CAT24C01 D

CAT24C01, CAT24C02,
CAT24C04, CAT24C08,
CAT24C16
1-Kb, 2-Kb, 4-Kb, 8-Kb and
16-Kb I2C CMOS Serial
EEPROM
www.onsemi.com
Description
The CAT24C01/02/04/08/16 are 1−Kb, 2−Kb, 4−Kb, 8−Kb and
16−Kb respectively CMOS Serial EEPROM devices organized
internally as 8/16/32/64 and 128 pages respectively of 16 bytes each.
All devices support both the Standard (100 kHz) as well as Fast
(400 kHz) I2C protocol.
Data is written by providing a starting address, then loading 1 to 16
contiguous bytes into a Page Write Buffer, and then writing all data to
non−volatile memory in one internal write cycle. Data is read by
providing a starting address and then shifting out data serially while
automatically incrementing the internal address count.
External address pins make it possible to address up to eight
CAT24C01 or CAT24C02, four CAT24C04, two CAT24C08 and one
CAT24C16 device on the same bus.
Features
•
•
•
•
•
•
•
•
•
•
Supports Standard and Fast I2C Protocol
1.7 V to 5.5 V Supply Voltage Range
16−Byte Page Write Buffer
Hardware Write Protection for Entire Memory
Schmitt Triggers and Noise Suppression Filters on I2C Bus Inputs
(SCL and SDA)
Low power CMOS Technology
More than 1,000,000 Program/Erase Cycles
100 Year Data Retention
Industrial and Extended Temperature Range
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
TDFN−8*
VP2 SUFFIX
CASE 511AK
UDFN8−EP
HU4 SUFFIX
CASE 517AZ
MSOP−8
Z SUFFIX
CASE 846AD
TSOT−23
TD SUFFIX
CASE 419AE
TSSOP−8
Y SUFFIX
CASE 948AL
WLCSP−4***
C4A SUFFIX
CASE 567DC
WLCSP−4**
C4U SUFFIX
CASE 567NX
SOIC−8
W SUFFIX
CASE 751BD
PDIP−8
L SUFFIX
CASE 646AA
WLCSP−5***
C5A SUFFIX
CASE 567DD
US8**
US SUFFIX
CASE 493
* The TDFN (VP2) package is not recommended for
new designs.
** Preliminary, please contact factory for availability.
*** WLCSP are available for the CAT24C04,
CAT24C08 and CAT24C16 only.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 21 of this data sheet.
This document contains information on some products that are still under development.
ON Semiconductor reserves the right to change or discontinue these products without
notice.
© Semiconductor Components Industries, LLC, 2016
May, 2016 − Rev. 30
1
Publication Order Number:
CAT24C01/D
CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16
PIN CONFIGURATIONS AND MARKING INFORMATION
VCC
Table 1. PIN FUNCTION
Pin Name†
A0, A1, A2
SCL
A2, A1, A0
CAT24Cxx
SDA
WP
VSS
Function
Device Address Input
SDA
Serial Data Input/Output
SCL
Serial Clock Input
WP
Write Protect Input
VCC
Power Supply
VSS
Ground
NC
No Connect
†The exposed pad for the TDFN/UDFN packages can be left floating
or connected to Ground.
Figure 1. Functional Symbol
CAT24C__
16 / 08 / 04 / 02 / 01
NC / NC / NC / A0 / A0
1
8
VCC
NC / NC / A1 / A1 / A1
2
7
WP
NC / A2 / A2 / A2 / A2
3
6
SCL
VSS
4
5
SDA
Pin 1
1
2
A
VCC
VSS
Pin 1
1
2
3
VSS
VCC
B
SDA
B
SCL
PDIP (L), SOIC (W), TSSOP (Y), MSOP (Z), US (US)**,
TDFN, (VP2)*, UDFN−EP (HU4) (Top View)
SDA
WLCSP−4***
(Top Views)
WP
SCL
WLCSP−5***
*** WLCSP are available for the CAT24C04,
CAT24C08 and CAT24C16 only.
* The TDFN (VP2) package is not recommended for new designs.
** Preliminary, please contact factory for availability.
TOP MARKING FOR WLCSP
Pin 1
Pin 1
(Ball Down)
SCL
1
VSS
2
SDA
3
5
4
WP
X
YM
VCC
WLCSP−4
TSOT−23 (TD) (Top View)
X = Specific Device
X = Code
4 or R = 24C04
8 or T = 24C08
6 or V = 24C16
X
YM
WLCSP−5
Y = Production Year (Last Digit)
M = Production Month (1−9, O, N, D)
www.onsemi.com
2
A
C
CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameters
Ratings
Units
Storage Temperature
−65 to +150
°C
Voltage on any pin with respect to Ground (Note 1)
−0.5 to +6.5
V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. During input transitions, voltage undershoot on any pin should not exceed −1 V for more than 20 ns. Voltage overshoot on pins A0, A1, A2
and WP should not exceed VCC + 1 V for more than 20 ns, while voltage on the I2C bus pins, SCL and SDA, should not exceed the absolute
maximum ratings, irrespective of VCC.
Table 3. RELIABILITY CHARACTERISTICS (Note 2)
Symbol
Parameter
NEND (Note 3)
TDR
Endurance
Min
Units
1,000,000
Program / Erase Cycles
100
Years
Data Retention
2. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC−Q100
and JEDEC test methods.
3. Page Mode, VCC = 5 V, 25°C.
Table 4. D.C. OPERATING CHARACTERISTICS
(VCC = 1.8 V to 5.5 V, TA = −40°C to +125°C and VCC = 1.7 V to 5.5 V, TA = −40°C to +85°C, unless otherwise specified.)
