DC100V(X):(DC100V,1000pF-0.01µF)

REFERENCE
REFERENCE
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PLASTIC
Product
Specifications
No.
Items
2
Insulation Resistance
(IR)
3
Capacitance
4
5
6
FILM
TYPE
CHIP CAPACITOR
ECWU(X)
Specifications
Revision
Code
1-23
F
2/14
P
.
Test method
(Refer to IEC 60384-20 [JIS C 5101-20])
3000 MΩ or more
(According to 4. 3. 4)
Apply a voltage of as below at 20°C±2°C.
DC100V±1.5V : 1min±5s
Within a range of specified value.
(According to 4. 3. 2)
Measured at a frequency of 1 kHz ±0.2 kHz, at
20°C ±2°C and with voltage of 5 Vrms or less.
Tangent of
loss angle
(tan δ)
0.6 % or less
(According to 4. 3. 3)
Measured at a frequency of 1 kHz ±0.2 kHz, at
20°C ±2°C and with voltage of 5 Vrms or less.
Connection
The connection of the element shall not
open even instantaneously
Apply a voltage of 100 mV p-p or less through
specified resistance while a weak impact.
Measured at a frequency of 10kHz to 1MHz.
Appearance: No remarkable change
Connection: Stable (No short circuit or
open)
(According to IEC 60000 [JIS C 5101-1] 4. 17)
Sweep : 10Hz to 55Hz to 10Hz (1 min)
Total amplitude : 1.5 mm max
Vibration above-mentioned shall be applied to
the capacitor mounted on the PCB (Printed
Circuit Board) for a period of 2 h in each of 3
mutually perpendicular directions (total of 6 h).
Vibration Resistance
Test solder covers more than 90 % of
immersed electrode surface.
7
No.
Solderability
(According to 4. 7)
Rosin concentration: 25 wt%
Composition of test solder: Sn-3.5Ag-0.5Cu
Temperature: 245°C±3°C
Immersion time : 2.5s±0.5s
0.2 mm
Electrode surface is mentioned shaded
area.
A large-sized element examines by the cut
part with electrode.
Electrode development
Film Capacitor Division
Capacitor Business Division Panasonic Corporation
0.2 mm
REFERENCE
28-763 of 14
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Clsf.
Standard Doc.
Product
Specifications
No.
8
PLASTIC
Items
Soldering Heat
Resistance
Appearance
No remarkable change
Voltage proof
See 9-1
Change rate of
Within ±3% of the value before
capacitance
the test.
(∆C/C)
tan δ
Damp heat
(I )
Damp heat
(II)
1000 MΩ or more
0.66% or less at 1kHz
Connection
Stable
Appearance
No remarkable change applied
Voltage proof
No change, when applied 130%
of rated voltage for 1 min.
∆C/C
Within +8%/ -5%
IR
100 MΩ or more
tan δ
10
CHIP CAPACITOR
ECWU(X)
Specifications
IR
9
FILM
TYPE
1.5 or less at 1kHz
Appearance
No remarkable change applied
Voltage proof
No change, when applied 130%
of rated %voltage for 1 min.
∆C/C
IR
tan δ
Within ±10%
10 MΩ or more
2.0% or less at 1kHz
Film Capacitor Division
No.
Revision
Code
1-23
F
3/14
P
.
Test method
(Refer to IEC 60384-20 [JIS C 5101-20])
(According to 4. 6)
(1) Reflow method
Peak temperature: 240°C
Soldering : 220°C or more, 60s
Pre-heating : 150°C to 180°C, 120s
The heat history of reflow adjusted to the
above-mentioned conditions is added.
(2) Soldering iron method
Wattage of soldering iron : 30 W
Bit temperature : 250°C ±10°C
Soldering time : 3.5s ±0.5s
The soldering iron adjusted to the abovementioned conditions is contacted to electrode
of a capacitor with a solder wire of 1mm
diameter. Furthermore, it performs to another
electrode.
(According to 4. 10)
Testing oven condition:
Temperature : 40°C±2°C
Humidity : 90 %RH to 95 %RH
Load time : 1000 h +48/ -0 h
Halogen concentration of flux
: less than 0.1 wt%.
After load, the capacitor kept at ordinary
condition (ordinary temperature and humidity)
for 1 h to 2 h.
(According to 4. 10)
Testing oven condition:
Temperature : 60°C ±2°C
Humidity : 90 %RH to 95 %RH
Load time : 500 h +24/ -0 h
Halogen concentration of flux
: less than 0.1 wt%.
