05-08-1720

UD Package
20-Lead Plastic QFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1720 Rev A)
0.70 ± 0.05
3.50 ± 0.05
(4 SIDES)
1.65 ± 0.05
2.10 ± 0.05
PACKAGE
OUTLINE
0.20 ± 0.05
0.40 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
3.00 ± 0.10
(4 SIDES)
BOTTOM VIEW—EXPOSED PAD
0.75 ± 0.05
R = 0.05
TYP
PIN 1
TOP MARK
(NOTE 6)
PIN 1 NOTCH
R = 0.20 TYP
OR 0.25 × 45°
CHAMFER
R = 0.115
TYP
19 20
0.40 ± 0.10
1
1.65 ± 0.10
(4-SIDES)
2
(UD20) QFN 0306 REV A
0.200 REF
0.00 – 0.05
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
0.20 ± 0.05
0.40 BSC
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