AP1155ADL

[AP1155ADL]
AP1155ADL
Suitable for High Power application
Low Noise, Adjustable Voltage LDO Regulator
1. Genaral Description
The AP1155ADL is a low dropout linear regulator with ON/OFF control, which can supply 1A load current. The
AP1155ADL is housed in HSOP-8 with Exposed-Pad package, and therefore suitable for high power application.
The AP1155ADL realizes high ripple rejection and low noise, because silicon monolithic bipolar structure is
adopted. The suitable voltage for the set can be set from 1.3V to 13.5V by external resistors. The AP1155ADL
realizes to downsize Printed Circuit Board, because the input and output capacitor is available to use a small
ceramic capacitor. Also over-current protection circuit and thermal shut down are integrated. These functions
will improve reliability of the system.
2. Features
 Operating Temperature Range
-40~85℃
 Operating Voltage Range
2.4~14.0V
 Output Current
1A
 Programmable Output Voltage
1.3~13.5V
 Reference Voltage Precision
1.21V ± 35mV
 Dropout Voltage
300mV at Iout=1A
 Ripple Rejection Ratio
80dB at 1kHz
 Available very low noise application
 Available to use a small ceramic capacitor
Vout
R1
24kΩ Cout
1uF
NC
Vout
Vin
FB
Cin
1uF
Vin
2.4~14V
Exposed-Pad
Cfb
1000pF
R2
36kΩ
 On/Off control (High active)
NC
Vcont
Vcont
1.8~14V
GND
NC
 Built-in Over Current Protection, Thermal Shutdown Protection
 Package
HSOP-8pin with Exposed-Pad
3. Applications
 RF Power Supplies
PLL, VCO, Mixers, LNA
 Low Noise Imaging Equipment
Digital Camera
 High Speed/High Precision A-D, D-A, Amplifier
Audio Equipment
Medical Equipment
Instrumentation
 Precision Power Supplies
 Post Regulator for Switching Supplies
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[AP1155ADL]
4. Table of Contents
1.
2.
3.
4.
5.
6.
7.
Genaral Description ........................................................................................................................................... 1
Features .............................................................................................................................................................. 1
Applications ....................................................................................................................................................... 1
Table of Contents ............................................................................................................................................... 2
Block Diagram ................................................................................................................................................... 3
Ordering Information ......................................................................................................................................... 3
Pin Configurations and Functions ...................................................................................................................... 3
■ Pin Configurations ............................................................................................................................................ 3
■ Function ............................................................................................................................................................ 4
8. Absolute Maximum Ratings .............................................................................................................................. 5
9. Recommended Operating Conditions ................................................................................................................ 5
10.
Electrical Characteristics ................................................................................................................................ 6
■ Electrical Characteristics of Ta=Tj=25°C ........................................................................................................ 6
■ Electrical Characteristics of Ta=-40°C~85℃................................................................................................... 6
11.
Description ..................................................................................................................................................... 7
11.1 DC Characteristics ...................................................................................................................................... 7
11.2 Load Transient .......................................................................................................................................... 11
11.3 Line Transient........................................................................................................................................... 12
11.4 On / Off Transient .................................................................................................................................... 13
11.5 Ripple Rejection ....................................................................................................................................... 14
11.6 Output Noise ............................................................................................................................................ 15
11.7 Stability..................................................................................................................................................... 16
11.8 Operating Region and Power Dissipation ................................................................................................ 17
12.
Definition of term ......................................................................................................................................... 18
13.
Recommended External Circuits .................................................................................................................. 19
■VOut,TYP=3.0V: Example of selection of external components. ....................................................................... 19
■Recommended Layout ..................................................................................................................................... 19
■Test Circuit ...................................................................................................................................................... 20
14.
Package ........................................................................................................................................................ 21
■ Outline Dimensions ........................................................................................................................................ 21
15.
Revise History .............................................................................................................................................. 22
IMPORTANT NOTICE .......................................................................................................................................... 23
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5. Block Diagram
VCont
FB
On/Off
Control
Thermal &
Over Current
Protection
VRef
VIn
VOut
GND
Figure 1.Block Diagram
6. Ordering Information
AP1155ADL
Ta = -40 to 85°C
HSOP-8
7. Pin Configurations and Functions
NC
Vin
Vcont
NC
■ Pin Configurations
8
7
6
5
(Top View)
016001036-E-01
Vout
3
4
GND
2
FB
1
NC
Exposed Pad
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[AP1155ADL]
■ Function
Pin Number
Symbol
Internal Equivalent Circuit
Description
1,5,8
NC
-
Non connection Terminal
Output Terminal
Connect resistance R1 between VOut
terminal and Fb terminal, and
resistance R2 between Fb terminal and
GND.
