05-08-1721

UF Package
28-Lead Plastic QFN (4mm × 4mm)
Reference LTC DWG # 05-08-1721 Rev A)
0.70 ± 0.05
4.50 ± 0.05
3.10 ± 0.05
2.64 ± 0.05
(4 SIDES)
PACKAGE
OUTLINE
0.20 ± 0.05
0.40 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
4.00 ± 0.10
(4 SIDES)
0.75 ± 0.05
R = 0.05
TYP
PIN 1
TOP MARK
(NOTE 6)
PIN 1 NOTCH
R = 0.20 TYP
OR 0.35 × 45°
CHAMFER
BOTTOM VIEW—EXPOSED PAD
R = 0.115
TYP
27 28
0.40 ± 0.05
1
2
2.64 ± 0.10
(4-SIDES)
(UF28) QFN 0106 REVA
0.200 REF
0.00 – 0.05
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE, IF PRESENT
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
0.20 ± 0.05
0.40 BSC
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