AWF0000CE7

Chip RC Networks
Chip RC Networks
Type:
Discontinued
Type:
EZACT
EZADT
EZAST/SS
EZANT
GND
EZASTB/SSB
GND
GND
GND
■ Features
Smallest SMD R/C networks
● 4 popular noise reduction circuits made
EZACT
: 2.0 mm ҂ 1.2 mm ҂ 0.6 mm, 0.5 mm pitch (Flat terminal type)
EZADT
: 3.2 mm ҂ 1.6 mm ҂ 0.65 mm, 0.635 mm pitch (Concave terminal type)
EZAST/SS
: 4.0 mm ҂ 2.1 mm ҂ 0.65 mm, 0.8 mm pitch (Concave terminal type)
EZASTB/SSB : 4.0 mm ҂ 2.1 mm ҂ 0.65 mm, 0.65 mm pitch (Convex terminal type)
EZANT
: 6.4 mm ҂ 3.1 mm ҂ 0.80 mm, 1.27 mm pitch (Concave terminal type)
● Takes up less space than discrete chip resistor & chip capacitor
EZACT:25 % of 0402 inches (1.0 mm ҂ 0.5 mm) chips placing area
EZADT:50 % of 0402 inches (1.0 mm ҂ 0.5 mm) chips placing area
EZAST/SS, EZASTB/SSB:70 % of 0402 inches (1.0 mm ҂ 0.5 mm) chips placing area
EZANT:55 % of 0805 inches (2.0 mm ҂ 1.2 mm) chips placing area
●RoHS compliant
<Effect of high density placing, PWB space saving>
RC Low pass filter
AC Terminator
I/O
I/O
I/O
I/O
Chip RC Network
(EZACT, EZADT, EZAST/SS, EZANT)
I/O
I/O
I/O
I/O
Chip RC Network
(EZACT, EZADT, EZAST/SS, EZANT)
Discrete Chips
I/O
I/O
Discrete Chips
I/O
I/O
Chip RC Network
(EZASTB/SSB)
Chip RC Network
(EZASTB/SSB)
■ Recommended Applications
●
●
●
●
Digital equipment such as PCs, printers, HDD, PCMCIA cards, PDAs, and word processors
Communication equipment, digital cordless phones, automobile phones, GSM, PHS, DECT
Digital audio and video equipment
Electronic musical instruments, and other digital devices
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
– 261 –
00 Sep. 2010
Discontinued
Chip RC Networks
■ Explanation of Part Numbers
● EZACT • EZADT • EZAST • EZANT (R/C Standard Combination)
1
2
3
4
5
6
7
8
9
10
11
E
Z
A
S
T
3
3
A
A
A
J
R/C Standard Combination
Dimension and
Circuit Configuration
Common Code
Thick Film Noise
Suppression and
Filtering
Components
CT
DT
ST
NT
2.0 mm
҂1.2 mm
3.2 mm
҂1.6 mm
4.0 mm
҂2.1 mm
6.4 mm
҂3.1 mm
Chip RC
Networks
0
1
2
3
4
5
6
Design
Configuration
Capacitance Value
Configuration ✽2
10 pF
0
22 pF
1
47 pF
2
100 pF
3
220 pF
4
470 pF
5
1000 pF
6
Resistance Value
Configuration ✽1
10 액
22 액
47 액
100 액
220 액
470 액
1k액
12
Resistance Suffix for Special
Tolerance
Requirement
AAA
±5 %
J
Standard
✽1 22 액 to 1 k액 available for EZADT, EZAST, and EZANT
✽2 10 pF and 22 pF available for EZACT. 22 pF to 100 pF available for EZAST, EZADT. 220 pF to 1000 pF available for EZANT.
● EZACT • EZADT • EZASS • EZANT (R/C Except the standard Combination)
1
2
3
4
5
6
7
8
9
10
11
E
Z
A
S
S
7
0
1
Y
A
J
Thick Film Noise
Suppression and
Filtering
Components
Design Number
Dimension and
Circuit Configuration
Common Code
2.0 mm
҂1.2 mm
3.2 mm
҂1.6 mm
4.0 mm
҂2.1 mm
6.4 mm
҂3.1 mm
CT
DT
SS
NT
Chip RC
Networks
Resistance Suffix for Special
Tolerance
Requirement
Resistance Value : 10 액 to 100 k액
Capacitance Value : 10 pF to 33 pF
In above-mentioned range, it is possible to
choose optional R/C.
Resistance Value : 10 액 to 100 k액
Capacitance Value : 10 pF to 100 pF
In above-mentioned range, it is possible to
choose optional R/C.
