PL IA N T Features M ■ 0402 and 0603 package options *R oH S CO ■ Rated for IEC 61000-4-2, level 4 ■ Withstands multiple ESD strikes ■ Low capacitance and leakage currents for invisible load protection ■ Tape and reel packaging ChipGuard® MLD Series Varistor ESD Clamp Protectors Description The Chip Guard® CG0402MLD and CG0603MLD Series have been specifically designed to protect sensitive electronic components from electrostatic discharge damage. The MLD family has been designed to protect equipment to IEC61000-4-2, level 4 ESD specifications targeted for high speed data applications. The Chip Guard® MLD Series has been manufactured to provide very low capacitance with excellent clamp qualities, making the family almost transparent under normal working conditions. Electrical Characteristics @ 25 °C (unless otherwise noted) Model Continuous Operating Voltage Breakdown Voltage Clamping Voltage Off-state Current Capacitance VDC (V) VB @ 1 mA (V) VC @ 1 A 8/20 µs (V) IL (µA) COFF (pF) Max. Typ. Max. Max. Max. CG0402MLD-12G 12 50 140 1 5 CG0603MLD-12E 12 50 140 1 5 Schematic Environmental Characteristics Operating Temperature ..................................................................................... -30 °C to +85 °C Storage Temperature......................................................................................... -30 °C to +85 °C Standard ...................................................................................................IEC 61000-4-2 Level 4 These products are RoHS compliant. There is some lead contained within the glass of the ceramic. This is acceptable under exemption no. 5 of the RoHS directive (DIRECTIVE 2002/95/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment). ESD Withstand Ratings Peak Voltage Repetitions (Min.) ESD Voltage Capability, Contact Discharge 8 kV 100 at 8 kV ESD Voltage Capability, Air Discharge 15 kV 100 at 15 kV Parameter Standard IEC61000-4-2 Level 4 How to Order CG 0n0n MLD - 12 x ® ChipGuard Product Designator Package Option 0402 = 0402 Package 0603 = 0603 Package Multilayer Series Designator Operating Voltage 12 = 12 V Tape & Reel Packaging E = 4,000 pcs. per reel (CG0603MLD Series) G = 10,000 pcs. per reel (CG0402MLD Series) Ni barrier terminations are standard on all ChipGuard® part numbers. Asia-Pacific: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116 Europe: Tel: +41-41 768 5555 • Fax: +41-41 768 5510 The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700 www.bourns.com *RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. ® ChipGuard 3312 - 2 mm MLD SMD Series Trimming Varistor Potentiometer ESD Clamp Protectors Product Dimensions Recommended Pad Layout A A W DIMENSIONS: MM (INCHES) B L B C D CG0402MLD Series CG0603MLD Series L 1.00 ± 0.15 (0.04 ± 0.006) 1.60 ± 0.20 (0.064 ± 0.008) W 0.50 ± 0.10 (0.02 ± 0.004) A B Dimension CG0402MLD Series CG0603MLD Series A 0.51 (0.020) 0.76 (0.030) 0.80 ± 0.20 (0.032 ± 0.008) B 0.61 (0.024) 1.02 (0.040) 0.50 ± 0.10 (0.02 ± 0.004) 0.80 ± 0.20 (0.032 ± 0.008) C 0.51 (0.020) 0.50 (0.020) 0.25 ± 0.15 (0.10 ± 0.006) 0.30 ± 0.20 (0.012 ± 0.008) D 1.70 (0.067) 2.54 (0.100) Dim. Solder Reflow Recommendations 300 Preheat Stages 1-3 Soldering Cooling A Stage 1 Preheat Temperature (°C) 250 200 150 30-70 sec. 60 s to 120 s B Stage 2 Preheat 140 °C to 160 °C Stage 3 Preheat Preheat to 200 °C 20 s to 40 s D Main Heating 200 °C 210 °C 220 °C 230 °C 240 °C 60 s to 70 s 55 s to 65 s 50 s to 60 s 40 s to 50 s 30 s to 40 s E Cooling 200 °C to 100 °C 1 °C/s to 4 °C/s 50 110 sec. (min.) 30 s to 60 s C 100 0 Ambient to Preheating Temperature 120 sec. (min.) Time (seconds) • • • • This product can be damaged by rapid heating, cooling or localized heating. Heat shocks should be avoided. Preheating and gradual cooling recommended. Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended. Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds. A solder gun under 30 watts is recommended. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. ChipGuard® MLD Series Varistor ESD Clamp Protectors Packaging Dimensions 13.0 ± 1.0 (0.52 ± 0.04) 8.00 ± 0.30 (0.32 ± 0.012) 4.00 ± 0.10 (0.16 ± 0.004) C 1.50 ± 0.10 (0.06 ± 0.004) 62.0 ± 1.50 (2.48 ± 0.06) 2.0 ± 0.50 (0.08 ± 0.02) L 13.0 ± 0.50 (0.52 ± 0.02) TOP TAPE G W D 21.0 ± 0.80 (0.84 ± 0.032) 3.50 ± 0.05 (0.14 ± 0.002) NOTES: TAPE MATERIAL IS PAPER. 0.48 ± 0.03 TAPE THICKNESS IS (0.019 ± 0.0012) COVER TAPE ADHESION IS 40 ± 15 GRAMS. DIMENSIONS: MM (INCHES) CG0402MLD Series CG0603MLD Series C 1.75 ± 0.05 (0.04 ± 0.002) 1.75 ± 0.10 (0.04 ± 0.004) D 2.00 ± 0.02 (0.08 ± 0.0008) 2.00 ± 0.05 (0.08 ± 0.002) L 1.19 ± 0.05 (0.047 ± 0.002) 1.80 ± 0.20 (0.072 ± 0.008) W 0.69 ± 0.05 (0.027 ± 0.002) 0.90 ± 0.20 (0.036 ± 0.008) G 2.0 ± 0.05 (0.08 ± 0.002) 4.0 ± 0.05 (0.16 ± 0.002) Dimension 180.8 ± 2.0 (7.12 ± 0.08) 9.0 ± 0.50 (0.36 ± 0.02) REV. H 06/13 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.