ABBTM NVC MDCS71 MESH

Low Power Bluetooth Module (supporting CSRmesh) (supporting CS
LLC
ABBTM- NVC-MDCS71-MESH
FCC ID: OC3BM1871
DC: 1508
ABBTM-NVC-MDCS71-MESH
FEATURES:
Pb
RoHS/RoHS II compliant
RoHS
19.5 x 12.5 x 2.4 mm SMT
Moisture Sensitivity Level (MSL) – Level 3
| | | | | | | | | | | | | | |
APPLICATIONS:
• Single mode Bluetooth v4.1 low energy
Typical Bluetooth low energy applications:
• 4dBm maximum TX power/ -92.5dBm RX sensitivity,
• IoT applications
RSSI monitoring for proximity applications
• Smart Home applications
• Support CSRmesh.
• UART/I2C master/SPI master interfaces
• 9 digital PIOs/3 analog IOs
• 10bit ADC IOs
• Wakeup interrupt and watchdog timer
• SMT pads for easy and reliable PCB mounting, Internal chip antenna
• 19.50x12.50x2.4mm
• FCC ID: OC3BM1871*
• QDID: B020997*
*Note: ABBTM-NVC-MDCS71-MESH crosses to NovaComm P/N: NVC-MDCS71. BQB/FCC certification documentation
is under P/N: NVC-MDCS71.
GENERAL DESCRIPTION
ABBTM-NVC-MDCS71-MESH is a single-mode Bluetooth v4.1 low power module based on CSR’s CSR1010. By integrating CSRmesh
and Novacomm’s proprietary technologies into the single module, it provides a simple solution for building intelligent network so devices can
communicate with each other directly.
CSRmesh supports different device models. Current firmware combines light model (e.g. LED lights) and data model together. It allows the
module to be used in a color LED light, or as a network endpoint to transmit data to each other. The module uses an ASCII command interface
over its 2 wire UART port. The command details can be found in the Software Interface for Mesh Application Manual.
Current firmware allows the module to scan for data packets from nearby devices and relay the data if needed. It consumes approximately
20mA @3V, so it is suitable for applications with power supply connected. If low power consumption operation mode is needed, please
contact Abracon for custom firmware.
PIN CONFIGURATION:
Figure 1. Pinout (Topview)
ABRACON IS
ISO 9001:2008
CERTIFIED
LLC
2 Faraday, Suite# B | Irvine | CA 92618 Revised: 06.29.15
Ph. 949.546.8000 | Fax. 949.546.8001
Visit www.abracon.com for Terms and Conditions of Sale
Rmesh)
Low Power Bluetooth Module (supporting CSRmesh) (supporting CS
LLC
ABBTM- NVC-MDCS71-MESH
FCC ID: OC3BM1871
DC: 1508
ABBTM-NVC-MDCS71-MESH
Pb
RoHS
RoHS/RoHS II compliant
19.5 x 12.5 x 2.4 mm SMT
| | | | | | | | | | | | | | |
PIN DESCRIPTION
Pin
Symbol
1
2
3
4
GND
AIO2
AIO1
AIO0
5
UART_TX
6
UART_RX
7
PIO3
8
PIO4
9
GND
10
PIO5/SPI_CLK
Bi-directional with programmable
strength internal pull-up/down
Programmable input/output line
Or debug SPI_CLK select by SPI_PIO_SEL
11
PIO6/SPI_CSB
Bi-directional with programmable
strength internal pull-up/down
Programmable input/output line
Or debug chip select, selected by SPI_PIO_SEL
12
PIO7/SPI_MOSI
Bi-directional with programmable
strength internal pull-up/down
Programmable input/output line
Or debug SPI_MOSI, selected by SPI_PIO_SEL
13
VDD_PIO
Powered
PIO power supply
Bi-directional with programmable
strength internal pull-up/down
Bi-directional tri-state with weak internal
pull-up
Programmable input/output line
Or debug SPI_MISO, selected by SPI_PIO_SEL
I2C data input/output or SPI serial flash data
output(SF_OUT)
I2C clock or SPI serial flash clock output
(SF_CLK)
Ground
Programmable input/output line
PWM or LED Controls
Programmable input/output line
PWM or LED Controls
14
PIO8/SPI_MISO
15
I2C_SDA
16
I2C_SCL
17
GND
18
PIO9
19
PIO10
20
PIO11
21
22
23
SPI_PIO_SEL
VDD_BAT
GND
24
WAKE
25
GND
ABRACON IS
ISO 9001:2008
CERTIFIED
I/O Type
Description
Ground
Bidirectional analogue
Bidirectional analogue
Bidirectional analogue
CMOS output, tri-state, with weak
internal pull-up
CMOS input with weak internal pulldown
Bi-directional with programmable
strength internal pull-up/down
Bi-directional with programmable
strength internal pull-up/down
Ground
Ground
10bit Analogue programmable I/O line
10bit Analogue programmable I/O line
10bit Analogue programmable I/O line
UART data output
UART data input
Programmable input/output line
PWM or LED Controls
Programmable input/output line
PWM or LED Controls
Ground
Input with weak internal pull-up
Ground
Bi-directional with programmable
strength internal pull-up/down
Bi-directional with programmable
strength internal pull-up/down
Bi-directional with programmable
strength internal pull-up/down
Input with strong internal pull-down
Power supply
Ground
Input has no internal pull-up or pull-down
use external pull-down
Ground
LLC
Programmable input/output line
Selects SPI debug on (8:5)
Button cell battery or DC 1.8V to 3.6V
Ground
Set high to wake the module from hibernate. Use
an external pull-down for this pin.