Resistance Value : 10 액 to 100 k액
Capacitance Value : 10 pF to 180 pF
In above-mentioned range, it is possible to
choose optional R/C.
Resistance Value : 10 액 to 100 k액
Capacitance Value : 220 pF to 1000 pF
In above-mentioned range, it is possible to
choose optional R/C.
CT
DT
SS
NT
12
J
±5 %
12
● EZASTB (R/C Standard Combination)
1
2
3
4
5
6
7
8
9
10
11
E
Z
A
S
T
B
3
3
A
A
J
Dimension and
Circuit Configuration
Common Code
Thick Film Noise
Suppression and
Filtering
Components
STB
Convex
4.0 mm terminal type
҂2.1 mm Chip RC
Networks
1
2
3
4
5
6
R/C Standard Combination
Resistance Value
Configuration
22 액
47 액
100 액
220 액
470 액
1k액
Design
Configuration
Capacitance Value
Configuration
1
22 pF
2
47 pF
3
100 pF
AA
Resistance Suffix for Special
Tolerance
Requirement
±5 %
J
Standard
● EZASSB (R/C Except the standard Combination)
1
2
3
4
5
6
7
8
9
10
11
E
Z
A
S
S
B
7
0
1
A
J
Thick Film Noise
Suppression and
Filtering
Components
Design Number
Dimension and
Circuit Configuration
Common Code
SSB
Convex
4.0 mm terminal type
҂2.1 mm Chip RC
Networks
Resistance Value : 10 액 to 100 k액
Capacitance Value : 10 pF to 180 pF
In above-mentioned range, it is possible to
choose optional R/C.
12
Resistance Suffix for Special
Tolerance
Requirement
J
±5 %
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
– 262 –
00 Sep. 2010
Discontinued
Chip RC Networks
■ Construction
EZACT
EZADT
Alumina substrate
Marking
Protective coating
EZAST/SS
Marking
Alumina substrate
Alumina substrate
GND
Electrode
(Outer)
GND
Electrode
(Outer)
GND
Electrode
(Outer)
Electrode
(Outer)
Protective coating
EZANT
Alumina substrate
Electrode
(Outer)
33
Electrode
(Outer)
Protective coating
GND
Electrode
(Outer)
EZASTB/SSB
Marking
Marking
GND
Electrode
(Outer)
GND
Electrode
(Outer)
Protective coating
GND
Electrode
(Outer)
Marking
Electrode
(Outer)
GND
Electrode
(Outer)
Alumina substrate
33
Protective coating
GND
Electrode
(Outer)
Electrode
(Outer)
■ Circuit Configuration
EZACT
10
R1
EZADT • EZAST/SS • EZANT
9
8
7
R2
R3
R4
10
R1
9
8
7
R2
R3
R4
12
C1
2
C2
C3
3
4
5
R1=R2=R3=R4
C1=C2=C3=C4
11
10
R2
R1
6 GND GND 1
GND 1
EZASTB/SSB
9
8
R3
R4
7
6 GND
C1
C4
2
C2
3
C3
4
R1=R2=R3=R4
C1=C2=C3=C4
C4
5
C1
1
GND
2
C2
C3
3
4
5
R1=R2=R3=R4
C1=C2=C3=C4
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
– 263 –
C4
6
GND
00 Sep. 2010
Discontinued
Chip RC Networks
■ Dimensions in mm(not to scale)
EZACT
EZADT
0.33±0.10
1
6
(0.5)
3
4
6
2
3
4
5
0.65 +–0.20
0.10
3.20±0.15
0.55±0.10
2.0±0.1
0.35±0.15
0.25±0.15
0.40±0.15
Size : 0805 inches
Mass (Weight) [1000 pcs.] :4 g
) Reference
0.35±0.10
0.45±0.15
0.30±0.15
0.20±0.15
(
7
1
(0.635)
5
8
(
0.40±0.15
2
9
1.60±0.15
10
7
0.2±0.1
8
0.40±0.15
9
1.25±0.10
10
Size : 1206 inches
Mass (Weight) [1000 pcs.] :11 g
) Reference
EZAST/SS
EZANT
0.5±0.2
2
(0.8)
3
4
0.45±0.20
0.5±0.2
0.4±0.2
0.9±0.2
0.5±0.2
Size : 1608 inches
Mass (Weight) [1000 pcs.] :17 g
) Reference
3
4
5
0.65±0.20
0.80 +–0.20
0.10
6.4±0.2
0.65+–0.20
0.10
0.4±0.2
6
2
4.0±0.2
(
1
(1.27)
5
7
(
) Reference
3.1±0.2
6
8
0.75±0.20
0.55±0.20
33
1
9
0.25±0.20
10
7
0.8±0.2
8
2.1±0.2
9
0.25±0.20
0.5±0.2
10
