05-08-1893

LGA Package
68-Lead (15mm × 9mm × 4.32mm)
(Reference LTC DWG# 05-08-1893 Rev B)
DETAIL A
G
A
aaa Z
SEE NOTES
F
E
D
C
B
7
A
PAD 1
1
PAD “A1”
CORNER
2
b
4
3
4
5
D
MOLD
CAP
F
SUBSTRATE
6
7
H1
8
9
Z
// bbb Z
H2
X
aaa Z
11
e
b
DIA (0.630) 68x
Y
E
10
e
DETAIL B
eee S X Y
PADS
SEE NOTES
G
DETAIL B
PACKAGE TOP VIEW
3
PACKAGE BOTTOM VIEW
2. ALL DIMENSIONS ARE IN MILLIMETERS
3.810
2.540
1.270
0.000
1.270
2.540
3.810
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
DETAIL A
6.350
0.630 ±0.025 Ø 68x
5.080
3.810
2.540
1.270
0.000
1.270
2.540
3.810
5.080
6.350
SUGGESTED PCB LAYOUT
TOP VIEW
DIMENSIONS
SYMBOL
A
b
D
E
e
F
G
H1
H2
aaa
bbb
eee
MIN
4.22
0.60
0.27
3.95
NOM
4.32
0.63
15.00
9.00
1.27
12.70
7.62
0.32
4.00
MAX
4.42
0.66
3
LAND DESIGNATION PER JESD MO-222
4
DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
NOTES
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. THE TOTAL NUMBER OF PADS: 68
7
0.37
4.05
0.15
0.10
0.05
TOTAL NUMBER OF LGA PADS: 68
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
LTMXXXXXX
µModule
PACKAGE IN TRAY LOADING ORIENTATION
LGA 68 1212 REV B
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