2
VOut
Output voltage VOut,TYP is determined
by the following equation:
VOut
VIn
R1 + R 2
R2
Connect a ceramic capacitor with a
capacitance higher than the following
values between VOut terminal and GND.
VOut,TYP ≥ 2.4V : 1μF
VOut,TYP < 2.4V : 2.2μF
Feedback Terminal
Connecting a capacitor between VOut
terminal and Fb terminal reduces
output noise.
FB
3
VOut,TYP = VFb ×
FB
This terminal features very high
impedance; please note that it is
susceptible to external noise, etc.
4
GND
-
GND Terminal
VCont
300kΩ
6
VCont
500kΩ
On/Off control Terminal
The On/Off voltages are as follows:
VCont ≥ 1.8V : VOut On state
VCont ≤ 0.35V : VOut Off state
Pull-down resistance (500kΩ) is
built-in.
Input Terminal
7
VIn
-
-
Exposed
Pad
-
016001036-E-01
Connect a capacitor of 1µF or higher
between VIn terminal and GND.
Ground Terminal
Heat dissipation pad
Exposed Pad must be connected to
GND.
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[AP1155ADL]
8. Absolute Maximum Ratings
Parameter
Input Voltage
Symbol
VIn,MAX
min
Max
Unit
-0.4
16
V
Reverse Bias Voltage
FB Terminal Voltage
VRev,MAX
VFB,MAX
-0.4
-0.4
14
5
V
V
Control Voltage
VCont,MAX
-0.4
16
V
Tj
-
150
°C
TStg
-55
150
°C
Junction temperature
Storage Temperature Range
2300
mW
Power Dissipation
PD
Note 1. A 2-layer board is used(x=30mm, y=30mm,t=1.0mm). RθJA = 50°C/W.
Please refer to Section 11.8 on page 17 for more information.
Condition
VOut-VIn
Ta=25°C (Note 1)
WARNING: The maximum ratings are the absolute limitation values with the possibility of the IC breakage.
When the operation exceeds this standard quality cannot be guaranteed.
9. Recommended Operating Conditions
Symbol
min
typ
max
Unit
Operating Temperature Range
Ta
-40
-
85
°C
Operating Voltage Range
VOP
2.4
-
14.0
V
Output Voltage Range
VOut
1.3
-
13.5
V
Parameter
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Condition
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[AP1155ADL]
10. Electrical Characteristics
■ Electrical Characteristics of Ta=Tj=25°C
The parameters with min or max values will be guaranteed at Ta=Tj=25°C.
(VIn=4.0V, R1=53kΩ, R2=36kΩ, Vcont=1.8V, Ta=Tj=25°C, unless otherwise specified.)
Parameter
Symbol
Condition
min
typ
max
Unit
Fb voltage
VFB
IOut=5mA
1.185
1.210
1.245
V
Line Regulation
LinReg ∆VIn=5V, IOut=5mA
0
10
mV
I =5~500mA
6
20
Load Regulation (Note 2)
LoaReg Out
mV
IOut=5~1000mA
20
35
IOut=500mA
150
260
Dropout Voltage (Note 3)
VDrop
mV
IOut=1000mA
300
490
Maximum Output Current
1100
1400
1700
mA
IOut,Max VOut=VOut,TYP×0.9
(Note 4)
Output Short-Circuit Current
IShort
VOut=0V
1500
mA
Quiescent Current
Iq
IOut=0mA
300
480
μA
Standby Current
IStandby
VCont=0V
0.1
μA
Control Current
ICont
VCont=1.8V
5
10
μA
VOut On state
1.8
V
Control Voltage
VCont
VOut Off state
0.35
V
Note 2. Load Regulation changes with output voltage. The value mentioned above is guaranteed with the
condition at VOut,TYP=3.0V (R1=53kΩ, R2=36kΩ). The standard value is displayed by the absolute value.
Note 3. For VOut,TYP≤2.0V , no regulations.
