HC5509A1R3060 SLIC Subscriber Line Interface Circuit June 1997 Features Description • DI Monolithic High Voltage Process • High Temperature Alarm Output The HC4P5509A1R3060 telephone Subscriber Line Interface Circuit integrates most of the BORSCHT functions on a monolithic IC. The device is manufactured in a Dielectric Isolation (DI) process and is designed for use as a high voltage interface between the traditional telephone subscriber pair (Tip and Ring) and the low voltage filtering and coding/decoding functions of the line card. Together with a secondary protection diode bridge and “feed” resistors, the device will withstand 1000V lightning induced surges, in plastic packages. The SLIC also maintains specified transmission performance in the presence of externally induced longitudinal currents. The BORSCHT functions that the SLIC provides are: • Low Power Consumption During Standby Functions • Battery Feed with Subscriber Loop Current Limiting • Switch Hook, Ground Key, and Ring Trip Detection • Overvoltage Protection • Selective Power Denial to Subscriber • Ring Relay Driver • Compatible with Worldwide PBX and CO Performance Requirements • Controlled Supply of Battery Feed Current with Programmable Current Limit • Operates with 5V Positive Supply (VB+) • Internal Ring Relay Driver and a Utility Relay Driver • High Impedance Mode for Subscriber Loop • Supervisory Signaling Functions • Voice Path Active During Power Denial • Hybrid Functions (with External Op Amp) • On Chip Op Amp for 2-Wire Impedance Matching • Test (or Battery Reversal) Relay Driver Applications In addition, the SLIC provides selective denial of power to subscriber loops, a programmable subscriber loop current limit from 20mA to 60mA, a thermal shutdown with an alarm output and line fault protection. Switch hook detection, ring trip detection and ground key detection functions are also incorporated in the SLIC device. • Solid State Line Interface Circuit for PBX or Central Office Systems, Digital Loop Carrier Systems • Hotel/Motel Switching Systems • Direct Inward Dialing (DID) Trunks The HC4P5509A1R3060 SLIC is ideally suited for line card designs in PBX and CO systems, replacing traditional transformer solutions. • Voice Messaging PBXs • High Voltage 2-Wire/4-Wire, 4-Wire/2-Wire Hybrid Ordering Information • Related Literature - AN9607, Impedance Matching Design Equations PART NUMBER - AN9628, AC Voltage Gain - AN9608, Implementing Pulse Metering HC4P5509A1R3060 TEMP. RANGE (oC) 0 to 75 PACKAGE 28 Ld PLCC PKG. NO. N28.45 - AN549, The HC-5502S/4X Telephone Subscriber Line Interface Circuits (SLIC) CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. http://www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999 1 File Number 3675.3 HC5509A1R3060 Absolute Maximum Ratings TA = 25oC Thermal Information Relay Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +15V Maximum Supply Voltages (VB+) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +7V (VB+)-(VB-) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +75V Junction Temperature Plastic . . . . . . . . . . . . . . . . . . . . . . . . . 150oC Lead Temperature (Soldering 10s) . . . . . . . . . . . . . . . . . . . . . 300oC Thermal Resistance (Typical, Note 1) PLCC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . θJA (oC/W) 67 Die Characteristics Transistor Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224 Diode Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Die Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 174 x 120 Substrate Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Connected Process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Bipolar-DI Operating Conditions Operating Temperature Range HC4P5509A1R3060 . . . . . . . . . . . . . . . . . . . . . . . . . .0oC to 75oC Storage Temperature Range . . . . . . . . . . . . . . . . . . -65oC to 150oC Relay Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5V to +12V Positive Power Supply (VB+) . . . . . . . . . . . . . . . . . . . . . . . +5V ±5% Negative Power Supply (VB-) . . . . . . . . . . . . . . . . . . . . -42V to -58V Loop Resistance (RL) . . . . . . . . . . . . . . . . . 