Size : 2512 inches
Mass (Weight) [1000 pcs.] :55 g
EZASTB/SSB
0.58±0.2 0.4±0.2
0.25±0.15
10
9
8
7
33
(0.65)
1
2
3
4
5
6
4.0±0.2
0.65+–0.20
0.10
0.2+–0.2
0.1
0.35±0.20
0.275+–0.200
0.100
2.2±0.2
11
0.3±0.2
12
(
) Reference
Size : 1608 inches
Mass (Weight) [1000 pcs.] :18 g
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
– 264 –
00 Sep. 2010
Discontinued
Chip RC Networks
■ Ratings
Item
Specification
10 액 to 100 k액
EZAC Standard : 10 액, 22 액, 47 액, 100 액, 220 액, 470 액, 1 k액
EZAD/S/N Standard : 22 액, 47 액, 100 액, 220 액, 470 액, 1 k액
±5 %
±200 ҂ 10–6/°C
EZAC : 0.031 W(<70 °C(1))
EZAD/S/N : 0.063 W(<70 °C(1))
25 V(2)
EZAC : 10 pF to 33 pF
Standard : 10 pF, 22 pF
EZAD : 10 pF to 100 pF
EZAS : 10 pF to 180 pF
Standard : 22 pF, 47 pF, 100 pF
EZAN : 220 pF to 1000 pF
Standard : 220 pF, 470 pF, 1000 pF
+30 %/–20 %
E Characteristic: +20 %/–55 %(–25 to +85 °C)
Less than 3 %(25, 1 kHz(3), 1 Vrms)
EZAC, EZAD : 12 V
EZAS : 25 V
EZAN : 50 V
–25 °C to +85 °C
Resistor
Resistance Values
Resistance Tolerance
Temperature Coefficient of Resistance (T.C.R.)
Rated Power
Limiting Element Voltage
Capacitor
Capacitance Values
(25 °C, 1 kHz(3), 1 Vrms)
Capacitance Tolerance
Capacitance Temperature Characteristics
Dissipation Factor
Rated Voltage
Category Temperature Range
Rated Load (%)
(1) For resistors operated in ambient temperature above 70 °C, rated power shall be derated. (“Power Derating Curve” is shown below)
(2) Rated Voltage for resistor shall be determined from 앀Rated Power҂Resistance Value, or Limiting Element Voltage whichever less.
(3) In measuring at 1 MHz, Capacitance and Dissipation Factor are different.
70 °C
100
Power Derating Curve
For resistors operated in ambient temperatures above
70 °C, power rating shall be derated in accordance
with the figure on the right.
80
60
40
85 °C
20
0
30
20
10
0
10 20 30 40 50 60 70 80 90
Ambient Temperature (°C)
■ Attenuation Characteristics
●EZACT
●EZADT
0
100
–10
–20
100
액
액/
/ 10
Attenuation (dB)
Attenuation (dB)
10
pF
22 p
F
–30
–40
–50
1M
10M
100M
Frequency (Hz)
1G
30
40
10M
100M
Frequency (Hz)
1G
3G
Attenuation (dB)
100
10
100
20
액/
30
액/
22 p
100
F
액/4
7 pF
100
pF
40
10 M
Measurement Circuit
50 액
100 M
Frequency (Hz)
1G
3G
0
10
20
30
40
50
60
70
80
1 k액
1 k액
1M
10M
/ 330
/ 100
pF
0 pF
100M
Frequency (Hz)
1G
EZACT
EZADT
EZAST
EZASTB
EZANT
50 액
촞
Attenuation (dB)
20
100
액/
22 p
100
F
액/4
액/
100 7 pF
pF
●EZANT
0
~
100
50
1M
3G
●EZST • EZASTB
50
1M
0
10
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
– 265 –
00 Sep. 2010
Discontinued
Chip RC Networks
■ Packaging Methods (Taping)
● Standard Quantity
Type
Kind of Taping
EZACT
Pitch (P1)
Quantity
Punched Carrier Taping
EZADT
5000 pcs./reel
4 mm
EZAST/SS
Embossed Carrier Taping
EZASTB/SSB
4000 pcs./reel
EZANT
● Carrier Tape
(Unit : mm)
P1
P2
P0
B
W
F
E
φD0
A
T
T
φD1 (Only Emboss)
Type
EZACT
A
1.55±0.15
B
2.30±0.20
EZADT
2.00±0.20
3.60±0.20
2.50±0.20
4.40±0.20
±0.20
±0.20
EZAST/SS
EZASTB/SSB
EZANT
3.50
W
F
E
8.00±0.20
3.50±0.05
1.75±0.10
±0.20
±0.20
P1
4.00±0.10
±0.30
12.00
5.50
1.75
P2
φD0
P0
2.00±0.05
4.00±0.10
1.50+0.10
−0
T
φD1
0.85±0.05
—