Max
Units
ICCR
Read Current
Read, fSCL = 400 kHz
1
mA
ICCW
Write Current
Write, fSCL = 400 kHz
2
mA
TA = −40°C to +85°C
VCC ≤ 3.3 V
1
mA
TA = −40°C to +85°C
VCC > 3.3 V
3
TA = −40°C to +125°C
5
Symbol
ISB
Parameter
Standby Current
IL
I/O Pin Leakage
VIL
Input Low Voltage
VIH
Input High Voltage
VOL
Output Low
Voltage
Test Conditions
All I/O Pins at GND or VCC
Min
2
mA
−0.5
0.3 x VCC
V
A0, A1, A2 and WP
0.7 x VCC
VCC + 0.5
V
SCL and SDA
0.7 x VCC
5.5
Pin at GND or VCC
VCC > 2.5 V, IOL = 3 mA
0.4
VCC < 2.5 V, IOL = 1 mA
0.2
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
www.onsemi.com
3
CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16
Table 5. PIN IMPEDANCE CHARACTERISTICS
(VCC = 1.8 V to 5.5 V, TA = −40°C to +125°C and VCC = 1.7 V to 5.5 V, TA = −40°C to +85°C, unless otherwise specified.)
Symbol
CIN (Note 4)
Parameter
SDA Pin Capacitance
Conditions
Max
Units
VIN = 0 V, f = 1.0 MHz, VCC = 5.0 V
8
pF
6
pF
VIN < VIH, VCC = 5.5 V
130
mA
VIN < VIH, VCC = 3.3 V
120
VIN < VIH, VCC = 1.7 V
80
VIN > VIH
2
VIN < VIH, VCC = 5.5 V
50
VIN < VIH, VCC = 3.3 V
35
VIN < VIH, VCC = 1.7 V
25
VIN > VIH
2
Other Pins
IWP (Note 5)
IA (Note 5)
WP Input Current
Address Input Current
(A0, A1, A2)
Product Rev H: CAT24C02
Product Rev K: CAT24C04,
CAT24C08, CAT24C16
mA
4. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC−Q100
and JEDEC test methods.
5. When not driven, the WP, A0, A1 and A2 pins are pulled down to GND internally. For improved noise immunity, the internal pull−down is
relatively strong; therefore the external driver must be able to supply the pull−down current when attempting to drive the input HIGH. To
conserve power, as the input level exceeds the trip point of the CMOS input buffer (~ 0.5 x VCC), the strong pull−down reverts to a weak
current source.
Table 6. A.C. CHARACTERISTICS
(Note 6) (VCC = 1.8 V to 5.5 V, TA = −40°C to +125°C and VCC = 1.7 V to 5.5 V, TA = −40°C to +85°C, unless otherwise specified.)
Standard
FSCL
tHD:STA
Min
Parameter
Symbol
Clock Frequency
Max
Fast
Min
100
START Condition Hold Time
Max
Units
400
kHz
4
0.6
ms
tLOW
Low Period of SCL Clock
4.7
1.3
ms
tHIGH
High Period of SCL Clock
4
0.6
ms
4.7
0.6
ms
tSU:STA
START Condition Setup Time
tHD:DAT
Data In Hold Time
0
0
ms
tSU:DAT
Data In Setup Time
250
100
ns
tR
SDA and SCL Rise Time
1000
300
ns
tF (Note 6)
SDA and SCL Fall Time
300
300
ns
tSU:STO
STOP Condition Setup Time
tBUF
Bus Free Time Between STOP and START
tAA
SCL Low to Data Out Valid
tDH
Data Out Hold Time
Ti (Note 6)
4
0.6
ms
4.7
1.3
ms
3.5
100
Noise Pulse Filtered at SCL and SDA Inputs
0.9
100
100
ms
ns
100
ns
tSU:WP
WP Setup Time
0
0
ms
tHD:WP
WP Hold Time
2.5
2.5
ms
tWR
tPU (Notes 7, 8)
Write Cycle Time
5
5
ms
Power−up to Ready Mode
1
1
ms
6. Test conditions according to “AC Test Conditions” table.
7. Tested initially and after a design or process change that affects this parameter.
8. tPU is the delay between the time VCC is stable and the device is ready to accept commands.
www.onsemi.com
4
CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16
Table 7. A.C. TEST CONDITIONS
Input Drive Levels
0.2 x VCC to 0.8 x VCC
Input Rise and Fall Time
v 50 ns
Input Reference Levels
0.3 x VCC, 0.7 x VCC
Output Reference Level
0.5 x VCC
Output Test Load
Current Source IOL = 3 mA (VCC w 2.5 V); IOL = 1 mA (VCC < 2.5 V); CL = 100 pF
Power−On Reset (POR)
Each CAT24Cxx* incorporates Power−On Reset (POR)
circuitry which protects the internal logic against powering
up in the wrong state.
A CAT24Cxx device will power up into Standby mode
after VCC exceeds the POR trigger level and will power
down into Reset mode when VCC drops below the POR
trigger level. This bi−directional POR feature protects the
device against ‘brown−out’ failure following a temporary
loss of power.
*For common features, the CAT24C01/02/04/08/16 will be
referred to as CAT24Cxx.
During data transfer, the SDA line must remain stable
while the SCL line is high. An SDA transition while SCL is
high will be interpreted as a START or STOP condition
(Figure 2). The START condition precedes all commands. It
consists of a HIGH to LOW transition on SDA while SCL
is HIGH. The START acts as a ‘wake−up’ call to all
receivers. Absent a START, a Slave will not respond to
commands. The STOP condition completes all commands.
