Data Sheet

BAS70 series;
1PS7xSB70 series
General-purpose Schottky diodes
Rev. 09 — 13 January 2010
Product data sheet
1. Product profile
1.1 General description
General-purpose Schottky diodes in small Surface-Mounted Device (SMD) plastic
packages.
Table 1.
Product overview
Type number
Package
Configuration
NXP
JEITA
1PS76SB70
SOD323
SC-76
single diode
1PS79SB70
SOD523
SC-79
single diode
BAS70
SOT23
-
single diode
BAS70H
SOD123F
-
single diode
BAS70L
SOD882
-
single diode
BAS70W
SOT323
SC-70
single diode
BAS70-04
SOT23
-
dual series
BAS70-04W
SOT323
SC-70
dual series
BAS70-05
SOT23
-
dual common cathode
BAS70-05W
SOT323
SC-70
dual common cathode
BAS70-06
SOT23
-
dual common anode
BAS70-06W
SOT323
SC-70
dual common anode
BAS70-07
SOT143B
-
dual isolated
BAS70-07S
SOT363
SC-88
dual isolated
BAS70-07V
SOT666
-
dual isolated
BAS70VV
SOT666
-
triple isolated
BAS70XY
SOT363
SC-88
quadruple; 2 series
1.2 Features
„ High switching speed
„ High breakdown voltage
„ Low leakage current
„ Low capacitance
1.3 Applications
„ Ultra high-speed switching
„ Voltage clamping
BAS70 series; 1PS7xSB70 series
NXP Semiconductors
General-purpose Schottky diodes
1.4 Quick reference data
Table 2.
Symbol
Quick reference data
Parameter
Conditions
Min
Typ
Max
Unit
-
-
70
mA
Per diode
forward current
IF
VF
forward voltage
VR
reverse voltage
[1]
[1]
IF = 1 mA
-
-
410
mV
-
-
70
V
Pulse test: tp ≤ 300 μs; δ ≤ 0.02.
2. Pinning information
Table 3.
Pin
Pinning
Description
Simplified outline
Symbol
BAS70H; 1PS76SB70; 1PS79SB70
1
cathode
2
anode
[1]
1
1
2
2
sym001
001aab540
BAS70L
1
cathode
2
anode
[1]
1
1
2
2
sym001
Transparent
top view
BAS70; BAS70W
1
anode
2
not connected
3
cathode
3
3
2
n.c.
1
006aaa436
1
2
006aaa144
BAS70-04; BAS70-04W
1
anode (diode 1)
2
cathode (diode 2)
3
cathode (diode 1),
anode (diode 2)
3
3
1
2
006aaa437
1
2
006aaa144
BAS70_1PS7XSB70_SER_9
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 09 — 13 January 2010
2 of 20
NXP Semiconductors
BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
Table 3.
Pin
Pinning …continued
Description
Simplified outline
Symbol
BAS70-05; BAS70-05W
1
anode (diode 1)
2
anode (diode 2)
3
cathode (diode 1),
cathode (diode 2)
3
3
1
2
006aaa438
1
2
006aaa144
BAS70-06; BAS70-06W
1
cathode (diode 1)
2
cathode (diode 2)
3
anode (diode 1),
anode (diode 2)
3
3
1
2
006aaa439
1
2
006aaa144
BAS70-07
1
cathode (diode 1)
2
cathode (diode 2)
3
anode (diode 2)
4
anode (diode 1)
4
1
3
4
2
1
3
2
006aaa434
BAS70-07S; BAS70-07V
1
anode (diode 1)
2
not connected
3
cathode (diode 2)
4
anode (diode 2)
5
not connected
6
cathode (diode 1)
6
5
4
1
2
3
6
5
4
1
2
3
006aaa440
001aab555
BAS70VV
1
anode (diode 1)
2
anode (diode 2)
3
anode (diode 3)
4
cathode (diode 3)
5
cathode (diode 2)
6
cathode (diode 1)
BAS70_1PS7XSB70_SER_9
Product data sheet
6
1
5
2
4
3
6
5
1
2
4
3
sym046
© NXP B.V. 2010. All rights reserved.