Note 4. The maximum output current is limited by power dissipation
Note 5. Parameters with only typical values are just reference. (Not guaranteed)
■ Electrical Characteristics of Ta=-40°C~85℃
The parameters with min or max values will be guaranteed at Ta = -40 ~ 85°C.
(VIn=4.0V, R1=53kΩ, R2=36kΩ, Vcont=1.8V, Ta= -40 ~ 85°C, unless otherwise specified.)
Parameter
Symbol
Condition
min
typ
max
Unit
Fb voltage
VFB
IOut=5mA
1.175
1.210
1.255
V
Line Regulation
LinReg ∆VIn=5V, IOut=5mA
0
16
mV
IOut=5~500mA
6
37
Load Regulation (Note 6)
LoaReg
mV
IOut=5~1000mA
20
95
IOut=500mA
150
335
Dropout Voltage (Note 7)
VDrop
mV
IOut=1000mA
300
550
Maximum Output Current
1400
mA
IOut,Max VOut=VOut,TYP×0.9
(Note 8)
Output Short-Circuit Current
IShort
VOut=0V
1500
mA
Quiescent Current
Iq
IOut=0mA
300
585
μA
Standby Current
IStandby
VCont=0V
1.5
μA
Control Current
ICont
VCont=1.8V
5
15
μA
VOut On state
1.8
V
Control Voltage
VCont
VOut Off state
0.35
V
Note 6. Load Regulation changes with output voltage. The value mentioned above is guaranteed with the
condition at VOut,TYP=3.0V (R1=53kΩ, R2=36kΩ). The standard value is displayed by the absolute value.
Note 7. For VOut,TYP≤2.0V , no regulations.
Note 8. The maximum output current is limited by power dissipation
Note 9. Parameters with only typical values are just reference. (Not guaranteed)
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11. Description
11.1 DC Characteristics
 ∆VOut vs VIn (AP1155ADL)
 ∆VOut vs VIn (AP1155ADL)
100
10
600mA
I Out = 0mA
(100mA step)
0
∆VOut [mV]
∆VOut [mV]
0
-10
-200
-20
-30
-100
0
2
4
8
6
10
12
14
-300
-100
16
200
100
0
400
300
500
VIn - VOut [mV]
VIn [V]
 IQ vs VIn (AP1155ADL)
 IQ vs VIn (AP1155ADL)
350
12
340
10
330
320
IQ [µA]
IQ [mA]
8
6
4
310
300
290
280
270
2
260
0
0
2
4
6
8
10
12
14
250
16
0
2
4
50
50
40
45
30
40
20
35
10
0
-10
10
-40
5
800
0
1000
0
200
400
600
800
1000
IOut [mA]
IOut [mA]
016001036-E-01
16
20
-30
600
14
25
15
400
12
30
-20
200
10
 IGND vs IOut (AP1155ADL)
IGND [mA]
∆VOut [mV]
 ∆VOut vs IOut (AP1155ADL)
0
8
VIn [V]
VIn [V]
-50
6
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[AP1155ADL]
 VDrop vs IOut (AP1155ADL)
0
0
-50
-50
-100
-100
VDrop [mV]
VDrop [mV]
 VDrop vs IOut (AP1155ADL)
-150
-200
-150
-200
-250
-250
-300
-300
-350
0
200m
400m
600m
800m
-350
1000
0
200
400
IOut [mA]
800
1000
IOut [mA]
 VOut vs IOut (AP1155ADL)
 ICont vs VCont (AP1155ADL)
4
100
3
75
I Cont [µA]
VOut [V]
600
2
1
50
25
0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
0
0
2
4
6
IOut [A]
8
10
12
14
16
10
12
14
16
VCont [V]
 VOut vs VCont (AP1155ADL)
 IStandby vs VIn (AP1155ADL)
4
1µ
100n
3
IStandby [A]
VOut [V]
10n
2
1n
100p
1
10p
0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
1p
VCont [V]
016001036-E-01
0
2
4
6
8
VIn [V]
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[AP1155ADL]
 ∆VOut vs Ta (AP1155ADL)
 IQ vs Ta (AP1155ADL)
400
30
380
360
340
10
IQ [mA]
∆VOut [mV]
20
0
-10
320
300
280
260
240
-20
220
-30
-40
-20
0
20
40
