REVISIONS LTR DESCRIPTION A DATE (YR-MO-DA) APPROVED 15-06-23 Charles F. Saffle Table I: For operating frequency test, correct min and max limits for non RHA subgroup 4 from “270” and “330” kHz to “260” and “370” kHz, and correct min and max limits for non RHA subgroups 5 and 6 from “270” and “330” kHz to “240” and “390” kHz. -gc REV SHEET REV SHEET REV STATUS REV A A A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY Greg Cecil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 CHECKED BY Greg Cecil http://www.landandmaritime.dla.mil/ APPROVED BY Charles F. Saffle DRAWING APPROVAL DATE 14-08-25 REVISION LEVEL A MICROCIRCUIT, HYBRID, HIGH VOLTAGE, SYNCHRONOUS, SWITCHING REGULATOR CONTROLLER SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 1 OF 5962-14223 13 5962-E384-15 1. SCOPE 1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN. 1.2 PIN. The PIN shall be as shown in the following example: 5962 Federal stock class designator \ F RHA designator (see 1.2.1) 14223 01 Device type (see 1.2.2) / K Device class designator (see 1.2.3) X Case outline (see 1.2.4) A Lead finish (see 1.2.5) \/ Drawing number 1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices meet the MIL-PRF-38534 specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device types. The device types identify the circuit function as follows: Device type Generic number 01 MSK 5055-1 02 MSK 5055-2 Circuit function Radiation hardened, reverse current mode disabled, high voltage, switching regulator controller Radiation hardened, reverse current mode enabled, high voltage, switching regulator controller 1.2.3 Device class designator. This device class designator is a single letter identifying the product assurance level. All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and E) or QML Listing (Class G and D). The product assurance levels are as follows: Device class Device performance documentation K Highest reliability class available. This level is intended for use in space applications. H Standard military quality class level. This level is intended for use in applications where non-space high reliability devices are required. G Reduced testing version of the standard military quality class. This level uses the Class H screening and In-Process Inspections with a possible limited temperature range, manufacturer specified incoming flow, and the manufacturer guarantees (but may not test) periodic and conformance inspections (Group A, B, C, and D). E Designates devices which are based upon one of the other classes (K, H, or G) with exception(s) taken to the requirements of that class. These exception(s) must be specified in the device acquisition document; therefore the acquisition document should be reviewed to ensure that the exception(s) taken will not adversely affect system performance. D Manufacturer specified quality class. Quality level is defined by the manufacturers internal, QML certified flow. This product may have a limited temperature range. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-14223 A REVISION LEVEL A SHEET 2 1.2.4 Case outline. The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals X Y See figure 1 See figure 1 16 16 Package style Flat pack with straight leads Flat pack with gull wing leads 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38534. 1.3 Absolute maximum ratings. 1/ Input voltage (VIN) ....................................................................................... Boost Voltage (BOOST).............................................................................. SW Voltage ................................................................................................. SW-Boost differential voltage...................................................................... Sync, VC, VFB, CSS and SHDN pin voltages............................................. SHDN pin current ........................................................................................ VCC voltage ................................................................................................. SENSE + SENSE - ..................................................................................... SENSE + SENSE – differential voltage ...................................................... Junction temperature (TJ) ........................................................................... Thermal resistance, junction-to-case (TC = +125°C) ................................... Storage temperature ................................................................................... Lead temperature (soldering, 10 seconds) ................................................. 