After load, the capacitor kept at ordinary
condition (ordinary temperature and humidity)
for 1 h to2 h.
Capacitor Business Division Panasonic Corporation
REFERENCE
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page
Clsf.
Standard Doc.
Product
Specifications
No.
PLASTIC
Items
FILM
TYPE
CHIP CAPACITOR
ECWU(X)
Specifications
Appearance No remarkable change applied
Voltage
proof
11
Damp heat with
Load (I )
No change, when applied 130% of
rated voltage for 1 min.
∆C/C
Within +8%/ -5%
IR
100 MΩ or more
tan δ
1.5% or less at 1kHz
Appearance No remarkable change applied
Voltage
proof
12
Damp heat with
Load (II)
∆C/C
IR
tan δ
No change, when applied 130% of
rated voltage for 1 min.
Within ±10%
10 MΩ or more
2.0% or less at 1kHz
Appearance No remarkable change applied
Voltage
proof
13
Damp heat with
Load (III)
∆C/C
IR
tan δ
No change, when applied rated
voltage for 1 min.
Within ±10%
10 MΩ or more
2.0% or less at 1kHz
Appearance No remarkable change applied
14
Electrical
endurance
∆C/C
Within +1%/ -6%
IR
1000 MΩ or more
tan δ
1.1% or less at 1kHz
Film Capacitor Division
No.
Revision
Code
1-23
F
4/14
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.
Test method
(Refer to IEC 60384-20 [JIS C 5101-20])
(According to 4. 10)
Testing oven condition:
Temperature : 40°C ±2°C
Humidity : 90 % RH to 95 % RH
Applying voltage : rated voltage
Load time : 1000 h +48/ -0 h
Halogen concentration of flux
: less than 0.1 wt %.
After load, the capacitor kept at ordinary
condition (ordinary temperature and humidity)
for 1 h to 2 h.
(According to 4. 10)
Testing oven condition:
Temperature : 60°C ±2°C
Humidity : 90 % RH to 95 % RH
Applying voltage : rated voltage
Load time : 500 h +24/ -0 h
Halogen concentration of flux
: less than 0.1 wt %.
After load, the capacitor kept at ordinary
condition (ordinary temperature and humidity)
for 1 h to 2 h.
(According to 4. 10)
Testing oven condition:
Temperature : 85°C ±2°C
Humidity : 85% RH +2% RH / -5% RH
Applying voltage : rated voltage
Load time : 500 h +24/ -0 h
Halogen concentration of flux
: less than 0.1 wt %.
After load, the capacitor kept at ordinary
condition (ordinary temperature and humidity)
for 1 h to 2 h.
(According to 4. 11)
Testing oven condition:
Temperature : 105°C ±2°C
Applying voltage : 125 % of rated voltage
(Apply through a series-connected resister
of 20 Ω to 1000 Ω per 1 V)
Load time : 1000 h +48/ -0 h
After load, the capacitor kept at ordinary
condition (ordinary temperature and humidity)
for 1 h to 2 h.
Capacitor Business Division Panasonic Corporation
REFERENCE
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Standard Doc.
Product
Specifications
No.
15
16
PLASTIC
Items
Heat
Resistance
Cold
Resistance
FILM
TYPE
Specifications
∆C/C
Within +3%/ -4%
IR
900MΩ or more
∆C/C
Within +1%/ -3%
Appearance No remarkable change applied
17
∆C/C
Within +1%/-5%
IR
1000MΩ or more
Change of
Temperature
tan δ
1.1% or less at 1kHz
Appearance No remarkable change applied
Adhesion of
electrode
Connection
Stable
No.
CHIP CAPACITOR
ECWU(X)
Revision
Code
P
.
Test method
(Refer to IEC 60384-20 [JIS C 5101-20])
(According to 4. 9. 2)
Testing oven condition:
Temperature : 105°C ±2°C
Time : 2 h +1/ -0 h
Measure in the testing oven.
(According to 4. 9. 4)
Testing oven condition:
Temperature : –55°C ±3°C
Time : 2 h +1/ -0 h
Measure in the testing oven.
(According to 4. 8)
Temperature cycle below-mentioned of 5
cycles shall be applied successively to the
capacitor mounted on the 1.6 t glass-epoxy
(FR-4) PCB in the testing oven.
After the cycle, the capacitor shall be kept at
the ordinary condition for 1 h to 2 h.
Soldering conditions and land dimensions are
recommended one.
step
1
2
3
4
temp.
