CGA MLC

*R
& oHS
AE C
C OM
AP P
PR LI
OV AN
ED T
Features
Applications
■ AEC-Q200 qualified
■ Camera links
■ ESD protection to IEC 61000-4-2 Level 4
■ Sensors
■ <1 ns response time to ESD strike
■ Touchscreen interfaces
■ Low leakage current
■ GPS
■ Extremely low capacitance (0.05 pF typ.)
■ Antennas
■ Bidirectional device
■ USB 3.0
■ Multi-strike capability
■ High-speed communications buses
ChipGuard® Automotive MLC Series - ESD Protectors
General Information
Bourns® ChipGuard® Automotive MLC Series is a sub-1 pF protector designed
specifically for use in automotive circuits requiring ESD protection. The CGA-MLC
series is available in industry standard 0402 and 0603 packages. In addition to its very
low capacitance, these protectors exhibit extremely fast response times to ESD events
making them ideal for protecting a wide array of high speed digitial electronic
applications.
The ChipGuard® Automotive MLC Series is fully AEC-Q200 qualified and supported.
Electrical Characteristics @ 25 °C (unless otherwise noted)
Parameter
Symbol
DC Working Voltage
VW(DC)
CGA0402MLC-
CGA0603MLC-
05G
12G
24G
05E
12E
24E
≤5
≤12
≤24
≤5
≤12
≤24
Unit
V
Maximum Leakage Current
@ Max. VW(DC)
IL
Typical Clamping Voltage (Note 1)
VC
30
V
Typical Trigger Voltage (Note 1)
VT
300
V
Typical Peak Voltage (Note 2)
VP
Typical Capacitance @ 1 MHz, 1 Vrms
CO
Response Time
RT
ESD Protection:
Per IEC 61000-4-2 Level 4
Min. Contact Discharge
Min. Air Discharge
Typical ESD Withstand
<0.01
μA
300
0.2
V
0.2
0.2
0.05
pF
<1
ns
±8
±15 (Note 3)
1000
kV
kV
Pulses
Operating Temperature
TOPR
-55 to +125
˚C
Storage Temperature
TSTG
-55 to +125
˚C
Notes: 1. VT and VC measured using TLP (Transmission Line Pulse) method.
2. Peak voltage measured under ESD Test Conditions: IEC61000-4-2, 8 kV contact discharge.
3. IEC 61000-4-2 ESD Performance for CGA0603MLC-05E and CGA0603MLC-12E devices will meet minimum 100 reps.
Some shifting in characteristics may occur when tested over several hundred ESD pulses. All other part numbers listed will meet
IEC 61000-4-2 ESD Performance with minimum 1000 reps without degradation in performance.
Asia-Pacific: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
EMEA: Tel: +36 88 520 390 • Fax: +36 88 520 211
The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
ChipGuard® Automotive MLC Series - ESD Protectors
Product Dimensions
Recommended Pad Layout
A
H
W
B
L
B
C
H
CGA0402MLC
Series
CGA0603MLC
Series
L
1.00 ± 0.10
(0.04 ± 0.004)
1.60 ± 0.10
(0.064 ± 0.004)
W
0.50 ± 0.10
(0.02 ± 0.004)
H
B
Dim.
CGA0402MLC
Series
CGA0603MLC
Series
A
0.50 ± 0.1
(0.02 ± 0.004)
0.75 ± 0.1
(0.03 ± 0.004)
0.85 ± 0.15
(0.033 ± 0.006)
B
0.50 ± 0.1
(0.02 ± 0.004)
0.75 ± 0.1
(0.03 ± 0.004)
0.34 ± 0.10
(0.014 ± 0.004)
0.51 ± 0.05
(0.020 ± 0.002)
C
0.50 ± 0.1
(0.02 ± 0.004)
0.75 ± 0.1
(0.03 ± 0.004)
0.20 ± 0.15
(0.008 ± 0.006)
0.30 ± 0.20
(0.012 ± 0.008)
Dim.
DIMENSIONS:
MM
(INCHES)
Solder Reflow Recommendations
300
Preheat Stages 1-3
Soldering
Cooling
A
Temperature (°C)
250
Stage 1 Preheat
Ambient to Preheating
Temperature
30 s to 60 s
60 s to 120 s
200
B
Stage 2 Preheat
140 °C to 160 °C
150
C
Stage 3 Preheat
Preheat to 200 °C
20 s to 40 s
D
Main Heating
200 °C
210 °C
220 °C
230 °C
240 °C
250 °C to 255 °C
60 s to 70 s
55 s to 65 s
50 s to 60 s
40 s to 50 s
30 s to 40 s
5s
E
Cooling
200 °C to 100 °C
1 °C/s to 4 °C/s
100
50
0
110 sec. (min.)
30-70
sec.
120 sec. (min.)
Time (seconds)
•
•
•
•
This product can be damaged by rapid heating, cooling or localized heating.
Heat shocks should be avoided. Preheating and gradual cooling recommended.
Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended.
Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds.
A solder gun under 30 watts is recommended.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
ChipGuard® Automotive MLC Series - ESD Protectors
Packaging Dimensions
F
E
13.0 ± 1.0
(0.52 ± 0.04)
C
B
A
62.0 ± 1.5
(2.48 ± 0.06)
2.0 ± 0.5
(0.08 ± 0.02)
L
13.0 ± 0.5
(0.52 ± 0.02)
TOP
TAPE
W
D
NOTES: TAPE MATERIAL IS PAPER.
0.48 ± 0.03
(0.019 ± 0.0012)
COVER TAPE ADHESION IS 35 ± 25 GRAMS.
TAPE THICKNESS IS: CGA0402MLC
DIMENSIONS:
CGA0603MLC
0.6 ± 0.03
(0.024 ± 0.0012)
21.0 ± 0.8
(0.84 ± 0.032)
178 ± 2.0
(7.08 ± 0.08)
MM
(INCHES)
9.0 ± 0.5
(0.36 ± 0.02)
CGA0402MLC
Series
CGA0603MLC
Series
A
8.00 ± 0.30
(0.315 ± 0.012)
8.00 ± 0.30
(0.315 ± 0.012)
B
3.50 ± 0.05
(0.138 ± 0.002)
3.50 ± 0.05
(0.138 ± 0.002)
C
1.75 ± 0.10
(0.069 ± 0.004)
1.75 ± 0.10
(0.069 ± 0.004)
D
2.00 ± 0.05
(0.079 ± 0.002)
2.00 ± 0.05
(0.079 ± 0.002)
E
4.00 ± 0.10
(0.157 ± 0.004)
4.00 ± 0.10
(0.157 ± 0.004)
F
1.50 ± 0.10
(0.059 ± 0.004)
1.50 ± 0.10
(0.059 ± 0.004)
Maximum DC Working Voltage
05 = 5 V
12 = 12 V
24 = 24 V
L
1.19 ± 0.05
(0.047 ± 0.002)
2.02 ± 0.20
(0.080 ± 0.008)
Tape & Reel Packaging
E = 5,000 pcs. per reel (0603 Package)
G = 10,000 pcs. per reel (0402 Package)
W
0.69 ± 0.05
(0.027 ± 0.002)
1.27 ± 0.15
(0.050 ± 0.006)
T
0.48 ± 0.03
(0.019 ± 0.0012)
0.60 ± 0.03
(0.024 ± 0.0012)
Dimension
How to Order
CG A 0n0n MLC - nn x
ChipGuard®
Product Designator
Automotive Series
Package Option
0402 = 0402 Package
0603 = 0603 Package
Multilayer Series Designator
REV. B 03/14
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
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