It consists of a LOW to HIGH transition on SDA while SCL
is HIGH.
NOTE: The I/O pins of CAT24Cxx do not obstruct the SCL
and SDA lines if the VCC supply is switched off. During
power−up, the SCL and SDA pins (connected with pull−up
resistors to VCC) will follow the VCC monotonically from
VSS (0 V) to nominal VCC value, regardless of pull−up
resistor value. The delta between the VCC and the
instantaneous voltage levels during power ramping will be
determined by the relation between bus time constant
(determined by pull−up resistance and bus capacitance) and
actual VCC ramp rate.
Pin Description
SCL: The Serial Clock input pin accepts the Serial Clock
generated by the Master.
SDA: The Serial Data I/O pin receives input data and
transmits data stored in EEPROM. In transmit mode, this pin
is open drain. Data is acquired on the positive edge, and is
delivered on the negative edge of SCL.
A0, A1 and A2: The Address inputs set the device address
when cascading multiple devices. When not driven, these
pins are pulled LOW internally.
WP: The Write Protect input pin inhibits all write
operations, when pulled HIGH. When not driven, this pin is
pulled LOW internally.
Device Addressing
The Master initiates data transfer by creating a START
condition on the bus. The Master then broadcasts an 8−bit
serial Slave address. For normal Read/Write operations, the
first 4 bits of the Slave address are fixed at 1010 (Ah). The
next 3 bits are used as programmable address bits when
cascading multiple devices and/or as internal address bits.
The last bit of the slave address, R/W, specifies whether a
Read (1) or Write (0) operation is to be performed. The 3
address space extension bits are assigned as illustrated in
Figure 3. A2, A1 and A0 must match the state of the external
address pins, and a10, a9 and a8 are internal address bits.
Functional Description
The CAT24Cxx supports the Inter−Integrated Circuit
(I2C) Bus data transmission protocol, which defines a device
that sends data to the bus as a transmitter and a device
receiving data as a receiver. Data flow is controlled by a
Master device, which generates the serial clock and all
START and STOP conditions. The CAT24Cxx acts as a
Slave device. Master and Slave alternate as either
transmitter or receiver.
Acknowledge
After processing the Slave address, the Slave responds
with an acknowledge (ACK) by pulling down the SDA line
during the 9th clock cycle (Figure 4). The Slave will also
acknowledge the address byte and every data byte presented
in Write mode. In Read mode the Slave shifts out a data byte,
and then releases the SDA line during the 9th clock cycle. As
long as the Master acknowledges the data, the Slave will
continue transmitting. The Master terminates the session by
not acknowledging the last data byte (NoACK) and by
issuing a STOP condition. Bus timing is illustrated in
Figure 5.
I2C Bus Protocol
The I2C bus consists of two ‘wires’, SCL and SDA. The
two wires are connected to the VCC supply via pull−up
resistors. Master and Slave devices connect to the 2−wire
bus via their respective SCL and SDA pins. The transmitting
device pulls down the SDA line to ‘transmit’ a ‘0’ and
releases it to ‘transmit’ a ‘1’.
Data transfer may be initiated only when the bus is not
busy (see AC Characteristics).
www.onsemi.com
5
CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16
SCL
SDA
START
CONDITION
STOP
CONDITION
Figure 2. Start/Stop Timing
1
0
1
0
A2
A1
A0
R/W
CAT24C01 and CAT24C02
1
0
1
0
A2
A1
a8
R/W
CAT24C04
1
0
1
0
A2
a9
a8
R/W
CAT24C08
1
0
1
0
a10
a9
a8
R/W
CAT24C16
Figure 3. Slave Address Bits
BUS RELEASE DELAY (TRANSMITTER)
SCL FROM
MASTER
1
BUS RELEASE DELAY
(RECEIVER)
8
9
DATA OUTPUT
FROM TRANSMITTER
DATA OUTPUT
FROM RECEIVER
ACK SETUP (w tSU:DAT)
ACK DELAY (v tAA)
START
Figure 4. Acknowledge Timing
tF
tHIGH
tR
tLOW
tLOW
SCL
tSU:STA
tHD:DAT
tHD:SDA
tSU:DAT
tSU:STO
SDA IN
tAA
tDH
SDA OUT
Figure 5. Bus Timing
www.onsemi.com
6
tBUF
CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16
WRITE OPERATIONS
Byte Write
sixteen bytes are received and the STOP condition has been
sent by the Master, the internal Write cycle begins. At this
point all received data is written to the CAT24Cxx in a single
write cycle.
In Byte Write mode, the Master sends the START
condition and the Slave address with the R/W bit set to zero
to the Slave. After the Slave generates an acknowledge, the
Master sends the byte address that is to be written into the
address pointer of the CAT24Cxx. After receiving another
acknowledge from the Slave, the Master transmits the data
byte to be written into the addressed memory location. The
CAT24Cxx device will acknowledge the data byte and the
Master generates the STOP condition, at which time the
device begins its internal Write cycle to nonvolatile memory
(Figure 6). While this internal cycle is in progress (tWR), the
SDA output will be tri−stated and the CAT24Cxx will not
respond to any request from the Master device (Figure 7).
Acknowledge Polling
The acknowledge (ACK) polling routine can be used to
take advantage of the typical write cycle time. Once the stop
condition is issued to indicate the end of the host’s write
operation, the CAT24Cxx initiates the internal write cycle.