RT
105°C±3°C
RT
-55°C ±3°C
time
2min to 3min
30min ±3min
2min to 3min
30min ±3min
(According to 4. 4)
As shown in the following figure, the force of 5N
is applied for 10s without a shock to the
capacitor mounted on PCB.
Land dimensions and soldering conditions are
recommended one, especially thickness of
solder paste is 0.15 mm.
18
F
Hole
F
Film Capacitor Division
1-23
F
5/14
Capacitor Business Division Panasonic Corporation
REFERENCE
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Standard Doc.
Product
Specifications
No.
PLASTIC
Items
FILM
TYPE
CHIP CAPACITOR
ECWU(X)
Specifications
Appearance No remarkable change applied
Connection
19
Stable
Core body
strength
No.
Revision
Code
1-23
F
6/14
P
.
Test method
(Refer to IEC 60384-20 [JIS C 5101-20])
The equipment shall permit pressurizing.
Apply a force to the center of specimen, using a
pressurizing tool as blow mentioned. The
pressure shall be 5N ±0.5N, and the holding
duration, 10s±1s.
F
R=0.5
1/2L
L
20
Resistance of
Board to bending
Appearance
No remarkable change applied
Connection
Stable
F
(According to 4. 5)
As shown in the following figure, it pressurizes
to the capacitor mounted on PCB until it is bent
by speed of 0.5mm/s and becomes the quantity
of 3 mm, and it holds for 30s.
Land dimensions and soldering conditions are
recommended one.
PC board
Capacitor
Fulcrum
45±2
Film Capacitor Division
45±2
Test stand
Capacitor Business Division Panasonic Corporation
REFERENCE
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Clsf.
Standard Doc.
Product
Specifications
Fig.1
PLASTIC
FILM
TYPE
No.
CHIP CAPACITOR
ECWU(X)
Revision
Code
1-23
F
7/14
Standard surface temperature curve of the capacitor for reflow method
Please confirm the test of the reflow method within the range of the under mentioned profile.
TEST CONDITION
50×115, 0.8 mm thickness
glass-epoxy board
Thermocouple K
Thermo electromotive force
wire diameter 0.1 mmΦ
dummy
(Attach thermocouple on the parts top surface.)
Temperature (°C) of parts surface
300
max 240°C
250
220°C or more, max 60s
――― Temperature (°C) ―――
200
150
100
50
40 s ~ 90 s
60 s ~ 150 s
20 s ~ 50 s
max 40s
0
Time →
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REFERENCE
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Standard Doc.
Product
Specifications
PLASTIC
FILM
TYPE
CHIP CAPACITOR
ECWU(X)
No.
Revision
Code
1-23
F
8/14
P
.
10. ! Caution about safety in use
I . Operating range (voltage, current, operating temperature)
Use the capacitor within the specified limits listed below (a to b). Over rated conditions might cause deterioration,
damage, smoke and fire. Do not use capacitor beyond range of the condition.
a) Permissible voltage
• DC rated voltage of this product is 100V. Use the capacitor within DC rated voltage.
• When used in AC applied circuit, less than 40Vrms should be applied.
When used in a high frequency, less than 40Vrms should be applied and current applied should be less than the
value of permissible current in Fig.2 in page 14.
• Not to be in connected directly to Primary or AC line.
• Use the peak of pulse voltage applied the capacitor within the DC rated voltage.
b) Permissible current
• The permissible current must be considered by dividing into pulse current (peak current) and continuous current
(rms current). When using, therefore, make sure the both current are within the permissible values.
In the case that a continuous current value is able not to be measured, use the capacitor within 7.5°C as the
inherent temperature rise confirmed by the measuring method show in page 13.
• Continuous current should be within specified figure in Fig.2. Contact us when the waveforms are totally different
from the sine wave.
• Pulse current should be within the figures calculated by Tab. 1. Use within 10000 cycles of pulse current. When
pulse current applied more than 10000 cycles, please consult us before use.
c) Operating temperature range
• It must be noted, however the operating temperature range is the surface temperature of the capacitor, not the
ambient temperature of the capacitor.
• In actual use, make sure the sum of the ambient temperature + own temperature rise value (Within specified
value), that is the capacitor surface temperature is within the rated operating temperature range.
• If there is cooling plate of the other part of any resistance heated to high temperature near the capacitor, the
capacitor may be locally heated by the radiation heat, exceeding the operating temperature range, and smoking or
firing may be caused. Check the capacitor surface temperature at the heat source side.
d) Protective means for safety should be provided in case the pulse and rms current may exceed the permissible
values due to abnormal action of elsewhere in the circuit.
