CD0402-TxxC TVS Diode Array Series

PL
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Features
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*R
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Applications
Lead free as standard
RoHS compliant*
Protects 1 line
Bidirectional configuration
ESD protection >25k V
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Cell phones
PDAs and notebooks
Digital cameras
MP3 players and GPS
CD0402-TxxC – TVS Diode Array Series
General Information
The markets of portable communications, computing and video equipment are
challenging the semiconductor industry to develop increasingly smaller electronic
components.
Bourns offers Transient Voltage Suppressor Array diodes for surge and ESD
protection applications, in 0402 chip package size format. The Transient Voltage
Supressor Array series offers a choice of voltage types ranging from 3 V to 36 V in a
bidirectional configuration. Bourns® Chip Diodes conform to JEDEC standards, are
easy to handle on standard pick and place equipment and their flat configuration
minimizes roll away.
The Bourns® device will meet IEC 61000-4-2 (ESD), IEC 61000-4-4 (EFT) and IEC
61000-4-5 (Surge) requirements.
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Electrical & Thermal Characteristics (@ TA = 25 °C Unless Otherwise Noted)
Parameter
Peak Pulse Power (tp = 8/20 µs)
Operating Temperature
Storage Temperature
1
Symbol
Value
Unit
PPP
250
W
TJ
-55 ˚C to 150 ˚C
˚C
TSTG
-55 ˚C to 150 ˚C
˚C
CD0402-
Parameter
Symbol
T3.3C
T05C
T08C
T12C
T15C
T24C
T36C
Unit
Min. Breakdown Voltage @ 1 mA
VBR
4.0
6.0
8.5
13.3
16.7
26.7
40.0
V
Working Peak Voltage
VWM
3.3
5.0
8.0
12.0
15.0
24.0
36.0
V
Maximum Clamping Voltage @ IP2 = 1 A
VF
7.0
11.0
13.4
19.0
24
43
64
V
Maximum Clamping Voltage
@ 8/20 µs VC @ IPP2
VF
12.5 V
@ 20 A
29.7 V
@9A
35.7 V
@7A
55 V
@5A
84 V
@3A
V
Maximum Leakage Current @ VWM
ID
75
10
4
10
1
1
1
1
µA
Typical Capacitance @ 0 V, 1 MHz
C
150
100
75
50
40
30
25
pF
3
Notes:
1. See Peak Pulse Power vs. Pulse Time.
2. See Pulse Wave Form.
3. Max. Leakage Current <500 µA @ 2.8 V.
4. Max. Leakage Current <500 nA @ 3.3 V.
5. Max. Leakage Current <200 nA @ 5 V.
All devices are bidirectional. Electrical Characteristics apply in both directions.
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
14.7 V 19.2 V
@ 17 A @ 13 A
5
CD0402-TxxC – TVS Diode Array Series
Product Dimensions
Recommended Footprint
This is a 0402 package with lead free 100 % Sn plating on the
bond pads. It weighs approximately 30 mg and has a flammability
rating of UL 94V-0.
A
A
B
C
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B
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B
C
D
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Dimensions (Nominal)
D
E
H
F
I
Dimensions
A
0.69
0.027
B
0.46
0.018
C
0.20
0.008
D
0.46
0.018
DIMENSIONS =
A
0.41 - 0.51
0.016 - 0.020
B
0.81 - 0.91
0.032 - 0.036
C
0.96 - 1.02
0.038 - 0.040
D
0.10
NOM.
0.004
E
0.35
NOM.
0.014
F
G
0.46 - 0.51
0.018 - 0.020
0.20
NOM.
0.008
H
0.076 - 0.127
0.003 - 0.005
I
0.401 - 0.411
0.014 - 0.018
DIMENSIONS =
MILLIMETERS
(INCHES)
How To Order
CD 0402 - T 05 C
Common Code
Chip Diode
Package
• 0402 = 0402 Chip Package
Model
T = Transient Voltage Supressor
Working Peak Reverse Voltage
3.3 = 3.3 VRWM (Volts)
05 = 5 VRWM (Volts)
08 = 8 VRWM (Volts)
12 = 12 VRWM (Volts)
15 = 15 VRWM (Volts)
24 = 24 VRWM (Volts)
36 = 36 VRWM (Volts)
Suffix
C = Bidirectional Diode
MILLIMETERS
(INCHES)
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
CD0402-TxxC – TVS Diode Array Series
Performance Graphs
Peak Pulse Power vs Pulse Time
Pulse Wave Form
120
1,000
IPP – Peak Pulse Current (% of IPP)
PPP – Peak Pulse Current (W)
10,000
250 W, 8/20 µs Waveform
100
10
0.01
1
10
80
et
60
40
td = t|IPP/2
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100
1,000
20
0
10,000
0
td – Pulse Duration (µs)
Power Derating Curve
5
10
15
20
30
35
Peak Pulse Power
8/20 µs
5 Volts per Division
80
60
40
20
Average Power
0
0
25
50
75
100
25
15
5
125
150
-5
-90.000 ns
TL – Lead Temperature (°C)
10.000 ns
ESD Test Pulse - 25 kilovolt, 1/30 ns (waveshape)
Typical Clamping Voltage vs. Peak Pulse Current
14
VC - Clamping Voltage - Volts
25
t – Time (µs)
Overshoot & Clamping Voltage
100
% of Rated Power
Test Waveform Parameters
tt = 8 µs
td = 20 µs
tt
100
12
10
8
6
4
2
0
0
5
10
15
IPP – Peak Pulse Current - Amps
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
20
110.000
CD0402-TxxC – TVS Diode Array Series
Block Diagram
Typical Part Marking
There is no part marking on the back side of the devices. The part
number for the device is located on the Tape and Reel label.
Packaging
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The surface mount product is packaged in an 8 mm x 4 mm Tape and Reel format per EIA-481 standard.
TOP SIDE VIEW
(INTO COMPONENT POCKET)
DIMENSIONS =
0.3 ± 0.05
(.01 ± .002)
0.3
MAX.
(0.01)
0.76 ± 0.1
(.03 ± .004)
(INCHES)
4.0 ± 0.1
(.16 ± .004)
1.5 ± 0.1/-0
(.06 ± .004/-0)
DIA.
2.0 ± 0.05
(.08 ± .002)
R
MILLIMETERS
1.52 ± 0.1
(.06 ± .004)
1.18 ± 0.1
(.05 ± .004)
4.0 ± 0.3
(.16 ± .01)
ORIENTATION
OF COMPONENT
IN POCKET
1.75 ± 0.1
(.07 ± .004)
8.0 ± 0.3
(.31 ± .01)
3.5 ± 0.3
(.14 ± .01)
R 0.25 TYP.
(0.010)
BACKSIDE FACING UP
Reliable Electronic Solutions
Asia-Pacific:
Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
Europe:
Tel: +41-41 768 5555 • Fax: +41-41 768 5510
The Americas:
Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
REV. 02/06
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
COPYRIGHT© 2005, BOURNS, INC. LITHO IN U.S.A., IPA0524 10/05
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