Rev. 09 — 13 January 2010
3 of 20
BAS70 series; 1PS7xSB70 series
NXP Semiconductors
General-purpose Schottky diodes
Table 3.
Pinning …continued
Pin
Description
Simplified outline
Symbol
BAS70XY
1
anode (diode 1)
2
cathode (diode 2)
3
anode (diode 3),
cathode (diode 4)
4
anode (diode 4)
5
cathode (diode 3)
6
cathode (diode 1),
anode (diode 2)
[1]
6
5
4
1
2
3
6
5
4
1
2
3
006aaa256
The marking bar indicates the cathode.
3. Ordering information
Table 4.
Ordering information
Type number
1PS76SB70
Package
Name
Description
Version
SC-76
plastic surface-mounted package; 2 leads
SOD323
1PS79SB70
SC-79
plastic surface-mounted package; 2 leads
SOD523
BAS70
-
plastic surface-mounted package; 3 leads
SOT23
BAS70H
-
plastic surface-mounted package; 2 leads
SOD123F
BAS70L
-
leadless ultra small plastic package; 2 terminals;
body 1.0 × 0.6 × 0.5 mm
SOD882
BAS70W
SC-70
plastic surface-mounted package; 3 leads
SOT323
BAS70-04
-
plastic surface-mounted package; 3 leads
SOT23
BAS70-04W
SC-70
plastic surface-mounted package; 3 leads
SOT323
BAS70-05
-
plastic surface-mounted package; 3 leads
SOT23
BAS70-05W
SC-70
plastic surface-mounted package; 3 leads
SOT323
BAS70-06
-
plastic surface-mounted package; 3 leads
SOT23
BAS70-06W
SC-70
plastic surface-mounted package; 3 leads
SOT323
BAS70-07
-
plastic surface-mounted package; 4 leads
SOT143B
BAS70-07S
SC-88
plastic surface-mounted package; 6 leads
SOT363
BAS70-07V
-
plastic surface-mounted package; 6 leads
SOT666
BAS70VV
-
plastic surface-mounted package; 6 leads
SOT666
BAS70XY
SC-88
plastic surface-mounted package; 6 leads
SOT363
BAS70_1PS7XSB70_SER_9
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 09 — 13 January 2010
4 of 20
BAS70 series; 1PS7xSB70 series
NXP Semiconductors
General-purpose Schottky diodes
4. Marking
Table 5.
Marking codes
Type number
Marking code[1]
Type number
Marking code[1]
1PS76SB70
S2
BAS70-05W
75*
1PS79SB70
G
BAS70-06
76*
BAS70
73*
BAS70-06W
76*
BAS70H
AH
BAS70-07
77*
BAS70L
S8
BAS70-07S
77*
BAS70W
73*
BAS70-07V
77
BAS70-04
74*
BAS70VV
N1
BAS70-04W
74*
BAS70XY
70*
BAS70-05
75*
-
-
[1]
* = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
5. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
-
70
V
-
70
mA
-
70
mA
-
100
mA
Per diode
VR
reverse voltage
IF
forward current
IFRM
repetitive peak forward
current
tp ≤ 1 s; δ ≤ 0.5
IFSM
non-repetitive peak forward
current
tp ≤ 10 ms
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
−65
+150
°C
Tstg
storage temperature
−65
+150
°C
[1]
Tj = 25 °C prior to surge.
BAS70_1PS7XSB70_SER_9
Product data sheet
[1]
© NXP B.V. 2010. All rights reserved.
Rev. 09 — 13 January 2010
5 of 20
BAS70 series; 1PS7xSB70 series
NXP Semiconductors
General-purpose Schottky diodes
6. Thermal characteristics
Table 7.
