10% to 90%)
tR
—
1.0
—
ms
Warm-Up
—
—
20
—
ms
Offset Stability(7)
—
—
±0.5
—
%VFSS
Full Scale Span(3)
Offset(4)
MPX2100D Series
MPX2100A Series
Sensitivity
Linearity(5)
MPX2100D Series
MPX2100A Series
Temperature Effect on Full Scale Span(5)
Temperature Effect on Offset(5)
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
4. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
5. Accuracy (error budget) consists of the following:
Linearity:
Output deviation from a straight line relationship with pressure, using end point method, over the specified
pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and
from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum
or maximum rated pressure, at 25°C.
TcSpan:
Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
TcOffset:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C.
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
7. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPX2100
Sensors
Freescale Semiconductor
3
Pressure
Maximum Ratings
Table 2. Maximum Ratings(1)
Rating
Symbol
Value
Unit
Maximum Pressure (P1 > P2)
Pmax
400
kPa
Storage Temperature
Tstg
-40 to +125
°C
Operating Temperature
TA
-40 to +125
°C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Least Squares Fit
Relative Voltage Output
LINEARITY
Linearity refers to how well a transducer's output follows
the equation: Vout = Voff + sensitivity x P over the operating
pressure range. There are two basic methods for calculating
nonlinearity: (1) end point straight line fit (see Figure 2) or (2)
a least squares best line fit. While a least squares fit gives the
“best case” linearity error (lower numerical value), the
calculations required are burdensome.
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user. Motorola's
specified pressure sensor linearities are based on the end
point straight line method measured at the midrange
pressure.
Exaggerated
Performance
Curve
Least
Square
Deviation
Straight Line
Deviation
End Point
Straight Line Fit
Offset
0
50
100
Pressure (% Fullscale)
Figure 2. Linearity Specification Comparison
MPX2100
4
Sensors
Freescale Semiconductor
Pressure
On-Chip Temperature Compensation and Calibration
Figure 3 shows the output characteristics of the
MPX2100 series at 25°C. The output is directly proportional
to the differential pressure and is essentially a straight line.
VS = 10 Vdc
TA = 25°C
P1 > P2
40
Output (mVdc)
35
30
25
20
The effects of temperature on Full-Scale Span and Offset
are very small and are shown under Operating
Characteristics.
TYP
Span
Range
(Typ)
MAX
15
10
MIN
5
0
-5
kPa 0
PSI
25
3.62
50
7.25
75
10.87
Offset
(Typ)
100
14.5
Figure 3. Output versus Pressure Differential
Silicone Gel
Die Coat
Differential/Gauge
Die
P1
Epoxy
Case
Wire Bond
Lead Frame
Silicone Gel
Die Coat
Stainless Steel
Metal Cover
Differential/Gauge Element
P2
Bond
Die
Absolute
Die
P1
Wire Bond
Lead Frame
Absolute Element
P2
Stainless Steel
Metal Cover
Epoxy
Case
Die
Bond
Figure 4. Cross-Sectional Diagram (not to scale)
Figure 4 illustrates the absolute sensing configuration
(right) and the differential or gauge configuration in the basic
chip carrier (Case 344). A silicone gel isolates the die surface
and wire bonds from the environment, while allowing the
pressure signal to be transmitted to the silicon diaphragm.
The MPX2100 series pressure sensor operating
characteristics and internal reliability and qualification tests
are based on use of dry air as the pressure media. Media
other than dry air may have adverse effects on sensor
performance and long term reliability. Contact the factory for
information regarding media compatibility in your application.
MPX2100
Sensors
Freescale Semiconductor
5
Pressure
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing the silicone gel
which isolates the die. The differential or gauge sensor is
designed to operate with positive differential pressure
Part Number
MPX2100A, MPX2100D
Case Type
344
applied, P1 > P2. The absolute sensor is designed for
vacuum applied to P1 side.
The Pressure (P1) side may be identified by using the
table below:
Pressure (P1) Side Identifier
Stainless Steel Cap
MPX2100DP
344C
Side with Part Marking
MPX2100AP, MPX2100GP
344B
Side with Port Attached
MPX2100ASX
344F
Side with Port Attached
MPX2100GVP
344D
Stainless Steel Cap
MPX2100
6
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
C
R
M
1
B
-A-
2
Z
4
3
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
DIM
A
B
C
D
F
G
J
L
M
N
R
Y
Z
N
L
1 2 3 4
PIN 1
-TSEATING
PLANE
J
F
G
F
Y
D 4 PL
0.136 (0.005)
STYLE 1:
PIN 1.
2.
3.
4.
M
T A
DAMBAR TRIM ZONE:
THIS IS INCLUDED
WITHIN DIM. "F" 8 PL
M
STYLE 2:
PIN 1.
2.
3.
4.
GROUND
+ OUTPUT
+ SUPPLY
- OUTPUT
STYLE 3:
PIN 1.
2.
3.
4.