The ACK polling can be initiated immediately. This
involves issuing the start condition followed by the slave
address for a write operation. If the CAT24Cxx is still busy
with the write operation, NoACK will be returned. If the
CAT24Cxx has completed the internal write operation, an
ACK will be returned and the host can then proceed with the
next read or write operation.
Page Write
The CAT24Cxx writes up to 16 bytes of data in a single
write cycle, using the Page Write operation (Figure 8). The
Page Write operation is initiated in the same manner as the
Byte Write operation, however instead of terminating after
the data byte is transmitted, the Master is allowed to send up
to fifteen additional bytes. After each byte has been
transmitted the CAT24Cxx will respond with an
acknowledge and internally increments the four low order
address bits. The high order bits that define the page address
remain unchanged. If the Master transmits more than sixteen
bytes prior to sending the STOP condition, the address
counter ‘wraps around’ to the beginning of page and
previously transmitted data will be overwritten. Once all
BUS ACTIVITY:
MASTER
S
T
A
R
T
Hardware Write Protection
With the WP pin held HIGH, the entire memory is
protected against Write operations. If the WP pin is left
floating or is grounded, it has no impact on the operation of
the CAT24Cxx. The state of the WP pin is strobed on the last
falling edge of SCL immediately preceding the first data
byte (Figure 9). If the WP pin is HIGH during the strobe
interval, the CAT24Cxx will not acknowledge the data byte
and the Write request will be rejected.
Delivery State
The CAT24Cxx is shipped erased, i.e., all bytes are FFh.
SLAVE
ADDRESS
ADDRESS
BYTE
DATA
BYTE
a7 − a 0
d7 − d 0
S
T
O
P
P
S
A
C
K
SLAVE
A
C
K
* For the CAT24C01 a7 = 0
Figure 6. Byte Write Sequence
www.onsemi.com
7
A
C
K
CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16
SCL
8th Bit
SDA
ACK
Byte n
tWR
STOP
CONDITION
START
CONDITION
ADDRESS
Figure 7. Write Cycle Timing
BUS ACTIVITY:
MASTER
S
T
A
R
T
DATA
BYTE
n
ADDRESS
BYTE
SLAVE
ADDRESS
DATA
BYTE
n+1
S
T
O
P
DATA
BYTE
n+P
S
P
A
C
K
SLAVE
n=1
P v 15
A
C
K
A
C
K
A
C
K
Figure 8. Page Write Sequence
ADDRESS
BYTE
DATA
BYTE
1
8
9
a7
a0
1
8
d7
d0
SCL
SDA
tSU:WP
WP
tHD:WP
Figure 9. WP Timing
www.onsemi.com
8
A
C
K
CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16
READ OPERATIONS
Immediate Read
CAT24Cxx acknowledges the byte address, the Master
device resends the START condition and the slave address,
this time with the R/W bit set to one. The CAT24Cxx then
responds with its acknowledge and sends the requested data
byte. The Master device does not acknowledge the data
(NoACK) but will generate a STOP condition (Figure 11).
Upon receiving a Slave address with the R/W bit set to ‘1’,
the CAT24Cxx will interpret this as a request for data
residing at the current byte address in memory. The
CAT24Cxx will acknowledge the Slave address, will
immediately shift out the data residing at the current address,
and will then wait for the Master to respond. If the Master
does not acknowledge the data (NoACK) and then follows
up with a STOP condition (Figure 10), the CAT24Cxx
returns to Standby mode.
Sequential Read
If during a Read session, the Master acknowledges the 1st
data byte, then the CAT24Cxx will continue transmitting
data residing at subsequent locations until the Master
responds with a NoACK, followed by a STOP (Figure 12).
In contrast to Page Write, during Sequential Read the
address count will automatically increment to and then
wrap−around at end of memory (rather than end of page). In
the CAT24C01, the internal address count will not wrap
around at the end of the 128 byte memory space.
Selective Read
Selective Read operations allow the Master device to
select at random any memory location for a read operation.
The Master device first performs a ‘dummy’ write operation
by sending the START condition, slave address and byte
address of the location it wishes to read. After the
BUS ACTIVITY:
MASTER
N
O
S
T
A
R
T
S
AT
CO
KP
SLAVE
ADDRESS
P
S
A
C
K
SLAVE
SCL
D ATA
BYTE
8
9
8th Bit
SDA
DATA OUT
NO ACK
STOP
Figure 10. Immediate Read Sequence and Timing
BUS ACTIVITY:
MASTER
S
T
A
R
T
S
T
A
R
T
ADDRESS
BYTE
SLAVE
ADDRESS
S
N
O
S
AT
CO
KP
SLAVE
ADDRESS
P
S
A
C
K
SLAVE
A
C
K
A
C
K
D ATA
BYTE
Figure 11. Selective Read Sequence
N
O
BUS ACTIVITY:
MASTER
A
C
K
SLAVE
ADDRESS
A
C
K
S
AT
CO
KP
A
C
K
P
SLAVE
A
C
K
D ATA
BYTE
n
D ATA
BYTE
n+1
D ATA
BYTE
n+2
Figure 12. Sequential Read Sequence
www.onsemi.com
9
D ATA
BYTE
n+x
CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16
PACKAGE DIMENSIONS
PDIP−8, 300 mils
CASE 646AA
ISSUE A
SYMBOL
MIN
NOM
A
E1
5.33
A1
0.38
A2
2.92
3.30
4.95
b
0.36
0.46
0.56
b2
1.14
1.52
1.78
c
0.20
0.25
0.36
D
9.02
9.27
10.16
E
7.62
7.87
8.25
E1
6.10
6.35
7.11
e
PIN # 1
IDENTIFICATION
MAX
2.54 BSC
eB
7.87
L
2.92
10.92
3.30
3.80
D
TOP VIEW
E
A2
A
A1
c
b2
L
e
eB
b
SIDE VIEW
END VIEW
Notes:
(1) All dimensions are in millimeters.