200Ω to 1750Ω (Note 2) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 1. θJA is measured with the component mounted on an evaluation PC board in free air. 2. May be extended to 1900Ω with application circuit. Electrical Specifications Unless Otherwise Specified, Typical Parameters are at TA = 25oC, Min-Max Parameters are over Operating Temperature Range, VB- = -48V, VB+ = +5V, AG = BG = 0V. All AC Parameters are specified at 600Ω 2-Wire terminating impedance. PARAMETER TEST CONDITIONS MIN TYP MAX UNITS AC TRANSMISSION PARAMETERS RX Input Impedance 300Hz to 3.4kHz (Note 3) - 100 - kΩ TX Output Impedance 300Hz to 3.4kHz (Note 3) - - 20 Ω 4-Wire Input Overload Level 300Hz to 3.4kHz RL = 1200Ω, 600Ω Reference +1.5 - - VPEAK 2-Wire Return Loss Matched for 600Ω (Note 3) SRL LO 26 35 - dB ERL 30 40 - dB SRL HI 30 40 - dB 2-Wire Longitudinal to Metallic Balance Off Hook Per ANSI/IEEE STD 455-1976 (Note 3) 300Hz to 3400Hz 58 63 - dB 4-Wire Longitudinal Balance Off Hook 300Hz to 3400Hz (Note 3) 50 55 - dB Low Frequency Longitudinal Balance R.E.A. Test Circuit - - -67 dBmp ILINE = 40mA TA = 25oC (Note 3) - - 23 dBrnC Longitudinal Current Capability ILINE = 40mA TA = 25oC (Note 3) - - 30 mARMS Insertion Loss 0dBm at 1kHz, Referenced 600Ω 2-Wire/4-Wire -6.22 -6.02 -5.82 dB 4-Wire/2-Wire - ±0.05 ±0.2 dB 4-Wire/4-Wire -6.22 -6.02 -5.82 dB 2 HC5509A1R3060 Electrical Specifications Unless Otherwise Specified, Typical Parameters are at TA = 25oC, Min-Max Parameters are over Operating Temperature Range, VB- = -48V, VB+ = +5V, AG = BG = 0V. All AC Parameters are specified at 600Ω 2-Wire terminating impedance. (Continued) PARAMETER Frequency Response Level Linearity 2-Wire to 4-Wire and 4-Wire to 2-Wire Absolute Delay TEST CONDITIONS MIN TYP MAX UNITS - ±0.02 ±0.05 dB +3 to -40dBm - - ±0.05 dB -40 to -50dBm - - ±0.1 dB -50 to -55dBm - - ±0.3 dB 300Hz to 3400Hz (Note 3) Referenced to Absolute Level at 1kHz, 0dBm Referenced 600Ω Referenced to -10dBm (Note 3) (Note 3) 2-Wire/4-Wire fIN - 1kHz - 0.7 1.2 µs 4-Wire/2-Wire fIN - 1kHz - 0.3 1.0 µs 4-Wire/4-Wire fIN - 1kHz - 1.5 2.0 µs 32 40 - dB Transhybrid Loss VIN = 1VP-P at 1kHz (Note 3) Total Harmonic Distortion 2-Wire/4-Wire, 4-Wire/2-Wire, 4-Wire/4-Wire Reference Level 0dBm at 600Ω 300Hz to 3400Hz (Note 3) - - -52 dB C-Message (Note 3) - - 5 dBrnC Psophometric - - -85 dBmp 3kHz Flat - - 15 dBrn 25 29 - dB VB+ to 4-Wire 25 29 - dB VB- to 2-Wire 25 29 - dB VB- to 4-Wire 25 29 - dB 25 - - dB VB+ to 2-Wire 25 - - dB VB- to 4-Wire 25 25 - dB VB- to 2-Wire 25 25 - dB 50 - 500 µs 20 (Note 4) - 60 mA 10 - - % - ±3 ±5 mA Idle Channel Noise 2-Wire and 4-Wire Power Supply Rejection Ratio VB+ to 2-Wire VB+ to 4-Wire (Note 3) 30Hz to 200Hz, RL = 600Ω (Note 3) 200Hz to 16kHz, RL = 600Ω Ring Sync Pulse Width DC PARAMETERS Loop Current Programming Limit Range (Note 4) Accuracy Loop Current During Power Denial RL = 200Ω 3 HC5509A1R3060 Electrical Specifications Unless Otherwise Specified, Typical Parameters are at TA = 25oC, Min-Max Parameters are over Operating Temperature Range, VB- = -48V, VB+ = +5V, AG = BG = 0V. All AC Parameters are specified at 600Ω 2-Wire terminating impedance. (Continued) PARAMETER TEST CONDITIONS MIN TYP MAX UNITS TIP to Ground - 38 45 mA RING to Ground - 54 60 mA TIP and RING to Ground - 85 95 mA Switch Hook Detection Threshold - 12 15 mA Ground Key Detection Threshold 9.5 13.5 17.5 mA Fault