DC100V(C):(DC100V,0.012µF-1.0µF)

REFERENCE
REFERENCE
28-76
page
2 of 14
Clsf.
Standard Doc.
PLASTIC
Product
Specifications
FILM CHIP CAPACITOR
TYPE ECWU1 (C)
No.
Revision
Code
7. DIMENSIONS
As specified in the individual drawing.
8. APPEARANCE
Plating of outer electrode shall be proper enough to be soldered.
9. CHARACTER
No.
Item
Performance
Between terminals:
Nothing abnormal shall be found, when applied voltage of
150% of the rated voltage for 1 minute.
(Pass the resistance of 2kΩ or more at the electrical
charge and discharge so that current must not exceed
1A.)
Between terminals :
3000MΩ or more (C: 0.33 µF or less)
1000Ω• F or more (C: more than 0.33 µF)
When the reading of measuring instrument becomes
steady at a value after applying a voltage of
100VDC ± 5.0VDC for 1 minute ± 5 seconds, at 20°C
± 2°C.
1-18
G
2/15
P
Testing method
JIS C 5102-1994
7.1
IEC 384-1-1982
4.6
1.
Withstand
voltage
2.
Insulation
Resistance
3.
Capacitance
Within a range of specified value.
(Measured at a frequency of 1kHz ± 0.2kHz, at 20°C ± 2°C
and a voltage of 5V or less.)
JIS C 5102-1994
7.8
IEC 384-1-1982
4.
Dissipation
Factor
1.0% or less
(Measured at a frequency of 1kHz ± 0.2kHz, at 20°C ± 2°C
and a voltage of 5V or less.)
JIS C 5102-1994
7.9
IEC 4.8
5.
Connection
The connection of the element shall not open even
instantaneously when applied a voltage of 100mV peak or
less and applied light force.
JIS C 5102-1994
7.10
IEC 384-1-1982
6.
7.
Vibration proof
Soldering
Property
The capacitor shall be mounted on the PC board, and the
following vibration shall be applied to the capacitor.
Range of vibration frequency 10Hz to 55Hz total amplitude
1.5mm, rate of frequency vibration to be such as to vary from
10Hz to 55Hz and return to 10Hz in about 1 minute and thus
repeated.
Thus shall be conducted for 2hours each (total 6hours) in
3 mutually perpendicular directions.
The connection shall not get short-circuit or open when
examined the connection of the element in compliance with
the previous item (connection of element) during the last
30 minutes of the test.
The terminal shall be immersed in methanol solution of resin
(about 25%) and the terminal shall be immersed in the solder
bath at a temperature of 255°C ± 2°C for 2.5seconds±
0.5seconds.
After test immersion, the solder shall be sticked to more than
90% in the surface of the electrodes.
Film Capacitor Division
Capacitor Business Division Panasonic Corporation
JIS C 5102-1994
7.6
IEC 384-1-1982
4.5
JIS C 5102-1994
8.2.3.(A)
IEC 384-1-1982
4.17
JIS C 5102-1994
8.4
IEC 384-1-1982
4.15
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Standard Doc.
Product
Specifications
No.
PLASTIC
FILM CHIP CAPACITOR
TYPE ECWU1 (C)
Item
No.
Revision
Code
Performance
1-18
G
3/15
Testing method
The capacitor under test shall be put in the testing oven and
kept at condition of the temperature at + 40°C ± 2°C and the
humidity at 90% to 95% for 500hours +24/ –0 hours and then
shall be let alone at ordinary condition for 1.5hours ± 0.5
hours.
After the test, the capacitor shall be satisfied with the
following performance.
8.
Moisture
Resistance
Appearance :
No remarkable change.
Withstand voltage :
Between terminals
Nothing abnormal shall be found, when applied a
voltage of 130% of the rated voltage for 1 minute.
(The capacitor shall be applied the voltage through
2kΩ or more when charge or discharge.)
Insulation resistance :
Between terminals
100MΩ or more (C: 0.33 µF or less)
30Ω • F or more (C: more than 0.33 µF)
Change rate of capacitance :
Within +8/ –5% of the value before the test.