(2) Complies with JEDEC MS-001.
www.onsemi.com
10
CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16
PACKAGE DIMENSIONS
SOIC 8, 150 mils
CASE 751BD
ISSUE O
E1
E
SYMBOL
MIN
A
1.35
1.75
A1
0.10
0.25
b
0.33
0.51
MAX
c
0.19
0.25
D
4.80
5.00
E
5.80
6.20
E1
3.80
4.00
1.27 BSC
e
PIN # 1
IDENTIFICATION
NOM
h
0.25
0.50
L
0.40
1.27
θ
0º
8º
TOP VIEW
D
h
A1
θ
A
c
e
b
L
SIDE VIEW
END VIEW
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MS-012.
www.onsemi.com
11
CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16
PACKAGE DIMENSIONS
TSSOP8, 4.4x3
CASE 948AL
ISSUE O
b
SYMBOL
MIN
NOM
A
E1
E
MAX
1.20
A1
0.05
A2
0.80
b
0.19
0.30
c
0.09
0.20
D
2.90
3.00
3.10
E
6.30
6.40
6.50
E1
4.30
4.40
4.50
0.15
0.90
e
0.65 BSC
L
1.00 REF
L1
0.50
θ
0º
0.60
1.05
0.75
8º
e
TOP VIEW
D
A2
c
q1
A
A1
L1
SIDE VIEW
L
END VIEW
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MO-153.
www.onsemi.com
12
CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16
PACKAGE DIMENSIONS
MSOP 8, 3x3
CASE 846AD
ISSUE O
MIN
NOM
A1
0.05
0.10
0.15
A2
0.75
0.85
0.95
b
0.22
0.38
c
0.13
0.23
D
2.90
3.00
3.10
E
4.80
4.90
5.00
E1
2.90
3.00
3.10
SYMBOL
MAX
A
E
E1
1.10
e
L
0.65 BSC
0.40
0.60
0.80
L1
0.95 REF
L2
0.25 BSC
θ
0º
6º
TOP VIEW
D
A
A2
A1
DETAIL A
e
b
c
SIDE VIEW
END VIEW
q
L2
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MO-187.
L
L1
DETAIL A
www.onsemi.com
13
CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16
PACKAGE DIMENSIONS
TDFN8, 2x3
CASE 511AK
ISSUE A
D
e
A
b
E2
E
PIN#1
IDENTIFICATION
A1
PIN#1 INDEX AREA
D2
TOP VIEW
SYMBOL
MIN
SIDE VIEW
NOM
A
0.70
0.75
0.80
0.00
0.02
0.05
A2
0.45
0.55
0.65
A2
0.20 REF
A3
b
0.20
0.25
0.30
D
1.90
2.00
2.10
D2
1.30
1.40
1.50
E
2.90
3.00
3.10
E2
1.20
1.30
1.40
e
L
BOTTOM VIEW
MAX
A1
A3
FRONT VIEW
0.50 TYP
0.20
0.30
L
0.40
Notes:
(1) All dimensions are in millimeters.
(2) Complies with JEDEC MO-229.
www.onsemi.com
14
CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16
PACKAGE DIMENSIONS
TSOT−23, 5 LEAD
CASE 419AE
ISSUE O
SYMBOL
D
MIN
NOM
A1
0.01
0.05
0.10
A2
0.80
0.87
0.90
b
0.30
c
0.12
A
e
E1
1.00
0.45
0.15
D
2.90 BSC
E
2.80 BSC
E1
1.60 BSC
E
MAX
e
0.20
0.95 TYP
L
0.30
0.40
L1
0.60 REF
L2
0.25 BSC
0º
θ
0.50
8º
TOP VIEW
A2 A
b
q
L
A1
c
L1
SIDE VIEW
END VIEW
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MO-193.
www.onsemi.com
15
L2
CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16
PACKAGE DIMENSIONS
UDFN8, 2x3 EXTENDED PAD
CASE 517AZ
ISSUE O
D
b
A
e
L
DAP SIZE 1.8 x 1.8
E2
E
PIN #1
IDENTIFICATION
A1
PIN #1 INDEX AREA
D2
TOP VIEW
SIDE VIEW
SYMBOL
MIN
NOM
MAX
A
0.45
0.50
0.55
A1
0.00
0.02
0.05
A3
0.127 REF
b
0.20
0.25
0.30
D
1.95
2.00
2.05
D2
1.35
1.40
1.45
E
2.95
3.00
3.05
E2
1.25
1.30
1.35
e
L
BOTTOM VIEW
DETAIL A
0.065 REF
A3 A
FRONT VIEW
0.50 REF
0.25
0.30
0.35
A3
Notes:
(1) All dimensions are in millimeters.
(2) Refer JEDEC MO-236/MO-252.
0.0 - 0.05
DETAIL A
www.onsemi.com
16
0.065 REF
Copper Exposed
CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16
PACKAGE DIMENSIONS
US8
CASE 493−02
ISSUE B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION “A” DOES NOT INCLUDE MOLD
FLASH, PROTRUSION OR GATE BURR.
MOLD FLASH. PROTRUSION AND GATE
BURR SHALL NOT EXCEED 0.140 MM
(0.0055”) PER SIDE.
4. DIMENSION “B” DOES NOT INCLUDE
INTER−LEAD FLASH OR PROTRUSION.