60
80
200
-40
100
-20
0
 LoaReg vs Ta (AP1155ADL)
IOut = 100mA, 200mA, 400mA,
600mA, 800mA, 1000mA
60
IGND [mA]
LoaReg [mV]
100
70
I Out = 100mA, 200mA, 400mA,
600mA, 800mA, 1000mA
40
30
20
10
50
40
30
20
0
10
-20
0
20
40
60
80
0
-40
100
-20
0
20
40
60
80
100
80
100
Ta [°C]
Ta [°C]
 VDrop vs Ta (AP1155ADL)
 VDrop vs Ta (AP1155ADL)
0
0
-100
-100
-200
-200
VDrop [mV]
VDrop [mV]
80
80
50
-300
IOut = 100mA, 200mA, 400mA,
600mA, 800mA, 1000mA
-500
-600
-40
60
 IGND vs Ta (AP1155ADL)
60
-400
40
Ta [°C]
Ta [°C]
-10
-40
20
-300
-400
IOut = 100mA, 200mA, 400mA,
600mA, 800mA, 1000mA
-500
-20
0
20
40
60
80
-600
-40
100
Ta [°C]
016001036-E-01
-20
0
20
40
60
Ta [°C]
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[AP1155ADL]
 VOut On/Off Point vs Ta (AP1155ADL)
 ICont vs Ta (AP1155ADL)
25
1.6
1.4
20
VOut On Point
1.0
VOut Off Point
ICont [µA]
VCont [V]
1.2
0.8
0.6
0.4
VCont = 1.8V, 2.0V, 3.0V, 4.0V
15
10
5
0.2
0.0
-40
-20
0
20
40
60
80
0
-40
100
-20
0
Ta [°C]
60
80
100
 Reverse Bias Current(IRev) vs Ta (AP1155ADL)
4.5
1500
4.0
1450
3.5
1400
IRev [mA]
IOut,MAX [mA]
40
Ta [°C]
 IOut,MAX vs Ta (AP1155ADL)
1350
3.0
VRev = 3.0V
VIn=0.0V
VCont=0.0V
2.5
2.0
1.5
1300
1.0
1250
1200
-40
20
0.5
-20
0
20
40
60
80
0.0
-40
100
Ta [°C]
016001036-E-01
-20
0
20
40
60
80
100
Ta [°C]
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[AP1155ADL]
11.2 Load Transient
 IOut=0mA→1000mA, COut=1.0µF, 2.2µF, 4.7µF
 IOut=1000mA→0mA, COut=1.0µF, 2.2µF, 4.7µF
1000mA
1000mA
IOut
1000mA/div
1000mA/div
0mA
0mA
C Out= 4.7mF
COut= 1.0mF
VOut
500mV/div
200mV/div
COut= 1.0mF
10msec/div
5msec/div
Time
Time
 IOut=0mA→500mA, 0mA→1000mA
 IOut=500mA→0mA, 1000mA→0mA
1000mA (500mA)
1000mA (500mA)
1000mA/div
(500mA/div)
IOut
1000mA/div
(500mA/div)
IOut
0mA
0mA
IOut= 0mA
VOut
IOut= 1000mA
IOut= 0mA
IOut= 500mA
VOut
200mV/div
IOut= 1000mA
IOut= 0mA
IOut= 500mA
IOut= 0mA
Time
Time
 IOut=0mA→1000mA, 10mA→1010mA
 IOut=1000mA→0mA, 1010mA→10mA
1000mA (1010mA)
1000mA (1010mA)
IOut
1000mA/div
IOut
1000mA/div
0mA (10mA)
0mA (10mA)
IOut= 0mA
IOut= 10mA
IOut= 1000mA
IOut= 1010mA 200mV/div
VOut
IOut= 1000mA
IOut= 1010mA
016001036-E-01
500mV/div
5msec/div
10msec/div
VOut
C Out= 4.7mF
10msec/div
5msec/div
Time
Time
- 11 -
IOut= 0mA
200mV/div
I Out= 10mA
2016/02
[AP1155ADL]
11.3
Line Transient
 IOut=100mA, 500mA, 1000mA
 COut=1.0µF, 2.2µF, 4.7µF
5V
5V
1V/div
VIn
VIn
4V
1V/div
4V
IOut = 100mA, 500mA, 1000mA
VOut
COut = 1.0mF, 2.2mF, 4.7mF
10mV/div
10mV/div
VOut
1msec/div
1msec/div
Time
Time
 CFb=none, 1000pF, 0.1µF
5V
VIn
1V/div
4V
CFB= none
VOut
C FB= 0.1mF
10mV/div
1msec/div
Time
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[AP1155ADL]
11.4
On / Off Transient
 VCont=0.0V→2.0V, COut=1.0µF, 4.7µF, 10µF
 VCont=2.0V→0.0V, COut=1.0µF, 4.7µF, 10µF
2V
2V
VCont
VCont
2V/div
2V/div
0V
0V
VOut
1V/div
VOut
1V/div
COut = 1.0mF, 4.7mF, 10mF
COut= 10mF, 4.7mF, 1.0mF
5msec/div
250msec/div
Time
Time
 VCont=0.0V→2.0V, IOut=100mA, 500mA, 1000mA
 VCont=2.0V→0.0V, IOut=100mA, 500mA, 1000mA