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
SOT23
-
-
500
K/W
SOT143B
-
-
500
K/W
Per device
Rth(j-a)
thermal resistance from
junction to ambient
in free air
[1]
SOT363 (BAS70-07S)
-
-
416
K/W
SOT666 (BAS70VV)
[2]
-
-
700
K/W
SOT666 (BAS70-07V)
[2]
-
-
416
K/W
SOD123F
[2]
-
-
330
K/W
SOD323
-
-
450
K/W
SOD523
[2]
-
-
450
K/W
SOD882
[2]
-
-
500
K/W
-
-
625
K/W
-
-
260
K/W
SOT323
Rth(j-sp)
thermal resistance from
junction to solder point
[3]
SOT363 (BAS70XY)
[1]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2]
Reflow soldering is the only recommended soldering method.
[3]
Soldering point at pins 2, 3, 5 and 6.
7. Characteristics
Table 8.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
IF = 1 mA
-
-
410
mV
IF = 10 mA
-
-
750
mV
IF = 15 mA
-
-
1
V
VR = 50 V
-
-
100
nA
VR = 70 V
-
-
10
μA
VR = 0 V; f = 1 MHz
-
-
2
pF
Per diode
VF
IR
Cd
[1]
[1]
forward voltage
reverse current
diode capacitance
Pulse test: tp ≤ 300 μs; δ ≤ 0.02.
BAS70_1PS7XSB70_SER_9
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 09 — 13 January 2010
6 of 20
BAS70 series; 1PS7xSB70 series
NXP Semiconductors
General-purpose Schottky diodes
mra803
102
IF
(mA)
mra805
102
IR
(μA)
(1)
10
10
(2)
1
1
10−1
10−1
10−2
(1)
10−2
(2)
0
(3)
(3)
(4)
0.2
0.4
0.6
0.8
1
10−3
0
20
40
60
80
VR (V)
VF (V)
(1) Tamb = 125 °C
(1) Tamb = 125 °C
(2) Tamb = 85 °C
(2) Tamb = 85 °C
(3) Tamb = 25 °C
(3) Tamb = 25 °C
(4) Tamb = −40 °C
Fig 1.
Forward current as a function of forward
voltage; typical values
Fig 2.
mra802
103
Reverse current as a function of reverse
voltage; typical values
mra804
2
Cd
(pF)
rdif
(Ω)
1.5
102
1
10
0.5
1
10−1
1
10
IF (mA)
0
102
0
60
80
Tamb = 25 °C; f = 1 MHz
Differential forward resistance as a function of
forward current; typical values
Fig 4.
Diode capacitance as a function of reverse
voltage; typical values
BAS70_1PS7XSB70_SER_9
Product data sheet
40
VR (V)
f = 10 kHz
Fig 3.
20
© NXP B.V. 2010. All rights reserved.
Rev. 09 — 13 January 2010
7 of 20
BAS70 series; 1PS7xSB70 series
NXP Semiconductors
General-purpose Schottky diodes
8. Package outline
1.35
1.15
0.45
0.15
1
2.7
2.3
0.85
0.75
1.1
0.8
1
1.65 1.25
1.55 1.15
1.8
1.6
2
2
0.40
0.25
0.25
0.10
0.34
0.26
Dimensions in mm
Fig 5.
0.65
0.58
03-12-17
Package outline SOD323 (SC-76)
3.0
2.8
0.17
0.11
Dimensions in mm
Fig 6.
02-12-13
Package outline SOD523 (SC-79)
1.7
1.5
1.1
0.9
1.2
1.0
1
3
0.55
0.35
0.45
0.15
2.5 1.4
2.1 1.2
3.6
3.4
1
2
0.48
0.38
1.9
2
0.15
0.09
Dimensions in mm
Fig 7.
2.7
2.5
04-11-04
Package outline SOT23 (TO-236AB)
Dimensions in mm
Fig 8.
04-11-29
Package outline SOD123F
2.2
1.8
0.50
0.46
0.62
0.55
0.25
0.10
0.70
0.55
1.1
0.8
0.45
0.15
3
2
0.30
0.22
0.65
0.30
0.22
2.2 1.35
2.0 1.15
1
0.55
0.47
1
Package outline SOD882
0.4
0.3
0.25
0.10
1.3
03-04-17
Dimensions in mm
04-11-04
Fig 10. Package outline SOT323 (SC-70)
BAS70_1PS7XSB70_SER_9
Product data sheet
2
cathode marking on top side
Dimensions in mm
Fig 9.