Currents Thermal ALARM Output Safe Operating Die Temperature Exceeded 140 - 160 oC Ring Trip Comparator Threshold See Typical Applications for more information 9.5 13.5 17.5 mA - 0.1 0.5 ms Dial Pulse Distortion Relay Driver Outputs On Voltage VOL IOL (PR) = 60mA, IOL (RD) = 60mA - 0.2 0.5 V Off Leakage Current VOH = 13.2V - ±10 ±100 µA Logic ‘0’ VIL - - 0.8 V Logic ‘1’ VIH 2.0 - 5.5 V 0V ≤ VIN ≤ 5V - - ±100 µA Logic ‘0’ VOL ILOAD = 800µA - 0.1 0.5 V Logic ‘1’ VOH ILOAD = 40µA 2.7 - - V - 200 - mW TTL/CMOS Logic Inputs (RC, PD, RS, TST, PRI) Input Current (RC, PD, RS, TST, PRI) Logic Outputs Power Dissipation On Hook Relay Drivers Off IB+ VB+ = +5.25V, VB- = -58V, RLOOP = ∞ - - 6 mA IB- VB+ = +5.25V, VB- = -58V, RLOOP = ∞ -6 - - mA Input Offset Voltage - ±5 - mV Input Offset Current - ±10 - nA UNCOMMITTED OP AMP PARAMETERS Differential Input Resistance (Note 2) - 1 - MΩ Output Voltage Swing RL = 10kΩ - ±3 - VP-P - 1 - MHz Small Signal GBW NOTES: 3. Absolute maximum ratings are limiting values, applied individually, beyond which the serviceability of the circuit may be impaired. Functional operability under any of these conditions is not necessarily implied. 4. These parameters are controlled by design or process parameters and are not directly tested. These parameters are characterized upon initial design release, upon design changes which would affect these characteristics, and at intervals to assure product quality and specification compliance. 5. Application limitation based on maximum switch hook detect limit and metallic currents. Not a part limitation. 4 HC5509A1R3060 Pin Descriptions SOIC SYMBOL DESCRIPTION 1 AG Analog Ground - To be connected to zero potential. Serves as a reference for the transmit output and receive input terminals. 2 VB+ Positive Voltage Source - Most Positive Supply. 3 C1 Capacitor #C1 - An external capacitor to be connected between this terminal and analog ground. Required for proper operation of the loop current limiting function. 4 PD Power Denial - A low active TTL-compatible logic input. When enabled, the output of the ring amplifier will ramp to close to the output voltage of the tip amplifier. 5 RC Ring Command - A low active TTL-compatible logic input. When enabled, the relay driver (RD) output goes low on the next high level of the ring sync (RS) input, as long as the SLIC is not in the power down mode (TST = 0) or the subscriber is not already off-hook (SHD = 0). 6 RS Ring Synchronization Input - A TTL - compatible clock input. The clock is arranged such that a positive pulse (50 - 500µs) occurs on the zero crossing of the ring voltage source, as it appears at the RFS terminal. For Tip side injected systems, the RS pulse should occur on the negative going zero crossing and for Ring injected systems, on the positive going zero crossing. This ensures that the ring relay activates and deactivates when the instantaneous ring voltage is near zero. If synchronization is not required, the pin should be tied to +5. 7 SHD Switch Hook Detection - An active low LS TTL compatible logic output. A line supervisory output. 8 GKD Ground Key Detection - An active low LS TTL compatible logic output. A line supervisory output. 9 TST A TTL logic input. A low on this pin will keep the SLIC in a power down mode. The TST pin in conjunction with the ALM pin can provide thermal shutdown protection for the SLIC. Thermal shutdown is implemented by a system controller that monitors the ALM pin. When the ALM pin is active (low) the system controller issues a command to the Test pin (low) to power down the SLIC. The timing of the thermal recovery is controlled by the system controller. 