Please consult in advance when capacitors are connected in parallel to supplement capacitance.
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Capacitor Business Division Panasonic Corporation
REFERENCE
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Standard Doc.
Product
Specifications
PLASTIC
FILM
TYPE
CHIP CAPACITOR
ECWU(X)
No.
Revision
Code
1-23
F
9/14
P
.
II.Recommendable land dimensions
For designing land size, refer to the following recommendable land size.
unit: mm
Size code
Dimensions
A
B
C
H1, H2, H3
1.8
3.6
1.4
G1, G2, G3
1.8
3.6
2.3
<Note>
• A recommended solder paste thickness is 0.10mm to 0.15mm.
C
A
B
III.Design of P. C. B.
Do not use ceramic and metal board, because they have a large thermal expansion coefficient which is different from
that of this capacitor, which are liable to cause a deterioration of thermal cycle endurance.
IV.Soldering
a) Soldering method
This capacitor shall be used in reflow method only.
b) Recommendable reflow soldering conditions
Temperature of parts surface(°C)
Recommendable reflow condition (parts surface)
Soldering (235°C, 5s)
250
220°C or more, 20s to 30s
200
150
Pre-heating
(150°C to 180°C)
100
60s to 120s
50
Time
<Note>
• The above figure is recommendable conditions.
• Soldering frequency shall be maximum two times. Solder after capacitor body temperature returned for normal
temperature soldering of a second time.
• When further conditions except for the above, please obey the following conditions. Consult us before use when
require further condition expect for the following.
(Reflow) 240°C max. and 60 seconds max. at more than 220°C (temp. at cap. surface).
• VPS’s heat effect to the capacitor is different in the reflow method, consult with our engineering section in advance
when the capacitor is mounted in VPS.
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10 of 14
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Standard Doc.
PLASTIC
Product
Specifications
FILM
TYPE
CHIP CAPACITOR
ECWU(X)
No.
Revision
Code
1-23
F
10/14
c) Soldering conditions used in soldering iron
Temperature Soldering time
Other conditions
260°C
maximum
4.0 seconds
maximum
Power of soldering iron:30W
Pre-heating is not needed
• In the case of sketch (a)
Put a soldering iron to an electrode (for less than 4 sec) with solder like sketch (a) shows.
*Put soldering iron lightly.
*Soldering is allowed as one side by one side (without interval) or as both sides at the same time.
• In the case of sketch (b)
After a solder is melted on a soldering iron like sketch (b), put them to an electrode. (for less than 4sec)
*Put soldering iron lightly.
*Soldering is allowed as one side by one side (without interval) or as both sides at the same time.
Sketch (b)
Sketch (a)
land
land
solder
soldering iron
melting solder
soldering iron
<Note>
• Soldering frequency shall be maximum two times. Solder after capacitor body temperature returned for normal
temperature soldering of a second time.
• The above condition shall be applied also on re-working after flow or reflow soldering.
Re-working with once. Because, there is heat career once when solder mounting.
• When measuring temperature, it shall be operated with solder on soldering iron.
• Please pay attention to the soldering iron not to touch a capacitor body (except electrode), especially not to touch
cut edge side.
• Consult with our engineering section in advance when require further conditions except for the above.
d) Others
• Solder a heat record of the case which soldering in others method with above-mentioned within b) and c).
• About heat record of the case which soldering removal of the case which this product solders using hot air – blow
the other part which approaches this product and a b) recommendable reflow conditions and note defend.
• Light beam and laser beam which using solders this product case c) soldering conditions used in soldering iron
and note defend.
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Standard Doc.
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Specifications
PLASTIC
FILM
TYPE
CHIP CAPACITOR
ECWU(X)
No.
Revision
Code
1-23
F
11/14
P
.
V. Soldering flux
• Solder paste shall be used flux which contains halogen within 0.1wt %. (In case of flow soldering, reflow soldering
and using soldering iron.)
• Consult with our engineering section in advance when using flux with more than 0.1wt % of the halogen content.
VI. Cleaning
a) Case of washfree
Please use a recommended flux, like low residue flux ULF-500VS or inactivated flux AM-173.
b) Applicable solvent
Type
Alcohol
Halogenated hydrocarbon
Cleaner
IPA(isopropyl alcohol)
AK-225AES
Manufacturer
General industrial use
Asahi Glass co.,Ltd.
Temperature
Period
Room temperature
less than 50°C
less than 50°C
Within 5minutes
Within 5minutes
Within 5minutes
c) Cleaning method
Conditions
Item
Immersion
Vaporized cleaning
Ultrasonic cleaning
<Note>
• Do not wash it with water.
