MURD320, SURD8320, NRVUD320W1 Switch-mode Power Rectifier DPAK Surface Mount Package These state−of−the−art devices are designed for use in switching power supplies, inverters and as free wheeling diodes. Features • • • • • Ultrafast 35 Nanosecond Recovery Time Low Forward Voltage Drop Low Leakage SURD8, NRVUD Prefixes for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable These Devices are Pb−Free and are RoHS Compliant* • Case: Epoxy, Molded • Weight: 0.4 Gram (Approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal • Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds ESD Ratings: ♦ Machine Model = C (> 400 V) ♦ Human Body Model = 3B (> 8 kV) MAXIMUM RATINGS Rating Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 200 V Average Rectified Forward Current (Rated VR, TC = 158°C) IF(AV) Peak Repetitive Forward Current (Rated VR, Square Wave, 20 kHz, TC = 158°C) IFRM Non−Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, 60 Hz) IFSM Operating Junction and Storage Temperature Range ULTRAFAST RECTIFIER 3.0 AMPERES, 200 VOLTS DPAK CASE 369C 1 Mechanical Characteristics • www.onsemi.com A 3.0 1 4 3 A A MARKING DIAGRAM AYWW U 320G MURD320T4G SURD8320T4G A Y WW G °C −65 to +175 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. AYWW U 320W1G NRVUD320T4G = Assembly Location = Year = Work Week = Pb−Free Package ORDERING INFORMATION Package Shipping† MURD320T4G DPAK (Pb−Free) 2500 / Tape & Reel SURD8320T4G DPAK (Pb−Free) 2500 / Tape & Reel NRVUD320W1T4G DPAK (Pb−Free) 2500 / Tape & Reel 75 TJ, Tstg STYLE 8 STYLE 3 Device 6.0 4 3 †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2015 May, 2015 − Rev. 9 1 Publication Order Number: MURD320/D MURD320, SURD8320, NRVUD320W1 THERMAL CHARACTERISTICS Characteristics Symbol Value Unit Thermal Resistance − Junction−to−Case RqJC 6 °C/W Thermal Resistance − Junction−to−Ambient (Note 1) RqJA 80 °C/W Symbol Value Unit 1. Rating applies when surface mounted on the minimum pad sizes recommended. ELECTRICAL CHARACTERISTICS Characteristics Maximum Instantaneous Forward Voltage Drop (Note 2) (iF = 3 Amps, TJ = 25°C) (iF = 3 Amps, TJ = 125°C) vF Maximum Instantaneous Reverse Current (Note 2) (TJ = 25°C, Rated dc Voltage) (TJ = 125°C, Rated dc Voltage) iR Maximum Reverse Recovery Time (IF = 1 Amp, di/dt = 50 Amps/ms, VR = 30 V, TJ = 25°C) (IF = 0.5 Amp, iR = 1 Amp, IREC = 0.25 A, VR = 30 V, TJ = 25°C) trr Volts 0.95 0.75 mA 5 500 ns 35 25 Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 2. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%. 