10 ALM A TTL compatible active low output which responds to the thermal detector circuit when a safe operating die temperature has been exceeded. Reference the TST pin description for a method to reduce prolonged thermal overstress that may reduce component life. 11 ILMT Loop Current Limit - Voltage on this pin sets the short loop current limiting conditions using a resistive voltage divider. 12 OUT1 The analog output of the spare operational amplifier. 13 -IN1 The inverting analog input of the spare operational amplifier. 14 TIP An analog input connected to the TIP (more positive) side of the subscriber loop through a feed resistor and ring relay contact. Functions with the RING terminal to receive voice signals from the telephone and for loop monitoring purpose. 15 RING An analog input connected to the RING (more negative) side of the subscriber loop through a feed resistor. Functions with the TIP terminal to receive voice signals from the telephone and for loop monitoring purposes. 16 RFS Ring Feed Sense - Senses RING side of the loop for Ground Key Detection. During Ring injected ringing the ring signal at this node is isolated from RF via the ring relay. For Tip injected ringing, the RF and RFS pins must be shorted. 17 VRX Receive Input, 4-Wire Side - A high impedance analog input. AC signals appearing at this input drive the Tip Feed and Ring Feed amplifiers differentially. 18 LAO Longitudinal Amplifier Output - A low impedance output to be connected to C2 through a low pass filter. Output is proportional to the difference in ITIP and IRING. 5 HC5509A1R3060 Pin Descriptions (Continued) SOIC SYMBOL DESCRIPTION 19 VTX Transmit Output, 4-Wire Side - A low impedance analog output which represents the differential voltage across TIP and RING. Transhybrid balancing must be performed beyond this output to completely implement two to four wire conversion. This output is referenced to analog ground. Since the DC level of this output varies with loop current, capacitive coupling to the next stage is necessary. 20 PRI A TTL compatible input used to control PR. PRI active High = PR active low. 21 PR An active low open collector output. Can be used to drive a Polarity Reversal Relay. 22 BG Battery Ground - Tube connected to zero potential. All loop current and some quiescent current flows into this terminal. 23 RD Ring Relay Driver - An active low open collector output. Used to drive a relay that switches ringing signals onto the 2-Wire line. 24 VFB Feedback input to the tip feed amplifier; may be used in conjunction with transmit output signal and the spare op amp to accommodate 2-Wire line impedance matching. 25 TF Tip Feed - A low impedance analog output connected to the TIP terminal through a feed resistor. Functions with the RF terminal to provide loop current, and to feed voice signals to the telephone set and to sink longitudinal currents. 26 RF Ring Feed - A low impedance analog output connected to the RING terminal through a feed resistor. Functions with the TF terminal to provide loop current, feed voice signals to the telephone set, and to sink longitudinal currents. 27 VB- The battery voltage source. The most negative supply. 28 C2 Capacitor #2 - An external capacitor to be connected between this terminal and ground. It prevents false ring trip detection from occurring when longitudinal currents are induced onto the subscriber loop from power lines and other noise sources. This capacitor should be nonpolarized. Pinout PD C1 VB+ AG C2 VB- RF HC4P5509A1R3060 (PLCC) TOP VIEW 4 3 2 1 28 27 26 7 23 RD GKD 8 22 BG TST 9 21 PR ALM 10 20 PRI ILMT 11 19 VTX 12 13 14 15 16 17 18 LAO SHD VRX 24 VFB RFS 6 RING RS TIP 25 TF -IN1 5 OUT1 RC 6 HC5509A1R3060 Functional Diagram PLCC R VRX R TF 25 TF + -IN 1 OUT 1 17 12 VFB 13 R VTX VB+ 19 AG 1 2 BIAS NETWORK OP AMP + R/2 24 22 27 RF1 BG VB- 2R R 4 2R PD R 5 RC R SHD TA + 2R R SW THERM LTD 4.5K 25K 