05-08-1999

BGA Package
48-Lead (9mm × 6.25mm × 3.32mm)
(Reference LTC DWG # 05-08-1999 Rev Ø)
A1
A
ccc Z
aaa Z
Z
SEE NOTES
DETAIL A
6
A2
5
4
3
2
7
1
A
PIN “A1”
CORNER
B
b
b1
MOLD
CAP
4
C
SUBSTRATE
D
D
H1
H2
// bbb Z
PIN 1
F
E
F
DETAIL B
G
e
H
Øb (48 PLACES)
X
aaa Z
b
ddd M Z X Y
eee M Z
Y
E
SEE NOTES
G
DETAIL B
PACKAGE SIDE VIEW
PACKAGE TOP VIEW
e
3
PACKAGE BOTTOM VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS
2.5
1.5
DIMENSIONS
0.5
0.5
1.5
2.5
0.000
DETAIL A
3.5
0.50 ±0.025 Ø 48x
2.5
1.5
0.5
0.000
0.5
1.5
2.5
3.5
SUGGESTED PCB LAYOUT
TOP VIEW
SYMBOL
A
A1
A2
b
b1
D
E
e
F
G
H1
H2
aaa
bbb
ccc
ddd
eee
MIN
3.12
0.40
2.72
0.50
0.47
0.27
2.45
NOM
3.32
0.50
2.82
0.60
0.50
9.00
6.25
1.00
7.00
5.00
0.32
2.50
MAX
3.52
0.60
2.92
0.70
0.53
0.37
2.55
0.15
0.10
0.20
0.25
0.10
TOTAL NUMBER OF BALLS: 48
NOTES
3
BALL DESIGNATION PER JEP95
4
DETAILS OF PIN #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PIN #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. SOLDER BALL COMPOSITION IS 96.5% Sn/3.0% Ag/0.5% Cu
7
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
LTMXXXXXX
µModule
PACKAGE IN TRAY LOADING ORIENTATION
BGA 48 0215 REV Ø
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