Dissipation factor :
1.5% or less (at 1kHz)
JIS C 5102-1994
9.5
IEC 384-1-1982
4.22
The capacitor under test shall be applied the rated voltage
continuously for 500hours +24/–0 hours in the testing oven
and kept at condition of the temperature at +40°C ± 2°C and
the humidity at 90% to 95% and then shall be let alone at
ordinary condition for 1.5hours ± 0.5 hours.
After the test, the capacitor shall be satisfied with the
following performance.
9.
Moisture
Resistant
Loading
Appearance :
No remarkable change.
Withstand voltage :
Between terminals
Nothing abnormal shall be found, when applied a
voltage of 130% of the rated voltage for 1 minutes.
(The capacitor shall be applied the voltage through
2kΩ or more when charge or discharge.)
Insulation resistance :
Between terminals
100MΩ or more (C: 0.33 µF or less)
30Ω • F or more (C: more than 0.33 µF)
Change rate of capacitance :
Within +8/ –5% of the value before the test.
Dissipation factor :
1.5% or less (at 1kHz)
Film Capacitor Division
Capacitor Business Division Panasonic Corporation
JIS C 5102-1994
9.9
P
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page
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Standard Doc.
Product
Specifications
PLASTIC
No.
Item
10.
High
Temperature
loading
11.
Heat
Resistance
12.
Cold
Resistance
FILM CHIP CAPACITOR
TYPE ECWU1 (C)
No.
Revision
Code
Performance
The capacitor under test shall be applied the voltage of 125%
of decrease rated voltage (Fig.1) through a series-connected
resister of from 20Ω to 1000Ω per 1V, continuously for
1000hours +48/ –0 hours in the testing oven and kept at
condition of the temperature at +125°C ± 2°C and then shall
be let alone at ordinary condition for 1.5hours± 0.5 hours.
After the test, the capacitor shall be satisfied with the
following performance.
Appearance :
No remarkable change.
Insulation resistance :
Between terminals
1000MΩ or more (C: 0.33 µF or less)
330Ω • F or more (C: more than 0.33 µF)
Change rate of capacitance :
Within +1/ –6% of the value before the test.
Dissipation factor :
1.1% or less (at 1kHz)
Insulation resistance at +125°C ± 2°C after 2hours +1/–0
hours.
Insulation resistance :
Between terminals
90MΩ or more (C: 0.33 µF or less)
30Ω • F or more (C: more than 0.33 µF)
Change rate of capacitance at +85°C ± 2°C after 2hours
+1/ –0 hours.
Within +3/–4% of the value before the test.
Change rate of capacitance at –55°C± 2°C after 2hours
+1/ –0 hours.
Within +1/ –3% of the value before the test.
Film Capacitor Division
Capacitor Business Division Panasonic Corporation
1-18
G
4/15
P
Testing method
JIS C 5102-1994
9.10
JIS C 5102-1994
9.2
IEC 384-1-1982
4.21.2
JIS C 5102-1994
9.1
IEC 384-1-1982
4.21.4
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Standard Doc.
PLASTIC
Product
Specifications
No.
FILM CHIP CAPACITOR
TYPE ECWU1 (C)
Item
No.
Revision
Code
Performance
1. Reflow method
Test condition of the reflow oven shall be adjusted that
maximum temperature of the capacitor surface shall be
240°C ±3°C. (See Fig. 2.)
After the test, the capacitor shall be let alone at ordinary
temperature and humidity for 1hour ± 0.5 hours. After this,
the capacitor shall be satisfied with the following
performance.
13.
Soldering
Heat
Resistance
2. Soldering iron method
The soldering iron of a 30-watt shall be used and the
temperature of the soldering iron shall be adjusted at
250°C ± 10°C.
The soldering iron together with a solder wire of 1mm
diameter shall be put to each outer electrode of the
capacitor for 3.5seconds ± 0.5seconds.
After this, the capacitor shall be satisfied with the following
performance.
Appearance :
No remarkable change.
Withstand voltage :
Between terminals
Nothing abnormal shall be found, when applied a
voltage of 150% of the rated voltage for 1 minute.
