Data Sheet

PESD5V0V1BA;
PESD5V0V1BB; PESD5V0V1BL
Very low capacitance bidirectional ESD protection diodes
Rev. 2 — 9 November 2012
Product data sheet
1. Product profile
1.1 General description
Very low capacitance bidirectional ElectroStatic Discharge (ESD) protection diodes in
small Surface-Mounted Device (SMD) plastic packages designed to protect one signal
line from the damage caused by ESD and other transients.
Table 1.
Product overview
Type number
PESD5V0V1BA
Package
Package configuration
NXP
JEITA
SOD323
SC-76
very small
PESD5V0V1BB
SOD523
SC-79
ultra small and flat lead
PESD5V0V1BL
SOD882
-
leadless ultra small
1.2 Features and benefits





Bidirectional ESD protection of one line
Very low diode capacitance: Cd = 11 pF
Max. peak pulse power: PPP = 45 W
Low clamping voltage: VCL = 12.5 V
Ultra low leakage current: IRM < 1 nA




ESD protection up to 30 kV
IEC 61000-4-2; level 4 (ESD)
IEC 61000-4-5 (surge); IPP = 4.8 A
AEC-Q101 qualified




Communication systems
Portable electronics
10/100 Mbit/s Ethernet
FireWire
1.3 Applications




Computers and peripherals
Audio and video equipment
Cellular handsets and accessories
Subscriber Identity Module (SIM) card
protection
1.4 Quick reference data
Table 2.
Quick reference data
Tamb = 25 C unless otherwise specified.
Symbol
Parameter
VRWM
reverse standoff voltage
Cd
diode capacitance
Conditions
f = 1 MHz; VR = 0 V
Min
Typ
Max
Unit
-
-
5
V
-
11
13
pF
PESD5V0V1BA/BB/BL
NXP Semiconductors
Very low capacitance bidirectional ESD protection diodes
2. Pinning information
Table 3.
Pinning
Pin
Description
Simplified outline
Graphic symbol
PESD5V0V1BA; PESD5V0V1BB
1
cathode (diode 1)
2
cathode (diode 2)
[1]
1
1
2
2
sym045
001aab540
PESD5V0V1BL
1
cathode (diode 1)
2
cathode (diode 2)
[1]
1
1
2
2
sym045
Transparent
top view
[1]
The marking bar indicates pin 1.
3. Ordering information
Table 4.
Ordering information
Type number
Package
Name
Description
Version
PESD5V0V1BA
SC-76
plastic surface-mounted package; 2 leads
SOD323
PESD5V0V1BB
SC-79
plastic surface-mounted package; 2 leads
SOD523
PESD5V0V1BL
-
leadless ultra small plastic package; 2 terminals;
body 1.0  0.6  0.5 mm
SOD882
4. Marking
Table 5.
Marking codes
Type number
Marking code
PESD5V0V1BA
1K
PESD5V0V1BB
Z9
PESD5V0V1BL
X1
5. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
peak pulse power
tp = 8/20 s
peak pulse current
tp = 8/20 s
Min
Max
Unit
[1]
-
45
W
[1]
-
4.8
A
Per diode
PPP
IPP
PESD5V0V1BA_BB_BL
Product data sheet
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Table 6.
Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
Per device
Tj
junction temperature
-
150
C
Tamb
ambient temperature
55
+150
C
Tstg
storage temperature
65
+150
C
[1]
Non-repetitive current pulse 8/20 s exponential decay waveform according to IEC 61000-4-5.
Table 7.
ESD maximum ratings
Tamb = 25 C unless otherwise specified.
Symbol
Parameter
electrostatic discharge voltage
VESD
[1]
Conditions
Min
Max
Unit
-
30
kV
machine model
-
2
kV
MIL-STD-883 (human
body model)
-
16
kV
[1]
IEC 61000-4-2
(contact discharge)
Device stressed with ten non-repetitive ESD pulses.
Table 8.
ESD standards compliance
Standard
Conditions
IEC 61000-4-2; level 4 (ESD)
> 15 kV (air); > 8 kV (contact)
MIL-STD-883; class 3B (human body model)
> 8 kV
001aaa631
IPP
001aaa630
120
100 %
90 %
100 % IPP; 8 μs
IPP
(%)
80
e−t
50 % IPP; 20 μs
40
10 %
0
10
20
30
30 ns
40
t (μs)
Fig 1.
t
tr = 0.7 ns to 1 ns
0
60 ns
8/20 s pulse waveform according to
IEC 61000-4-5
PESD5V0V1BA_BB_BL
Product data sheet
Fig 2.
ESD pulse waveform according to
IEC 61000-4-2
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6. Characteristics
Table 9.
Characteristics
Tamb = 25 C unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VRWM
reverse standoff voltage
-
-
5
V
IRM
reverse leakage current
VBR
breakdown voltage
VRWM = 5 V
-
<1
10
nA
IR = 5 mA
5.8
6.8
7.8
V
Cd
diode capacitance
f = 1 MHz;
VR = 0 V
-
11
13
pF
VCL
clamping voltage
IPP = 4.8 A
[1]
-
-
12.5
V
rdyn
dynamic resistance
IR = 10 A
[2]
-
0.2
-

