CAY10-J4

MATERIAL DECLARATION SHEET
Material Number
CAY10-J4 (LF)
Product Line
Chip Resistor Array
Compliance Date
2012/7/18
RoHS Compliant
YES
MSL
1
No.
Construction
Element(subpart)
Homogeneous
Material
Material weight [g]
1
Ceramic Substrate
Ceramic
0.002381686493
2
Conductor Layer
Other
0.000076837386
3
Resistive Element
Other
0.000064031155
4
Over-Coating
Paint
0.000030516976
5
Marking
Ink
0.000003269676
6
End Terminal
Metal
0.000002452257
7
8
Ni Plating
Tin Plating
Metal
Metal
Total weight
0.000087736306
0.000078199751
0.00272473
This Document was updated on:
Homogeneous
Material\
Substances
Aluminum
dioxide
Silicon dioxide
if applicable
Materials
Mass %
Material Mass
% of total unit
wt.
1344-28-1
96%
83.91%
14808-60-7
4%
3.50%
Silver
7440-22-4
95%
2.68%
Glass
Ruthenium
dioxide
Silver
Palladium
Lead oxide
Epoxy
65997-18-4
5%
0.14%
12036-10-1
25%
0.59%
7440-22-4
7440-05-3
1317-36-8
25068-38-6
40%
15%
20%
100%
0.94%
0.35%
0.47%
1.12%
2.35%
Epoxy
Nickel
Chromium
Nickel
Tin
25068-38-6
7440-02-0
7440-47-3
7440-02-0
7440-31-5
100%
80%
20%
100%
100%
0.12%
0.07%
0.02%
3.22%
2.87%
0.12%
CAS
Subpart
mass of
total wt. (%)
87.41%
2.82%
1.12%
0.09%
3.22%
2.87%
2012/7/23
Important remarks: Resistive Element contains the Lead (Pb) which can be referred to RoHS Exemption 7(c)-I
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