(The capacitor shall be applied the voltage through
2kΩ or more when charge or discharge.)
Insulation resistance :
Between terminals
1000MΩ or more (C: 0.33 µF or less)
330Ω • F or more (C: more than 0.33 µF)
Change rate of capacitance :
Within ±5% of the value before the test.
Dissipation factor :
1.1% or less (at 1kHz)
Film Capacitor Division
Capacitor Business Division Panasonic Corporation
1-18
G
5/15
Testing method
P
REFERENCE
28-76
page
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Standard Doc.
PLASTIC
Product
Specifications
No.
14.
FILM CHIP CAPACITOR
TYPE ECWU1 (C)
Item
No.
Revision
Code
Performance
The capacitor under the test shall be kept in the testing oven
and kept at condition of the temperature of –55°C ± 3°C for
30minutes ± 3minutes. After this, the capacitor shall be let
alone at the ordinary temperature for 3 minutes or less.
After this, the capacitor under the test shall be kept in the
testing oven and kept at condition of the temperature of
+125°C ± 3°C for 30minutes± 3minutes.
Then the capacitor shall be let alone at the ordinary
temperature for 3 minutes or less.
This operation shall be counted as 1 cycle, and it shall be
repeated for 5 cycles successively.
After the test, the capacitor shall be let alone at the ordinary
condition for 1.5hours ± 0.5hours, and shall be satisfied with
the following performance.
Temperature
cycle
1-18
G
6/15
Testing method
JIS C 5102-1994
9.3
Appearance :
No remarkable change.
Insulation resistance :
Between terminals
1000MΩ or more (C: 0.33 µF or less)
330Ω• F or more (C: more than 0.33 µF)
Change rate of capacitance :
Within +1/ –5% of the value before the test.
Dissipation factor :
1.1% or less (at 1kHz)
Permissible current to pulse current.
The pulse permissible current is generally obtained by the
product of dV/dt (V/µs) value and capacitance (µF) .
I =C • dV/dt
However, number of repetitions is 10,000 cycles or less.
Make sure the rms current is within the permissible value.
(See Tab.1)
15.
dV/dt
16.
Robustness of
capacitor body
Insulation resistance :
Between terminals
500MΩ or more (C: 0.33 µF or less)
150Ω• F or more (C: more than 0.33 µF)
Change rate of capacitance :
Within ±3% of the value before the test.
Dissipation factor :
1.2% or less (at 1kHz)
The equipment shall permit pressurizing.
Apply a force to the center of specimen, using a pressurizing
as shown in the drawing. The pressure shall be 5N ±0.5N,
and the holding duration, 10seconds ±1 second.
F
Appearance :
No remarkable change.
Film Capacitor Division
Capacitor Business Division Panasonic Corporation
JIS C 5102-1994
8.11.1
JIS C 5102-1994
8.12
P
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Specifications
PLASTIC
No.
Item
17.
Resistance of
Board to bending
18.
Adhesivenes
FILM CHIP CAPACITOR
TYPE ECWU1 (C)
No.
Revision
Code
Performance
Testing method
The bending stroke shall be 1mm. Pressurizing shall be
carried out at the rate of 1mm/s. After reaching the specified
bending, keep it for 5seconds ±1second.
After the test no breaking of the terminal shall be found.
Mount the specimen to the testing wiring printed board.
Examine, with a magnifier of magnification of 10, the
appearance of specimen.
As shown in below, apply the pressurizing jig to the center in
the longitudinal direction of specimen.
Apply a force to the pressurizing jig gradually in the
horizontal direction with the testing printed wiring board.
The pressure shall be 5N ±0.5N, and the holding duration,
10seconds ±1 second.
After the test, use magnifier of magnification of 10, and check
for cracks of soldering position.
Appearance
No remarkable change.
Film Capacitor Division
1-18
G
7/15
F
Capacitor Business Division Panasonic Corporation
JIS C 5102-1994
8.12
JIS C 5102-1994
8.11.2
P
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Standard Doc.
PLASTIC
Product
Specifications
FILM CHIP CAPACITOR
TYPE ECWU1 (C)
No.
