CAV24C02 D

CAV24C02, CAV24C04,
CAV24C08, CAV24C16
2-Kb, 4-Kb, 8-Kb and 16-Kb
I2C CMOS Serial EEPROM
Description
The CAV24C02/04/08/16 are 2−Kb, 4−Kb, 8−Kb and 16−Kb
respectively CMOS Serial EEPROM devices organized internally as
16/32/64 and 128 pages respectively of 16 bytes each. All devices
support both the Standard (100 kHz) as well as Fast (400 kHz) I2C
protocol.
Data is written by providing a starting address, then loading 1 to 16
contiguous bytes into a Page Write Buffer, and then writing all data to
non−volatile memory in one internal write cycle. Data is read by
providing a starting address and then shifting out data serially while
automatically incrementing the internal address count.
External address pins make it possible to address up to eight
CAV24C02, four CAV24C04, two CAV24C08 and one CAV24C16
device on the same bus.
Features
•
•
•
•
•
•
•
•
•
•
•
Automotive Temperature Grade 1 (−40°C to +125°C)
Supports Standard and Fast I2C Protocol
2.5 V to 5.5 V Supply Voltage Range
16−Byte Page Write Buffer
Hardware Write Protection for Entire Memory
CAV Prefix for Automotive and Other Applications Requiring Site
and Change Control
Schmitt Triggers and Noise Suppression Filters on I2C Bus Inputs
(SCL and SDA)
Low power CMOS Technology
1,000,000 Program/Erase Cycles
100 Year Data Retention
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
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TSSOP−8
Y SUFFIX
CASE 948AL
WLCSP−4***
C4A SUFFIX
CASE 567DC
SOIC−8
W SUFFIX
CASE 751BD
WLCSP−5***
C5A SUFFIX
CASE 567DD
PIN CONFIGURATIONS
SOIC (W), TSSOP (Y)
CAV24C__
16 / 08 / 04 / 02
NC / NC / NC / A0
1
8
VCC
NC / NC / A1 / A1
2
7
WP
NC / A2 / A2 / A2
3
6
SCL
4
5
SDA
VSS
(Top View)
Pin 1
1
2
A
VCC
VSS
B
SCL
3
VSS
VCC
SDA
WP
WLCSP−4***
(Top Views)
A
B
SCL
C
WLCSP−5***
PIN FUNCTION
Pin Name
A0, A1, A2
SCL
CAV24Cxx
2
SDA
VCC
A2, A1, A0
1
Pin 1
SDA
WP
Function
Device Address Input
SDA
Serial Data Input/Output
SCL
Serial Clock Input
WP
Write Protect Input
VCC
Power Supply
VSS
Ground
NC
No Connect
VSS
Figure 1. Functional Symbol
This document contains information on some products that are still under development.
ON Semiconductor reserves the right to change or discontinue these products without
notice.
© Semiconductor Components Industries, LLC, 2015
November, 2015 − Rev. 4
1
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 14 of this data sheet.
Publication Order Number:
CAV24C02/D
CAV24C02, CAV24C04, CAV24C08, CAV24C16
DEVICE MARKINGS
(TSSOP−8)
(SOIC−8)
CSSS
AYMXXX
G
CSSS
SSS
SSS
SSS
SSS
A
Y
M
XXX
G
24CSSS
AYMXXX
G
= Specific Device Code, where
= 02H for CAV24C02
= 04K for CAV24C04
= 08K for CAV24C08
= 16K for CAV24C16
= Assembly Location
= Production Year (Last Digit)
= Production Month (1−9, O, N, D)
= Last Three Digits of Assembly Lot Number
= Pb−Free Package
24CSSS = Specific Device Code, where
SSS = 02H for CAV24C02
SSS = 04K for CAV24C04
SSS = 08K for CAV24C08
SSS = 16K for CAV24C16
A
= Assembly Location
Y
= Production Year (Last Digit)
M
= Production Month (1−9, O, N, D)
XXX
= Last Three Digits of Assembly Lot Number
G
= Pb−Free Package
TOP MARKING FOR WLCSP
Pin 1
Pin 1
(Ball Down)
X
YM
WLCSP−4
X = Specific Device
X = Code
4 = 24C04
8 = 24C08
6 = 24C16
X
YM
WLCSP−5
Y = Production Year (Last Digit)
M = Production Month (1−9, O, N, D)
Table 1. ABSOLUTE MAXIMUM RATINGS
Ratings
Units
Storage Temperature
Parameters
−65 to +150
°C
Voltage on any pin with respect to Ground (Note 1)
−0.5 to +6.5
V
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. During input transitions, voltage undershoot on any pin should not exceed −1 V for more than 20 ns. Voltage overshoot on pins A0, A1, A2
and WP should not exceed VCC + 1 V for more than 20 ns, while voltage on the I2C bus pins, SCL and SDA, should not exceed the absolute
maximum ratings, irrespective of VCC.
