05-08-1997

BGA Package
80-Lead (11.25mm × 9mm × 3.32mm)
(Reference LTC DWG # 05-08-1997 Rev Ø)
A
Z
DETAIL A
8
A2
aaa Z
7
6
5
4
3
2
7
PIN 1
A1
PIN “A1”
CORNER
SEE NOTES
1
A
ccc Z
b
B
4
C
D
b1
MOLD
CAP
E
D
F
SUBSTRATE
G
Z
// bbb Z
F
H1
H2
DETAIL B
H
J
e
Øb (80 PLACES)
K
ddd M Z X Y
eee M Z
aaa Z
e
b
X
Y
E
DETAIL B
PACKAGE SIDE VIEW
PACKAGE TOP VIEW
SEE NOTES
G
3
PACKAGE BOTTOM VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
3.5
2.5
1.5
0.000
0.5
0.5
1.5
2.5
3.5
2. ALL DIMENSIONS ARE IN MILLIMETERS
DETAIL A
DIMENSIONS
4.5
0.50 ±0.025 Ø 80x
3.5
2.5
1.5
0.5
0.000
0.5
1.5
2.5
3.5
4.5
SUGGESTED PCB LAYOUT
TOP VIEW
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
H1
H2
aaa
bbb
ccc
ddd
eee
MIN
3.12
0.40
2.72
0.50
0.47
0.27
2.45
NOM
3.32
0.50
2.82
0.60
0.50
11.25
9.00
1.00
9.00
7.00
0.32
2.50
MAX
3.52
0.60
2.92
0.70
0.53
0.37
2.55
0.15
0.10
0.20
0.25
0.10
TOTAL NUMBER OF BALLS: 80
3
BALL DESIGNATION PER JEP95
4
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
NOTES
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu
7
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
LTMXXXXXX
µModule
PACKAGE IN TRAY LOADING ORIENTATION
BGA 80 0215 REV Ø
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