Data Sheet

74HC1G125-Q100; 74HCT1G125-Q100
Bus buffer/line driver; 3-state
Rev. 1 — 18 June 2013
Product data sheet
1. General description
The 74HC1G125-Q100; 74HCT1G125-Q100 is a single buffer/line driver with 3-state
output. Inputs include clamp diodes. This enables the use of current limiting resistors to
interface inputs to voltages in excess of VCC.
This product has been qualified to the Automotive Electronics Council (AEC) standard
Q100 (Grade 1) and is suitable for use in automotive applications.
2. Features and benefits
 Automotive product qualification in accordance with AEC-Q100 (Grade 1)
 Specified from 40 C to +85 C and from 40 C to +125 C
 Input levels:
 For 74HC1G125-Q100: CMOS level
 For 74HCT1G125-Q100: TTL level
 Symmetrical output impedance
 High noise immunity
 Low power consumption
 Balanced propagation delays
 ESD protection:
 MIL-STD-883, method 3015 exceeds 2000 V
 HBM JESD22-A114F exceeds 2000 V
 MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 )
3. Ordering information
Table 1.
Ordering information
Type number
74HC1G125GW-Q100
Package
Temperature range
Name
Description
40 C to +125 C
TSSOP5
plastic thin shrink small outline package; 5 leads; SOT353-1
body width 1.25 mm
40 C to +125 C
SC-74A
plastic surface mounted package; 5 leads
74HCT1G125GW-Q100
74HC1G125GV-Q100
74HCT1G125GV-Q100
Version
SOT753
NXP Semiconductors
74HC1G125-Q100; 74HCT1G125-Q100
Bus buffer/line driver; 3-state
4. Marking
Table 2.
Marking
Type number
Marking code[1]
74HC1G125GW-Q100
HM
74HCT1G125GW-Q100
TM
74HC1G125GV-Q100
H25
74HCT1G125GV-Q100
T25
[1]
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
5. Functional diagram
2
A
Y
4
2
4
1
1
OE
EN
mna119
mna118
Fig 1.
Logic symbol
Fig 2.
IEC logic symbol
Y
A
OE
mna120
Fig 3.
Logic diagram
6. Pinning information
6.1 Pinning
+&*4
+&7*4
2(
$
*1'
9&&
<
DDD
Fig 4.
Pin configuration
74HC_HCT1G125_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 June 2013
© NXP B.V. 2013. All rights reserved.
2 of 16
NXP Semiconductors
74HC1G125-Q100; 74HCT1G125-Q100
Bus buffer/line driver; 3-state
6.2 Pin description
Table 3.
Pin description
Symbol
Pin
Description
OE
1
output enable input (active LOW)
A
2
data input
GND
3
ground (0 V)
Y
4
data output
VCC
5
supply voltage
7. Functional description
7.1 Function table
Table 4.
Function table[1]
Control
Input
Output
OE
A
Y
L
L
L
L
H
H
H
X
Z
[1]
H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state.
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
VCC
supply voltage
IIK
input clamping current
VI < 0.5 V or VI > VCC + 0.5 V
output clamping current
IO
output current
ICC
supply current
IGND
ground current
Tstg
storage temperature
IOK
Ptot
total power dissipation
Conditions
Min
Max
Unit
0.5
+7.0
V
[1]
-
20
mA
VO < 0.5 V or VO > VCC + 0.5 V
[1]
-
20
mA
VO = 0.5 V to (VCC + 0.5 V)
[1]
-
35
mA
-
70
mA
70
-
mA
65
+150
C
-
200
mW
Tamb = 40 C to +125 C
[2]
[1]
The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2]
Above 55 C the value of Ptot derates linearly with 2.5 mW/K.
74HC_HCT1G125_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 June 2013
© NXP B.V. 2013. All rights reserved.
3 of 16
NXP Semiconductors
74HC1G125-Q100; 74HCT1G125-Q100
Bus buffer/line driver; 3-state
9. Recommended operating conditions
Table 6.
Recommended operating conditions
Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
74HC1G125-Q100
Min
Typ
74HCT1G125-Q100
Max
Min
Typ
Unit
Max
VCC
supply voltage
2.0
5.0
6.0
4.5
5.0
5.5
V
VI
input voltage
0
-
VCC
0
-
VCC
V
VO
output voltage
0
-
VCC
0
-
VCC
V
Tamb
ambient temperature
40
+25
+125
40
+25
+125
C
t/V
input transition rise
and fall rate
VCC = 2.0 V
-
-
625
-
-
-
ns/V
VCC = 4.5 V
-
-
139
-
-
139
ns/V
VCC = 6.0 V
-
-
83
-
-
-
ns/V
10. Static characteristics
Table 7.