INTER−LEAD FLASH AND PROTRUSION
SHALL NOT E3XCEED 0.140 (0.0055”) PER
SIDE.
5. LEAD FINISH IS SOLDER PLATING WITH
THICKNESS OF 0.0076−0.0203 MM.
(300−800 “).
6. ALL TOLERANCE UNLESS OTHERWISE
SPECIFIED ±0.0508 (0.0002 “).
−X−
A
8
J
−Y−
5
DETAIL E
B
L
1
4
R
S
G
P
U
C
−T−
SEATING
PLANE
H
0.10 (0.004) T
K
D
N
0.10 (0.004)
M
R 0.10 TYP
T X Y
V
M
DIM
A
B
C
D
F
G
H
J
K
L
M
N
P
R
S
U
V
F
DETAIL E
SOLDERING FOOTPRINT*
3.8
0.15
0.50
0.0197
1.8
0.07
0.30
0.012
1.0
0.0394
SCALE 8:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
17
MILLIMETERS
MIN
MAX
1.90
2.10
2.20
2.40
0.60
0.90
0.17
0.25
0.20
0.35
0.50 BSC
0.40 REF
0.10
0.18
0.00
0.10
3.00
3.20
0_
6_
5_
10 _
0.23
0.34
0.23
0.33
0.37
0.47
0.60
0.80
0.12 BSC
INCHES
MIN
MAX
0.075
0.083
0.087
0.094
0.024
0.035
0.007
0.010
0.008
0.014
0.020 BSC
0.016 REF
0.004
0.007
0.000
0.004
0.118
0.126
0_
6_
5_
10 _
0.010
0.013
0.009
0.013
0.015
0.019
0.024
0.031
0.005 BSC
CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16
PACKAGE DIMENSIONS
WLCSP4, 0.84x0.86
CASE 567NX
ISSUE O
A B
E
È
È
PIN A1
REFERENCE
2X
0.02 C
2X
0.02 C
D
A3
TOP VIEW
DETAIL A
A
0.10 C
0.04 C
A1
NOTE 4
C
SIDE VIEW
b
C A B
NOTE 5
M
DETAIL A
SEATING
PLANE
NOTE 3
DIM
A
A1
A2
A3
b
D
E
e
MILLIMETERS
MIN
MAX
0.28
0.33
0.08
0.12
0.175 REF
0.025 REF
0.16
0.20
0.84 BSC
0.86 BSC
0.40 BSC
RECOMMENDED
SOLDERING FOOTPRINT*
e
4X
0.10
A2
OPTIONAL
BACKSIDE COAT
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DATUM C, THE SEATING PLANE, IS DEFINED BY
THE SPHERICAL CROWNS OF THE CONTACT
BALLS.
4. COPLANARITY APPLIES TO SPHERICAL CROWNS
OF THE CONTACT BALLS.
5. DIMENSION b IS MEASURED AT THE MAXIMUM
CONTACT BALL DIAMETER PARALLEL TO DATUM C.
A1
e
PACKAGE
OUTLINE
B
A
1
2
0.40
PITCH
BOTTOM VIEW
4X
0.18
0.40
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
18
CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16
PACKAGE DIMENSIONS
WLCSP4, 0.84x0.86
CASE 567DC
ISSUE D
PIN A1
REFERENCE
ÈÈ
ÈÈ
2X
0.10 C
2X
0.10 C
D
A2
TOP VIEW
A3*
* Die Coat
(Optional)
A2
DETAIL A
A
0.10 C
DETAIL A
0.05 C
NOTE 4
0.10
NOTE 5
M
4X
b
C A B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DATUM C, THE SEATING PLANE, IS DEFINED BY
THE SPHERICAL CROWNS OF THE CONTACT
BALLS.
4. COPLANARITY APPLIES TO SPHERICAL CROWNS
OF THE CONTACT BALLS.
5. DIMENSION b IS MEASURED AT THE MAXIMUM
CONTACT BALL DIAMETER PARALLEL TO DATUM C.
A B
E
C
A1
SIDE VIEW
SEATING
PLANE
NOTE 3
A
MILLIMETERS
DIM
MIN
MAX
A
0.28
0.38
A1
0.08
0.12
A2
0.23 REF
A3*
0.025 REF
b
0.16
0.20
D
0.84 BSC
E
0.86 BSC
e
0.40 BSC
* Die Coat (Optional)
RECOMMENDED
SOLDERING FOOTPRINT*
e
e
A1
B
PACKAGE
OUTLINE
A
1
2
0.40
PITCH
BOTTOM VIEW
4X
0.40
PITCH
0.18
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
19
CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16
PACKAGE DIMENSIONS
WLCSP5, 0.86x0.84
CASE 567DD
ISSUE C
PIN A1
REFERENCE
ÈÈ
ÈÈ
2X
0.10 C
2X
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DATUM C, THE SEATING PLANE, IS DEFINED BY THE
SPHERICAL CROWNS OF THE CONTACT BALLS.
4. COPLANARITY APPLIES TO SPHERICAL CROWNS
OF THE CONTACT BALLS.