2V
2V
VCont
VCont
2V/div
0V
VOut
2V/div
0V
IOut = 100mA, 500mA, 1000mA
VOut
1V/div
1V/div
IOut= 100mA, 500mA, 1000mA
25msec/div
5msec/div
Time
Time
*
*
 VCont=0.0V→2.0V, CFb=none~0.1µF
 VCont=0.0V→2.0V, CFb=none~0.1µF
2V
2V
VCont
2V/div
2V/div
VCont
0V
0V
VOut
1V/div
CFb= none
1V/div
VOut
CFb= 0.1mF
CFb= none
2.5msec/div
5msec/div
Time
Time
C Fb= 0.1mF
※ CFb=none, 100pF, 1000pF, 0.001µF, 0.01μF, 0.1μF
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11.5
Ripple Rejection
 COut=1.0μF, 2.2µF, 4.7µF, 10μF
0
0
-20
-20
-40
-40
RR [dB]
RR [dB]
 IOut=100mA, 200mA, 500mA, 1000mA
-60
-80
-60
COut= 1.0µF
-80
IOut = 100mA, 200mA, 500mA, 1000mA
-100
100
1k
10k
100k
COut= 10µF
-100
100
1M
1k
Frequency [Hz]
100k
1M
Frequency [Hz]
 IOut=1mA~1000mA, f=1kHz
 CFb=none, 0.1µF
0
0
-20
-20
-40
-40
RR [dB]
RR [dB]
10k
-60
-60
CFb= none
-80
-80
-100
100
CFb= 0.1µF
1k
10k
100k
-100
1M
200
400
600
800
1000
IOut [mA]
Frequency [Hz]
016001036-E-01
0
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[AP1155ADL]
11.6
Output Noise
 VOut,TYP=3.0V, IOut=0.1mA~1000mA
 VOut,TYP=3.0V, CFb=1pF~0.1μF
100
120
80
80
VNoise [µVrµs]
VNoise [mVrms]
100
60
40
40
20
20
0
60
0
200
400
600
800
0
1000
1p
10p
100p
0.001µ
0.01µ
0.1µ
CFb [F]
IOut [mA]
 VOut,TYP=1.3V ~ 12V
250
VNoise [µVrµs]
200
150
100
50
0
0
2
4
6
8
10
12
14
VOut,TYP [V]
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11.7 Stability
The standard capacitor recommended for use on the output side is a ceramic capacitor equal to or greater than
1.0µF. For operations at 2.4V or less, use at least a 2.2µF capacitor.
100
ESR [Ω]
10
Unstable Area
1
0.1
0.01
Stable Area
0
200
400
600
800
1000
IOut [mA]
Figure 2. Stable operation area when VOut,TYP=3.0V
The above graph indicates that operation is stable in the entire current range with a resistance of 1Ω or less
(equivalent series resistance or ‘ESR’) connected in series to the output capacitor. Generally, the ESR of a
ceramic capacitor is very low (several tens of mΩ), and no problems should arise in actual use. If an
application requires use of a large ESR capacitor, connecting a ceramic capacitor with low ESR in parallel will
enable operations at this level. When parallel output capacitors are used, be sure to position the ceramic
capacitor as close to the IC as possible. The other capacitor connected in parallel may be located away from
the IC. The IC will not be damaged by the increased capacitance. Input capacitors are necessary when the
power supply impedance increases due to battery depletion or when the line to the power supply is particularly
long. There is no general rule that can be used to determine the required number of capacitors used for such
purposes. In some cases, only one capacitor is necessary for several regulator ICs. In some cases, one capacitor
is required for each IC. To determine the required number of capacitors in a specific application, be sure to
verify operation with all parts in the installed configuration.