Revision
Code
1-18
G
8/15
Fig.2 Standard surface temperature curve of the capacitor for reflow method
Test condition
Glass epoxy base board (0.8mm)
Thermocouple(Φ0.1mm K-type)
50mm
115mm
Temperature of element surface
250
Max.240°C
220°C or more
Max.60s
Temperature(°C)
200
150
100
50
Max.90s
Min.40s
60 to 150s
Max.25s
Min.10s
Max.40s
0
0
60
Film Capacitor Division
120
Time (s)
180
Capacitor Business Division Panasonic Corporation
240
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Standard Doc.
Product
Specifications
PLASTIC
FILM CHIP CAPACITOR
TYPE ECWU1 (C)
No.
Revision
Code
1-18
G
9/15
P
10. ! Caution about safety in use
I. Operating range (voltage, current, operating temperature)
Use the capacitor within the specified limits listed below (a to d). Over rated conditions might cause deterioration,
damage, smoke and fire. Do not use capacitor beyond range of the condition.
a) Permissible voltage
• Rated voltage of this product is 100VDC. Use the capacitor within DC rated voltage.
• When used in AC applied circuit, less than 40Vrms should be applied. When used in a high frequency, less
than 40Vrms should be applied and current applied should be less than the value of permissible current in
Fig.3.
• Use the peak of pulse voltage applied the capacitor within the DC rated voltage.
b) Permissible current
• The permissible current must be considered by dividing into pulse current (peak current) and continuous
current (rms current). When using, therefore, make sure the both current are within the permissible values.
In the case that a continuous current value is able not to be measured, use the capacitor within 7.5°C as the
inherent temperature rise confirmed by the measuring method show in page 14.
• Continuous current should be within specified figure in Fig.3. Contact us when the waveforms are totally
different from the sine wave.
• Pulse current should be within the figures calculated by Tab. 1. Use within 10000 cycles of pulse current.
When pulse current applied more than 10000 cycles, please consult us before use.
c) Operating temperature range
• It must be noted, however the operating temperature range is the surface temperature of the capacitor, not
the ambient temperature of the capacitor.
• In actual use, make sure the sum of the ambient temperature + own temperature rise value (Within specified
value), that is the capacitor surface temperature is within the rated operating temperature range.
• If there is cooling plate of the other part of any resistance heated to high temperature near the capacitor, the
capacitor may be locally heated by the radiation heat, exceeding the operating temperature range, and
smoking or firing may be caused. Check the capacitor surface temperature at the heat source side.
d) Protective means for safety should be provided in case the pulse and rms current may exceed the permissible
values due to abnormal action of elsewhere in the circuit.
Please consult in advance when capacitors are connected in parallel to supplement capacitance.
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Capacitor Business Division Panasonic Corporation
REFERENCE
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Standard Doc.
PLASTIC
Product
Specifications
FILM CHIP CAPACITOR
TYPE ECWU1 (C)
No.
Revision
Code
1-18
G
10/15
P
II. Recommendable land size
For designing land size, refer to the following recommendable land size.
unit: mm
Size code
Dimensions
A
B
C
E1, E2, E3a, E3 (4833)
2.6
6.6
3.0
D1, D3, D4
(6041)
3.8
7.8
3.8
Z
(7150)
4.5
9.0
4.6
X
(7755)
5.1
9.7
5.0
V
(9863)
7.2
11.9
5.7
<Note>
• A recommended solder paste thickness is between 0.10mm and 0.15mm.
C
A
B
III. Design of P. W. B.
Do not use ceramic and metal board, because they have a large thermal expansion coefficient which is different from
that of this capacitor, which are liable to cause a deterioration of thermal cycle endurance.
IV. Soldering
a) Soldering method
This capacitor shall be used in reflow method only.
Temperature of element surface(°C)
b) Recommendable reflow soldering condition
Temperature of element surface
Recommendable reflow condition
Soldering
300
(Max.235°C, Max. 5s)
250
200
150
220°C or more
Pre-heating
(150°C to 180°C)
20 to 30s
60 to 120s
100
50
Time (s)
<Note>
• The above figure is recommendable conditions.