Static characteristics 74HC1G125-Q100
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Tamb = 40 C to +85
VIH
VIL
VOH
VOL
Conditions
Min
Typ
Max
Unit
VCC = 2.0 V
1.5
1.2
-
V
VCC = 4.5 V
3.15
2.4
-
V
VCC = 6.0 V
4.2
3.2
-
V
C[1]
HIGH-level input voltage
LOW-level input voltage
HIGH-level output voltage
LOW-level output voltage
VCC = 2.0 V
-
0.8
0.5
V
VCC = 4.5 V
-
2.1
1.35
V
VCC = 6.0 V
-
2.8
1.8
V
IO = 20 A; VCC = 2.0 V
1.9
2.0
-
V
IO = 20 A; VCC = 4.5 V
4.4
4.5
-
V
IO = 20 A; VCC = 6.0 V
5.9
6.0
-
V
IO = 6.0 mA; VCC = 4.5 V
3.84
4.32
-
V
IO = 7.8 mA; VCC = 6.0 V
5.34
5.81
-
V
IO = 20 A; VCC = 2.0 V
-
0
0.1
V
IO = 20 A; VCC = 4.5 V
-
0
0.1
V
VI = VIH or VIL
VI = VIH or VIL
IO = 20 A; VCC = 6.0 V
-
0
0.1
V
IO = 6.0 mA; VCC = 4.5 V
-
0.15
0.33
V
IO = 7.8 mA; VCC = 6.0 V
-
0.16
0.33
V
II
input leakage current
VI = VCC or GND; VCC = 6.0 V
-
-
1.0
A
IOZ
OFF-state output current
VI = VIH or VIL; VO = VCC or GND;
VCC = 6.0 V
-
-
5
A
ICC
supply current
VI = VCC or GND; IO = 0 A;
VCC = 6.0 V
-
-
10
A
CI
input capacitance
-
1.5
-
pF
74HC_HCT1G125_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 June 2013
© NXP B.V. 2013. All rights reserved.
4 of 16
NXP Semiconductors
74HC1G125-Q100; 74HCT1G125-Q100
Bus buffer/line driver; 3-state
Table 7.
Static characteristics 74HC1G125-Q100 …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
Min
Typ
Max
Unit
VCC = 2.0 V
1.5
-
-
V
VCC = 4.5 V
3.15
-
-
V
VCC = 6.0 V
4.2
-
-
V
VCC = 2.0 V
-
-
0.5
V
VCC = 4.5 V
-
-
1.35
V
VCC = 6.0 V
-
-
1.8
V
IO = 20 A; VCC = 2.0 V
1.9
-
-
V
IO = 20 A; VCC = 4.5 V
4.4
-
-
V
Tamb = 40 C to +125 C
HIGH-level input voltage
VIH
LOW-level input voltage
VIL
VOH
VOL
HIGH-level output voltage
LOW-level output voltage
VI = VIH or VIL
IO = 20 A; VCC = 6.0 V
5.9
-
-
V
IO = 6.0 mA; VCC = 4.5 V
3.7
-
-
V
IO = 7.8 mA; VCC = 6.0 V
5.2
-
-
V
IO = 20 A; VCC = 2.0 V
-
-
0.1
V
IO = 20 A; VCC = 4.5 V
-
-
0.1
V
IO = 20 A; VCC = 6.0 V
-
-
0.1
V
IO = 6.0 mA; VCC = 4.5 V
-
-
0.4
V
VI = VIH or VIL
IO = 7.8 mA; VCC = 6.0 V
-
-
0.4
V
II
input leakage current
VI = VCC or GND; VCC = 6.0 V
-
-
1.0
A
IOZ
OFF-state output current
VI = VIH or VIL; VO = VCC or GND;
VCC = 6.0 V
-
-
10
A
ICC
supply current
VI = VCC or GND; IO = 0 A;
VCC = 6.0 V
-
-
20
A
[1]
All typical values are measured at Tamb = 25 C.
74HC_HCT1G125_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 June 2013
© NXP B.V. 2013. All rights reserved.
5 of 16
NXP Semiconductors
74HC1G125-Q100; 74HCT1G125-Q100
Bus buffer/line driver; 3-state
Table 8.