Capacitance vs Voltage
100
90
80
70
60
50
CAP(%)
B Curve
F Curve
0
2
4
6
8
10
12
Bias Voltage(V)
Capacitance vs Temperature
100
90
80
70
60
50
CAP(%)
B Curve
F Curve
-50
-25
0
25
50
75
100
Ta(°C)
Figure 3. General characteristics of ceramic capacitors
Ceramic capacitors normally have specific temperature and voltage characteristics. Be sure to take the
operating voltage and temperature into consideration when selecting parts for use. We recommend parts
featuring B characteristics.
For evaluation
Kyocera : CM05B104K10AB , CM05B224K10AB ,CM105B104K16A ,CM105B224K16A ,CM21B225K10A
Murata : GRM36B104K10 , GRM42B104K10 ,GRM39B104K25 , GRM39B224K10 , GRM39B105K6.3
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11.8 Operating Region and Power Dissipation
Power dissipation capability is limited by the junction temperature that triggers the built-in overheat
protection circuit. Therefore, power dissipation capability is regarded as an internal limitation. The package
itself does not offer high heat dissipation because of its small size. The package is, however, designed to
release heat effectively when mounted on the PCB. Therefore, the heat-dissipation value will vary depending
on the material, copper pattern, etc. of the PCB on which the package is mounted.
When the regulator loss is large (high ambient temperature, poor heat radiation), the overheat protection
circuit is activated. When this occurs, output current cannot be obtained, and an output voltage drop is
observed. When the junction temperature reaches the set value, the IC stops operating. However, after the IC
has stopped operation and the junction temperature lowers sufficiently, the IC restarts operation immediately.
・How to determine the thermal resistance when installation on PCB
The chip junction temperature during operation is expressed by
Tj = θ ja × PD + 25
The junction temperature of the AP1155ADL is limited to approximately 140°C by the overheat protection
circuit. PD is the value observed when the overheat protection circuit is activated. The following example is
based on an ambient temperature of 25°C.
140 = θ ja × PD + 25
θ ja × PD + 25 = 140
θ ja × PD = 115
θ ja =
115
(°C/W)
PD
Glass epoxy substrate with double-layer wiring
(x=30mm, y=30mm, t=1.0mm, copper pattern thickness: 35µm)
PD is 2300mW. If the temperature exceeds 25°C, be sure to derate at -20mW/°C.
・PD is easily calculated.
With the output terminal shorted-circuited to GND, gradually increase the input voltage and measure the input
current. Slowly increase the input voltage to about 10V. The initial input current value becomes the maximum
instantaneous output current value, but gradually lowers as the chip temperature rises, and ultimately reaches
a state of thermal equilibrium (through natural air cooling). PD is calculated using the input value for input
current and the input voltage value in the equilibrium state.
PD ≅ VIn × I In
2
PD (mW)
PD
5
DPD
3
4
0
25
75
140
TA (℃)
Procedure
(conducted at the time of installation on PCB)
1: Obtain PD ( VIn × I In when output is short-circuited).
2: Plot PD on the 25°C line.
3: Draw a straight line between PD and the 140°C line.
4: Extend a straight-line perpendicular from the point of
the designed maximum operating temperature (for
example, 75°C).
5: Extend a line to the left from the intersection of the
derating curve and the line drawn in 4, and read the PD
value (this value is DPD).
6: DPD ÷ (VIn,MAX × VOut ) = I Out at 75°C
The maximum operating current at the maximum temperature is as follows:
I Out ≅ {DPD ÷ (VIn,MAX − VOut )}
Try to achieve maximum heat dissipation in your design in order to minimize the part’s temperature during
operation. Generally speaking, lower part temperatures result in higher reliability in operation.
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12. Definition of term
 Characteristics
・Output Voltage (VOut)
The output voltage is specified with VIn=VOut,TYP+1V and IOut=5mA.
・Output Current (IOut)
Output current, which can be used continuously (It is the range where overheating protection of the IC does not
operate).
