FREESCALE MPX2102GSX

Freescale Semiconductor
Technical Data
MPX2102
Rev 5, 10/2006
100 kPa On-Chip Temperature
Compensated & Calibrated
Silicon Pressure Sensors
The MPX2102/MPXV2102G series device is a silicon piezoresistive pressure
sensor providing a highly accurate and linear voltage output directly proportional to
the applied pressure. The sensor is a single, monolithic silicon diaphragm with the
strain gauge and a thin-film resistor network integrated on-chip. The chip is laser
trimmed for precise span and offset calibration and temperature compensation.
Features
• Temperature Compensated Over 0°C to +85°C
• Easy-to-Use Chip Carrier Package Options
• Available in Absolute, Differential and Gauge Configurations
• Ratiometric to Supply Voltage
Application Examples
• Pump/Motor Controllers
• Robotics
• Level Indicators
• Medical Diagnostics
• Pressure Switching
• Barometers
• Altimeters
Options
Case No.
MPX Series
Order No.
MPX2102GP
CASE 1369-01
Packing
Options
Device
Marking
SMALL OUTLINE PACKAGE (MPXV2102G SERIES)
Ported
Elements
0 TO 100 kPA (0 TO 14.5 psi)
40 mV FULL SCALE SPAN
(TYPICAL)
SMALL OUTLINE PACKAGES
ORDERING INFORMATION
Device
Type
MPX2102
MPXV2102G
SERIES
Gauge, Side
Port, SMT
1369
MPXV2102GP
Trays
MPXV2102G
Differential,
Dual Port,
SMT
1351
MPXV2102DP
Trays
MPXV2102G
MPXV2102DP
CASE 1351-01
SMALL OUTLINE PACKAGE
PIN NUMBERS
1
GND(1)
5
N/C
2
+VOUT
6
N/C
3
VS
7
N/C
4
–VOUT
8
N/C
1. Pin 1 in noted by the notch in the lead.
UNIBODY PACKAGE (MPX2102 SERIES)
Basic
Element
Absolute,
Differential
344
MPX2102A
MPX2102D
—
MPX2102A
MPX2102D
Ported
Elements
Differential,
Dual Port
344C
MPX2102DP
—
MPX2102DP
Absolute,
Gauge
344B
MPX2102AP
MPX2102GP
—
MPX2102AP
MPX2102GP
Absolute,
Gauge Axial
344F
MPX2102ASX
MPX2102GSX
—
MPX2102A
MPX2102D
Gauge,
Vacuum
344D
MPX2102GVP
—
MPX2102GVP
UNIBODY PACKAGE PIN NUMBERS
1
GND(1)
3
VS
2
+VOUT
4
–VOUT
1. Pin 1 in noted by the notch in the lead.
UNIBODY PACKAGES
MPX2102A/D
CASE 344-15
MPX2102AP/GP
CASE 344B-01
MPX2102DP
CASE 344C-01
© Freescale Semiconductor, Inc., 2006. All rights reserved.
MPX2102GVP
CASE 344D-01
MPX2102ASX/GSX
CASE 344F-01
VS
3
Thin Film
Temperature
Compensation
and
Calibration
Circuitry
Sensing
Element
2
+ VOUT
4 -V
OUT
1
GND
Figure 1. Temperature Compensated Pressure Sensor Schematic
VOLTAGE OUTPUT VS. APPLIED DIFFERENTIAL PRESSURE
The differential voltage output of the sensor is directly
proportional to the differential pressure applied.
The absolute sensor has a built-in reference vacuum. The
output voltage will decrease as vacuum, relative to ambient,
is drawn on the pressure (P1) side.
The output voltage of the differential or gauge sensor
increases with increasing pressure applied to the pressure
(P1) side relative to the vacuum (P2) side. Similarly, output
voltage increases as increasing vacuum is applied to the
vacuum (P2) side relative to the pressure (P1) side.
Figure 1 illustrates a block diagram of the internal circuitry
on the stand-alone pressure sensor chip.