Static characteristics 74HCT1G125-Q100
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Tamb = 40 C to +85
Conditions
Min
Typ
Max
Unit
C[1]
VIH
HIGH-level input voltage
VCC = 4.5 V to 5.5 V
2.0
1.6
-
V
VIL
LOW-level input voltage
VCC = 4.5 V to 5.5 V
-
1.2
0.8
V
VOH
HIGH-level output voltage
VI = VIH or VIL; VCC = 4.5 V
LOW-level output voltage
VOL
IO = 20 A
4.4
4.5
-
V
IO = 6.0 mA
3.84
4.32
-
V
IO = 20 A
-
0
0.1
V
IO = 6.0 mA
VI = VIH or VIL; VCC = 4.5 V
-
0.16
0.33
V
II
input leakage current
VI = VCC or GND; VCC = 5.5 V
-
-
1.0
A
IOZ
OFF-state output current
VI = VIH or VIL; VO = VCC or GND;
VCC = 5.5 V
-
-
5
A
ICC
supply current
VI = VCC or GND; IO = 0 A;
VCC = 5.5 V
-
-
10
A
ICC
additional supply current
VI = VCC  2.1 V; IO = 0 A;
VCC = 4.5 V to 5.5 V
-
-
500
A
CI
input capacitance
-
1.5
-
pF
Tamb = 40 C to +125 C
VIH
HIGH-level input voltage
VCC = 4.5 V to 5.5 V
2.0
-
-
V
VIL
LOW-level input voltage
VCC = 4.5 V to 5.5 V
-
-
0.8
V
VOH
HIGH-level output voltage
VI = VIH or VIL; VCC = 4.5 V
IO = 20 A
4.4
-
-
V
IO = 6.0 mA
3.7
-
-
V
IO = 20 A
-
-
0.1
V
IO = 6.0 mA
-
-
0.4
V
LOW-level output voltage
VOL
VI = VIH or VIL; VCC = 4.5 V
II
input leakage current
VI = VCC or GND; VCC = 5.5 V
-
-
1.0
A
IOZ
OFF-state output current
VI = VIH or VIL; VO = VCC or GND;
VCC = 5.5 V
-
-
10
A
ICC
supply current
VI = VCC or GND; IO = 0 A;
VCC = 5.5 V
-
-
20
A
ICC
additional supply current
VI = VCC  2.1 V; IO = 0 A;
VCC = 4.5 V to 5.5 V
-
-
850
A
[1]
All typical values are measured at Tamb = 25 C.
74HC_HCT1G125_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 June 2013
© NXP B.V. 2013. All rights reserved.
6 of 16
NXP Semiconductors
74HC1G125-Q100; 74HCT1G125-Q100
Bus buffer/line driver; 3-state
11. Dynamic characteristics
Table 9.
Dynamic characteristics 74HC1G125-Q100
Voltages are referenced to GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit see Figure 7
Symbol
Parameter
Tamb = 40 C to +85
tpd
Conditions
Min
Typ
Max
Unit
VCC = 2.0 V
-
24
125
ns
VCC = 4.5 V
-
10
25
ns
VCC = 5 V; CL = 15 pF
-
9
-
ns
-
8
21
ns
VCC = 2.0 V
-
19
155
ns
VCC = 4.5 V
-
9
31
ns
-
7
26
ns
VCC = 2.0 V
-
18
155
ns
VCC = 4.5 V
-
12
31
ns
C[1]
propagation delay
A to Y; see Figure 5
[2]
VCC = 6.0 V
ten
enable time
OE to Y; see Figure 6
[2]
VCC = 6.0 V
tdis
disable time
OE to Y; see Figure 6
[2]
VCC = 6.0 V
CPD
power dissipation capacitance
VI = GND to VCC
[3]
A to Y; see Figure 5
[2]
-
11
26
ns
-
30
-
pF
Tamb = 40 C to +125 C
tpd
propagation delay
VCC = 2.0 V
-
-
150
ns
VCC = 4.5 V
-
-
30
ns
-
-
26
ns
VCC = 6.0 V
ten
enable time
OE to Y; see Figure 6
[2]
VCC = 2.0 V
-
-
190
ns
VCC = 4.5 V
-
-
38
ns
-
-
32
ns
VCC = 6.0 V
tdis
[1]
[2]
disable time
OE to Y; see Figure 6
[2]
VCC = 2.0 V
-
-
190
ns
VCC = 4.5 V
-
-
38
ns
VCC = 6.0 V
-
-
32
ns
All typical values are measured at Tamb = 25 C.
tpd is the same as tPLH and tPHL.
ten is the same as tPZL and tPZH.
tdis is the same as tPLZ and tPHZ.