・Maximum output current (IOut,Max)
The rated output current is specified under the condition where the output voltage drops 0.9V times the value
specified with IOut=5mA by increasing the output current. The input voltage is set to VOutTYP+1V and the
current is pulsed to minimize temperature effect.
・Dropout Voltage (VDrop)
It is the difference between the input voltage and the output voltage when the circuit stops the stable operation
by decreasing the input voltage. It is measured when the output voltage drops 100mV from its nominal value
by decreasing the input voltage gradually.
・Line Regulation (LinReg)
It is the fluctuations of the output voltage value when the input voltage is changed.
・Load Regulation (LoaReg)
It is the fluctuations of the output voltage value when the input voltage is assumed to be VOut,TYP+1V, and the
output current is changed.
・Ripple Rejection (RR)
Ripple rejection is the ability of the regulator to attenuate the ripple content of the input voltage at the output.
It is measured with the condition of VIn=VOut,TYP+1.5V. Ripple rejection is the ratio of the ripple content
between the output vs. input and is expressed in dB
・Standby Current (IStandby)
Standby current is the current which flows into the regulator when the output is turned off by the control
function (VCont=0V).
 Protections
・Over Current Protection
It is an function to protect the IC by limiting the output current when excessive current flows to IC, such as the
output is connected to GND, ets.
・Thermal Protection
It protects the IC not to exceed the permissible power consumption of the package in case of large power loss
inside the regulator. The output is turned off when the chip reaches around 140°C, but it turns on again when
the temperature of the chip decreases.
・ESD
MM: 200pF 0Ω 200V or over
HBM: 100pF 1.5kΩ 2000V or over
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[AP1155ADL]
4
NC
GND
3
R2
36kΩ
Cout
1uF
Vout
1
NC
1uF
NC
Cfb
1000pF
2
FB
Vout
Cin
8
Vin
2.4~14V
Vin
7
1.8~14V
R1
24kΩ
Exposed-Pad
Vcont
Vcout
6
5
13. Recommended External Circuits
■VOut,TYP=3.0V: Example of selection of external components.
Figure 4. External Circuit
The output voltage value VOut,TYP is determined using the following equation:
VOut,TYP =
R1 + R 2
× VFB (1.21V )
R1
The minimum required current through resistance R1, R2 is 30µA, which is determined by
VFB
.
R1
Only a ceramic capacitor should be used for COut. For CIn any type of capacitor may be selected. For COut and
CIn, use capacitors rated at 1µF or higher. For details, refer to 11.7 Stability.
The Fb terminal has high impedance and is therefore susceptible to external noise, etc. Connecting capacitor
CFb between the VOut terminal and the Fb terminal minimizes the effects of external noise and also reduces
output noise.
■Recommended Layout
① Cin should be located as close as possible to Vin pin and GND.
② Cout should be located as close as possible to VOUT pin and GND.
③ Feedback resistor R1, R2 should be placed as close as possible to
the FB terminal.
When connecting Vout and R2, please wiring from "+" terminal
of Cout.
④ Cfb should be located as close as possible to VOUT pin and FB pin.
⑤ GND plane should be large as much as possible.
⑥ Exposed Pad is the ground and sharing of the IC.
Exposed Pad must be connected to GND.
⑦ Via hall is effective to heat dissipation to each layer of PCB.
