CG0805MLA

T
PL
IA
N
M
CO
*R
oH
S
Features
Applications
■ RoHS compliant*
■ IC supply line protection
■ ESD protection >25 kV
■ MOSFET gate protection
■ Surge protection
■ Control line protection
■ Low capacitance
■ Low frequency I/O line protection
ChipGuard® CG0805MLA Series - ESD Protector Array
General Information
The ChipGuard® CG0805MLA series has been designed to provide a competitive solution for
applications where capacitance of the ESD protector is less critical. General ESD
applications in end products such as computers, analog modems and PDAs include IC
supply lines, MOSFET gate protection, and low frequency digital and control lines.
The ChipGuard® CG0805MLA quad device is designed to protect equipment to
IEC61000-4-2, Level 4 (±8 kV Contact / ±15 kV Air Discharge) ESD specification.
Electrical & Thermal Characteristics @ TA = 25 °C (unless otherwise noted)
Parameter
Symbol
CG0805MLA-5.5ME
CG0805MLA-18KE
VRMS
VDC
4
14
V
5.5
18
V
IR
IS
10
WMax
VBR
12
28
V
%_ VBR
20
10
%
VC
28
58
V
Typical Capacitance @ 1 VRMS 1 kHz
CO1
36
17
pF
Typical Capacitance @ 1 VRMS 1 MHz
CO2
33
15
pF
Maximum AC Working Voltage @ 10 µA Max.
Maximum DC Working Voltage @ 10 µA Max.
Minimum Resistance @ 3.3 VDC
Maximum Peak Current @ 8/20 µS Pulse
Maximum Transient Energy @ 10/1000 µS Pulse
Nominal Breakdown Voltage @ 1 mA
Breakdown Voltage Tolerance
Maximum Clamping Voltage @ 1 A 8/20 µS Pulse
Maximum Response Time
RT
ESD Protection: Per IEC 61000-4-2
Min. Contact Discharge (>100 Reps)
Min. Air Discharge (>100 Reps)
Operating Temperature
Storage Temperature
TOPR
TSTG
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications
10
Unit
Megohms
5
0.01
A
Joules
1
ns
±8
± 15
kV
kV
-40 to +85
˚C
-40 to +85
˚C
ChipGuard® CG0805MLA Series - ESD Protector Array
Product Dimensions
Recommended Pad Layout
W
BL
X
E
X
D
P
A
S
L
B
T
C
BW
CG0805
Series
Dimension
L
DIMENSIONS:
1.25 ± 0.20
(0.049 ± 0.008)
MM
(INCHES)
Dimension
CG0805
Series
W
2.00 ± 0.20
(0.080 ± 0.008)
A
0.64
(0.025)
T
0.90
(0.035) MAX.
B
1.27
(0.050)
BW
0.20 ± 0.10
(0.008 ± 0.004)
C
1.91
(0.075)
BL
0.20 ± 0.10
(0.008 ± 0.004)
D
0.28
(0.011)
P
0.50
(0.020)
E
0.51
(0.020)
X
0.75 ± 0.10
(0.029 ± 0.004)
S
0.25 ± 0.10
(0.009 ± 0.004)
Solder Reflow Recommendations
300
Preheat Stages 1-3
Soldering
Cooling
A
Stage 1 Preheat
Temperature (°C)
250
200
150
30-70
sec.
60 s to 120 s
B
Stage 2 Preheat
140 °C to 160 °C
Stage 3 Preheat
Preheat to 200 °C
20 s to 40 s
D
Main Heating
200 °C
210 °C
220 °C
230 °C
240 °C
60 s to 70 s
55 s to 65 s
50 s to 60 s
40 s to 50 s
30 s to 40 s
E
Cooling
200 °C to 100 °C
1 °C/s to 4 °C/s
50
110 sec. (min.)
30 s to 60 s
C
100
0
Ambient to Preheating
Temperature
120 sec. (min.)
Time (seconds)
•
•
•
•
This product can be damaged by rapid heating, cooling or localized heating.
Heat shocks should be avoided. Preheating and gradual cooling recommended.
Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended.
Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds.
A solder gun under 30 watts is recommended.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications
ChipGuard® CG0805MLA Series - ESD Protector Array
Packaging Dimensions
13.0 ± 1.0
(0.52 ± 0.04)
8.00 ± 0.30
(0.32 ± 0.012)
4.00 ± 0.10
(0.16 ± 0.004)
C
1.50 ± 0.10
(0.06 ± 0.004)
62.0 ± 1.50
(2.48 ± 0.06)
2.0 ± 0.50
(0.08 ± 0.02)
L
13.0 ± 0.50
(0.52 ± 0.02)
TOP
TAPE
G
D
NOTES: TAPE MATERIAL IS PAPER.
0.60 ± 0.05
TAPE THICKNESS IS
(0.024 ± 0.002)
COVER TAPE ADHESION IS 40 ± 15 GRAMS.
Dimension
C
21.0 ± 0.80
(0.84 ± 0.032)
3.50 ± 0.05
(0.14 ± 0.002)
W
DIMENSIONS:
CG0805
Series
180.8 ± 2.0
(7.12 ± 0.08)
MM
(INCHES)
9.0 ± 0.50
(0.36 ± 0.02)
How to Order
1.75 ± 0.10
(0.069 ± 0.004)
D
2.00 ± 0.05
(0.080 ± 0.002)
L
2.40 ± 0.20
(0.094 ± 0.008)
W
1.65 ± 0.20
(0.065 ± 0.008)
G
4.00 ± 0.10
(0.16 ± 0.004)
CG 0805 - MLA n.n x E
®
ChipGuard
Product Designator
Package Option
0805 = 0805 Package
Model Series
MLA = Standard Capacitance
Working Peak Voltage**
18 = 18 V
5.5 = 5.5 V
Tolerance
K = 10 %
M = 20 %
Tape & Reel Packaging
E = 4,000 pcs. per reel
** Only models lower than 10 volts require
decimal point.
Asia-Pacific: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
Europe: Tel: +41-41 768 5555 • Fax: +41-41 768 5510
The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
REV. C 09/12
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications
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