[3]
CPD is used to determine the dynamic power dissipation (PD in W).
PD = CPD  VCC2  fi  N + (CL  VCC2  fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
(CL  VCC2  fo) = sum of the outputs.
74HC_HCT1G125_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 June 2013
© NXP B.V. 2013. All rights reserved.
7 of 16
NXP Semiconductors
74HC1G125-Q100; 74HCT1G125-Q100
Bus buffer/line driver; 3-state
Table 10. Dynamic characteristics 74HCT1G125-Q100
Voltages are referenced to GND (ground = 0 V); CL = 50 pF unless otherwise specified; for test circuit see Figure 7
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit
-
11
30
ns
Tamb = 40 C to +85 C
tpd
propagation delay
A to Y; see Figure 5
[2]
VCC = 4.5 V
VCC = 5 V; CL = 15 pF
-
10
-
ns
-
10
35
ns
ten
enable time
VCC = 4.5 V; OE to Y;
see Figure 6
[2]
tdis
disable time
VCC = 4.5 V; OE to Y;
see Figure 6
[2]
-
11
31
ns
CPD
power dissipation capacitance
VI = GND to VCC  1.5 V
[3]
-
27
-
pF
VCC = 4.5 V; A to Y; see Figure 5
[2]
-
-
36
ns
-
-
42
ns
-
-
38
ns
Tamb = 40 C to +125 C
tpd
propagation delay
ten
enable time
VCC = 4.5 V; OE to Y;
see Figure 6
[2]
tdis
disable time
VCC = 4.5 V; OE to Y;
see Figure 6
[2]
[1]
[2]
All typical values are measured at Tamb = 25 C.
tpd is the same as tPLH and tPHL.
ten is the same as tPZL and tPZH.
tdis is the same as tPLZ and tPHZ.
[3]
CPD is used to determine the dynamic power dissipation (PD in W).
PD = CPD  VCC2  fi  N + (CL  VCC2  fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
(CL  VCC2  fo) = sum of the outputs.
74HC_HCT1G125_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 June 2013
© NXP B.V. 2013. All rights reserved.
8 of 16
74HC1G125-Q100; 74HCT1G125-Q100
NXP Semiconductors
Bus buffer/line driver; 3-state
12. Waveforms
VI
VM
A input
GND
t PLH
t PHL
VM
Y output
001aad070
Measurement points are given in Table 11.
Fig 5.
Propagation delay data input (A) to output (Y)
VI
OE input
VM
GND
tPLZ
tPZL
VCC
output
LOW-to-OFF
OFF-to-LOW
VM
VX
VOL
tPHZ
VOH
tPZH
VY
output
HIGH-to-OFF
OFF-to-HIGH
VM
GND
outputs
enabled
outputs
disabled
outputs
enabled
mna644
Measurement points are given in Table 11.
Logic levels: VOL and VOH are typical output voltage drop that occur with the output load.
Fig 6.
Table 11.
Enable and disable times
Measurement points
Type
Input
Output
VM
VM
VX
VY
74HC1G125-Q100
0.5VCC
0.5VCC
VOL  0.3 V
VOH  0.3 V
74HCT1G125-Q100
1.3 V
1.3 V
VOL  0.3 V
VOH  0.3 V
74HC_HCT1G125_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 June 2013
© NXP B.V. 2013. All rights reserved.
9 of 16
74HC1G125-Q100; 74HCT1G125-Q100
NXP Semiconductors
Bus buffer/line driver; 3-state
VI
tW
90 %
negative
pulse
VM
0V
tf
tr
tr
tf
VI
90 %
positive
pulse
0V
VM
10 %
VM
VM
10 %
tW
VCC
VCC
G
VI
VO
RL
S1
open
DUT
CL
RT
001aad983
Test data is given in Table 12.
Definitions for test circuit:
RT = Termination resistance should be equal to the output impedance Zo of the pulse generator
CL = Load capacitance including jig and probe capacitance
RL = Load resistor
S1 = Test selection switch
Fig 7.
Table 12.