Ground
2 Faraday, Suite# B | Irvine | CA 92618 Revised: 06.29.15
Ph. 949.546.8000 | Fax. 949.546.8001
Visit www.abracon.com for Terms and Conditions of Sale
Rmesh)
Low(supporting
Power Bluetooth
CSRmesh)
Module (supporting CSRmesh)
ABBTM-NVC-MDCS71-MESH
Pb
LLC
ABBTM- NVC-MDCS71-MESH
FCC ID: OC3BM1871
DC: 1508
RoHS
RoHS/RoHS II compliant
19.5 x 12.5 x 2.4 mm SMT
| | | | | | | | | | | | | | |
ELECTRICAL CHARACTERISTICS
Absolute Maximum Rating
Rating
Min
Max
Unit
Storage Temperature
-40
+85
°C
Battery (VDD_BAT) operation*
1.8
3.6
V
I/O supply voltage
-0.4
+3.6
V
Vss-0.4
VDD+0.4
V
Other Terminal Voltages except RF
* Short-term operation up to a maximum of 10% of product lifetime is permissible without damage, but output regulation and
other specifications are not guaranteed in excess of 4.2V.
Recommended Operating Conditions
Operating Condition
Operating Temperature Range
Min
-30
Battery (VDD_BAT) operation
I/O Supply Voltage (VDD_PIO)
Typ
Max
+85
Unit
°C
1.8
+3.6
V
1.2
+3.6
V
Power Consumptions
The current consumption are measured at the VDD_BAT.
Mode
Description
Total typical current at
3V (average)
Fast Advertising
All functions are shutdown. To wake up toggle
the WAKE pin
All functions are shutdown except for the sleep
clock. The module can wake up on a timer on the
sleep clock.
In 30 second after Power on VDD=3.3V
Slow Advertising
In 3 minutes after fast advertising VDD=3.3V
6uA
Standby (no connect)
VDD=3.3V ,VDD_PIO=3.3v
5uA
Standby (connect)
VDD=3.3V ,VDD_PIO=3.3v
8uA
Transmit data
VDD=3.3V VDD_PIO=3.3V
1mA
RF RX /TX active (0dBm) *
VDD=3.3V VDD_PIO=3.3V
~16mA peak
Dormant
Hibernate
<600nA
<1.5uA
0.8mA
* Note: The TX power of the module can be increased by firmware to a maximum of 4dBm and the peak current is around
28mA.
ABRACON IS
ISO 9001:2008
CERTIFIED
LLC
2 Faraday, Suite# B | Irvine | CA 92618 Revised: 06.29.15
Ph. 949.546.8000 | Fax. 949.546.8001
Visit www.abracon.com for Terms and Conditions of Sale
Low Power Bluetooth Module (supporting CSRmesh)
ABBTM-NVC-MDCS71-MESH
Pb
LLC
ABBTM- NVC-MDCS71-MESH
FCC ID: OC3BM1871
DC: 1508
RoHS
RoHS/RoHS II compliant
19.5 x 12.5 x 2.4 mm SMT
| | | | | | | | | | | | | | |
I/O CHARACTERISTICS
Digital I/O Characteristics
Supply Voltage Levels
Min
Typ
Max
Unit
Input Voltage Levels
VIL input logic level low
-0.4
0.4
V
VIH input logic level high
0.7*VDD
VDD + 0.4
V
25
ns
0.4
V
Tr/Tf
Output Voltage Levels
VOL output logic level low, IOL = 4.0mA
VOH output logic level high, IOH = -4.0mA
0.75*VDD
V
Tr/Tf
5
ns
Input and Tri-state Current
With strong pull-up
-150
-40
-10
μA
With strong pull-down
10
40
150
μA
With weak pull-up
-5.0
-1.0
-0.33
μA
With weak pull-down
0.33
+1.0
5.0
μA
CI Input Capacitance
1.0
5.0
pF
Max
1.3
Unit
V
AIO Characteristics
Input Voltage Levels
AIO
Min
0
Typ
ESD Protection
Condition
Human Body Model Contact Discharge per JEDEC EIA/JESD22-A114
Class
2
Max Rating
2000V (all pins)
Machine Model Contact Discharge per JEDEC EIA/JESD22-A115
200V
200V (all pins)
III
500V (all pins)
Charged Device Model Contact Discharge per JEDEC EIA/JESD22-C101
ABRACON IS
ISO 9001:2008
CERTIFIED
LLC
2 Faraday, Suite# B | Irvine | CA 92618 Revised: 06.29.15
Ph. 949.546.8000 | Fax. 949.546.8001
Visit www.abracon.com for Terms and Conditions of Sale
Low Power Bluetooth Module (supporting CSRmesh)
Pb
LLC
ABBTM- NVC-MDCS71-MESH
FCC ID: OC3BM1871
DC: 1508
RoHS
RoHS/RoHS II compliant
19.5 x 12.5 x 2.4 mm SMT
| | | | | | | | | | | | | | |
PHYSICAL INTERFACES
Power Supply
The m le integrates internal reg lators. It can be easil powered
capacitor at pin VDD_BAT.
