SX(T)6A-3-5SA

PL
IA
NT
Features
CO
M
■
*R
oH
S
■
■
■
■
■
SIP (Single In-line Package)
Output voltage programmable from
0.75 Vdc to 3.6 Vdc via external resistor
6 A output current
Up to 96 % efficiency
Small size, low profile
Cost-efficient
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■
■
■
■
Low output ripple and noise
High reliability
Remote on/off
Output overcurrent protection
(non-latching)
Sequencing function
SXT6A-3-5SA SIP Non-Isolated Power Module
Description
Bourns® SXT6A-3-5SA is a non-isolated DC-DC converter offering designers a cost and space-efficient solution with standard features
such as sequencing, remote on/off, precisely regulated programmable output voltage and overcurrent protection.
Specifications
Parameter
Min.
Nom.
Max.
Units
Notes
5.5
Vdc
Adc
Vin (min) = Vo + 0.5 V, Vo > 1.9 V
INPUT
Voltage
2.4
Current
Remote ON/OFF:
Low or Open =
High =
6.0
E
T
E
L
O
S
B
O
Standard
On
Off
OUTPUT
Voltage Adjustment Range
Current
Voltage Setpoint Accuracy
Line Regulation
Load Regulation
Temperature Regulation
-P Option
Off
On
2.4
0.4
Vin
Vdc
Vdc
0.75
3.63
0.0
6.0
Vdc
Adc
-2.0
2.0
0.3
0.4
10 µA max.
1 mA max.
% Vo,set
% Vo,set
% Vo,set
% Vo,set
0.4
Ripple (pk-pk) (20 MHz Bandwidth)
40
50
mVpk-pk
1 µF ceramic//10 µF tantalum capacitors
Ripple (rms)
10
15
mVrms
1 µF ceramic//10 µF tantalum capacitors
1 µF ceramic//10 µF tantalum capacitors
Dynamic Load Response:
50 % to 100 % Load or 100 % to 50 % Load;
(∆i/∆t = 2.5 A/µs; 25 °C)
130
25
mV
µs
50 % to 100 % Load or 100 % to 50 % Load;
(∆i/∆t = 2.5 A/µs; 25 °C)
50
50
mV
µs
2 x 150 µF polymer Capacitors
GENERAL
MTBF
10,000
kHrs
Operating Temperature
-40
+85
°C
Storage Temperature
-55
+125
°C
Switching Frequency
300
Efficiency
81.0
%
Vo,set = 0.75 Vdc
87.0
%
Vo,set = 1.2 Vdc
89.0
%
Vo,set = 1.5 Vdc
90.0
%
Vo,set = 1.8 Vdc
93.0
%
Vo,set = 2.5 Vdc
95.0
%
Vo,set = 3.3 Vdc
(Vin = 5.0 Vdc, TA= 25 °C, Full Load)
kHz
Applications
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■
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Intermediate Bus architecture
Distributed power applications
Workstations and servers
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■
Telecom equipment
Enterprise networks including LANs/WANs
Latest generation ICs (DSP, FPGA, ASIC) and microprocessor powered applications
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
Output Voltage Programming
Via external trim resistor between Trim and GND:
Rtrim =
[
Via application of external voltage between Trim and GND:
]
21.07
- 5.11 kΩ
Vo - 0.7525
Vtrim = (0.7 - 0.1698 x {Vo - 0.7525})
SXT6A-3-5SA SIP Non-Isolated Power Module
Product Dimensions
Recommended Hole Pattern
BACK VIEW OF BOARD
COMPONENT SIDE FOOTPRINT
25.4
(1.0000)
25.4
(1.0000)
OUTLINE AREA
12.70
(0.5000)
12.32
(0.4850)
5
4
A
3
2
1
5 PINS
Die-Tech 315-0969-00
0.38
0.64
X
(0.025) (0.015)
5.8
(0.23)
6.6
(0.26)
2.54
(0.100)
2.54
(0.100)
E
T
E
L
O
S
B
O
12.7
(0.500)
7.6
(0.30)
15.24
(0.600)
2.54
(0.100)
2.54
(0.100)
1.09
(0.043)
PLATED
THROUGH-HOLE
1.63
(0.064)
PAD SIZE
BOTH SIDES
17.78
(0.700)
20.32
(0.800)
12.7
(0.500)
15.24
(0.600)
17.78
(0.700)
20.32
(0.800)
Pinout Detail
PIN
1
2
3
A
4
5
SIDE VIEW
6.53
(0.257)
MAX.
DIMENSIONS:
MM
(INCHES)
6.26
(0.246)
REF.
FUNCTION
VOUT
TRIM
GND
SEQ
VIN
ON/OFF
How to Order
L1 (REF.)
S X T 6A - 3 - 5 S A (-P)
TOLERANCES:
Configuration
• S = SIP
0.5
(0.02)
0.25
DECIMAL .XX ±
(0.010)
DECIMAL .X ±
Internal Identifier
Identifies Sequencing Pin Function
Output Current (Amps)
Input Voltage (V)
Outputs
• S = Single
Output Voltage (V)*
• A = Adjustable
0.64
(0.025)
5.62
(0.2210)
Optional Positive On/Off Logic
Fixed output voltage parts and optional features available; contact factory.
Derating Output Current vs. Local Ambient Temp & Airflow
(Vin = 5.0 Vdc, Vo = 3.3 Vdc)
7
Output Current (A)
6
5
1.0 m/s
(200 LFM)
NC (0 LFM)
0.5 m/s
(100 LFM)
4
3
2
1
0
25
Asia-Pacific:
Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
Europe:
Tel: +41-41 768 5555 • Fax: +41-41 768 5510
The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
REV. B 08/06
30
35
40
45
50
55
60
65
70
Ambient Temperature (°C)
75
80
85
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.