Table 1. Maximum Ratings(1)
Rating
Symbol
Value
Unit
Maximum Pressure (P1 > P2)
PMAX
400
kPa
Storage Temperature
TSTG
-40 to +125
°C
TA
-40 to +125
°C
Operating Temperature
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
MPX2102
2
Sensors
Freescale Semiconductor
Table 2. Operating Characteristics (VS = 10 VDC, TA = 25°C unless otherwise noted, P1 > P2)
Characteristic
Symbol
Min
Typ
Max
Units
POP
0
—
100
kPa
Supply Voltage(2)
VS
—
10
16
VDC
Supply Current
IO
—
6.0
—
mAdc
VFSS
38.5
40
41.5
mV
VOFF
-1.0
-2.0
—
—
1.0
2.0
mV
∆V/∆Ρ
—
0.4
—
mV/kPa
—
—
-0.6
-1.0
—
—
0.4
1.0
%VFSS
Pressure Hysteresis(5) (0 to 100 kPa)
—
—
±0.1
—
%VFSS
Temperature Hysteresis(5)(- 40°C to +125°C)
—
—
±0.5
—
%VFSS
Temperature Coefficient of Full Scale Span(5)
TCVFSS
-2.0
—
2.0
%VFSS
Temperature Coefficient of Offset(5)
TCVOFF
-1.0
—
1.0
mV
ZIN
1000
—
2500
W
ZOUT
1400
—
3000
W
Response Time(6) (10% to 90%)
tR
—
1.0
—
ms
Warm-Up Time
—
—
20
—
ms
Offset Stability(7)
—
—
±0.5
—
%VFSS
Differential Pressure Range(1)
Full Scale Span(3)
Offset(4)
MPX2102D Series
MPX2102A Series
Sensitivity
Linearity(5)
MPX2102D Series
MPX2102A Series
Input Impedance
Output Impedance
1. 1.0 kPa (kiloPascal) equals 0.145 psi.
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum related pressure.
4. Offset (VOFF) is defined as the output voltage at the minimum rated pressure.
5. Accuracy (error budget) consists of the following:
• Linearity:
•
•
•
•
Output deviation from a straight line relationship with pressure, using end point method, over the specified
pressure range.
Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis:
Output deviation at any pressure with the specified range, when this pressure is cycled to and from the minimum
or maximum rated pressure at 25°C.
TcSpan:
Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
TcOffset:
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C.
6. Response Time is defined as the time form the incremental change in the output to go from 10% to 90% of its final value when subjected
to a specified step change in pressure.
7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPX2102
Sensors
Freescale Semiconductor
3
Least Squares Fit
Least
Square
Deviation
Exaggerated
Performance
Curve
Straight Line
Deviation
Relative Voltage Output
LINEARITY
Linearity refers to how well a transducer's output follows
the equation: VOUT = VOFF + sensitivity x P over the operating
pressure range. There are two basic methods for calculating
nonlinearity: (1) end point straight line fit (see Figure 2) or (2)
a least squares best line fit. While a least squares fit gives the
“best case” linearity error (lower numerical value), the
calculations required are burdensome.
Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user.
Freescale’s specified pressure sensor linearities are based
on the end point straight line method measured at the
midrange pressure.
End Point Straight
Line Fit
Offset
50
Pressure (% Fullscale)
0
100
Figure 2. Linearity Specification Comparison
ON-CHIP TEMPERATURE COMPENSATION AND CALIBRATION
Figure 3 shows the output characteristics of the MPX2102/
MPXV2102G series at 25°C. The output is directly
proportional to the differential pressure and is essentially a
straight line.
VS = 10 VDC
TA = 25°C
MPX2102
P1 > P2
40
35
30
The effects of temperature on Full Scale Span and Offset
are very small and are shown under Operating
Characteristics.
TYP
Output (mVDC)
25
20
Span
Range
(TYP)
MAX
15
MIN
10
5
0
kPa
PSI
-5
0
25
3.62
50
7.25
75
10.88
100
14.5
Offset
(TYP)
Figure 3. Output vs. Pressure Differential
Silcone Gel
Die Coat
Differential/Gauge
Die
P1
Epoxy
Case
Wire Bond
Lead Frame
Silicone Gel
Die Coat
Stainless Steel
Metal Cover
Differential/GaugeElement
P2
Bond
Die
Absolute
Die
Stainless Steel
Metal Cover
P1
Epoxy
Case
Wire Bond
Lead Frame
Absolute Element
P2
Die
Bond
Figure 4. Cross Sectional Diagrams (Not to Scale)
Figure 4 illustrates the absolute sensing configuration
(right) and the differential or gauge configuration in the basic
chip carrier (Case 344). A silicone gel isolates the die surface
and wire bonds from the environment, while allowing the
pressure signal to be transmitted to the silicon diaphragm.