• Soldering frequency shall be maximum two times. Solder after capacitor body temperature returned for
normal temperature soldering of a second time.
• When further conditions except for the above, please obey the following conditions. Consult us before use
when require further condition expect for the following.
(Reflow) 240°C max. and 60 seconds max. at more than 220°C (temp. at cap. surface).
• VPS’s heat effect to the capacitor is different in the reflow method, consult with our engineering section in
advance when the capacitor is mounted in VPS.
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Capacitor Business Division Panasonic Corporation
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Standard Doc.
PLASTIC
Product
Specifications
FILM CHIP CAPACITOR
TYPE ECWU1 (C)
No.
1-18
G
11/15
Revision
Code
c) Soldering conditions used in soldering iron
Temperature Soldering time
Other conditions
260°C
maximum
4.0 seconds
maximum
Power of soldering iron:30W
Pre-heating is not needed
• In the case of sketch (a)
Put a soldering iron to an electrode (for less than 4 sec) with solder like sketch (a) shows.
*Put soldering iron lightly.
*Soldering is allowed as one side by one side (without interval) or as both sides at the same time.
• In the case of sketch (b)
After a solder is melted on a soldering iron like sketch (b), put them to an electrode. (for less than 4sec)
*Put soldering iron lightly.
*Soldering is allowed as one side by one side (without interval) or as both sides at the same time.
Sketch (b)
Sketch (a)
land
land
melting solder
solder
soldering iron
soldering iron
<Note>
• Soldering frequency shall be maximum two times. Solder after capacitor body temperature returned for
normal temperature soldering of a second time.
• The above condition shall be applied also on re-working after reflow soldering. Readjust with once after
reflow soldering.
• When measuring temperature, it shall be operated with solder on soldering iron.
• Please pay attention to the soldering iron not to touch a capacitor body(except electrode), especially not to
touch cut edge side.
• Consult with our engineering section in advance when require further conditions except for the above.
d) Others
• Solder a heat record of the case which soldering in others method with above-mentioned within b) and c) .
• It is too much heat record that solders or solders removal this product or the other part which approaches
this product using hot air – blow. Consult us before use.
• Do not to use soldering this product by Light beam and laser beam. If used these method , consult us before
use.
• Consult us before use ,when soldering in other method.
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Standard Doc.
Product
Specifications
PLASTIC
FILM CHIP CAPACITOR
TYPE ECWU1 (C)
No.
Revision
Code
1-18
G
12/15
V. Warning about solder paste
• Solder paste shall be used which contains halogen with less than 0.1wt%.(In case of flow soldering, reflow
soldering and using soldering iron.)
VI. Cleaning
a) Case of washfree
Please use a recommended flux ,like low residue flux ULF-500VS or inactivated flux AM-173.
b) Applicable solvent
Type
Alcohol
Halogenated hydrocarbon
Cleaner
IPA(isopropyl alcohol)
AK-225AES
Manufacturer
General industrial use
Asahi Glass co.,Ltd.
c) Cleaning method
Item
Conditions
Immersion
Vaporized cleaning
Ultrasonic cleaning
Temperature
Room temperature
Less than 50°C
Less than 50°C
Period
Within 5minutes
Within 5minutes
Within 5minutes
<Note>
• When washing right after soldering, make sure the capacitor surface temperature is lower than 60°C.
• It is necessary to remove cleaner from P.W.B. by drying thoroughly after cleaning.
• Cleaner shall contain halogen with less than 0.1wt%, because in case of cleaning after mounting, halogen in
flux will dissolve into cleaner.
• Consult with our engineering section in advance when further information for cleaning solvent, conditions
are required.
VII. Storage and preservation
• It must be noted that the solderability of the external electrode may deteriorated when stored in an
atmosphere filled with moisture, dust, or a reactive oxidizing gas (hydrogen chloride, hydrogen sulfide,
sulfuric acid) .
• Avoid location with particularly high temperature and high humidity, and store in conditions not exceeding
35°C and 85%RH. Storage period limit is 6 months (use within 6 months).