1.02
0.95
© NXP B.V. 2010. All rights reserved.
Rev. 09 — 13 January 2010
8 of 20
BAS70 series; 1PS7xSB70 series
NXP Semiconductors
General-purpose Schottky diodes
3.0
2.8
2.2
1.8
1.1
0.9
1.9
6
4
2.5
2.1
1.1
0.8
5
4
2
3
0.45
0.15
3
0.45
0.15
1.4
1.2
1
2.2 1.35
2.0 1.15
pin 1
index
2
0.88
0.78
1
0.48
0.38
0.15
0.09
0.25
0.10
0.3
0.2
0.65
1.3
1.7
Dimensions in mm
04-11-16
Fig 11. Package outline SOT143B
Dimensions in mm
06-03-16
Fig 12. Package outline SOT363 (SC-88)
1.7
1.5
6
0.6
0.5
5
4
0.3
0.1
1.7
1.5
1.3
1.1
pin 1 index
1
2
3
0.27
0.17
0.5
0.18
0.08
1
Dimensions in mm
04-11-08
Fig 13. Package outline SOT666
BAS70_1PS7XSB70_SER_9
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 09 — 13 January 2010
9 of 20
BAS70 series; 1PS7xSB70 series
NXP Semiconductors
General-purpose Schottky diodes
9. Packing information
Table 9.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package
Description
Packing quantity
3000 4000 8000 10000
1PS76SB70
SOD323
4 mm pitch, 8 mm tape and reel
-115
-
-
-135
1PS79SB70
SOD523
2 mm pitch, 8 mm tape and reel
-
-
-315
-
4 mm pitch, 8 mm tape and reel
-115
-
-
-135
4 mm pitch, 8 mm tape and reel
-215
-
-
-235
BAS70
SOT23
BAS70H
SOD123F 4 mm pitch, 8 mm tape and reel
-115
-
-
-135
BAS70L
SOD882
2 mm pitch, 8 mm tape and reel
-
-
-
-315
BAS70W
SOT323
4 mm pitch, 8 mm tape and reel
-115
-
-
-135
BAS70-04
SOT23
4 mm pitch, 8 mm tape and reel
-215
-
-
-235
BAS70-04W
SOT323
4 mm pitch, 8 mm tape and reel
-115
-
-
-135
BAS70-05
SOT23
4 mm pitch, 8 mm tape and reel
-215
-
-
-235
BAS70-05W
SOT323
4 mm pitch, 8 mm tape and reel
-115
-
-
-135
BAS70-06
SOT23
4 mm pitch, 8 mm tape and reel
-215
-
-
-235
BAS70-06W
SOT323
4 mm pitch, 8 mm tape and reel
-115
-
-
-135
BAS70-07
SOT143B 4 mm pitch, 8 mm tape and reel
-215
-
-
-235
4 mm pitch, 8 mm tape and reel; T1
[2]
-115
-
-
-135
4 mm pitch, 8 mm tape and reel; T2
[3]
-125
-
-
-165
2 mm pitch, 8 mm tape and reel
-
-
-315
-
4 mm pitch, 8 mm tape and reel
-
-115
-
-
2 mm pitch, 8 mm tape and reel
-
-
-315
-
BAS70-07S
BAS70-07V
BAS70VV
SOT363
SOT666
SOT666
4 mm pitch, 8 mm tape and reel
BAS70XY
SOT363
-
-115
-
-
4 mm pitch, 8 mm tape and reel; T1
[2]
-115
-
-
-135
4 mm pitch, 8 mm tape and reel; T2
[3]
-125
-
-
-165
[1]
For further information and the availability of packing methods, see Section 13.