The MPX2102/MPXV2102G series pressure sensor
operating characteristics and internal reliability and
qualification tests are based on use of dry air as the pressure
media. Media other than dry air may have adverse effects on
sensor performance and long term reliability. Contact the
factory for information regarding media compatibility in your
application.
MPX2102
4
Sensors
Freescale Semiconductor
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing the silicone gel
which isolates the die. The differential or gauge sensor is
designed to operate with positive differential pressure
applied, P1 > P2. The absolute sensor is designed for
vacuum applied to P1 side.
The Pressure (P1) side may be identified by using Table 3.
Table 3. Pressure (P1) Side Delineation
Part Number
MPX2102A
MPX2102D
MPX2102DP
Case
Type
344
Pressure (P1) Side
Identifier
Stainless Steep Cap
344C
Side with Part Marking
344B
Side with Port Attached
MPX2102GVP
344D
Stainless Steep Cap
MPX2102ASX MPX2102GSX
344F
Side with Port Marking
MPX2102GP
1369
Side with Port Attached
MPX2102DP
1351
Side with Part Marking
MPX2102AP
MPX2102GP
MPX2102
Sensors
Freescale Semiconductor
5
PACKAGE DIMENSIONS
C
R
M
1
B
2
-A-
3
Z
4
DIM
A
B
C
D
F
G
J
L
M
N
R
Y
Z
N
L
1 2 3 4
PIN 1
-TSEATING
PLANE
J
F
G
F
Y
D 4 PL
0.136 (0.005)
STYLE 1:
PIN 1.
2.
3.
4.
M
T A
DAMBAR TRIM ZONE:
THIS IS INCLUDED
WITHIN DIM. "F" 8 PL
M
STYLE 2:
PIN 1.
2.
3.
4.
GROUND
+ OUTPUT
+ SUPPLY
- OUTPUT
STYLE 3:
PIN 1.
2.
3.
4.
VCC
- SUPPLY
+ SUPPLY
GROUND
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED
16.00 (0.630).
INCHES
MILLIMETERS
MIN
MAX MIN
MAX
0.595
0.630 15.11
16.00
0.514
0.534 13.06
13.56
0.200
0.220
5.08
5.59
0.016
0.020
0.41
0.51
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.014
0.016
0.36
0.40
0.695
0.725 17.65
18.42
30˚ NOM
30˚ NOM
0.475
0.495 12.07
12.57
0.430
0.450 10.92
11.43
0.048
0.052
1.22
1.32
0.106
0.118
2.68
3.00
GND
-VOUT
VS
+VOUT
CASE 344-15
ISSUE AA
UNIBODY PACKAGE
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
-A-
-T-
U
L
R
H
N
PORT #1
POSITIVE
PRESSURE
(P1)
-Q-
B
1 2 3 4
PIN 1
K
-P0.25 (0.010)
J
M
T Q
S
S
F
C
G
D 4 PL
0.13 (0.005)
M
T S
S
Q
S
DIM
A
B
C
D
F
G
H
J
K
L
N
P
Q
R
S
U
INCHES
MILLIMETERS
MIN
MAX
MIN
MAX
1.145
1.175
29.08
29.85
0.685
0.715
17.40
18.16
0.305
0.325
7.75
8.26
0.016
0.020
0.41
0.51
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.182
0.194
4.62
4.93
0.014
0.016
0.36
0.41
0.695
0.725
17.65
18.42
0.290
0.300
7.37
7.62
0.420
0.440
10.67
11.18
0.153
0.159
3.89
4.04
0.153
0.159
3.89
4.04
0.230
0.250
5.84
6.35
0.220
0.240
5.59
6.10
0.910 BSC
23.11 BSC
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT
CASE 344B-01
ISSUE B
UNIBODY PACKAGE
MPX2102
6
Sensors
Freescale Semiconductor
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
-AU
V
PORT #1
R
W
L
H
PORT #2
N
DIM
A
B
C
D
F
G
H
J
K
L
N
P
Q
R
S
U
V
W
PORT #1
POSITIVE PRESSURE
(P1)
PORT #2
VACUUM
(P2)
-QB
SEATING
PLANE
SEATING
PLANE
1 2 3 4
PIN 1
K
-P-T-
-T-
0.25 (0.010)
M
T Q
S
S
F
J
G
D 4 PL
C
0.13 (0.005)
T S
M
S
Q
S
INCHES
MILLIMETERS
MIN
MAX
MIN MAX
1.145
1.175
29.08 29.85
0.685
0.715
17.40 18.16
0.405
0.435
10.29 11.05
0.016
0.020
0.41
0.51
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.182
0.194
4.62
4.93
0.014
0.016
0.36
0.41
0.695
0.725
17.65 18.42
0.290
0.300
7.37
7.62
0.420
0.440
10.67 11.18
0.153
0.159
3.89
4.04
0.153
0.159
3.89
4.04
0.063
0.083
1.60
2.11
0.220
0.240
5.59
6.10
0.910 BSC
23.11 BSC
0.248
0.278
6.30
7.06
0.310
0.330
7.87
8.38
STYLE 1:
PIN 1.