65 V dc 80 V 65 V, -2 V 2/ 24 V 5V 1 mA 24 V 40 V +/- 1 V +150°C 5.6º C/W -65°C to +150°C +300°C 1.4 Recommended operating conditions. Input voltage range (VIN) ............................................................................. Case operating temperature range (TC) ...................................................... +4 V dc to +65 V dc -55°C to +125°C 1.5 Radiation features. 3/ 4/ Maximum total dose available (dose rate = 50 - 300 rads(Si)/s)................. Neutron irradiation (1 MeV equivalent neutrons) ........................................ 300 krads(Si) 5/ 11 2 5 x 10 n/cm 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines. 1/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ The -2 V SW rating is a transient condition only. It is guaranteed by design, but not tested. 3/ See 4.3.5 for the manufacturers radiation hardness assurance analysis and testing 4/ Devices on this SMD have not been characterized for Enhanced Low Dose Radiation Sensitivity (ELDRS). 5/ A representative device has been high dose rate tested using condition A of Method 1019 of MIL-STD-883 to 300 krads(Si) to ensure RHA designator level “F”. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-14223 A REVISION LEVEL A SHEET 3 DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http://quicksearch.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class. The manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not affect the form, fit, or function of the device for the applicable device class. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Radiation exposure circuits. The radiation exposure circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the qualifying and acquiring activity upon request. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full specified operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking of devices. Marking of devices shall be in accordance with MIL-PRF-38534. The device shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked. 3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made available to the preparing activity (DLA Land and Maritime-VA) upon request. 3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this drawing. The certificate of compliance (original copy) submitted to DLA Land and Maritime-VA shall affirm that the manufacturer's product meets the performance requirements of MIL-PRF-38534 and herein. 3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of microcircuits delivered to this drawing. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-14223 A REVISION LEVEL A SHEET 4 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ 2/ -55°C ≤ TC ≤ +125°C unless otherwise specified Group A subgroups Device type Limits Min Minimum input start voltage VIN 1,2,3 01,02 Voltage input UVLO threshold (falling) VINUVLO 1, 2, 3 01,02 L,R 3/ 1 L,R,F 3/ Unit Max 7.5 V 3.6 4 V 3.55 4 3.45 4 VCC supply current VCCsupply 1,2,3 01,02 VCC current limit VCCLIMIT 1,2,3 01,02 40 Error amp reference voltage VREF 1 01,02 1.224 1.238 2, 3 1.215 1.245 1 1.200 1.238 1.173 1.238 1.3 1.4 1.25 1.4 90 115 90 115 84 115 260 370 5,6 240 390 L,R 3/ 4 255 330 L,R,F 3/ 4 250 330 VC = VFB L,R 3/ L,R,F 3/ Shutdown enable threshold (rising) SHDN 1,2, 3 L,R,F 3/ Current limit sense voltage VSENSE 6.0 01,02 1 (VSENSE+) – (VSENSE-), VFB = 0 v 1,2,3 L,R 3/ 01,02 1 L,R,F 3/ Operating frequency FREQop Reset = 49 KΩ 4 01,02 mA mA V V mV kHz See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-14223 A REVISION LEVEL A SHEET 5 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ 2/ -55°C ≤ TC ≤ +125°C unless otherwise specified Group A subgroups Device type Limits Min Unit Max Programmable frequency range FREQ FSW ≤ 100 kHz at RSET = 232 KΩ FSW ≥ 500 kHz at RSET = 22.1 KΩ 7,8a,8b 01,02 Pass Pass/ Fail External sync frequency range Syncext 100 kHz ≤ FSYNC ≤ 600 kHz 7,8a,8b 01,02 Pass Pass/ Fail Sync voltage threshold SyncTHR 1,2,3 01,02 2 V Minimum TG off time MinOFF 4,5,6 01,02 650 nS Minimum TG on time MinON 4,5,6 01,02 400 nS 1/ A representative device has been high dose rate tested using condition A of Method 1019 of MIL-STD-883 to 300 krads(Si) to ensure RHA designator level “F”. Pre and post irradiation limits are identical unless otherwise specified. 2/ VIN = 20 V, VCC = BOOST = 10 V, SHDN > 2 V, RSET = 49.9 KΩ, SENSE- = SENSE+ = 10 V, SGND = PGND = SW = SYNC = 0 V. 3/ Device types 01 and 02 have been characterized through all levels L, R, and F of irradiation. However, device types 01 and 02 are tested at 1X times the F level. Pre and post irradiation values are identical unless otherwise specified in table I. When performing post irradiation electrical measurements for any RHA level, TC = +25ºC. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-14223 A REVISION LEVEL A SHEET 6 Case outline X. Symbol A A1 b c D E e e1 L1 S1 Millimeters Min Max --2.92 0.81 1.32 0.30 0.46 0.20 0.30 9.27 9.78 12.45 12.95 1.27 TYP 8.76 9.02 10.16 --1.91 REF Inches Min Max --.115 .032 .052 .012 .018 .008 .012 .365 .385 .490 .510 .050 TYP .345 .355 .400 --.075 REF NOTES: 1. The U. S. Government preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall take precedence. 