[2]
T1: normal taping
[3]
T2: reverse taping
BAS70_1PS7XSB70_SER_9
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 09 — 13 January 2010
10 of 20
BAS70 series; 1PS7xSB70 series
NXP Semiconductors
General-purpose Schottky diodes
10. Soldering
3.05
2.80
2.10
1.60
solder lands
solder resist
1.65
0.95
0.50
0.60
occupied area
solder paste
0.50
(2×)
msa433
Dimensions in mm
Fig 14. Reflow soldering footprint SOD323 (SC-76)
5.00
4.40
1.40
solder lands
solder resist
occupied area
2.75 1.20
msa415
preferred transport direction during soldering
Dimensions in mm
Fig 15. Wave soldering footprint SOD323 (SC-76)
2.15
0.50 0.60
1.20
solder lands
solder paste
0.30
0.40
solder resist
occupied area
1.80
1.90
mgs343
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 16. Reflow soldering footprint SOD523 (SC-79)
BAS70_1PS7XSB70_SER_9
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 09 — 13 January 2010
11 of 20
BAS70 series; 1PS7xSB70 series
NXP Semiconductors
General-purpose Schottky diodes
2.90
2.50
solder lands
solder resist
2
0.85
1
2.70
1.30
3.00
0.85
3
occupied area
solder paste
0.60
(3x)
0.50 (3x)
0.60 (3x)
1.00
3.30
MSA439
Dimensions in mm
Fig 17. Reflow soldering footprint SOT23 (TO-236AB)
3.40
1.20 (2x)
solder lands
solder resist
occupied area
2
1
4.60 4.00 1.20
3
preferred transport direction during soldering
2.80
4.50
MSA427
Dimensions in mm
Fig 18. Wave soldering footprint SOT23 (TO-236AB)
BAS70_1PS7XSB70_SER_9
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 09 — 13 January 2010
12 of 20
BAS70 series; 1PS7xSB70 series
NXP Semiconductors
General-purpose Schottky diodes
4.4
4
2.9
1.6
solder lands
solder resist
2.1 1.6
1.1 1.2
solder paste
occupied area
1.1
(2×)
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 19. Reflow soldering footprint SOD123F
1.30
R = 0.05 (8×)
0.30
0.60 0.70 0.80
(2×) (2×) (2×)
0.90
solder lands
solder paste
solder resist
R = 0.05 (8×)
0.30
(2×)
0.40
(2×)
0.50
(2×)
occupied area
mbl872
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 20. Reflow soldering footprint SOD882
BAS70_1PS7XSB70_SER_9
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 09 — 13 January 2010
13 of 20
BAS70 series; 1PS7xSB70 series
NXP Semiconductors
General-purpose Schottky diodes
2.65
0.75
1.325
1.30
solder lands
2
solder paste
0.60
2.35 0.85
(3×)
0.50
(3×) 1.90
3
solder resist
occupied area
1
Dimensions in mm
0.55
(3×)
2.40
msa429
Dimensions in mm
Fig 21. Reflow soldering footprint SOT323 (SC-70)
4.60
4.00
1.15
2
3.65
3
2.10
2.70
solder lands
1
0.90
(2×)
solder resist
occupied area
Dimensions in mm
preferred transport direction during soldering
msa419
Dimensions in mm
Fig 22. Wave soldering footprint SOT323 (SC-70)
BAS70_1PS7XSB70_SER_9
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 09 — 13 January 2010
14 of 20
BAS70 series; 1PS7xSB70 series
NXP Semiconductors
General-purpose Schottky diodes
3.25
0.60 (3x)
0.50 (3x)
solder lands
0.60
(4x)
solder resist
4
3
2.70
occupied area
1.30 3.00
1
2
solder paste
msa441
0.90
1.00
2.50
Dimensions in mm
Fig 23. Reflow soldering footprint SOT143B
4.45
1.20 (3×)
4
3
1.15 4.00 4.60
solder lands
1
solder resist
2
occupied area
Dimensions in mm
1.00
3.40
preferred transport direction during soldering
msa422
Dimensions in mm
Fig 24. Wave soldering footprint SOT143B
BAS70_1PS7XSB70_SER_9
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 09 — 13 January 2010
15 of 20
BAS70 series; 1PS7xSB70 series
NXP Semiconductors
General-purpose Schottky diodes
2.65
0.60
(2×)
0.40 0.90 2.10
(2×)
2.35
0.50