2.
3.
4.
GROUND
+ OUTPUT
+ SUPPLY
- OUTPUT
CASE 344C-01
ISSUE B
UNIBODY PACKAGE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
-AU
SEATING
PLANE
-T-
L
H
PORT #2
VACUUM
(P2)
R
DIM
A
B
C
D
F
G
H
J
K
L
N
P
Q
R
S
U
POSITIVE
PRESSURE
(P1)
N
-Q-
B
1 2 3 4
K
PIN 1
S
C
F
-P-
J
0.25 (0.010)
M
T Q
S
G
D
4 PL
0.13 (0.005)
M
T S
S
Q
S
STYLE 1:
PIN 1.
2.
3.
4.
INCHES
MILLIMETERS
MIN
MAX MIN
MAX
1.145
1.175 29.08
29.85
0.685
0.715 17.40
18.16
0.305
0.325
7.75
8.26
0.016
0.020
0.41
0.51
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.182
0.194
4.62
4.93
0.014
0.016
0.36
0.41
0.695
0.725 17.65
18.42
0.290
0.300
7.37
7.62
0.420
0.440 10.67
11.18
0.153
0.159
3.89
4.04
0.153
0.158
3.89
4.04
0.230
0.250
5.84
6.35
0.220
0.240
5.59
6.10
0.910 BSC
23.11 BSC
GROUND
+ OUTPUT
+ SUPPLY
- OUTPUT
CASE 344D-01
ISSUE B
UNIBODY PACKAGE
MPX2102
Sensors
Freescale Semiconductor
7
PACKAGE DIMENSIONS
-TC
A
E
-Q-
U
N
V
B
R
PORT #1
POSITIVE
PRESSURE
(P1)
PIN 1
-P0.25 (0.010)
M
T Q
M
4
3
2
1
S
K
J
F
D 4 PL
0.13 (0.005)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
A
B
C
D
E
F
G
J
K
N
P
Q
R
S
U
V
INCHES
MILLIMETERS
MIN
MAX MIN
MAX
1.080
1.120 27.43
28.45
0.740
0.760 18.80
19.30
0.630
0.650 16.00
16.51
0.016
0.020
0.41
0.51
0.160
0.180
4.06
4.57
0.048
0.064
1.22
1.63
0.100 BSC
2.54 BSC
0.014
0.016
0.36
0.41
0.220
0.240
5.59
6.10
0.070
0.080
1.78
2.03
0.150
0.160
3.81
4.06
0.150
0.160
3.81
4.06
0.440
0.460 11.18
11.68
0.695
0.725 17.65
18.42
0.840
0.860 21.34
21.84
0.182
0.194
4.62
4.92
G
M
T P
S
Q
S
STYLE 1:
PIN 1.
2.
3.
4.
GROUND
V (+) OUT
V SUPPLY
V (-) OUT
CASE 344F-01
ISSUE B
UNIBODY PACKAGE
MPX2102
8
Sensors
Freescale Semiconductor
PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
MPX2102
Sensors
Freescale Semiconductor
9
PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
MPX2102
10
Sensors
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PACKAGE DIMENSIONS
PAGE 1 OF 2
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MPX2102
Sensors
Freescale Semiconductor
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PACKAGE DIMENSIONS
PAGE 2 OF 2
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MPX2102
12
Sensors
Freescale Semiconductor
NOTES
MPX2102
Sensors
Freescale Semiconductor
13
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MPX2102
Rev. 5
10/2006
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