Table 2. RELIABILITY CHARACTERISTICS (Note 2)
Parameter
Symbol
NEND (Note 3)
TDR
Endurance
Data Retention
Min
Units
1,000,000
Program / Erase Cycles
100
Years
2. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC−Q100
and JEDEC test methods.
3. Page Mode, VCC = 5 V, 25°C.
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CAV24C02, CAV24C04, CAV24C08, CAV24C16
Table 3. D.C. OPERATING CHARACTERISTICS
(VCC = 2.5 V to 5.5 V, TA = −40°C to +125°C, unless otherwise specified.)
Parameter
Symbol
Test Conditions
Min
Max
Units
ICCR
Read Current
Read, fSCL = 400 kHz
1
mA
ICCW
Write Current
Write, fSCL = 400 kHz
2
mA
5
mA
2
mA
ISB
Standby Current
All I/O Pins at GND or VCC
IL
I/O Pin Leakage
Pin at GND or VCC
VIL
Input Low Voltage
VIH
Input High Voltage
VOL
Output Low Voltage
TA = −40°C to +125°C
−0.5
0.3 x VCC
V
A0, A1, A2 and WP
0.7 x VCC
VCC + 0.5
V
SCL and SDA
0.7 x VCC
5.5
V
0.4
V
VCC > 2.5 V, IOL = 3 mA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
Table 4. PIN IMPEDANCE CHARACTERISTICS (VCC = 2.5 V to 5.5 V, TA = −40°C to +125°C, unless otherwise specified.)
Symbol
Parameter
CIN (Note 4)
SDA Pin Capacitance
IWP (Note 5)
WP Input Current
Conditions
Max
Units
VIN = 0 V, f = 1.0 MHz, VCC = 5.0 V
8
pF
6
pF
VIN < VIH, VCC = 5.5 V
130
mA
VIN < VIH, VCC = 3.6 V
120
VIN < VIH, VCC = 2.5 V
80
VIN > VIH
2
VIN < VIH, VCC = 5.5 V
50
VIN < VIH, VCC = 3.6 V
35
VIN < VIH, VCC = 2.5 V
25
VIN > VIH
2
Other Pins
IA (Note 5)
Address Input Current
(A0, A1, A2)
mA
4. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC−Q100
and JEDEC test methods.
5. When not driven, the WP, A0, A1 and A2 pins are pulled down to GND internally. For improved noise immunity, the internal pull−down is relatively
strong; therefore the external driver must be able to supply the pull−down current when attempting to drive the input HIGH. To conserve power,
as the input level exceeds the trip point of the CMOS input buffer (~ 0.5 x VCC), the strong pull−down reverts to a weak current source.
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3
CAV24C02, CAV24C04, CAV24C08, CAV24C16
Table 5. A.C. CHARACTERISTICS (Note 6) (VCC = 2.5 V to 5.5 V, TA = −40°C to +125°C, unless otherwise specified.)