100 IR, REVERSE CURRENT (m A) 70 50 20 10 TJ = 175°C 150°C 100°C 0.08 0.04 0.02 0.008 0.004 0.002 7.0 25°C 0 40 20 5.0 60 80 100 120 140 160 180 200 VR, REVERSE VOLTAGE (VOLTS) Figure 2. Typical Reverse Current* 3.0 175°C * The curves shown are typical for the highest voltage device in the voltage grouping. Typical reverse current for lower voltage selections can be estimated from these curves if VR is sufficiently below rated VR. TJ = 25°C 2.0 150°C 100°C PF(AV) , AVERAGE POWER DISSIPATION (WATTS) i , INSTANTANEOUS FORWARD CURRENT (AMPS) F 30 80 40 20 8.0 4.0 2.0 0.8 0.4 0.2 1.0 0.7 0.5 0.3 0.2 0.1 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 vF, INSTANTANEOUS VOLTAGE (VOLTS) 14 13 12 11 10 9.0 8.0 7.0 6.0 5.0 4.0 3.0 2.0 1.0 0 SINE WAVE SQUARE WAVE 5.0 dc 10 IPK/IAV = 20 TJ = 175°C 0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 IF(AV), AVERAGE FORWARD CURRENT (AMPS) Figure 1. Typical Forward Voltage Figure 3. Average Power Dissipation www.onsemi.com 2 9.0 10 MURD320, SURD8320, NRVUD320W1 IF(AV) , AVERAGE FORWARD CURRENT (AMPS) 8.0 RATED VOLTAGE APPLIED RqJC = 6°C/W 7.0 6.0 5.0 SINE WAVE OR SQUARE WAVE 4.0 3.0 dc 2.0 TJ = 175°C 1.0 0 100 110 120 130 140 150 160 170 180 TC, CASE TEMPERATURE (°C) IF(AV) , AVERAGE FORWARD CURRENT (AMPS) Figure 4. Current Derating, Case 4.0 RATED VOLTAGE APPLIED RqJA = 80°C/W 3.5 3.0 SURFACE MOUNTED ON MIN. PAD SIZE RECOMMENDED 2.5 2.0 dc TJ = 175°C 1.5 SINE WAVE OR SQUARE WAVE 1.0 0.5 0 0 20 40 60 80 100 120 140 160 180 200 TA, AMBIENT TEMPERATURE (°C) Figure 5. Current Derating, Ambient 1000 C, CAPACITANCE (pF) 500 300 200 TJ = 25°C 100 50 30 20 10 0 10 20 30 40 50 60 70 80 VR, REVERSE VOLTAGE (VOLTS) Figure 6. Typical Capacitance www.onsemi.com 3 90 100 MURD320, SURD8320, NRVUD320W1 PACKAGE DIMENSIONS DPAK (SINGLE GAUGE) CASE 369C ISSUE E A E C A b3 B c2 4 L3 D 1 2 Z Z H DETAIL A 3 L4 NOTE 7 b2 e b TOP VIEW c SIDE VIEW 0.005 (0.13) M BOTTOM VIEW NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES. 3. THERMAL PAD CONTOUR OPTIONAL WITHIN DIMENSIONS b3, L3 and Z. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.006 INCHES PER SIDE. 5. DIMENSIONS D AND E ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY. 6. DATUMS A AND B ARE DETERMINED AT DATUM PLANE H. 7. OPTIONAL MOLD FEATURE. DIM A A1 b b2 b3 c c2 D E e H L L1 L2 L3 L4 Z BOTTOM VIEW ALTERNATE CONSTRUCTION C H L2 GAUGE PLANE C L L1 DETAIL A SEATING PLANE A1 ROTATED 905 CW SOLDERING FOOTPRINT* 6.20 0.244 2.58 0.102 5.80 0.228 STYLE 3: PIN 1. ANODE 2. CATHODE 3. ANODE 4. CATHODE 3.00 0.118 1.60 0.063 INCHES MIN MAX 0.086 0.094 0.000 0.005 0.025 0.035 0.028 0.045 0.180 0.215 0.018 0.024 0.018 0.024 0.235 0.245 0.250 0.265 0.090 BSC 0.370 0.410 0.055 0.070 0.114 REF 0.020 BSC 0.035 0.050 −−− 0.040 0.155 −−− MILLIMETERS MIN MAX 2.18 2.38 0.00 0.13 0.63 0.89 0.72 1.14 4.57 5.46 0.46 0.61 0.46 0.61 5.97 6.22 6.35 6.73 2.29 BSC 9.40 10.41 1.40 1.78 2.90 REF 0.51 BSC 0.89 1.27 −−− 1.01 3.93 −−− STYLE 8: PIN 1. N/C 2. CATHODE 3. ANODE 4. CATHODE 6.17 0.243 SCALE 3:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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