VCC
- SUPPLY
+ SUPPLY
GROUND
INCHES
MILLIMETERS
MIN
MAX MIN
MAX
0.595
0.630 15.11
16.00
0.514
0.534 13.06
13.56
0.200
0.220
5.08
5.59
0.016
0.020
0.41
0.51
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.014
0.016
0.36
0.40
0.695
0.725 17.65
18.42
30˚ NOM
30˚ NOM
0.475
0.495 12.07
12.57
0.430
0.450 10.92
11.43
0.048
0.052
1.22
1.32
0.106
0.118
2.68
3.00
GND
-VOUT
VS
+VOUT
CASE 344-15
ISSUE AA
UNIBODY PACKAGE
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
-A-
-T-
U
L
R
H
N
PORT #1
POSITIVE
PRESSURE
(P1)
-Q-
B
1 2 3 4
PIN 1
K
-P0.25 (0.010)
J
M
T Q
S
S
F
C
G
D 4 PL
0.13 (0.005)
M
T S
S
Q
S
DIM
A
B
C
D
F
G
H
J
K
L
N
P
Q
R
S
U
INCHES
MILLIMETERS
MIN
MAX
MIN
MAX
1.145
1.175
29.08
29.85
0.685
0.715
17.40
18.16
0.305
0.325
7.75
8.26
0.016
0.020
0.41
0.51
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.182
0.194
4.62
4.93
0.014
0.016
0.36
0.41
0.695
0.725
17.65
18.42
0.290
0.300
7.37
7.62
0.420
0.440
10.67
11.18
0.153
0.159
3.89
4.04
0.153
0.159
3.89
4.04
0.230
0.250
5.84
6.35
0.220
0.240
5.59
6.10
0.910 BSC
23.11 BSC
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
CASE 344B-01
ISSUE B
UNIBODY PACKAGE
MPX2100
Sensors
Freescale Semiconductor
7
Pressure
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
-AU
V
PORT #1
R
W
L
H
PORT #2
PORT #1
POSITIVE PRESSURE
(P1)
PORT #2
VACUUM
(P2)
N
-QB
SEATING
PLANE
SEATING
PLANE
1 2 3 4
PIN 1
K
-P-T-
0.25 (0.010)
-T-
M
T Q
S
S
F
J
G
D 4 PL
C
0.13 (0.005)
M
T S
Q
S
S
-TA
E
-Q-
U
N
V
B
R
PORT #1
POSITIVE
PRESSURE
(P1)
PIN 1
-P0.25 (0.010)
M
T Q
M
4
3
2
1
S
K
J
F
INCHES
MILLIMETERS
MIN
MAX
MIN MAX
1.145
1.175
29.08 29.85
0.685
0.715
17.40 18.16
0.405
0.435
10.29 11.05
0.016
0.020
0.41
0.51
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.182
0.194
4.62
4.93
0.014
0.016
0.36
0.41
0.695
0.725
17.65 18.42
0.290
0.300
7.37
7.62
0.420
0.440
10.67 11.18
0.153
0.159
3.89
4.04
0.153
0.159
3.89
4.04
0.063
0.083
1.60
2.11
0.220
0.240
5.59
6.10
0.910 BSC
23.11 BSC
0.248
0.278
6.30
7.06
0.310
0.330
7.87
8.38
STYLE 1:
PIN 1.
2.
3.
4.
CASE 344C-01
ISSUE B
UNIBODY PACKAGE
C
DIM
A
B
C
D
F
G
H
J
K
L
N
P
Q
R
S
U
V
W
GROUND
+ OUTPUT
+ SUPPLY
- OUTPUT
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
A
B
C
D
E
F
G
J
K
N
P
Q
R
S
U
V
INCHES
MILLIMETERS
MIN
MAX MIN
MAX
1.080
1.120 27.43
28.45
0.740
0.760 18.80
19.30
0.630
0.650 16.00
16.51
0.016
0.020
0.41
0.51
0.160
0.180
4.06
4.57
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.014
0.016
0.36
0.41
0.220
0.240
5.59
6.10
0.070
0.080
1.78
2.03
0.150
0.160
3.81
4.06
0.150
0.160
3.81
4.06
0.440
0.460 11.18
11.68
0.695
0.725 17.65
18.42
0.840
0.860 21.34
21.84
0.182
0.194
4.62
4.92
G
D 4 PL
0.13 (0.005)
M
T P
S
Q
S
STYLE 1:
PIN 1.
2.
3.
4.
GROUND
V (+) OUT
V SUPPLY
V (-) OUT
CASE 344F-01
ISSUE B
UNIBODY PACKAGE
MPX2100
8
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
-AU
SEATING
PLANE
-T-
L
R
DIM
A
B
C
D
F
G
H
J
K
L
N
P
Q
R
S
U
H
PORT #2
VACUUM
(P2)
POSITIVE
PRESSURE
(P1)
N
-Q-
B
1 2 3 4
K
PIN 1
S
C
F
-P-
J
0.25 (0.010)
M
T Q
S
G
D
4 PL
0.13 (0.005)
M
T S
S
Q
S
STYLE 1:
PIN 1.
2.
3.
4.
INCHES
MILLIMETERS
MIN
MAX MIN
MAX
1.145
1.175 29.08
29.85
0.685
0.715 17.40
18.16
0.305
0.325
7.75
8.26
0.016
0.020
0.41
0.51
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.182
0.194
4.62
4.93
0.014
0.016
0.36
0.41
0.695
0.725 17.65
18.42
0.290
0.300
7.37
7.62
0.420
0.440 10.67
11.18
0.153
0.159
3.89
4.04
0.153
0.158
3.89
4.04
0.230
0.250
5.84
6.35
0.220
0.240
5.59
6.10
0.910 BSC
23.11 BSC
GROUND
+ OUTPUT
+ SUPPLY
- OUTPUT
CASE 344D-01
ISSUE B
UNIBODY PACKAGE
MPX2100
Sensors
Freescale Semiconductor
9
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MPX2100
Rev. 10
10/2008
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