Standard
Symbol
FSCL
tHD:STA
Min
Parameter
Clock Frequency
Max
Fast
Min
100
START Condition Hold Time
Max
Units
400
kHz
4
0.6
ms
tLOW
Low Period of SCL Clock
4.7
1.3
ms
tHIGH
High Period of SCL Clock
4
0.6
ms
4.7
0.6
ms
tSU:STA
START Condition Setup Time
tHD:DAT
Data In Hold Time
0
0
ms
tSU:DAT
Data In Setup Time
250
100
ns
tR
SDA and SCL Rise Time
1000
300
ns
tF (Note 6)
SDA and SCL Fall Time
300
300
ns
tSU:STO
STOP Condition Setup Time
tBUF
Bus Free Time Between STOP and START
tAA
SCL Low to Data Out Valid
tDH
Data Out Hold Time
Ti (Note 6)
4
0.6
ms
4.7
1.3
ms
3.5
100
Noise Pulse Filtered at SCL and SDA Inputs
0.9
100
100
ms
ns
100
ns
tSU:WP
WP Setup Time
0
0
ms
tHD:WP
WP Hold Time
2.5
2.5
ms
tWR
tPU (Notes 7, 8)
Write Cycle Time
Power−up to Ready Mode
6. Test conditions according to “AC Test Conditions” table.
7. Tested initially and after a design or process change that affects this parameter.
8. tPU is the delay between the time VCC is stable and the device is ready to accept commands.
Table 6. A.C. TEST CONDITIONS
Input Drive Levels
0.2 x VCC to 0.8 x VCC
Input Rise and Fall Time
v 50 ns
Input Reference Levels
0.3 x VCC, 0.7 x VCC
Output Reference Level
0.5 x VCC
Output Test Load
Current Source IOL = 3 mA; CL = 100 pF
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4
5
5
ms
0.1
0.1
ms
CAV24C02, CAV24C04, CAV24C08, CAV24C16
Power−On Reset (POR)
Each CAV24Cxx* incorporates Power−On Reset (POR)
circuitry which protects the internal logic against powering
up in the wrong state.
A CAV24Cxx device will power up into Standby mode
after VCC exceeds the POR trigger level and will power
down into Reset mode when VCC drops below the POR
trigger level. This bi−directional POR feature protects the
device against ‘brown−out’ failure following a temporary
loss of power.
*For common features, the CAV24C02/04/08/16 will be
referred to as CAV24Cxx.
bus via their respective SCL and SDA pins. The transmitting
device pulls down the SDA line to ‘transmit’ a ‘0’ and
releases it to ‘transmit’ a ‘1’.
Data transfer may be initiated only when the bus is not
busy (see AC Characteristics).
During data transfer, the SDA line must remain stable
while the SCL line is high. An SDA transition while SCL is
high will be interpreted as a START or STOP condition
(Figure 2). The START condition precedes all commands. It
consists of a HIGH to LOW transition on SDA while SCL
is HIGH. The START acts as a ‘wake−up’ call to all
receivers. Absent a START, a Slave will not respond to
commands. The STOP condition completes all commands.
It consists of a LOW to HIGH transition on SDA while SCL
is HIGH.
Pin Description
SCL: The Serial Clock input pin accepts the Serial Clock
generated by the Master.
SDA: The Serial Data I/O pin receives input data and
transmits data stored in EEPROM. In transmit mode, this pin
is open drain. Data is acquired on the positive edge, and is
delivered on the negative edge of SCL.
A0, A1 and A2: The Address inputs set the device address
when cascading multiple devices. When not driven, these
pins are pulled LOW internally.
WP: The Write Protect input pin inhibits all write
operations, when pulled HIGH. When not driven, this pin is
pulled LOW internally.
Device Addressing
The Master initiates data transfer by creating a START
condition on the bus. The Master then broadcasts an 8−bit
serial Slave address. For normal Read/Write operations, the
first 4 bits of the Slave address are fixed at 1010 (Ah). The
next 3 bits are used as programmable address bits when
cascading multiple devices and/or as internal address bits.
The last bit of the slave address, R/W, specifies whether a
Read (1) or Write (0) operation is to be performed. The 3
address space extension bits are assigned as illustrated in
Figure 3. A2, A1 and A0 must match the state of the external
address pins, and a10, a9 and a8 are internal address bits.