rdif
differential resistance
IR = 5 mA
-
-
35

[1]
Non-repetitive current pulse 8/20 s exponential decay waveform according to IEC 61000-4-5.
[2]
Non-repetitive current pulse, Transmission Line Pulse (TLP) tp = 100 ns; square pulse;
ANS/IESD STM5.1-2008.
006aab606
103
001aaa193
1.2
PPP
PPP
(W)
PPP(25°C)
102
0.8
10
0.4
1
1
10
102
0
103
0
tp (μs)
50
100
150
200
Tj (°C)
Tamb = 25 C
Fig 3.
Peak pulse power as a function of exponential
pulse duration; typical values
PESD5V0V1BA_BB_BL
Product data sheet
Fig 4.
Relative variation of peak pulse power as a
function of junction temperature; typical
values
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Very low capacitance bidirectional ESD protection diodes
006aab607
12
006aab608
103
IRM
IRM(25°C)
Cd
(pF)
102
10
10
1
8
10−1
10−2
−100
6
0
1
2
3
4
5
VR (V)
−50
0
50
100
150
Tj (°C)
f = 1 MHz; Tamb = 25 C
Fig 5.
Diode capacitance as a function of reverse
voltage; typical values
Fig 6.
Relative variation of reverse leakage current
as a function of junction temperature; typical
values
IPP
−VCL −VBR −VRWM
IR
IRM
−IRM
−IR
VRWM VBR VCL
−
+
−IPP
006aaa676
Fig 7.
V-I characteristics for a bidirectional ESD protection diode
PESD5V0V1BA_BB_BL
Product data sheet
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Very low capacitance bidirectional ESD protection diodes
ESD TESTER
acc. to IEC 61000-4-2
CZ = 150 pF; RZ = 330 Ω
4 GHz DIGITAL
OSCILLOSCOPE
RZ
450 Ω
RG 223/U
50 Ω coax
10×
ATTENUATOR
50 Ω
CZ
DUT
(DEVICE
UNDER
TEST)
vertical scale = 10 V/div
horizontal scale = 100 ns/div
vertical scale = 10 A/div
horizontal scale = 15 ns/div
GND
GND
clamped +8 kV ESD pulse waveform
(IEC 61000-4-2 network)
unclamped +8 kV ESD pulse waveform
(IEC 61000-4-2 network)
vertical scale = 10 V/div
horizontal scale = 100 ns/div
vertical scale = 10 A/div
horizontal scale = 15 ns/div
GND
GND
clamped −8 kV ESD pulse waveform
(IEC 61000-4-2 network)
unclamped −8 kV ESD pulse waveform
(IEC 61000-4-2 network)
Fig 8.
006aab609
ESD clamping test setup and waveforms
PESD5V0V1BA_BB_BL
Product data sheet
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7. Application information
The PESD5V0V1Bx series is designed for the protection of one bidirectional data or
signal line from the damage caused by ESD and surge pulses. The devices may be used
on lines where the signal polarities are both, positive or negative with respect to ground.
The PESD5V0V1Bx series provides a surge capability of 45 W per line for an 8/20 s
waveform.
line to be protected
PESD5V0V1Bx
GND
006aab610
Fig 9.
Application diagram
Circuit board layout and protection device placement
Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT)
and surge transients. The following guidelines are recommended:
1. Place the device as close to the input terminal or connector as possible.
2. Minimize the path length between the device and the protected line.
3. Keep parallel signal paths to a minimum.
4. Avoid running protected conductors in parallel with unprotected conductors.
5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and
ground loops.
6. Minimize the length of the transient return path to ground.
7. Avoid using shared transient return paths to a common ground point.
8. Use ground planes whenever possible. For multilayer PCBs, use ground vias.
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
PESD5V0V1BA_BB_BL
Product data sheet
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Very low capacitance bidirectional ESD protection diodes
9. Package outline
1.35
1.15
0.45
0.15
1
2.7
2.3
0.85
0.75
1.1
0.8
0.65
0.58
1
1.65 1.25
1.55 1.15
1.8
1.6
2
2
0.40
0.25
0.25
0.10
0.34
0.26
Dimensions in mm
03-12-17
Fig 10. Package outline
PESD5V0V1BA (SOD323/SC-76)
0.17
0.11
Dimensions in mm
02-12-13
Fig 11. Package outline
PESD5V0V1BB (SOD523/SC-79)
0.50
0.46
