05-08-1856

LGA Package
77-Lead (15mm × 9mm × 4.32mm)
(Reference LTC DWG # 05-08-1856 Rev B)
aaa Z
SEE NOTES
DETAIL A
9
BSC
X
4.22 – 4.42
Y
7
6
5
4
3
2
7
1
PAD 1
DIA (0.635)
A
B
PAD 1
CORNER
C
4
D
E
15
BSC
12.70
BSC
MOLD
CAP
F
SUBSTRATE
G
0.27 – 0.37
H
Z
// bbb Z
3.95 – 4.05
J
1.27
BSC
K
DETAIL B
L
aaa Z
PADS
SEE NOTES
3
0.635 ±0.025 SQ. 76x
0.9525
1.5875
DETAIL B
7.62
BSC
PACKAGE BOTTOM VIEW
3.810
eee S X Y
2.540
1.270
0.000
1.270
2.540
3.810
4.1275
3.4925
PACKAGE TOP VIEW
6.350
5.080
DETAIL A
3.810
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2.540
2. ALL DIMENSIONS ARE IN MILLIMETERS
1.270
0.000
0.9525
1.5875
3
LAND DESIGNATION PER JESD MO-222, SPP-010
4
DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
1.270
2.540
5. PRIMARY DATUM -Z- IS SEATING PLANE
3.810
6. THE TOTAL NUMBER OF PADS: 77
5.080
7
6.350
SUGGESTED PCB LAYOUT
TOP VIEW
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
SYMBOL TOLERANCE
aaa
0.15
bbb
0.10
eee
0.05
LTMXXXXXX
µModule
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
LGA 77 1212 REV B
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