Functional Description
The CAV24Cxx supports the Inter−Integrated Circuit
(I2C) Bus data transmission protocol, which defines a device
that sends data to the bus as a transmitter and a device
receiving data as a receiver. Data flow is controlled by a
Master device, which generates the serial clock and all
START and STOP conditions. The CAV24Cxx acts as a
Slave device. Master and Slave alternate as either
transmitter or receiver.
Acknowledge
After processing the Slave address, the Slave responds
with an acknowledge (ACK) by pulling down the SDA line
during the 9th clock cycle (Figure 4). The Slave will also
acknowledge the address byte and every data byte presented
in Write mode. In Read mode the Slave shifts out a data byte,
and then releases the SDA line during the 9th clock cycle. As
long as the Master acknowledges the data, the Slave will
continue transmitting. The Master terminates the session by
not acknowledging the last data byte (NoACK) and by
issuing a STOP condition. Bus timing is illustrated in
Figure 5.
I2C Bus Protocol
The I2C bus consists of two ‘wires’, SCL and SDA. The
two wires are connected to the VCC supply via pull−up
resistors. Master and Slave devices connect to the 2−wire
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CAV24C02, CAV24C04, CAV24C08, CAV24C16
SCL
SDA
START
CONDITION
STOP
CONDITION
Figure 2. Start/Stop Timing
1
0
1
0
A2
A1
A0
R/W
CAV24C02
1
0
1
0
A2
A1
a8
R/W
CAV24C04
1
0
1
0
A2
a9
a8
R/W
CAV24C08
1
0
1
0
a10
a9
a8
R/W
CAV24C16
Figure 3. Slave Address Bits
BUS RELEASE DELAY (TRANSMITTER)
SCL FROM
MASTER
1
BUS RELEASE DELAY
(RECEIVER)
8
9
DATA OUTPUT
FROM TRANSMITTER
DATA OUTPUT
FROM RECEIVER
ACK SETUP (w tSU:DAT)
ACK DELAY (v tAA)
START
Figure 4. Acknowledge Timing
tF
tHIGH
tR
tLOW
tLOW
SCL
tSU:STA
tHD:DAT
tHD:SDA
tSU:DAT
tSU:STO
SDA IN
tAA
tDH
SDA OUT
Figure 5. Bus Timing
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6
tBUF
CAV24C02, CAV24C04, CAV24C08, CAV24C16
WRITE OPERATIONS
Byte Write
sixteen bytes are received and the STOP condition has been
sent by the Master, the internal Write cycle begins. At this
point all received data is written to the CAV24Cxx in a single
write cycle.
In Byte Write mode, the Master sends the START
condition and the Slave address with the R/W bit set to zero
to the Slave. After the Slave generates an acknowledge, the
Master sends the byte address that is to be written into the
address pointer of the CAV24Cxx. After receiving another
acknowledge from the Slave, the Master transmits the data
byte to be written into the addressed memory location. The
CAV24Cxx device will acknowledge the data byte and the
Master generates the STOP condition, at which time the
device begins its internal Write cycle to nonvolatile memory
(Figure 6). While this internal cycle is in progress (tWR), the
SDA output will be tri−stated and the CAV24Cxx will not
respond to any request from the Master device (Figure 7).
Acknowledge Polling
The acknowledge (ACK) polling routine can be used to
take advantage of the typical write cycle time. Once the stop
condition is issued to indicate the end of the host’s write
operation, the CAV24Cxx initiates the internal write cycle.
The ACK polling can be initiated immediately. This
involves issuing the start condition followed by the slave
address for a write operation. If the CAV24Cxx is still busy
with the write operation, NoACK will be returned. If the
CAV24Cxx has completed the internal write operation, an
ACK will be returned and the host can then proceed with the
next read or write operation.