• It is necessary to remove cleaner from P.C.B. by drying thoroughly after cleaning.
• Cleaner shall contain halogen with less than 0.1wt%, because in case of cleaning after mounting, halogen in flux
will dissolve into cleaner.
• Consult with our engineering section in advance when further information for cleaning solvent, conditions are
required.
VII. Storage and preservation
• It must be noted that the solderability of the external electrode may deteriorated when stored in an atmosphere
filled with moisture, dust, or a reactive oxidizing gas (hydrogen chloride, hydrogen sulfide, sulfuric acid) .
• Avoid location with particularly high temperature and high humidity, and store in conditions not exceeding 35°C and
85%RH. Storage period limit is 6 months (use within 6 months).
• Consult with our engineering section in advance when require further conditions except for the above.
VIII. Operating environment
• Avoid to use in a place of corrosive and oxidizing gas atmosphere (hydrogen chloride, hydrogen sulfide, sulfuric
acid etc.)
• Avoid use under the environment where water is generated to deteriorated the characteristic of the capacitor when
the adhesion of water (drop of water etc.) is generated in the capacitor.
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FILM
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ECWU(X)
No.
Revision
Code
1-23
F
12/14
P
.
Capacitance change (%)
IX. Capacitance change due to humidity absorption
In environment with humidity change, capacitance of this capacitor changes (increases and decreases).
Because capacitor absorbing and dis-absorbing due to humidity of environment.
Consult with our engineering section detail of this capacitance change.
[ For example : The data shown below is capacitance change from dry condition to 40°C, 95%RH condition.]
40°C • 95%RH
About 8 %
Dry condition
Time →
X. In case of using resin for fixing the chip parts
In case of using resin for fixing the chip parts, inquiring in advance of our engineering section is recommended.
XI . Resin coating
When capacitors are coated or embedded with resin, inquiring of our engineering section is recommended.
XII. Handling of a element
When handle an element of the capacitor with tweezers, use tweezers made of resign and applied stress should
be less than 5N.
XIII. Stress, damage
Please pay attention to the following points, when stress or damage is applied to the capacitor it may become the
cause of malfunction.
• Do not apply more than 5N as pull, stress and pressure etc.
• Do not apply strong stress to cut edge side of the capacitor and not give the damage of scratch etc.
XIV. Singular using
This capacitor is generally surface mount device. Do not use singular using.
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PLASTIC
Product
Specifications
FILM
TYPE
CHIP CAPACITOR
ECWU(X)
No.
Revision
Code
1-23
F
13/14
Tab.1 Permissible pulse current (Max.10000cycles)
Pulse current applied to this capacitor should be used within permissible pulse current (Max.10000cycles)
shown in the following table.
In case of pulse current is over the specified table, inquire of our engineering section.
dV/dt (V/µs)
ECWU1(X)
Part No.
(Rated Capacitance: µF)
102
122
152
182
222
272
332
392
472
562
682
822
103
(0.0010)
(0.0012)
(0.0015)
(0.0018)
(0.0022)
(0.0027)
(0.0033)
(0.0039)
(0.0047)
(0.0056)
(0.0068)
(0.0082)
(0.010)
1000
920
830
760
690
630
570
530
480
450
410
370
340
Measuring method of inherent temperature rise
As shown in the drawing, attach a thermocouple to the capacitor surface with adhesive, and measure the
surface temperature and capacitor surface temperature while avoiding radiation heat from peripheral parts.
At this time, use a thermocouple with small thermal capacity (Φ0.1 T wire), and to avoid heat release to the
board, lift the parts to be measure from the board by using lead wire or the like, and install as shown in the
drawing. To avoid effects of convention and wind, put the capacitor into the box or the like, and measure in
wind-free condition.
Thermocouple
Land
Lead wire
Temperature measurement
instrument
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Product
Specifications
PLASTIC
FILM
TYPE
CHIP CAPACITOR
ECWU(X)
No.
Revision
Code
1-23
F
14/14
Fig.2 Permissible Current
Measuring condition :
Sine wave
ECWU1(X)
0.5
0.4
Permissible Current (Arms)
0.010 µF
0.3
0.0082 µF
0.0068 µF
0.0056 µF
0.0047 µF
0.2
0.0039 µF
0.0033 µF
0.0027 µF
0.0022 µF
0.0018 µF
0.0015 µF
0.1
0.0012 µF
0.0010 µF
0
10
100
Frequency (kHz)
Film Capacitor Division
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1000
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.
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