ATK0000CE41

Light Touch Switches/EVPAV
2.8 mm҂2.3 mm Side-operational Edge Mount
Light Touch Switches
Type:
EVPAV
■ Features
● External dimensions : 2.8 mm҂2.3 mm (Excluding the
push plate), Height 1.95 mm (Printed circuit board
being as low as 0.975 mm)
● Improved soldering strength in the operating direction
■ Recommended Applications
● Operation switches for portable electronic equipment
(Mobile phones, Digital still cameras, Camcorders
Portable audio players, etc.)
■ Explanation of Part Numbers
1
2
3
4
5
E
V
P
A
V
Product Code
6
7
8
9
Type
■ Specifications
Type
Snap action / Push-on type SPST
Rating
10 µA 2 Vdc to 20 mA 15 Vdc (Resistive load)
Contact Resistance
Electrical
500 m액 max.
Insulation Resistance
50 M액 min. (at 100 Vdc)
Dielectric Withstanding Voltage
250 Vac (1 minute)
Bouncing
10 ms max. (ON, OFF)
Operating Force
1.6 N
Mechanical
Push Travel
Push Strength
50 N (15 seconds)
Endurance
Operating Life
300000 cycles min.
0.13 mm
Operating Temperature
–40 °C to +85 °C
–40 °C to +85 °C (Bulk)
–20 °C to +60 °C (Taping)
Storage Temperature
Minimum Quantity/Packing Unit
8000 pcs. Embossed Taping (Reel Pack)
Quantity/Carton
40000 pcs.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
– ES106 –
00 Oct. 2012
Light Touch Switches/EVPAV
■ Dimensions in mm (not to scale)
General dimension tolerance : ± 0.1
( )dimensions are reference dimensions.
This reference specifications are subject to change.
(1.63)
EVPAV
1
3
2
4
This product is designed to be smaller
than the conventional type, which lowered
the film peel off strength. Therefore please
avoid to apply force to a push plate from
side, or/and avoid set-knob to touch push
plate during insertion to a set-case.
0.975±0.200
2.3±0.2
✽1 These dimensions are
from the outer shape
to the center of push plate.
✽2 These dimensions are
from the center of datum A.
φ0.6
Push plate
2.00±0.15
0.65±0.15
3.20±0.05
0.65
✽1)1.4±0.2
0.92±0.05
1.50±0.05
3
(1.88)
(2.8)
0.65±0.05
0.40±0.05
2
0.65
(0.98)
1.93±0.15
0.3
1
4
Push plate side
0.45±0.05
1.42±0.05
(φ0.75)
Adhesive
✽2) 1.00±0.08
1.95
2.8
0.9
✽2) 1.00±0.08
A
✽1) 0.975±0.200
Circuit Diagram
Soldering thickness t=0.1±0.02
PWB land pattern for reference
✻ Height from surface of PCB : 0.975 mm
■ Recommended Reflow Soldering Conditions
B
150
D
Chip
pocket
E
F
I
H
230
180
A
L
C
Operation Top (°C)
Feeding hole
φG
Fan or Normal Temp.
t
Tape width=8.0 mm
MAX.
260
K
J
● Embossed Carrier Taping
Tape running direction
Taping condition : Lack of products in the middle of taping should be
one MAX, but total quantity specified in the
specifications should be secured.
Peeling off strength of top tape : It should be within 0.2N to 1. ON at
165 degree in peeling off angle.
Joint of carrier tape : One joint per one reel may exist.
(Normal Temp.)
90±30
40±10
Soldering Time (s)
Unit: mm
Part No.
Height
EVPAV
1.95
A
B
C
8.0±0.3 1.75±0.10 3.5±0.1
D
E
F
4.0±0.1
4.0±0.1
2.0±0.1
G
1.5
+0.1
0
H
3.1±0.2
I
J
K
2.8±0.2 1.35±0.20 2.7±0.2
L
t
(6.25)
0.3±0.1
● Standard Reel Dimensions in mm (not to scale)
G
Item
E
B
Rate (mm) φ380.0±2.0 φ80.0±1.0
Item
F
G
Rate (mm)
9.4±1.0
13.4±1.0
B
C
D
A
A
C
D
E
φ13.0±0.5
φ21.0±1.0
2.0±0.5
F
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
– ES107 –
00 Oct. 2012
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