Page Write
The CAV24Cxx writes up to 16 bytes of data in a single
write cycle, using the Page Write operation (Figure 8). The
Page Write operation is initiated in the same manner as the
Byte Write operation, however instead of terminating after
the data byte is transmitted, the Master is allowed to send up
to fifteen additional bytes. After each byte has been
transmitted the CAV24Cxx will respond with an
acknowledge and internally increments the four low order
address bits. The high order bits that define the page address
remain unchanged. If the Master transmits more than sixteen
bytes prior to sending the STOP condition, the address
counter ‘wraps around’ to the beginning of page and
previously transmitted data will be overwritten. Once all
BUS ACTIVITY:
MASTER
S
T
A
R
T
Hardware Write Protection
With the WP pin held HIGH, the entire memory is
protected against Write operations. If the WP pin is left
floating or is grounded, it has no impact on the operation of
the CAV24Cxx. The state of the WP pin is strobed on the last
falling edge of SCL immediately preceding the first data
byte (Figure 9). If the WP pin is HIGH during the strobe
interval, the CAV24Cxx will not acknowledge the data byte
and the Write request will be rejected.
Delivery State
The CAV24Cxx is shipped erased, i.e., all bytes are FFh.
SLAVE
ADDRESS
ADDRESS
BYTE
DATA
BYTE
a7 − a 0
d7 − d 0
S
T
O
P
P
S
SLAVE
A
C
K
A
C
K
Figure 6. Byte Write Sequence
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7
A
C
K
CAV24C02, CAV24C04, CAV24C08, CAV24C16
SCL
8th Bit
SDA
ACK
Byte n
tWR
STOP
CONDITION
START
CONDITION
ADDRESS
Figure 7. Write Cycle Timing
BUS ACTIVITY:
MASTER
S
T
A
R
T
DATA
BYTE
n
ADDRESS
BYTE
SLAVE
ADDRESS
DATA
BYTE
n+1
S
T
O
P
DATA
BYTE
n+P
S
P
A
C
K
SLAVE
n=1
P v 15
A
C
K
A
C
K
A
C
K
Figure 8. Page Write Sequence
ADDRESS
BYTE
DATA
BYTE
1
8
9
a7
a0
1
8
d7
d0
SCL
SDA
tSU:WP
WP
tHD:WP
Figure 9. WP Timing
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8
A
C
K
CAV24C02, CAV24C04, CAV24C08, CAV24C16
READ OPERATIONS
Immediate Read
address of the location it wishes to read. After the
CAV24Cxx acknowledges the byte address, the Master
device resends the START condition and the slave address,
this time with the R/W bit set to one. The CAV24Cxx then
responds with its acknowledge and sends the requested data
byte. The Master device does not acknowledge the data
(NoACK) but will generate a STOP condition (Figure 11).
Upon receiving a Slave address with the R/W bit set to ‘1’,
the CAV24Cxx will interpret this as a request for data
residing at the current byte address in memory. The
CAV24Cxx will acknowledge the Slave address, will
immediately shift out the data residing at the current address,
and will then wait for the Master to respond. If the Master
does not acknowledge the data (NoACK) and then follows
up with a STOP condition (Figure 10), the CAV24Cxx
returns to Standby mode.
Sequential Read
If during a Read session, the Master acknowledges the 1st
data byte, then the CAV24Cxx will continue transmitting
data residing at subsequent locations until the Master
responds with a NoACK, followed by a STOP (Figure 12).
In contrast to Page Write, during Sequential Read the
address count will automatically increment to and then
wrap−around at end of memory (rather than end of page).
Selective Read
Selective Read operations allow the Master device to
select at random any memory location for a read operation.
