CSPEMI201AG D

CSPEMI201AG
2 Channel Headset Speaker
EMI Filter with ESD
Protection
Product Description
Features
• Two Channels of EMI Filtering
• Pi−Style EMI Filters in a Capacitor−Resistor−Capacitor (C−R−C)
•
•
•
•
•
•
•
Network
Greater than 40 dB Attenuation at 1 GHz
±8 kV ESD Protection on each Channel
(IEC 61000−4−2 Level 4, Contact Discharge)
±15 kV ESD Protection in each Channel (HBM)
Supports AC Signals − Ideal for Audio Applications
Extremely Low Lead Inductance for Optimum Filter and ESD
Performance
5−Bump, 0.930 x 1.410 mm Footprint Chip Scale Package (CSP)
These Devices are Pb−Free and are RoHS Compliant
Applications
•
•
•
•
•
•
•
EMI Filtering and ESD Protection for Headset Speaker Ports
Wireless Handsets
Handheld PCs / PDAs
MP3 Players
Digital Camcorders
Notebooks
Desktop PCs
© Semiconductor Components Industries, LLC, 2011
May, 2011 − Rev. 4
1
http://onsemi.com
WLCSP5
AG SUFFIX
CASE 567AZ
C1
100 pF
100 pF
10 W
A3
C3
100 pF
100 pF
SPKR_OUT1
10 W
A1
SPKR_OUT2
SPKR_IN2
SPKR_IN1
ELECTRICAL SCHEMATIC
GND
The CSPEMI201AG is a dual low−pass filter array integrating two
pi−style filters (C−R−C) that reduce EMI/RFI emissions while at the
same time providing ESD protection. This part is custom−designed to
interface with a speaker port on a cellular telephone or similar device.
Each high quality filter provides more than 35 dB attenuation in the
800−2700 MHz range. These pi−style filters support bidirectional
filtering, controlling EMI both to and from a speaker element. They
also support bipolar signals with a cutoff frequency of 31 MHz,
enabling audio signals to pass through without distortion.
In addition, the CSPEMI201AG provides a very high level of
protection for sensitive electronic components that may be subjected
to electrostatic discharge (ESD). The CSPEMI201AG can safely
dissipate ESD strikes of ±8 kV, the maximum requirement of the IEC
61000−4−2 international standard. Using the MIL−STD−883 (Method
3015) specification for Human Body Model (HBM) ESD, the device
provides protection for contact discharges to greater than ±15 kV.
The CSPEMI201AG is particularly well−suited for portable
electronics (e.g. cellular telephones, PDAs, notebook computers)
because of its small package and low weight. The CSPEMI201AG is
available in a space−saving, low−profile Chip Scale Package with
RoHS compliant lead−free finishing.
B2
MARKING DIAGRAM
+
AB
AB
= CSPEMI201AG
ORDERING INFORMATION
Device
Package
Shipping†
CSPEMI201AG
CSP−5
(Pb−Free)
3500/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Publication Order Number:
CSPEMI201AG/D
CSPEMI201AG
PACKAGE / PINOUT DIAGRAMS
Table 1. PIN DESCRIPTIONS
5−bump CSP Package
Top View
(Bumps Down View)
Pin
Name
Description
A1
SPKR_IN1
Speaker Input 1 (from audio circuitry)
A3
SPKR_IN2
Speaker Input 2 (from audio circuitry)
B2
GND
Orientation
Marking
Device Ground
A
C1
SPKR_OUT1 Speaker Output 1 (to speaker)
B
C3
SPKR_OUT1 Speaker Output 2 (to speaker)
+
Bottom View
(Pins Up View)
1 2 3
Pin “A1”
Marking
C1
C3
B2
A1
C
A1
A3
CSPEMI201A
CSP Package
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter
Rating
Units
−65 to +150
°C
DC Power per Resistor
100
mW
DC Package Power Rating
200
mW
Storage Temperature Range
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 3. STANDARD OPERATING CONDITIONS
Parameter
Operating Temperature Range
Rating
Units
−40 to +85
°C
Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
R
Resistance
9
10
11
W
C
Capacitance
80
100
120
pF
1.0
mA
ILEAK
Diode Leakage Current
VIN = 5.0 V
VSIG
Signal Voltage
Positive Clamp
Negative Clamp
ILOAD = 10 mA
VESD
In−system ESD Withstand Voltage
a) Human Body Model, MIL−STD−883, Method 3015
b) Contact Discharge per IEC 61000−4−2 Level 4
(Note 2)
Clamping Voltage during ESD Discharge
MIL−STD−883 (Method 3015), 8 kV
Positive Transients
Negative Transients
(Notes 2 and 3)
Cut−off frequency
ZSOURCE = 50 W, ZLOAD = 50 W
R = 10 W, C = 100 pF
VCL
fC
5
−15
7
−10
15
−5
V
kV
±15
±8
V
+15
−19
31
MHz
1. TA = 25°C unless otherwise specified.
2. ESD applied to input and output pins with respect to GND, one at a time.
3. Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping
voltage is measured at Pin C1.
http://onsemi.com
2
CSPEMI201AG
PERFORMANCE INFORMATION
Typical Filter Performance (nominal conditions unless specified otherwise, 50 W Environment)
Figure 1. Insertion Loss vs. Frequency (A1−C1 to GND B2)
Figure 2. Insertion Loss vs. Frequency (A3−C3 to GND B2)
http://onsemi.com
3
CSPEMI201AG
APPLICATION INFORMATION
Parameter
Value
Pad Size on PCB
0.240 mm
Pad Shape
Round
Pad Definition
Non−Solder Mask defined pads
Solder Mask Opening
0.290 mm Round
Solder Stencil Thickness
0.125 mm − 0.150 mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.300 mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance − Edge To Corner Ball
±50 mm
Solder Ball Side Coplanarity
±20 mm
Maximum Dwell Time Above Liquidous
60 seconds
Maximum Soldering Temperature for Lead−free Devices using a Lead−free Solder Paste
260°C
Non−Solder Mask Defined Pad
0.240 mm DIA.
Solder Stencil Opening
0.300 mm DIA.
Solder Mask Opening
0.290 mm DIA.
Figure 3. Recommended Non−Solder Mask Defined Pad Illustration
Temperature (5C)
250
200
150
100
50
0
1:00.0
2:00.0
3:00.0
Time (minutes)
4:00.0
Figure 4. Lead−free (SnAgCu) Solder Ball Reflow Profile
http://onsemi.com
4
CSPEMI201AG
PACKAGE DIMENSIONS
WLCSP5, 0.94x1.41
CASE 567AZ−01
ISSUE O
D
2X
A
ÈÈ
PIN A1
REFERENCE
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
E
DIM
A
A1
A2
b
D
E
eD
eE
0.05 C
2X
0.05 C
TOP VIEW
A2
ÉÉÉ
OptiGuard Option
0.05 C
A
RECOMMENDED
SOLDERING FOOTPRINT*
0.05 C
NOTE 3
A1
SIDE VIEW
C
SEATING
PLANE
A1
eD/2
5X
0.05 C A B
0.03 C
PACKAGE
OUTLINE
0.87
eD
b
MILLIMETERS
MIN
MAX
0.72
0.56
0.21
0.27
0.40 REF
0.29
0.35
0.94 BSC
1.41 BSC
0.50 BSC
0.435 BSC
eE
C
0.44
0.25
0.50
B
A
5X
0.25
DIMENSIONS: MILLIMETERS
1 2 3
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
BOTTOM VIEW
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
http://onsemi.com
5
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
CSPEMI201AG/D
Similar pages