05-08-1670

BGA Package
186-Lead (15mm × 15mm × 3.32mm)
(Reference LTC DWG# 05-08-1670 Rev Ø)
Z
A
aaa Z
E
Y
X
A2
A1
SEE NOTES
DETAIL A
SEE NOTES
14
13
12
11
10
9
8
7
6
5
4
3
2
7
1
PIN 1
3
ccc Z
A
B
PIN “A1”
CORNER
C
4
b1
MOLD
CAP
D
E
SUBSTRATE
G
F
Z
// bbb Z
D
F
H1
H2
H
DETAIL B
J
e
K
Øb (186 PLACES)
L
ddd M Z X Y
eee M Z
M
N
P
aaa Z
e
DETAIL A
DETAIL B
PACKAGE SIDE VIEW
6.50
5.50
4.50
3.50
2.50
1.50
0.50
0.50
1.50
2.50
3.50
4.50
PACKAGE BOTTOM VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
0.00
6.25
5.50
6.75
6.50
b
G
PACKAGE TOP VIEW
6.50
5.50
4.50
0.50 ±0.025 Ø 186x
3.50
2.50
1.50
0.50
0.50
0.00
1.50
2.50
3.50
4.50
5.50
6.50
SUGGESTED PCB LAYOUT
TOP VIEW
2. ALL DIMENSIONS ARE IN MILLIMETERS
DIMENSIONS
6.25
6.75
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
H1
H2
aaa
bbb
ccc
ddd
eee
MIN
3.12
0.40
2.72
0.50
0.47
0.27
2.45
NOM
3.32
0.50
2.82
0.60
0.50
15.0
15.0
1.0
13.0
13.0
0.32
2.50
MAX
3.52
0.60
2.92
0.70
0.53
0.37
2.55
0.15
0.10
0.20
0.25
0.10
TOTAL NUMBER OF BALLS: 186
NOTES
3
BALL DESIGNATION PER JEP95
4
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu
7
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
LTMXXXXXX
µModule
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
BGA 186 0215 REV Ø
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