The Master device first performs a ‘dummy’ write operation
by sending the START condition, slave address and byte
BUS ACTIVITY:
MASTER
N
O
S
T
A
R
T
S
AT
CO
KP
SLAVE
ADDRESS
P
S
A
C
K
SLAVE
SCL
D ATA
BYTE
8
9
8th Bit
SDA
DATA OUT
NO ACK
STOP
Figure 10. Immediate Read Sequence and Timing
BUS ACTIVITY:
MASTER
S
T
A
R
T
S
T
A
R
T
ADDRESS
BYTE
SLAVE
ADDRESS
S
N
O
S
AT
CO
KP
SLAVE
ADDRESS
P
S
A
C
K
SLAVE
A
C
K
A
C
K
D ATA
BYTE
Figure 11. Selective Read Sequence
N
O
BUS ACTIVITY:
MASTER
A
C
K
SLAVE
ADDRESS
A
C
K
S
AT
CO
KP
A
C
K
P
SLAVE
A
C
K
D ATA
BYTE
n
D ATA
BYTE
n+1
D ATA
BYTE
n+2
Figure 12. Sequential Read Sequence
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9
D ATA
BYTE
n+x
CAV24C02, CAV24C04, CAV24C08, CAV24C16
PACKAGE DIMENSIONS
SOIC 8, 150 mils
CASE 751BD
ISSUE O
E1
E
SYMBOL
MIN
A
1.35
1.75
A1
0.10
0.25
b
0.33
0.51
MAX
c
0.19
0.25
D
4.80
5.00
E
5.80
6.20
E1
3.80
4.00
1.27 BSC
e
PIN # 1
IDENTIFICATION
NOM
h
0.25
0.50
L
0.40
1.27
θ
0º
8º
TOP VIEW
D
h
A1
θ
A
c
e
b
L
SIDE VIEW
END VIEW
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MS-012.
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CAV24C02, CAV24C04, CAV24C08, CAV24C16
PACKAGE DIMENSIONS
TSSOP8, 4.4x3
CASE 948AL
ISSUE O
b
SYMBOL
MIN
NOM
A
E1
E
MAX
1.20
A1
0.05
A2
0.80
b
0.19
0.30
c
0.09
0.20
D
2.90
3.00
3.10
E
6.30
6.40
6.50
E1
4.30
4.40
4.50
0.15
0.90
e
0.65 BSC
L
1.00 REF
L1
0.50
θ
0º
0.60
1.05
0.75
8º
e
TOP VIEW
D
A2
c
q1
A
A1
L1
SIDE VIEW
L
END VIEW
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MO-153.
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CAV24C02, CAV24C04, CAV24C08, CAV24C16
PACKAGE DIMENSIONS
WLCSP4, 0.84x0.86
CASE 567DC
ISSUE D
PIN A1
REFERENCE
ÈÈ
ÈÈ
2X
0.10 C
2X
0.10 C
D
A2
TOP VIEW
A3*
* Die Coat
(Optional)
A2
DETAIL A
A
0.10 C
DETAIL A
0.05 C
NOTE 4
b
C A B
NOTE 5
M
C
A1
SIDE VIEW
SEATING
PLANE
NOTE 3
A
MILLIMETERS
DIM
MIN
MAX
0.38
A
0.28
A1
0.08
0.12
A2
0.23 REF
A3*
0.025 REF
b
0.16
0.20
D
0.84 BSC
E
0.86 BSC
e
0.40 BSC
* Die Coat (Optional)
RECOMMENDED
SOLDERING FOOTPRINT*
e
4X
0.10
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DATUM C, THE SEATING PLANE, IS DEFINED BY
THE SPHERICAL CROWNS OF THE CONTACT
BALLS.
4. COPLANARITY APPLIES TO SPHERICAL CROWNS
OF THE CONTACT BALLS.
5. DIMENSION b IS MEASURED AT THE MAXIMUM
CONTACT BALL DIAMETER PARALLEL TO DATUM C.
A B
E
e
A1
B
PACKAGE
OUTLINE
A
1
2
0.40
PITCH
BOTTOM VIEW
4X
0.40
PITCH
0.18
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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12
CAV24C02, CAV24C04, CAV24C08, CAV24C16
PACKAGE DIMENSIONS
WLCSP5, 0.86x0.84
CASE 567DD
ISSUE C
ÈÈ
2X
0.10 C
2X
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DATUM C, THE SEATING PLANE, IS DEFINED BY THE
SPHERICAL CROWNS OF THE CONTACT BALLS.
4. COPLANARITY APPLIES TO SPHERICAL CROWNS
OF THE CONTACT BALLS.