• Consult with our engineering section in advance when require further conditions except for the above.
VIII. Operating environment
• Consult us when used for a long period in humid environments, because characteristic deterioration as low
insulation resistance and oxidized evaporated film may occur due to humidity absorbed with the passing of
the time.
• Avoid to use in a place of corrosive and oxidizing gas atmosphere (hydrogen chloride, hydrogen sulfide,
sulfuric acid etc.)
• Avoid use under the environment where water is generated to deteriorated the characteristic of the capacitor
when the adhesion of water (drop of water etc.) is generated in the capacitor.
• No dust should be permitted to remain on the surface of the product as this may cause electrical leakage.
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Specifications
PLASTIC
FILM CHIP CAPACITOR
TYPE ECWU1 (C)
No.
Revision
Code
1-18
G
13/15
P
Capacitance change (%)
IX. Capacitance change due to humidity absorption
In environment with humidity change, capacitance of this capacitor changes (increases and decreases).
Because capacitor absorbing and dis-absorbing due to humidity of environment.
Consult with our engineering section detail of this capacitance change.
[ For example : The data shown below is capacitance change from dry condition to 40°C, 95%RH condition.]
40°C • 95%RH
About 8 %
Dry condition
Time →
X. In case of using resin for fixing the chip parts
In case of using resin for fixing the chip parts, inquiring in advance of our engineering section is recommended.
XI. Resin coating
When capacitors are coated or embedded with resin, inquiring of our engineering section is recommended.
XII. Handling of a element
When handle an element of the capacitor with tweezers, use tweezers made of resign and applied stress should
be less than 5N.
XIII. Stress, damage
Please pay attention to the following points, when stress or damage is applied to the capacitor it may become the
cause of malfunction.
• Do not apply more than 5N as pull, stress and pressure etc.
• Do not apply strong stress to cut edge side of the capacitor and not give the damage of scratch etc.
XIV. Singular using
This capacitor is generally surface mount device. Do not use singular using.
11. Life designed
This product is designed as its life time is more than 10 year (actual working hours of capacitor are 50,000h) under the
conditions that operating temperature is less than 85°C and applied voltage is than rated voltage.
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Product
Specifications
PLASTIC
FILM CHIP CAPACITOR
TYPE ECWU1 (C)
No.
Revision
Code
Tab.1 Permissible pulse current (Max.10000cycles)
Pulse current applied to this capacitor should be used within permissible pulse current (Max.10000cycles)
shown in table.
In case of pulse current is over the specified table, inquire of our engineering section.
Item
dV/dt(V/µs)
ECWU1 123 to 823 (C)
320
ECWU1 104 to 154 (C)
210
ECWU1 184 to 334 (C)
120
ECWU1 394 to 474 (C)
100
ECWU1 564 to 105 (C)
70
Measuring method of inherent temperature rise
As shown in the drawing, attach a thermocouple to the capacitor surface with adhesive, and measure
the surface temperature and capacitor surface temperature while avoiding radiation heat from
peripheral parts. At this time, use a thermocouple with small thermal capacity (Φ0.1 T wire), and to
avoid heat release to the board, lift the parts to be measure from the board by using lead wire or the
like, and install as shown in the drawing. To avoid effects of convention and wind, put the capacitor
into the box or the like, and measure in wind-free condition.
Thermocouple
Land
Solder-plated copper wireΦ0.8
Film Capacitor Division
Temperature measurement
instrument
Capacitor Business Division Panasonic Corporation
1-18
G
14/15
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Specifications
Fig.3
PLASTIC
Permissible Current
Measuring condition
FILM CHIP CAPACITOR
TYPE ECWU1 (C)
No.
Revision
Code
1-18
G
15/15
: Sine wave
PERMISSIBLE CURRENT(Arms)
3.0
105
824
2.0
684
474
564
394
334
274
224
184
154
124
104
823
683
563
473
393
333
273
223
183
153
123
1.0
0
1
10
100
FREQUENCY(kHz)
Film Capacitor Division
Capacitor Business Division Panasonic Corporation
1000
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