5. DIMENSION b IS MEASURED AT THE MAXIMUM CONTACT BALL DIAMETER PARALLEL TO DATUM C.
A B
E
D
TOP VIEW
DIM
A
A1
A2
b
D
E
e
e1
A
A2
0.10 C
0.05 C
5X
C
A1
NOTE 3
SEATING
PLANE
MILLIMETERS
MIN
MAX
0.29
0.39
0.10
0.14
0.23 REF
0.14
0.18
0.86 BSC
0.84 BSC
0.30 BSC
0.52 BSC
SIDE VIEW
0.10
M
5X
b
C A B
NOTE 4
PIN A1
REFERENCE
RECOMMENDED
SOLDERING FOOTPRINT*
e
e1
A1
C
B
A
PACKAGE
OUTLINE
123
0.52
PITCH
BOTTOM VIEW
5X
0.30
PITCH
0.16
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
20
CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16
Ordering Information
CAT24C01 Ordering Information
Device Order Number
CAT24C01TDI−GT3
CAT24C01VP2I−GT3*
Specific
Device Marking
Package
Type
Temperature
Range (Note 9)
Lead
Finish
Shipping
MM
TSOT−23−5
Industrial
NiPdAu
Tape & Reel, 3,000 Units / Reel
EE
TDFN−8
Industrial
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C01WI−GT3
24C01WI
SOIC−8
Industrial
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C01WE−GT3
24C01WI
SOIC−8
Extended
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C01YI−GT3
C01
TSSOP−8
Industrial
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C01YE−GT3
C01
TSSOP−8
Extended
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C01ZI−GT3
ABMK
MSOP−8
Industrial
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C02 Ordering Information (Notes 10, 11)
Specific
Device Marking
Package
Type
Temperature
Range (Note 9)
Lead
Finish
Shipping
CAT24C02WI−G
24C02H
SOIC−8
Industrial
NiPdAu
Tube, 100 Units / Tube
CAT24C02WI−GA
24C02H
SOIC−8
Industrial
NiPdAu
Tube, 100 Units / Tube
CAT24C02WI−GT3
24C02H
SOIC−8
Industrial
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C02WI−GT3A
24C02H
SOIC−8
Industrial
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C02WE−GT3
24C02H
SOIC−8
Extended
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C02WE−GT3A
24C02H
SOIC−8
Extended
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C02YI−G
C02H
TSSOP−8
Industrial
NiPdAu
Tube, 100 Units / Tube
CAT24C02YI−GA
C02H
TSSOP−8
Industrial
NiPdAu
Tube, 100 Units / Tube
CAT24C02YI−GT3
C02H
TSSOP−8
Industrial
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C02YI−GT3A
C02H
TSSOP−8
Industrial
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C02YE−GT3
C02H
TSSOP−8
Extended
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C02YE−GT3A
C02H
TSSOP−8
Extended
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C02VP2I−GT3*
C1T
TDFN−8
Industrial
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C02VP2IGT3A*
C1T
TDFN−8
Industrial
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C02VP2E−GT3*
C1T
TDFN−8
Extended
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C02VP2EGT3A*
Device Order Number
C1T
TDFN−8
Extended
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C02ZI−GT3
C1
MSOP−8
Industrial
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C02ZE−GT3
C1
MSOP−8
Extended
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C02ZI−GT3A
C1
MSOP−8
Industrial
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C02ZE−GT3A
C1
MSOP−8
Extended
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C02TDI−GT3
C1
TSOT−23−5
Industrial
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C02TDE−GT3
C1
TSOT−23−5
Extended
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C02TDI−GT3A
C1
TSOT−23−5
Industrial
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C02TDE−GT3A
C1
TSOT−23−5
Extended
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C02LI−GA
24C02H
PDIP−8
Industrial
NiPdAu
Tube, 50 Units / Tube
CAT24C02LE−GA
24C02H
PDIP−8
Extended
NiPdAu
Tube, 50 Units / Tube
CAT24C02HU4IGT3A
C1U
UDFN8−EP
Industrial
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C02HU4EGT3A
C1U
UDFN8−EP
Extended
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C02USI−T3
TBD
US8
Industrial
Matte−Tin
Tape & Reel, 3,000 Units / Reel
www.onsemi.com
21
CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16
CAT24C04 Ordering Information
Specific
Device Marking
Package
Type
Temperature
Range (Note 9)
Lead
Finish
Shipping
CAT24C04WI−G
24C04K
SOIC−8
Industrial
NiPdAu
Tube, 100 Units / Tube
CAT24C04WI−GT3
24C04K
SOIC−8
Industrial
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C04WE−GT3
Tape & Reel, 3,000 Units / Reel
Device Order Number
24C04K
SOIC−8
Extended
NiPdAu
CAT24C04YI−G
C04K
TSSOP−8
Industrial
NiPdAu
Tube, 100 Units / Tube
CAT24C04YI−GT3
C04K
TSSOP−8
Industrial
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C04YE−GT3
C04K
TSSOP−8
Extended
NiPdAu
Tape & Reel, 3,000 Units / Reel
C2T
TDFN−8
Industrial
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C04LI−G
24C04K
PDIP−8
Industrial
NiPdAu
Tube, 50 Units / Tube
CAT24C04LE−G
24C04K
PDIP−8
Extended
NiPdAu
Tube, 50 Units / Tube
CAT24C04ZI−GT3
C2
MSOP−8
Industrial
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C04ZE−GT3
C2
MSOP−8
Extended
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C04C4UTR
R
WLCSP−4
Industrial
N/A
(Notes 12 and 13)
CAT24C04C4ATR
4
WLCSP−4
Industrial
N/A
Tape & Reel, 5,000 Units / Reel
CAT24C04C5ATR
4
WLCSP−5
Industrial
N/A
Tape & Reel, 5,000 Units / Reel
C2