100K RING 15 RTD GKD 100K 16 GK LA + 100K RFS TSD 100K 25K 6 IIL LOGIC INTERFACE TIP 14 FAULT DET 4.5K TST 20 PR 23 RD 8 RFC 90K RF 26 10 90K RF + VB/2 REF R = 108kΩ 3 C1 GM + 18 LAO PRI 21 7 90K RS 9 SHD GKD ALM RF2 11 28 C2 ILMT Overvoltage Protection and Longitudinal Current Protection TABLE 1. PARAMETER The SLIC device, in conjunction with an external protection bridge, will withstand high voltage lightning surges and power line crosses. Longitudinal Surge Metallic Surge High voltage surge conditions are as specified in Table 1. TEST CONDITION 10µs Rise/ PERFORMANCE (MAX) UNITS ±1000 (Plastic) VPEAK ±1000 (Plastic) VPEAK ±1000 (Plastic) VPEAK 700 (Plastic) VRMS 1000µs Fall 10µs Rise/ 1000µs Fall The SLIC will withstand longitudinal currents up to a maximum or 30mARMS, 15mARMS per leg, without any performance degradation. T/GND 10µs Rise/ R/GND 1000µs Fall . 50/60Hz Current 7 T/GND 11 Cycles R/GND Limited to 10ARMS HC5509A1R3060 Logic Diagram TTL TO I2L RS RELAY DRIVER RD I2L TO TTL RC GKD SHD GK SH TST ALM TSD BN PD IPD INJ PD = 0, IPD = ACTIVE A B C KEY NOTE: PRI and PD are independent switch driven by TTL input levels. 8 A B C HC5509A1R3060 Applications Diagram SYSTEM CONTROLLER K1 RS1 K2 CS1 SHD GKD PRI RS TST PD ALM RD RL2 ILIMIT PR K1A TIP TIP RB1 RC VRX+ RB2 TF VFB SECONDARY PROTECTION (NOTE) C5 VB- SLIC HC4P5509A1R3060 FROM PCM FILTER/CODER RL1 CAC VTX PRIMARY PROTECTION K1B -IN1 RS2 KZ0 CS2 RING KRF RF OUT1 RFS VRING 150VPEAK(MAX) RB3 LAO RING VB- Z1 TO HYBRID BALANCE NETWORK RB4 BG C2 AG VB+ C1 PTC CF2 C3 C4 RF1 +5V NOTE: Secondary protection diode bridge recommended is 3A, 200V type. RF2 CF1 FIGURE 1. TYPICAL LINE CIRCUIT APPLICATION WITH THE MONOLITHIC SLIC TYPICAL COMPONENT VALUES C1 = 0.5µF, 30V ILIMIT = (0.6) (RL1 + RL2)/(200 x RL2), RL1 typically 100kΩ RF1 = RF2 = 210kΩ, 1% KRF = 20kΩ CF1 = CF2 = 0.22µF, 10%, 20V Nonpolarized RB1 = RB2 = RB3 = RB4 = 50Ω 0.1% absolute matching C3 = 0.01µF, 100V, ±20% RS1 = RS2 = 1kΩ typically C4 = 0.01µF, 100V, ±20% CS1 = CS2 = 0.1µF, 200V typically, depending on VRing and line length. C5 = 0.01µF, 100V, ±20% Z1 = 150V to 200V transient protector. PTC used as ring generator ballast. CAC = 0.5µF, 20V KZ0 = 30kΩ, (Z0 = 600Ω) RL1, RL2; Current Limit Setting Resistors: NOTES: 1. All grounds (AG, BG) must be applied before VB+ or VB-. Failure to do so may result in premature failure of the part. If a user wishes to run separate grounds off a line card, the AG must be applied first. 2. Application shows Ring Injected Ringing, a Balanced or Tip injected configuration may be used. 9 HC5509A1R3060 Plastic Leaded Chip Carrier Packages (PLCC) 0.042 (1.07) 0.048 (1.22) 0.042 (1.07) 0.056 (1.42) PIN (1) IDENTIFIER 0.004 (0.10) C C L INCHES D2/E2 C L D2/E2 VIEW “A” D1 D 0.020 (0.51) MAX 3 PLCS 0.020 (0.51) MIN A1 A 0.026 (0.66) 0.032 (0.81) MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A 0.165 0.180 4.20 4.57 - A1 0.090 0.120 2.29 3.04 - D 0.485 0.495 12.32 12.57 - D1 0.450 0.456 11.43 11.58 3 D2 0.191 0.219 4.86 5.56 4, 5 E 0.485 0.495 12.32 12.57 - E1 0.450 0.456 11.43 11.58 3 E2 0.191 0.219 4.86 5.56 4, 5 N 28 28 6 Rev. 1 3/95 -C- SEATING PLANE 0.045 (1.14) MIN 28 LEAD PLASTIC LEADED CHIP CARRIER PACKAGE 0.025 (0.64) R 0.045 (1.14) 0.050 (1.27) TP E1 E N28.45 (JEDEC MS-018AB ISSUE A) 0.013 (0.33) 0.021 (0.53) 0.025 (0.64) MIN VIEW “A” TYP. NOTES: 1. Controlling dimension: INCH. Converted millimeter dimensions are not necessarily exact. 2. Dimensions and tolerancing per ANSI Y14.5M-1982. 3. Dimensions D1 and E1 do not include mold protrusions. Allowable mold protrusion is 0.010 inch (0.25mm) per side. 4. To be measured at seating plane -C- contact point. 5. Centerline to be determined where center leads exit plastic body. 6. “N” is the number of terminal positions. 10