CD214B-F250 F2600

PL
IA
N
T
Features
S
CO
M
■
*R
oH
■
■
■
■
RoHS compliant*
Glass passivated chip
Low reverse leakage current
Low forward voltage drop
High current capability
CD214B-F250~F2600 Surface Mount Fast Response Rectifiers
General Information
The markets of portable communications, computing and video equipment are challenging the semiconductor industry to develop increasingly
smaller electronic components. Bourns offers Surface Mount Fast Response Rectifiers for rectification applications, in compact chip
DO-214AA (SMB) size format, which offer PCB real estate savings and are considerably smaller than most competitive parts. The Fast
Response Rectifier Diodes offer a forward current of 2.0 A with a choice of repetitive peak reverse voltages of 50 V up to 600 V.
Bourns® Chip Diodes conform to JEDEC standards, are easy to handle on standard pick and place equipment and their flat configuration
minimizes roll away.
Electrical Characteristics (@ TA = 25 °C Unless Otherwise Noted)
Parameter
Symbol
Maximum Repetitive
Peak Reverse Voltage
Maximum RMS Voltage
CD214B-
Unit
F250
F2100
F2150
F2200
F2400
F2600
VRRM
50
100
150
200
400
600
V
VRMS
35
70
105
140
280
420
V
Maximum DC
Blocking Voltage
VDC
50
100
150
200
400
600
V
Max. Average Forward
Rectified Current1
I(AV)
2.0
A
DC Reverse Current @
Rated DC Blocking Voltage (@
TJ = 25 °C)
IR
5.0
µA
DC Reverse Current @
Rated DC Blocking Voltage (@
TJ = 125 °C)
IR
350
µA
Typical Junction Capacitance2
CJ
200
pF
Maximum Instantaneous
Forward Voltage @ 1 A
VF
0.92
1.25
1.30
V
Typical Thermal Resistance3
RθJL
15
°C/W
Peak forward surge current
8.3 ms single half sine-wave
superimposed on rated load
(JEDEC Method)
IFSM
50
A
Notes:
1 See Figure 1.
2 Measured @ 1.0 MHz and applied reverse voltage of 4.0 VDC.
3 Thermal resistance from junction to ambient and from junction to lead P.C.B. mounted on 0.2 ˝ x 0.2 ˝ (5.0 mm x 5.0 mm) copper pad areas.
Thermal Characteristics (@ TA = 25 °C Unless Otherwise Noted)
Parameter
Operating Temperature Range
Storage Temperature Range
Symbol
CD214B-F250~F2600
Unit
TJ
-55 to +125
°C
TSTG
-55 to +150
°C
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
CD214B-F250~F2600 Surface Mount Fast Response Rectifiers
Product Dimensions
Recommended Pad Layout
A
This is an RoHS compliant product. It is a molded plastic package.
A cathode band indicates the polarity. The package weighs approximately 0.064 g. The package and dimensions are shown below.
A
B
B
C
DIMENSIONS:
MM
(INCHES)
C
Dimension
SMA (DO-214AC)
A
2.90
(0.114)
B
3.00
(0.118)
C
2.30
(0.091)
How To Order
CD 214B - F 2 50
D
H
G
E
F
Dimensions
A
4.06 - 4.57
(0.167 - 0.187)
B
3.30 - 3.94
(0.130 - 0.150)
C
1.96 - 2.21
(0.075 - 0.087)
D
2.01 - 2.62
(0.079 - 0.096)
E
0.76 - 1.52
(0.039 - 0.055)
F
5.21 - 5.59
(0.197 - 0.236)
G
0.05 - 0.20
(0.00196 - 0.00787)
H
0.15 - 0.31
(0.006 - 0.016)
DIMENSIONS:
Common Code
Chip Diode
Package
• 214B = SMB/DO-214AA
Model
F = Fast Response Rectifiers
Forward Current I(AV)
2=2A
Reverse Voltage
50 = 50 V
100 = 100 V
150 = 150 V
200 = 200 V
400 = 400 V
600 = 600 V
MM
(INCHES)
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
CD214B-F250~F2600 Surface Mount Fast Response Rectifiers
Rating and Characteristic Curves
Forward Current Derating Curve
Non-Repetitive Surge Current
Peak Forward Surge Current (Amps)
Average Forward Current (Amps)
2.00
1.50
1.25
1.00
0.75
0.50
Single Phase Half Wave 60 Hz
Resistive or Inductive Load
0.25
0
25
50
75
100
125
150
100
80
60
40
Pulse Width 8.3 ms
Single Half Sine-Wave
(JEDEC Method)
20
0
175
1
10
Lead Temperature (°C)
Forward Characteristics
Reverse Characteristics
100
Instantaneous Reverse Leakage Current (mA)
10
Instantaneous Forward Current (Amps)
100
Number of Cycles at 60 Hz
1.0
0.1
Pulsewidth: 300 µs
1% Duty Cycle
TJ = 150 °C
10
TJ = 125 °C
1.0
TJ = 25 °C
0.1
.01
0.4
0.6
0.8
1.0
1.2
1.4
Instantaneous Forward Voltage (Volts)
1.6
0
20
40
60
80
100
Percent of Rated Peak Reverse Voltage (%)
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
110
CD214B-F250~F2600 Surface Mount Fast Response Rectifiers
Packaging Information
The surface mount product is packaged in an 8 mm x 4 mm tape and reel format per EIA-481 standard.
P
0
P
1
d
T
E
Index Hole
120 °
F
D2
W
B
D1 D
P
A
Trailer
C
Device
Leader
....... .......
....... .......
.......
....... ....... .......
End
W1
Start
DIMENSIONS:
10 pitches (min.)
10 pitches (min.)
MM
(INCHES)
Direction of Feed
Item
Symbol
Carrier Width
A
Carrier Length
B
Carrier Depth
C
Sprocket Hole
d
Reel Outside Diameter
D
Reel Inner Diameter
D1
Feed Hole Diameter
D2
Sprocket Hole Position
E
Punch Hole Position
F
Punch Hole Pitch
P
Sprocket Hole Pitch
P0
Embossment Center
P1
Overall Tape Thickness
T
Tape Width
W
Reel Width
W1
Quantity per Reel
—
DO-214AA (SMB)
1.90 ± 0.10
(0.075 ± 0.004)
4.30 ± 0.10
(0.169 ± 0.004)
1.80 ± 0.10
(0.071 ± 0.004)
1.55 ± 0.05
(0.061 ± 0.002)
178
(7.008)
80.0
MIN.
(3.150)
13.0 ± 0.20
(0.512 ± 0.008)
1.75 ± 0.10
(0.069 ± 0.004)
3.50 ± 0.05
(0.138 ± 0.002)
4.00 ± 0.10
(0.157 ± 0.004)
4.00 ± 0.10
(0.157 ± 0.004)
2.00 ± 0.05
(0.079 ± 0.002)
0.20 ± 0.10
(0.008 ± 0.004)
8.00 ± 0.20
(0.315 ± 0.008)
13.5
MIN.
(0.531)
REV. 09/15
3,000
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
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