PANASONIC 2SC5725

Transistors
2SC5725
Silicon NPN epitaxial planar type
For DC-DC converter
Unit: mm
0.40+0.10
–0.05
■ Features
0.16+0.10
–0.06
0.4±0.2
5˚
1.50+0.25
–0.05
2.8+0.2
–0.3
3
• Low collector-emitter saturation voltage VCE(sat)
• Mini type package, allowing downsizing of the equipment and
automatic insertion through the tape packing
(0.95) (0.95)
1.9±0.1
(0.65)
2
1
2.90+0.20
–0.05
■ Absolute Maximum Ratings Ta = 25°C
Unit
Collector-base voltage (Emitter open)
VCBO
20
V
Collector-emitter voltage (Base open)
VCEO
15
V
Emitter-base voltage (Collector open)
VEBO
5
V
Collector current
IC
2
A
Peak collector current
ICP
6
A
Collector power dissipation *
PC
600
mW
Junction temperature
Tj
150
°C
Storage temperature
Tstg
−55 to +150
°C
10˚
1.1+0.2
–0.1
Rating
1.1+0.3
–0.1
Symbol
0 to 0.1
Parameter
1: Base
2: Emitter
3: Collector
EIAJ: SC-59
Mini3-G1 Package
Marking Symbol: 3C
Note) *: Measure on the ceramic substrate at 15 mm × 15 mm × 0.6 mm
■ Electrical Characteristics Ta = 25°C ± 3°C
Parameter
Symbol
Collector-base voltage (Emitter open)
VCBO
IC = 10 µA, IE = 0
20
Collector-emitter voltage (Base open)
VCEO
IC = 1 mA, IB = 0
15
V
Emitter-base voltage (Collector open)
VEBO
IE = 10 µA, IC = 0
5
V
Collector-base cutoff current (Emitter open)
ICBO
VCB = 10 V, IE = 0
Forward current transfer ratio *
hFE1
VCE = 2 V, IC = 100 mA
200
hFE2
VCE = 2 V, IC = 1.5 A
120
VCE(sat)
IC = 0.5 A, IB = 25 mA
Collector-emitter saturation voltage *
Transition frequency
Collector output capacitance
(Common base, input open circuited)
fT
Cob
Conditions
Min
Typ
Max
Unit
V
0.1
µA
800

40
100
mV
IC = 1.5 A, IB = 30 mA
130
280
VCB = 10 V, IE = −50 mA, f = 200 MHz
280
VCB = 10 V, IE = 0, f = 1 MHz
15
MHz
25
pF
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *: Pulse measurement
Publication date: January 2003
SJC00188CED
1
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government
if any of the products or technologies described in this material and controlled under the "Foreign
Exchange and Foreign Trade Law" is to be exported or taken out of Japan.
(2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license.
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the
product or technologies as described in this material.
(4) The products described in this material are intended to be used for standard applications or general
electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment,
combustion equipment, life support systems and safety devices) in which exceptional quality and
reliability are required, or if the failure or malfunction of the products may directly jeopardize life or
harm the human body.
• Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without
notice for modification and/or improvement. At the final stage of your design, purchasing, or use of
the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that
the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of
incidence of break down and failure mode, possible to occur to semiconductor products. Measures
on the systems such as redundant design, arresting the spread of fire or preventing glitch are
recommended in order to prevent physical injury, fire, social damages, for example, by using the
products.
(7) When using products for which damp-proof packing is required, observe the conditions (including
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2002 JUL