Test circuit for measuring switching times
Test data
Type
Input
VI
tr, tf
CL
RL
tPLH, tPHL
tPZH, tPHZ
tPZL, tPLZ
74HC1G125-Q100
VCC
6 ns
15 pF, 50 pF
1 k
open
GND
VCC
74HCT1G125-Q100
3V
6 ns
15 pF, 50 pF
1 k
open
GND
VCC
74HC_HCT1G125_Q100
Product data sheet
Load
S1 position
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 June 2013
© NXP B.V. 2013. All rights reserved.
10 of 16
74HC1G125-Q100; 74HCT1G125-Q100
NXP Semiconductors
Bus buffer/line driver; 3-state
13. Package outline
TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1.25 mm
E
D
SOT353-1
A
X
c
y
HE
v M A
Z
5
4
A2
A
(A3)
A1
θ
1
Lp
3
L
e
w M
bp
detail X
e1
0
1.5
3 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D(1)
E(1)
e
e1
HE
L
Lp
v
w
y
Z(1)
θ
mm
1.1
0.1
0
1.0
0.8
0.15
0.30
0.15
0.25
0.08
2.25
1.85
1.35
1.15
0.65
1.3
2.25
2.0
0.425
0.46
0.21
0.3
0.1
0.1
0.60
0.15
7°
0°
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
OUTLINE
VERSION
SOT353-1
Fig 8.
REFERENCES
IEC
JEDEC
JEITA
MO-203
SC-88A
EUROPEAN
PROJECTION
ISSUE DATE
00-09-01
03-02-19
Package outline SOT353-1 (TSSOP5)
74HC_HCT1G125_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 June 2013
© NXP B.V. 2013. All rights reserved.
11 of 16
74HC1G125-Q100; 74HCT1G125-Q100
NXP Semiconductors
Bus buffer/line driver; 3-state
Plastic surface-mounted package; 5 leads
SOT753
D
E
B
y
A
X
HE
5
v M A
4
Q
A
A1
c
1
2
3
Lp
detail X
bp
e
w M B
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
bp
c
D
E
e
HE
Lp
Q
v
w
y
mm
1.1
0.9
0.100
0.013
0.40
0.25
0.26
0.10
3.1
2.7
1.7
1.3
0.95
3.0
2.5
0.6
0.2
0.33
0.23
0.2
0.2
0.1
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
SOT753
Fig 9.
JEITA
SC-74A
EUROPEAN
PROJECTION
ISSUE DATE
02-04-16
06-03-16
Package outline SOT753 (SC-74A)
74HC_HCT1G125_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 June 2013
© NXP B.V. 2013. All rights reserved.
12 of 16
74HC1G125-Q100; 74HCT1G125-Q100
NXP Semiconductors
Bus buffer/line driver; 3-state
14. Abbreviations
Table 13.
Abbreviations
Acronym
Description
CMOS
Complementary Metal Oxide Semiconductor
ESD
ElectroStatic Discharge
HBM
Human Body Model
TTL
Transistor-Transistor Logic
MM
Machine Model
15. Revision history
Table 14.
Revision history
Document ID
Release date
74HC_HCT1G125_Q100 v.1 20130618
74HC_HCT1G125_Q100
Product data sheet
Data sheet status
Change notice
Supersedes
Product data sheet
-
-
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 June 2013
© NXP B.V. 2013. All rights reserved.
13 of 16
NXP Semiconductors
74HC1G125-Q100; 74HCT1G125-Q100
Bus buffer/line driver; 3-state
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
16.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
74HC_HCT1G125_Q100
Product data sheet
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 June 2013
© NXP B.V. 2013. All rights reserved.
14 of 16
NXP Semiconductors
74HC1G125-Q100; 74HCT1G125-Q100
Bus buffer/line driver; 3-state
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
74HC_HCT1G125_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 18 June 2013
© NXP B.V. 2013. All rights reserved.
15 of 16
NXP Semiconductors
74HC1G125-Q100; 74HCT1G125-Q100
Bus buffer/line driver; 3-state
18. Contents
1
2
3
4
5
6
6.1
6.2
7
7.1
8
9
10
11
12
13
14
15
16
16.1
16.2
16.3
16.4
17
18
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 1
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 3
Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Recommended operating conditions. . . . . . . . 4
Static characteristics. . . . . . . . . . . . . . . . . . . . . 4
Dynamic characteristics . . . . . . . . . . . . . . . . . . 7
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13
Legal information. . . . . . . . . . . . . . . . . . . . . . . 14
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Contact information. . . . . . . . . . . . . . . . . . . . . 15
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 18 June 2013
Document identifier: 74HC_HCT1G125_Q100