05-08-1991

BGA Package
24-Lead (22mm × 6.25mm × 2.06mm)
(Reference LTC DWG# 05-08-1991 Rev Ø)
A
aaa Z
E
Y
Z
X
SEE NOTES
DETAIL A
A2
SEE NOTES
6
5
4
3
2
7
1
PIN 1
3
A
PIN “A1”
CORNER
4
B
b
A1
C
ccc Z
D
E
F
b1
MOLD
CAP
G
SUBSTRATE
J
K
Z
// bbb Z
H2
D
H
H1
DETAIL B
L
F
M
N
Øb (24 PLACES)
P
ddd M Z X Y
eee M Z
R
S
T
U
V
DETAIL A
W
e
X
aaa Z
e
b
G
DETAIL B
PACKAGE SIDE VIEW
PACKAGE BOTTOM VIEW
2.50
1.50
0.00
0.50
0.50
2.20
1.50
2.50
2.80
PACKAGE TOP VIEW
0.60 ±0.025 Ø 24x
10.375
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
9.375
2. ALL DIMENSIONS ARE IN MILLIMETERS
DIMENSIONS
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
H1
H2
aaa
bbb
ccc
ddd
eee
0.00
9.375
10.375
SUGGESTED PCB LAYOUT
TOP VIEW
10.075
10.675
MIN
1.81
0.40
1.41
0.55
0.45
0.46
0.95
NOM
2.06
0.50
1.56
0.60
0.50
22.0
6.25
1.0
20.75
5.0
0.56
1.00
MAX
2.31
0.60
1.71
0.65
0.55
0.66
1.05
0.15
0.10
0.15
0.15
0.08
TOTAL NUMBER OF BALLS: 24
NOTES
3
BALL DESIGNATION PER JESD MS-028 AND JEP95
4
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu
7
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
LTMXXXXXX
µModule
PACKAGE IN TRAY LOADING ORIENTATION
BGA 24 1014 REV Ø
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