Figure 5. Recommended Layout
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■Test Circuit
 Test circuit for DC characteristics
A
VIn
CIn
IIn
VIn
R1
A
VCont
ICont
VCont
VOut,TYP=3.0V(R1=53kΩ, R2=36kΩ)
VIn=4.0V, VCont=1.8V, IOut=5mA
CIn=1.0µF(Tantalum), CFb=0.001µF(Ceramic),
COut=1.0µF(Ceramic), Ta=25°C
VOut
CFb
COut
Fb
GND
V
VOut
IOut
R2
 Test circuit for Load Transient
VIn
VOut
IOut
CIn
VIn
VOut,TYP=3.0V(R1=53kΩ, R2=36kΩ)
VIn=4.0V, VCont=1.8V
CIn=1.0µF(Tantalum), Ta=25°C
R1
VCont
VCont
COut
Fb
GND
10Hz
R2
 Test circuit for Line Transient
VIn
VIn
VOut,TYP=3.0V(R1=53kΩ, R2=36kΩ)
VIn=4.0V↔5.0V(100Hz), VCont=1.8V, IOut=100mA
CIn=1.0µF(Tantalum), CFb=none, Ta=25°C
VOut
CIn
R1
VCont
VCont
CFb
IOut
COut
Fb
GND
R2
 Test circuit for On/Off Transient
VIn
CIn
CFb
R1
IOut
COut
Fb
VCont
R2
GND
VCont
VOut,TYP=3.0V(R1=53kΩ, R2=36kΩ)
VIn=4.0V, VCont=0.0V↔2.0V(10Hz), IOut=100mA
CIn=1.0µF(Tantalum), CFb=none, Ta=25°C
VOut
VIn
 Test circuit for Ripple Rejection
VIn
VIn
VRippple=
500mVp-p
R1
VCont
VCont
VOut,TYP=3.0V(R1=53kΩ, R2=36kΩ)
VIn=4.5V, VCont=2.0V, VRipple=500mVp-p, IOut=100mA
CIn=none, CFb=none, Ta=25°C
VOut
CFb
COut
Fb
GND
IOut
R2
 Test circuit for Output Noise
VIn
VIn
CIn
R1
VCont
VCont
016001036-E-01
R2=36kΩ
VIn=VOut,TYP+1.0V, VCont=2.0V, IOut=100mA
BPF=400Hz~80kHz
CIn=COut=1.0µF(Ceramic), CFb=none, Ta=25°C
VOut
GND
CFb
COut
Fb
IOut
V
VNoise
R2
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[AP1155ADL]
14. Package
■ Outline Dimensions
(Unit:mm)
Mark
5
8
4.4 0.2
AC30
xxxX
Green Product Mark
1
4
0.40 0.05
0 - 0.25
1.45 0.1
0.1
0.15 0.05
Lot No.
4.9 0.2
1.27
4
8
5
0.4 0.2
(2.7)
1
6.2 0.3
(2.9)
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15. Revise History
Date
(YY/MM/DD)
15/12/25
16/01/19
Revision
Page
Contents
00
1
1
First Edition
Added a Recommend Circuit to “2.Features”.
Fixed “3.Applications”.
Added a Recommend Layout to “13. Recommended External
Circuits”.
01
19
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[AP1155ADL]
IMPORTANT NOTICE
0. Asahi Kasei Microdevices Corporation (“AKM”) reserves the right to make changes to the
information contained in this document without notice. When you consider any use or application of
AKM product stipulated in this document (“Product”), please make inquiries the sales office of
AKM or authorized distributors as to current status of the Products.
1. All information included in this document are provided only to illustrate the operation and
application examples of AKM Products. AKM neither makes warranties or representations with
respect to the accuracy or completeness of the information contained in this document nor grants any
license to any intellectual property rights or any other rights of AKM or any third party with respect
to the information in this document. You are fully responsible for use of such information contained
in this document in your product design or applications. AKM ASSUMES NO LIABILITY FOR
ANY LOSSES INCURRED BY YOU OR THIRD PARTIES ARISING FROM THE USE OF
SUCH INFORMATION IN YOUR PRODUCT DESIGN OR APPLICATIONS.
2. The Product is neither intended nor warranted for use in equipment or systems that require
extraordinarily high levels of quality and/or reliability and/or a malfunction or failure of which may
cause loss of human life, bodily injury, serious property damage or serious public impact, including
but not limited to, equipment used in nuclear facilities, equipment used in the aerospace industry,
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not use Product for the above use unless specifically agreed by AKM in writing.
3. Though AKM works continually to improve the Product’s quality and reliability, you are
responsible for complying with safety standards and for providing adequate designs and safeguards
for your hardware, software and systems which minimize risk and avoid situations in which a
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4. Do not use or otherwise make available the Product or related technology or any information
contained in this document for any military purposes, including without limitation, for the design,
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missile technology products (mass destruction weapons). When exporting the Products or related
technology or any information contained in this document, you should comply with the applicable
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5. Please contact AKM sales representative for details as to environmental matters such as the RoHS
compatibility of the Product. Please use the Product in compliance with all applicable laws and
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6. Resale of the Product with provisions different from the statement and/or technical features set forth
in this document shall immediately void any warranty granted by AKM for the Product and shall not
create or extend in any manner whatsoever, any liability of AKM.
7. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior
written consent of AKM.
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