TSOT−23−5
Industrial
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C04TDE−GT3
C2
TSOT−23−5
Extended
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C04HU4I−GT3
C2U
UDFN8−EP
Industrial
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C04HU4E−GT3
C2U
UDFN8−EP
Extended
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C04USI−T3
TBD
US8
Industrial
Matte−Tin
Tape & Reel, 3,000 Units / Reel
Specific
Device Marking
Package
Type
Temperature
Range (Note 9)
Lead
Finish
Shipping
CAT24C08WI−G
24C08K
SOIC−8
Industrial
NiPdAu
Tube, 100 Units / Tube
CAT24C08WI−GT3
24C08K
SOIC−8
Industrial
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C08WE−GT3
Tape & Reel, 3,000 Units / Reel
CAT24C04VP2I−GT3*
CAT24C04TDI−GT3
CAT24C08 Ordering Information
Device Order Number
24C08K
SOIC−8
Extended
NiPdAu
CAT24C08YI−G
C08K
TSSOP−8
Industrial
NiPdAu
Tube, 100 Units / Tube
CAT24C08YI−GT3
C08K
TSSOP−8
Industrial
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C08YE−GT3
C08K
TSSOP−8
Extended
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C08VP2I−GT3*
C3T
TDFN−8
Industrial
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C08VP2E−GT3*
C3T
TDFN−8
Extended
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C08LI−G
24C08K
PDIP−8
Industrial
NiPdAu
Tube, 50 Units / Tube
CAT24C08LE−G
24C08K
PDIP−8
Extended
NiPdAu
Tube, 50 Units / Tube
CAT24C08ZI−GT3
C3
MSOP−8
Industrial
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C08ZE−GT3
C3
MSOP−8
Extended
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C08C4UTR
T
WLCSP−4
Industrial
N/A
(Notes 12 and 13)
CAT24C08C4ATR
8
WLCSP−4
Industrial
N/A
Tape & Reel, 5,000 Units / Reel
CAT24C08C4CTR**
8
WLCSP−4
Industrial
N/A
Tape & Reel, 5,000 Units / Reel
CAT24C08C5ATR
8
WLCSP−5
Industrial
N/A
Tape & Reel, 5,000 Units / Reel
CAT24C08TDI−GT3
C3
TSOT−23−5
Industrial
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C08TDE−GT3
C3
TSOT−23−5
Extended
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C08HU4I−GT3
C3U
UDFN8−EP
Industrial
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C08HU4E−GT3
C3U
UDFN8−EP
Extended
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C08USI−T3
TBD
US8
Industrial
Matte−Tin
Tape & Reel, 3,000 Units / Reel
www.onsemi.com
22
CAT24C01, CAT24C02, CAT24C04, CAT24C08, CAT24C16
CAT24C16 Ordering Information
Specific
Device Marking
Package
Type
Temperature
Range (Note 9)
Lead
Finish
Shipping
CAT24C16WI−G
24C16K
SOIC−8
Industrial
NiPdAu
Tube, 100 Units / Tube
CAT24C16WI−GT3
24C16K
SOIC−8
Industrial
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C16WE−GT3
24C16K
SOIC−8
Extended
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C16YI−G
C16K
TSSOP−8
Industrial
NiPdAu
Tube, 100 Units / Tube
CAT24C16YI−GT3
C16K
TSSOP−8
Industrial
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C16YE−GT3
C16K
TSSOP−8
Extended
NiPdAu
Tape & Reel, 3,000 Units / Reel
C4T
TDFN−8
Industrial
NiPdAu
Tape & Reel, 3,000 Units / Reel
Device Order Number
CAT24C16VP2I−GT3*
CAT24C16VP2E−GT3*
C4T
TDFN−8
Extended
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C16LI−G
24C16K
PDIP−8
Industrial
NiPdAu
Tube, 50 Units / Tube
CAT24C16LE−G
24C16K
PDIP−8
Extended
NiPdAu
Tube, 50 Units / Tube
CAT24C16ZI−GT3
C4
MSOP−8
Industrial
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C16ZE−GT3
C4
MSOP−8
Extended
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C16C4UTR
V
WLCSP−4
Industrial
N/A
(Notes 12 and 13)
CAT24C16C4ATR
6
WLCSP−4
Industrial
N/A
Tape & Reel, 5,000 Units / Reel
CAT24C16C5ATR
6
WLCSP−5
Industrial
N/A
Tape & Reel, 5,000 Units / Reel
CAT24C16TDI−GT3
C4
TSOT−23−5
Industrial
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C16TDE−GT3
C4
TSOT−23−5
Extended
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C16HU4I−GT3
C4U
UDFN8−EP
Extended
NiPdAu
Tape & Reel, 3,000 Units / Reel
CAT24C16USI−T3
TBD
US8
Industrial
Matte−Tin
Tape & Reel, 3,000 Units / Reel
9. Industrial temperature range is −40°C to +85°C and Extended temperature range is −40°C to +125°C.
10. Part numbers ending with “A” for the CAT24C02 are for Gresham (Product Rev H) only die.
11. The CAT24C02 ”non−A” Device Order Numbers use Gresham die (Rev H) for date codes, starting August 1st, 2012. Therefore the Specific
Device Marking for these OPNs reflect Rev H die.
12. Contact local sales office for availability.
13. CAUTION: The EEPROM devices delivered in WLCSP must never be exposed to ultraviolet light. When exposed to ultraviolet light the
EEPROM cells lose their stored data.
14. All packages are RoHS−compliant (Lead−free, Halogen−free).
15. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
16. For detailed information and a breakdown of device nomenclature and numbering systems, please see the ON Semiconductor Device
Nomenclature document, TND310/D, available at www.onsemi.com
* The TDFN (VP2) package is not recommended for new designs.
** CAT24C08C4CTR is a backside coated version. Contact factory for other densities.
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
www.onsemi.com
23
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
CAT24C01/D
Similar pages