CG0201MLA

T
PL
IA
N
M
CO
*R
oH
S
Features
Applications
■ Miniature 0201 package
■ Smart phones
■ Fast response time to ESD strikes (<1 ns)
■ Tablets
■ Bidirectional protection
■ Handheld devices
■ Low clamping voltage
■ Embedded components
■ Low leakage current
■ Scanners
■ RoHS compliant*
■ Notebooks
ChipGuard® MLA Series µVaristor ESD Clamp Protector
Description
Bourns® ChipGuard® MLA Series μVaristor ESD Clamp Protectors are based on multilayer metal oxide varistor technology.
Bidirectional ESD protection is provided in a miniature 0201 package, making it one of the smallest protectors available on the market
today. The series is ideally suited for space-constrained applications where circuit board space is at a premium.
Electrical Characteristics @ 25 °C (unless otherwise noted)
Vrms
(V)
Model
VDC
(V)
VN Min.
(V)
<10 µA
CG0201MLA-5.5MH
4
VN Max.
(V)
1 mA DC
5.5
8
14
VC
(V)
ITM (Max.)
(A)
WTM (Max.)
(J)
CP
(pF) Typ.
1A@
8/20 µs
@ 8/20 µs
10/1000 µs
@ 1 MHz
28
—
—
32
General Characteristics
Device Symbol
Operating Temperature...........................................................................-40 °C to +85 °C
Storage Temperature ..............................................................................-40 °C to +85 °C
Response Time........................................................................................................ <1 ns
Performance Standard ..............................................................................IEC 61000-4-2
Environmental Characteristics
Characteristic
Bias Humidity
Thermal Shock
Load Test
Specification
Test Condition
ΔVn/Vn ≤ 10 %
90 % RH, 40 °C, Working Voltage, 1000 Hours
-40 °C to +85 °C, 30 Minute Cycle, 5 Cycles Total
Working Voltage, 85 °C, 1000 Hours
How to Order
CG 0201 MLA - 5.5 x H
®
ChipGuard
Product Designator
Package Designator
0201 = 0201 Package
Technology
MLA = Multilayer Varistor
Operating Voltage
5.5 = 5.5 V
Tolerance
M = 20 %
Tape & Reel Packaging
H = 15,000 pcs. per reel
Asia-Pacific: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
EMEA: Tel: +36 88 520 390 • Fax: +36 88 520 211
The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
ChipGuard® MLA Series µVaristor ESD Clamp Protector
Product Dimensions
Recommended Pad Layout
TOP VIEW
SIDE VIEW
0.30 ± 0.05
(.012 ± .002)
0.60 ± 0.05
(.024 ± .002)
0.30 ± 0.05
(.012 ± .002)
0.30 ± 0.05
(.012 ± .002)
0.20 ± 0.10
(.008 ± .004)
DIMENSIONS:
0.25 ± 0.05
(.010 ± .002)
0.25 ± 0.05
(.010 ± .002)
0.30 ± 0.05
(.012 ± .002)
MM
(INCHES)
Construction
Solder Reflow Recommendations
TP
Temperature (°C)
TP
TL
A
Stage 1 Preheat
Ramp
Ambient to Preheating
Temperature
3 °C / s max.
B
Stage 2 Preheat
Preheat min./max.
Temperature Range
150 °C to 200 °C
60 s to 180 s
C
Stage 3 Preheat
to Main Heating
Max. Time Above
Stated Temperature
217 °C
60 s to 150 s
D
Main Heating
Max. Time Within 5 °C
of Peak Temperature
(260 °C)
255 °C
20 s to 40 s
E
Cool Down
Rate from Peak
Temperature
6 °C / s max.
CRITICAL ZONE
TLTO TP
RAMP-UP
TSmax
TL
TSmin
TS
RAMP-DOWN
PREHEAT
25
t 25 °C TO PEAK
Time (seconds)
CAUTION:
• Rapid heating and cooling in excess of stated maximum rates will easily damage this product.
• Locating heating can also damage product.
• Do not thermally shock product in excess of 100 °C.
• Product can be repaired using a 30 W or less solder gun/iron. Tip temperature maximum is 280 °C for less than 3 seconds.
• Do not touch the component directly with the soldering gun/iron.
• Excess soldering volumes can damage the body of the product.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
ChipGuard® MLA Series µVaristor ESD Clamp Protector
Packaging Dimensions
8.0 ± 0.1
(.315 ± .004)
0.42 ± 0.02
(.017 ± .0008)
4.0 ± 0.10
(.157 ± .004)
DIA.
1.55 ± 0.05
(.061 ± .002)
13.0 ± 1.0
(.512 ± .039)
1.75 ± 0.05
(.069 ± .002)
2.0 ± 0.05
(.079 ± .002)
62.0 ± 1.5
(2.441 ± .059)
2.0 ± 0.5
(.079 ± .020)
13.0 ± 0.5
(.512 ± .020)
21.0 ± 0.8
(.827 ± .031)
2.0 ± 0.05
(.079 ± .002)
0.36 ± 0.02
(.014 ± .0008)
178 ± 2.0
(7.008 ± .079)
0.70 ± 0.02
(.028 ± .0008)
3.5 ± 0.05
(.138 ± 0.002)
DIMENSIONS:
9.0 ± 0.5
(.354 ± .020)
MM
(INCHES)
REV. A 07/14
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
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