5. DIMENSION b IS MEASURED AT THE MAXIMUM CONTACT BALL DIAMETER PARALLEL TO DATUM C.
A B
E
PIN A1
REFERENCE
D
TOP VIEW
DIM
A
A1
A2
b
D
E
e
e1
A
A2
0.10 C
0.05 C
5X
C
A1
NOTE 3
SEATING
PLANE
MILLIMETERS
MIN
MAX
0.29
0.39
0.10
0.14
0.23 REF
0.14
0.18
0.86 BSC
0.84 BSC
0.30 BSC
0.52 BSC
SIDE VIEW
0.10
M
5X
b
C A B
NOTE 4
PIN A1
REFERENCE
RECOMMENDED
SOLDERING FOOTPRINT*
e
e1
A1
C
B
A
PACKAGE
OUTLINE
123
0.52
PITCH
BOTTOM VIEW
5X
0.30
PITCH
0.16
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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13
CAV24C02, CAV24C04, CAV24C08, CAV24C16
CAV24C02 Ordering Information
Specific
Device Marking
Package Type
Temperature
Range
Lead
Finish
Shipping
CAV24C02WE−GT3
24C02H
SOIC−8
−40°C to +125°C
NiPdAu
3,000 Units / Tape & Reel
CAV24C02YE−GT3
C02H
TSSOP−8
−40°C to +125°C
NiPdAu
3,000 Units / Tape & Reel
Specific
Device Marking
Package Type
Temperature
Range
Lead
Finish
Shipping
CAV24C04WE−GT3
24C04K
SOIC−8
−40°C to +125°C
NiPdAu
3,000 Units / Tape & Reel
CAV24C04YE−GT3
C04K
TSSOP−8
−40°C to +125°C
NiPdAu
3,000 Units / Tape & Reel
CAV24C04C4ATR
(In Development)
4
WLCSP−4
−40°C to +125°C
N/A
5,000 Units / Tape & Reel
CAV24C04C5ATR
(In Development)
4
WLCSP−5
−40°C to +125°C
N/A
5,000 Units / Tape & Reel
Package Type
Temperature
Range
Lead
Finish
Shipping
Device Order Number
CAV24C04 Ordering Information
Device Order Number
CAV24C08 Ordering Information
Device Order Number
Specific
Device Marking
CAV24C08WE−GT3
24C08K
SOIC−8
−40°C to +125°C
NiPdAu
3,000 Units / Tape & Reel
CAV24C08YE−GT3
C08K
TSSOP−8
−40°C to +125°C
NiPdAu
3,000 Units / Tape & Reel
CAV24C08C4ATR
(In Development)
8
WLCSP−4
−40°C to +125°C
N/A
5,000 Units / Tape & Reel
CAV24C08C4CTR*
(In Development)
8
WLCSP−4
−40°C to +125°C
N/A
5,000 Units / Tape & Reel
CAV24C08C5ATR
(In Development)
8
WLCSP−5
−40°C to +125°C
N/A
5,000 Units / Tape & Reel
* CAV24C08C4CTR is a backside coated version. Contact factory for other densities.
CAV24C16 Ordering Information
Device Order Number
Specific
Device Marking
Package Type
Temperature
Range
Lead
Finish
Shipping
CAV24C16WE−GT3
24C16K
SOIC−8
−40°C to +125°C
NiPdAu
3,000 Units / Tape & Reel
CAV24C16YE−GT3
C16K
TSSOP−8
−40°C to +125°C
NiPdAu
3,000 Units / Tape & Reel
CAV24C16C4ATR
(In Development)
6
WLCSP−4
−40°C to +125°C
N/A
5,000 Units / Tape & Reel
CAV24C16C5ATR
(In Development)
6
WLCSP−5
−40°C to +125°C
N/A
5,000 Units / Tape & Reel
9. All packages are RoHS−compliant (Lead−free, Halogen−free).
10. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
11. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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14
CAV24C02, CAV24C04, CAV24C08, CAV24C16
ON Semiconductor is licensed by Philips Corporation to carry the I2C Bus Protocol.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: ord[email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
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15
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
CAV24C02/D