ATV0000CE16

Light Touch Switches/EVPAD
10 mm Square Center Space Long Travel SMD
Light Touch Switches
Type:
EVPAD
■ Features
● The open center space allows for flexibility in choosing a LED
Up to a 4.2-mm diameter chip LED can be mounted.
● Provides an excellent operational feel.
• Crisp tactile feedback
• Long stroke (1 mm)
● Supports auto reflow soldering.
■ Recommended Applications
● Control switches for automotive electronic equipment,
such as car audio systems and heater control panels
■ Explanation of Part Numbers
1
2
3
4
5
E
V
P
A
D
Product Code
6
7
Type
8
9
Height
6th
K
Terminal
6 Terminals
■ Specifications
Type
Snap action/Push-on type SPST
Rating
Contact Resistance
Electrical
Insulation Resistance
Dielectric Withstanding Voltage
Bouncing
Operating Force
10 µA 2 Vdc to 50 mA 12 Vdc (Resistive load)
100 m액 max.
100 M액 min. (at 100 Vdc)
250 Vac for 1 minute
10 ms max. (ON, OFF)
4.0 N±0.8 N
Mechanical
Travel
Endurance
Operating Life
Operating Temperature
Storage Temperature
Minimum Quantity/Packing Unit
Quantity/Carton
1.0 mm±0.15 mm
100000 cycles min.
–40 °C to +85 °C
–40 °C to +85 °C (Bulk)
–20 °C to +60 °C (Taping)
1000 pcs. Embossed Taping (Reel Pack)
5000 pcs.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00
Oct. 2012
Light Touch Switches/EVPAD
■ Dimensions in mm (not to scale)
(Embossed Taping)
LED implementation position
9.8
.2
φ4 .5
φ4
0.8
3.2
B1
B2
A2
A4
0.8
0.8
10.15
9.8
0.8
φ7
A3
A1
0.5 max.
(Plastic projection)
EVPADK04K
+0
10.35–0.4
A1,A2,A3,A4
11.3±0.1
8.4±0.1
A1
A3
B1
1.2±0.1
3.2±0.1
1.2±0.1
1.2±0.1
0.7
4.7
3.2+0.2
–0.1
LED implementation area
B2
A2
A4
B1,B2
Circuit Diagram
PWB land pattern for reference
(Precautions for pattern design)
✽ Note that the terminals are exposed at the sections shaded with "
"
✽ Establish electrical connection at A1, A2, A3, and A4 to improve the contact performance.
■ Recommended Reflow Soldering Conditions
Fan or Normal Temp.
Chip pocket
P2 P0
E
230
180
Tape width=16.0 mm
t1
Feeding hole
φD0
F
W
A
B
Operation Top (°C)
MAX.
260
● Embossed Carrier Taping
150
t2
1
Chip component
P1
Tape running direction
The delivered carrier tape shape is either 1 or 2.
(Normal Temp.)
90 to 30
Dimension t3 only applies to shape 2.
40 to 10
t2
t3
Soldering Time (s)
2
Unit: mm
Part No.
Height
EVPAD
4.6
A
B
W
F
10.7±0.2 10.7±0.2 16.0±0.3
E
P1
7.5±0.1 1.75±0.10 12.0±0.1
P2
P0
D0 Dia
2.0±0.1
4.0±0.1
_0
1.5+0.1
t1
t2
t3
0.40±0.05 4.8±0.2
5.8±2.0
● Standard Reel Dimensions in mm (not to scale)
T
E
Item
C
B
D
r
A
A
B
Rate (mm) φ380.0±2.0 φ80.0±1.0
W
C
D
E
φ13.0±0.5
φ21.0±1.0
2.0±0.5
Item
W
T
t
r
Rate (mm)
17.5±0.5
21.5±1.0
—
—
t
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00
Oct. 2012
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