Internal Antenna
connecting a 3V coin batter with a >100 F
Figure 2. Capacitor at pin VDD_BAT
The m le integrates an on-board chip antenna. There s no need to se external antenna on
ta e preca tion to lea e ample clearance for the antenna
PIO
IOs are pro ided 4 are m ltiplexed with S I deb g interface . The are powered from VDD
IO lines are software-config rable as wea
ll-
ll-down, strong
wea
ll-
or strong
stomer s CB.
ease
IO.
ll-down.
AIO
3 AIOs are pro ided. The can be connected to internal 10 bits ADC. Depending on the software, the can be sed
to read or o tp t a oltage between 0V to 1.3V. Each of them can be also sed as a digital o t t with special firmware.
PWM
IO3, IO4, IO9, IO10 can be dri en b internal
M m le. The
M m le also wor s while the m
is sleep. Therefore it can be sed as a ED flasher. These f ctions are controlled b special firmwares.
le
UART
This m le has a standard. UART interface which pro ides a simple mechanism for comm icating with other serial
de ices sing the RS232 protocol.
The UART CTS and RTS signals can be assigned to an
IO pin b the on-chip firmware.
Possible UART Settings
Parameter
B
te
Possible Values
Minim m
Maxim
Flow Control
rit
N mber of Stop Bits
Bits per B te
ABRACON IS
ISO 9001:2008
CERTIFIED
LLC
1200 ba d 2%Error
9600 ba d 1%Error
2M ba d 1%Error
RT CTS or None
None, Odd or E en
1 or 2
8
2 Faraday, Suite# B | Irvine | CA 92618 Revised: 06.29.15
Ph. 949.546.8000 | Fax. 949.546.8001
Visit www.abracon.com for Terms and Conditions of Sale
Low Power Bluetooth Module (supporting CSRmesh)
Pb
LLC
ABBTM- NVC-MDCS71-MESH
FCC ID: OC3BM1871
DC: 1508
RoHS
RoHS/RoHS II compliant
19.5 x 12.5 x 2.4 mm SMT
| | | | | | | | | | | | | | |
PHYSICAL INTERFACES
I2C Master
The m le can act as an I2C master when config red b software. An two IOs can be config red as I2C_SC and
I2C_SDA.
SPI Master
The m le can act as an S I master mode 0 when config red b software. An f
S I_C K, S I_CS#, S I_DIN and S I_DOUT. The cloc rate of the software S I is ar
SPI Debug
r IOs can be config red as
z.
The S I D g interface is chosen when S I_ IO_SE is high. The interface is sed to program and
So alwa s place test points or header
CB for this interface and S I_ IO_SE .
g the m
le.
SOFTWARE STACK
ABBTM-NVC-MDCS71is a single mode Bl tooth 4.1 m le. It integrates CSRmesh and
acomm s
sers can access mesh f nctions easil ia the UART interface of the m le.
proprietar control interface together
iNovaMESH Stack
No a comm Control Inte rfa ce
CS Rme sh
ight Mode l
Da ta Mode l
Mesh
Association
Mes h Control
rotocol
Mesh Tra ns port a e r
Bl e tooth S ma rt
Figure 3. iNovaMESH Stack
REFERENCE DESIGN
Figure 4. Reference Design
ABRACON IS
ISO 9001:2008
CERTIFIED
LLC
2 Faraday, Suite# B | Irvine | CA 92618 Revised: 06.29.15
Ph. 949.546.8000 | Fax. 949.546.8001
Visit www.abracon.com for Terms and Conditions of Sale
Low Power Bluetooth Module (supporting CSRmesh)
ABBTM-NVC-MDCS71-MESH
Pb
LLC
ABBTM- NVC-MDCS71-MESH
FCC ID: OC3BM1871
DC: 1508
RoHS
RoHS/RoHS II compliant
19.5 x 12.5 x 2.4 mm SMT
| | | | | | | | | | | | | | |
LAYOUT AND SOLDERING
Soldering Recommendations
.