2. Pin numbers are for reference only. 3. Case outline X weight: 1.5 grams typical. FIGURE 1. Case outlines. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-14223 A REVISION LEVEL A SHEET 7 Case outline Y. Symbol A A1 b c D E D1 e e1 L1 L2 S1 Millimeters Min Max --2.92 0.20 0.46 0.30 0.46 0.20 0.30 9.27 9.78 12.45 12.95 13.97 15.24 1.27 TYP 8.76 9.02 1.27 REF 1.14 1.40 1.91 REF Inches Min Max --.115 .008 .018 .012 .018 .008 .012 .365 .385 .490 .510 .550 .600 .050 TYP .345 .355 .050 REF 0.045 0.055 .075 REF NOTES: 1. The U. S. Government preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall take precedence. 2. Pin numbers are for reference only. 3. Case outline Y weight: 1.5 grams typical. FIGURE 1. Case outlines - Continued. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-14223 A REVISION LEVEL A SHEET 8 Device type 01 and 02 Case outlines X and Y Terminal number Terminal symbol 1 VIN 2 SHDN 3 CSS 4 SGND 5 VFB 6 VC 7 SYNC 8 FSET 9 SENSE- 10 SENSE+ 11 PGND 12 BG 13 VCC 14 SW 15 TG 16 BOOST CASE ISOLATED FIGURE 2. Terminal connections. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-14223 A REVISION LEVEL A SHEET 9 TABLE II. Electrical test requirements. MIL-PRF-38534 test requirements Subgroups (in accordance with MIL-PRF-38534, group A test table) Interim electrical parameters 1 Final electrical parameters 1*, 2, 3, 4, 5, 6, 7, 8A, 8B Group A test requirements 1*, 2, 3, 4, 5, 6, 7, 8A, 8B Group C end-point electrical parameters 1*, 2, 3, 4, 5, 6, 7, 8A, 8B End-point electrical parameters for radiation hardness assurance (RHA) devices 1, 4, 7 * PDA applies to subgroup 1. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. 4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply: a. b. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DLA Land and Maritime-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TC = +125°C minimum. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Conformance and periodic inspections. Conformance inspection (CI) and periodic inspection (PI) shall be in accordance with MIL-PRF-38534 and as specified herein. 4.3.1 Group A inspection (CI). Group A inspection shall be in accordance with MIL-PRF-38534 and as follows: a. Tests shall be as specified in table II herein. b. Subgroups 9, 10, and 11 shall be omitted. 4.3.2 Group B inspection (PI). Group B inspection shall be in accordance with MIL-PRF-38534. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-14223 A REVISION LEVEL A SHEET 10 4.3.3 Group C inspection (PI). Group C inspection shall be in accordance with MIL-PRF-38534 and as follows: a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DLA Land and Maritime-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TC = +125°C minimum. (3) Test duration: 1,000 hours minimum as specified in 1005 of MIL-STD-883. 4.3.4 Group D inspection (PI). Group D inspection shall be in accordance with MIL-PRF-38534. 4.3.5 Radiation Hardness Assurance (RHA). RHA qualification is required for those devices with the RHA designator as specified herein. See table IIIA and IIIB. Table IIIA. Radiation Hardness Assurance Methods Table. RHA method Employed Testing at rated total dose of 300 krads(Si) Element Hybrid Level Device Level 1X 1/ 1X Worst Case Analysis Not Performed Includes Combines temperature temperature and effects radiation effects No No End point electrical tests after total dose Combines End-of-life Element Level Hybrid device total dose level and displacement effects No No TC = +25ºC TC = +25ºC 1/ Elements tested at the hybrid level, since there is only one active element in the device. Table IIIB. Hybrid level and element level test table. M.S. Kennedy SMD 596214223 Hybrid Level Testing Radiation Test Total Dose Neutron Low Dose High Dose ELDRS Displacement Rate Rate (HDR) Characterization Damage (DD) Not Tested Element Level Testing 1/ Bipolar Linear or Mixed Signal Tested (300 krads) No Tested11 (5 x 102 n/cm ) Not X Tested (hybrid level test) No Tested (hybrid level test) 1/ Elements tested at the hybrid level, since there is only one active element in the device. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-14223 A REVISION LEVEL A SHEET 11 4.3.5.1 Radiation Hardness Assurance (RHA) inspection. RHA qualification is required for those devices with the RHA designator as specified herein. End-point electrical parameters for radiation hardness assurance (RHA) devices shall be specified in table II. Radiation testing will be in accordance with the qualifying activity (DLA Land and Maritime -VQ) approved plan and with MIL-PRF-38534, Appendix G. a. The hybrid device manufacturer shall establish procedures controlling element radiation testing, and shall establish radiation test plans used to implement element lot qualification during procurement. Test plans and test reports shall be filed and controlled in accordance with the manufacturer's configuration management system. b. The hybrid device manufacturer shall oversee element lot qualification, and monitor design changes for continued compliance to RHA requirements. 