(4×)
solder paste
solder lands
0.50
(4×)
solder resist
1.20
2.40
occupied area
MSA432
Dimensions in mm
Fig 25. Reflow soldering footprint SOT363 (SC-88)
1.5
solder lands
0.3 2.5
4.5
solder resist
occupied area
1.5
Dimensions in mm
1.3
1.3
preferred transport
direction during soldering
2.45
5.3
sot363_fw
Fig 26. Wave soldering footprint SOT363 (SC-88)
BAS70_1PS7XSB70_SER_9
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 09 — 13 January 2010
16 of 20
BAS70 series; 1PS7xSB70 series
NXP Semiconductors
General-purpose Schottky diodes
2.75
2.45
2.1
1.6
solder lands
0.4
(6×) 0.25
(2×)
0.538
2
1.7 1.075
0.3
(2×)
0.55
(2×)
placement area
solder paste
occupied area
0.325 0.375
(4×) (4×)
Dimensions in mm
1.7
0.45
(4×)
0.6
(2×)
0.5
(4×)
0.65
(2×)
sot666_fr
Reflow soldering is the only recommended soldering method.
Fig 27. Reflow soldering footprint SOT666
BAS70_1PS7XSB70_SER_9
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 09 — 13 January 2010
17 of 20
BAS70 series; 1PS7xSB70 series
NXP Semiconductors
General-purpose Schottky diodes
11. Revision history
Table 10.
Revision history
Document ID
Release date
BAS70_1PS7XSB70_SER_9 20100113
Modifications:
•
Data sheet status
Change notice
Supersedes
Product data sheet
-
BAS70_1PS7XSB70_SER_8
This data sheet was changed to reflect the new company name NXP Semiconductors,
including new legal definitions and disclaimers. No changes were made to the technical
content.
BAS70_1PS7XSB70_SER_8 20060504
Product data sheet
-
BAS70_1PS7XSB70_SER_7
BAS70_1PS7XSB70_SER_7 20050718
Product data sheet
-
1PS76SB70_2
1PS79SB70_1 BAS70H_1
BAS70L_1 BAS70-07V_1
BAS70VV_1 BAS70W_3
BAS70-07S_4
BAS70_SERIES_6
1PS76SB70_2
20040126
Product specification
-
1PS76SB70_1
1PS79SB70_1
19980716
Product specification
-
-
BAS70H_1
20050425
Product data sheet
-
-
BAS70L_1
20030520
Product specification
-
-
BAS70-07V_1
20020117
Product specification
-
-
BAS70VV_1
20040910
Product data sheet
-
-
BAS70W_3
19990326
Product specification
-
BAS70W_2
BAS70-07S_4
20030411
Product specification
-
BAS70_07S_3
BAS70_SERIES_6
20011011
Product specification
-
BAS70_5
BAS70_1PS7XSB70_SER_9
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 09 — 13 January 2010
18 of 20
NXP Semiconductors
BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
12. Legal information
12.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
12.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
12.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
BAS70_1PS7XSB70_SER_9
Product data sheet
© NXP B.V. 2010. All rights reserved.
Rev. 09 — 13 January 2010
19 of 20
NXP Semiconductors
BAS70 series; 1PS7xSB70 series
General-purpose Schottky diodes
14. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
10
11
12
12.1
12.2
12.3
12.4
13
14
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 4
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Thermal characteristics . . . . . . . . . . . . . . . . . . 6
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
Packing information . . . . . . . . . . . . . . . . . . . . 10
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 18
Legal information. . . . . . . . . . . . . . . . . . . . . . . 19
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 19
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Contact information. . . . . . . . . . . . . . . . . . . . . 19
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 13 January 2010
Document identifier: BAS70_1PS7XSB70_SER_9
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