ABBTM-NVC-MDCS71 is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile
used is dependent on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven and particular
type of solder paste used. Please refer to the datasheet of the particular solder paste for profile configurations.
The following are recommended for soldering the module to ensure reliable solder joint and operation of the module
after soldering. Since the profile used is process and layout dependent, the optimum profile should be studied case by
case. Thus following recommendation should be taken as reference only.
•
Refer to technical documentations of particular solder paste for profile configurations
•
Avoid using more than one flow.
•
Reliability of the solder joint and self-alignment of the component are dependent on the solder volume. Minimum of
150µm stencil thickness is recommended.
•
Aperture size of the stencil should be 1:1 with the pad size.
•
A low residue, “no clean” solder paste should be used due to low mounted height of the component.
REFLOW PROFILE
Figure 5. Typical Lead-Free Reflow Solder Profile for ABBTM-NVC-MDCS71
Key features of the profile:
ABRACON IS
ISO 9001:2008
CERTIFIED
•
Initial Ramp = 1-2.5°C/sec to 175°C ±25°C equilibrium
•
Equilibrium time = 60 to 180 seconds
•
Ramp to Maximum temperature (250°C) = 3°C/sec max.
•
Time above liquidus temperature (217°C): 45-90 seconds
•
Device absolute maximum reflow temperature: 255°C
LLC
2 Faraday, Suite# B | Irvine | CA 92618 Revised: 06.29.15
Ph. 949.546.8000 | Fax. 949.546.8001
Visit www.abracon.com for Terms and Conditions of Sale
Low Power Bluetooth Module (supporting CSRmesh)
ABBTM-NVC-MDCS71-MESH
Pb
RoHS/RoHS II compliant
LLC
ABBTM- NVC-MDCS71-MESH
FCC ID: OC3BM1871
DC: 1508
RoHS
19.5 x 12.5 x 2.4 mm SMT
| | | | | | | | | | | | | | |
PHYSICAL INTERFACES
Layout Guideline
.
It is strongly recommended to use good layout practices to ensure proper operation of the module. Placing copper or any
metal near antenna deteriorates its operation by having effect on the matching properties. Metal shield around the
antenna will prevent the radiation and thus metal case should not be used with the module. Use grounding vias separated
maximum 3 mm apart at the edge of grounding areas to prevent RF penetrating inside the PCB and causing an
unintentional resonator. Use GND vias all around the PCB edges. Figure 4 illustrates recommended PCB design around
the antenna of ABBTM-NVC-MDCS71 when the module is placed at the edge of a PCB.
Do not place copper on the top layer under the module, as shown in Figure 6. The module has vias on the area shown,
which can cause short circuit if there is copper underneath. Any metal placed closer than 20 mm in any direction from
the antenna changes the matching properties and thus will considerably deteriorate the RF performance of the module.
Figure 6. Placement of the Module on a Main Board
ABRACON IS
ISO 9001:2008
CERTIFIED
LLC
2 Faraday, Suite# B | Irvine | CA 92618 Revised: 06.29.15
Ph. 949.546.8000 | Fax. 949.546.8001
Visit www.abracon.com for Terms and Conditions of Sale
Low Power Bluetooth Module (supporting CSRmesh)
Pb
LLC
ABBTM- NVC-MDCS71-MESH
FCC ID: OC3BM1871
DC: 1508
RoHS
RoHS/RoHS II compliant
19.5 x 12.5 x 2.4 mm SMT
| | | | | | | | | | | | | | |
OUTLINE DIMENSIONS
Recommended Land Pattern
in 1
.
in 1
in 25
in 25
Dimensions: mm
TAPE & REEL:
80pcs/tray
Dimensions: mm
ATTENTION: Abracon Corporation s prod s are COTS – Commercial-Off-The-Shelf prod s; itable for Commercial,
trial and, where designated, tomo
Applicadesigned for Militar , A
on, Aerospace, fe-dependant Medical applications or an application re iring high reliab
where
tions. Abracon s prod cts are not specif
component fail e
res in loss of life
r propert . For applications re iring high reliabilit and or presenting an extreme operating
ronment, written consent and
rization from Abracon Corporation is req ire
lease contact Abracon Corporation for more information.
ABRACON IS
ISO 9001:2008
CERTIFIED
LLC
2 Faraday, Suite# B | Irvine | CA 92618 Revised: 06.29.15
Ph. 949.546.8000 | Fax. 949.546.8001
Visit www.abracon.com for Terms and Conditions of Sale
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