4.3.5.1.1 Hybrid level radiation qualification. 4.3.5.1.1.1 Qualification by similarity. Device type 5962F1422301HXA was initially subjected to neutron and TID testing . All other devices on this SMD contain the same active element and are considered similar for the purpose of RHA testing. 4.3.5.1.1.2 Total ionizing dose characterization testing. A representative device is characterized and tested, initially and after any design or process changes which may affect the RHA response. Devices are tested at High Dose Rate (HDR) in accordance with condition A of method 1019 of MIL-STD-883 to 300 krads(Si). 0.9900/90% statistics are applied to the device parameter degradations, which are compared against Table I herein. A minimum of 8 devices (4 biased and 4 unbiased) shall be tested. 4.3.5.1.1.3 Neutron testing. A representative device is characterized and tested initially, and after design or process changes that may affect the RHA response. The device is tested in accordance with Method 1017 of MIL-STD-883. Five samples shall be tested. The end point electrical values of the five samples will be compared to the limits specified in table I herein. 4.3.5.1.2 Element level radiation qualification. Elements are tested at the hybrid level since this device contains only one active element. 4.3.5.2 Radiation lot acceptance. Each wafer lot of active elements shall be evaluated for acceptance in accordance with the approved plan and MIL-PRF-38534 Appendix G. 4.3.5.2.1 Total Ionizing Dose. Every wafer lot of the active element will be RLAT (Radiation Lot Acceptance Testing) tested In accordance with 4.3.5.1.1.2. Alternatively, active element manufacturer TID data from the wafer lot may be evaluated for acceptance per 4.3.5.1.1.2. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38534. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing. 6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated as specified in MIL-PRF38534. 6.4 Record of users. Military and industrial users should inform DLA Land and Maritime when a system application requires configuration control and the applicable SMD. DLA Land and Maritime will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DLA Land and Maritime-VA, telephone (614) 692-8108. 6.5 Comments. Comments on this drawing should be directed to DLA Land and Maritime-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-1081. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-14223 A REVISION LEVEL A SHEET 12 6.6 Sources of supply. Sources of supply are listed in MIL-HDBK-103 and QML-38534. The vendors listed in MIL-HDBK-103 and QML-38534 have submitted a certificate of compliance (see 3.7 herein) to DLA Land and Maritime-VA and have agreed to this drawing. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-14223 A REVISION LEVEL A SHEET 13 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 15-06-23 Approved sources of supply for SMD 5962-14223 listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38534 during the next revisions. MIL-HDBK-103 and QML-38534 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DLA Land and Maritime-VA. This information bulletin is superseded by the next dated revisions of MIL-HDBK-103 and QML-38534. DLA Land and Maritime maintains an online database of all current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/ Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962F1422301HXA 5962F1422301HXC 5962F1422301HYA 5962F1422301HYC 5962F1422301KXA 5962F1422301KXC 5962F1422301KYA 5962F1422301KYC 31597 31597 31597 31597 31597 31597 31597 31597 MSK 5055-1HRHS MSK 5055-1HRHS MSK 5055-1HRHGW MSK 5055-1HRHGW MSK 5055-1KRHS MSK 5055-1KRHS MSK 5055-1KRHGW MSK 5055-1KRHGW 5962F1422302HXA 5962F1422302HXC 5962F1422302HYA 5962F1422302HYC 5962F1422302KXA 5962F1422302KXC 5962F1422302KYA 5962F1422302KYC 31597 31597 31597 31597 31597 31597 31597 31597 MSK 5055-2HRHS MSK 5055-2HRHS MSK 5055-2HRHGW MSK 5055-2HRHGW MSK 5055-2KRHS MSK 5055-2KRHS MSK 5055-2KRHGW MSK 5055-2KRHGW 1/ 2/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the Vendor to determine its availability. Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. Vendor CAGE number 31597 Vendor name and address Anaren Microwave Inc - MSK Products 6635 Kirkville Road East Syracuse, NY 13057 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.