Light Touch Switches/EVPAV 2.8 mm҂2.3 mm Side-operational Edge Mount Light Touch Switches Type: EVPAV ■ Features ● External dimensions : 2.8 mm҂2.3 mm (Excluding the push plate), Height 1.95 mm (Printed circuit board being as low as 0.975 mm) ● Improved soldering strength in the operating direction ■ Recommended Applications ● Operation switches for portable electronic equipment (Mobile phones, Digital still cameras, Camcorders Portable audio players, etc.) ■ Explanation of Part Numbers 1 2 3 4 5 E V P A V Product Code 6 7 8 9 Type ■ Specifications Type Snap action / Push-on type SPST Rating 10 µA 2 Vdc to 20 mA 15 Vdc (Resistive load) Contact Resistance Electrical 500 m액 max. Insulation Resistance 50 M액 min. (at 100 Vdc) Dielectric Withstanding Voltage 250 Vac (1 minute) Bouncing 10 ms max. (ON, OFF) Operating Force 1.6 N Mechanical Push Travel Push Strength 50 N (15 seconds) Endurance Operating Life 300000 cycles min. 0.13 mm Operating Temperature –40 °C to +85 °C –40 °C to +85 °C (Bulk) –20 °C to +60 °C (Taping) Storage Temperature Minimum Quantity/Packing Unit 8000 pcs. Embossed Taping (Reel Pack) Quantity/Carton 40000 pcs. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. – ES106 – 00 Oct. 2012 Light Touch Switches/EVPAV ■ Dimensions in mm (not to scale) General dimension tolerance : ± 0.1 ( )dimensions are reference dimensions. This reference specifications are subject to change. (1.63) EVPAV 1 3 2 4 This product is designed to be smaller than the conventional type, which lowered the film peel off strength. Therefore please avoid to apply force to a push plate from side, or/and avoid set-knob to touch push plate during insertion to a set-case. 0.975±0.200 2.3±0.2 ✽1 These dimensions are from the outer shape to the center of push plate. ✽2 These dimensions are from the center of datum A. φ0.6 Push plate 2.00±0.15 0.65±0.15 3.20±0.05 0.65 ✽1)1.4±0.2 0.92±0.05 1.50±0.05 3 (1.88) (2.8) 0.65±0.05 0.40±0.05 2 0.65 (0.98) 1.93±0.15 0.3 1 4 Push plate side 0.45±0.05 1.42±0.05 (φ0.75) Adhesive ✽2) 1.00±0.08 1.95 2.8 0.9 ✽2) 1.00±0.08 A ✽1) 0.975±0.200 Circuit Diagram Soldering thickness t=0.1±0.02 PWB land pattern for reference ✻ Height from surface of PCB : 0.975 mm ■ Recommended Reflow Soldering Conditions B 150 D Chip pocket E F I H 230 180 A L C Operation Top (°C) Feeding hole φG Fan or Normal Temp. t Tape width=8.0 mm MAX. 260 K J ● Embossed Carrier Taping Tape running direction Taping condition : Lack of products in the middle of taping should be one MAX, but total quantity specified in the specifications should be secured. Peeling off strength of top tape : It should be within 0.2N to 1. ON at 165 degree in peeling off angle. Joint of carrier tape : One joint per one reel may exist. (Normal Temp.) 90±30 40±10 Soldering Time (s) Unit: mm Part No. Height EVPAV 1.95 A B C 8.0±0.3 1.75±0.10 3.5±0.1 D E F 4.0±0.1 4.0±0.1 2.0±0.1 G 1.5 +0.1 0 H 3.1±0.2 I J K 2.8±0.2 1.35±0.20 2.7±0.2 L t (6.25) 0.3±0.1 ● Standard Reel Dimensions in mm (not to scale) G Item E B Rate (mm) φ380.0±2.0 φ80.0±1.0 Item F G Rate (mm) 9.4±1.0 13.4±1.0 B C D A A C D E φ13.0±0.5 φ21.0±1.0 2.0±0.5 F Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. – ES107 – 00 Oct. 2012