0.62
0.55
2
0.30
0.22
0.65
0.30
0.22
1.02
0.95
1
0.55
0.47
cathode marking on top side (if applicable)
Dimensions in mm
03-04-17
Fig 12. Package outline PESD5V0V1BL (SOD882)
10. Packing information
Table 10. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
Package
Description
Packing quantity
3000
SOD323
4 mm pitch, 8 mm tape and reel
-115
-
-135
PESD5V0V1BB
SOD523
2 mm pitch, 8 mm tape and reel
-
-315
-
4 mm pitch, 8 mm tape and reel
-115
-
-135
2 mm pitch, 8 mm tape and reel
-
-
-315
[1]
Product data sheet
10000
PESD5V0V1BA
PESD5V0V1BL
PESD5V0V1BA_BB_BL
8000
SOD882
For further information and the availability of packing methods, see Section 14.
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 9 November 2012
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11. Soldering
3.05
2.1
solder lands
solder resist
0.5 (2×)
1.65 0.95
0.6 (2×)
solder paste
occupied area
2.2
Dimensions in mm
0.5
(2×)
0.6
(2×)
sod323_fr
Fig 13. Reflow soldering footprint PESD5V0V1BA (SOD323/SC-76)
5
2.9
1.5 (2×)
solder lands
solder resist
occupied area
2.75
1.2
(2×)
Dimensions in mm
preferred transport
direction during soldering
sod323_fw
Fig 14. Wave soldering footprint PESD5V0V1BA (SOD323/SC-76)
PESD5V0V1BA_BB_BL
Product data sheet
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Footprint information for reflow soldering of plastic surface-mounted, 2 leads package
SOD523
2.15
1.4
0.5 0.6
(2×) (2×)
1.2
0.4
(2×)
0.5
(2×)
solder land
solder land plus solder paste
solder paste deposit
solder resist
occupied area
Dimensions in mm
sod523_fr
Fig 15. Reflow soldering footprint PESD5V0V1BB (SOD523/SC-79)
1.3
0.7
R0.05 (8×)
solder lands
0.6 0.7 0.8
(2×) (2×) (2×)
0.9
solder resist
solder paste
occupied area
0.3
(2×)
Dimensions in mm
0.4
(2×)
0.5
(2×)
sod882_fr
Fig 16. Reflow soldering footprint PESD5V0V1BL (SOD882)
PESD5V0V1BA_BB_BL
Product data sheet
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Rev. 2 — 9 November 2012
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12. Revision history
Table 11.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PESD5V0V1BA_BB_BL v.2
20121109
Product data sheet
-
PESD5V0V1BA_BB_BL v.1
Modifications:
PESD5V0V1BA_BB_BL v.1
PESD5V0V1BA_BB_BL
Product data sheet
•
•
•
Table 9 “Characteristics”: added dynamic resistance rdyn
Figure 15: updated
Section 13 “Legal information”: updated
20090728
Product data sheet
-
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Rev. 2 — 9 November 2012
-
© NXP B.V. 2012. All rights reserved.
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13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
13.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
PESD5V0V1BA_BB_BL
Product data sheet
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
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No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
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15. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
8.1
9
10
11
12
13
13.1
13.2
13.3
13.4
14
15
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Application information. . . . . . . . . . . . . . . . . . . 7
Test information . . . . . . . . . . . . . . . . . . . . . . . . . 7
Quality information . . . . . . . . . . . . . . . . . . . . . . 7
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
Packing information . . . . . . . . . . . . . . . . . . . . . 8
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11
Legal information. . . . . . . . . . . . . . . . . . . . . . . 12
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 12
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Contact information. . . . . . . . . . . . . . . . . . . . . 13
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 9 November 2012
Document identifier: PESD5V0V1BA_BB_BL