1.15±0.20
1.50+0.10
−0
±0.20
6.80
1.30
● Taping Reel
(Unit : mm)
Type
EZACT
EZADT
EZAST/SS
EZASTB/SSB
EZANT
180.0+0
–1.5
φN
60+1.0
–0
φC
W1
W2
9.0+1.0
–0
11.4±1.0
13.0+1.0
–0
15.4±1.0
13.0±0.2
φN
φC
φA
W1
φA
W2
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
– 266 –
00 Sep. 2010
Discontinued
Chip RC Networks
■ Recommended Land Pattern Design
●EZACT
bg
P
Land pattern
d
a
e
Dimensions
(mm)
c
h
●EZADT
Dimensions
(mm)
b
P
a
b
c
d
0.75
0.25
1.70
0.35
e
h
g
P
1.85
2.60
0.25
0.50
b
c
d
0.2 to 0.3
2.6 to 2.8
0.3 to 0.4
g
P
3.6 to 4.2
0.635
b
c
d
0.4
3.1 to 3.3
0.4 to 0.5
e
f1
f2
P
0.8
2.9 to 3.3
4.8 to 5.2
0.8
b
c
d
0.35
0.45
0.3
f2
P
3.8
0.65
b
c
d
0.4 to 0.6
5.6 to 5.8
0.4 to 0.8
g
P
7.6 to 8.0
1.27
Land pattern
a
a
f
d
Dimensions 0.9 to 1.1
(mm)
f
Dimensions 2.0 to 2.6
(mm)
c
g
●EZAST/SS
Solder resistant
f2
c
Land pattern
GND
e
a
f1
d
a
Dimensions 1.2 to 1.4
(mm)
Dimensions
(mm)
b
P
●EZASTB/SSB
f2
Land pattern
a
f1
a
Dimensions 1.4 to 1.6
(mm)
GND
f1
●EZANT
c d b
P
b
P
Dimensions 2.7 to 3.5
(mm)
Land pattern
a
f
d
a
Dimensions 2.3 to 2.5
(mm)
f
c
g
Dimensions 4.3 to 4.7
(mm)
• Design to make GND pattern as large as possible, because high
frequency noise is removed from GND terminals of chip RC network.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
– 267 –
00 Sep. 2010
Discontinued
Chip RC Networks
■ Recommended Soldering Conditions
Recommendations and precautions are described below.
● Recommended soldering conditions for reflow
·Reflow soldering shall be performed a maximum of
two times.
·Please contact us for additional information when
used in conditions other than those specified.
·Please measure the temperature of the terminals and
study every kind of solder and printed circuit board
for solderability before actual use.
For soldering (Example : Sn/Pb)
Preheating
Main heating
Peak
Temperature
Time
140 °C to 160 °C
60 s to120 s
Above 200 °C
30 s to 40 s
235 ± 5 °C
max. 10 s
For lead-free soldering (Example : Sn/Ag/Cu)
Temperature
Peak
Preheating
Preheating
Main heating
Peak
Heating
Temperature
Time
150 °C to 180 °C
60 s to 120 s
Above 230 °C
30 s to 40 s
max. 260 °C
max. 10 s
This product has circuits on both sides. Therefore, do not use
adhesives because they may impair the products characteristics.
Time
● Flow Soldering
We do not recommend flow soldering to the product, because solder bridging may occur due to the
narrow pitch of the terminals and the characteristics of the product may be badly affected when using
adhesive to affix it to a circuit board.
Safety Precautions
The following are precautions for individual products. Please also refer to the common precautions shown on page 4
of this catalog.
1. Take measures against mechanical stress during and after mounting of Chip RC Networks (hereafter called the RC networks)
so as not to damage their electrodes and protective coatings.
Be careful not to misplace the RC networks on the land patterns. Otherwise, solder bridging may occur.
2. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the RC networks' performance
and/or reliability.
3. Perform sufficient preheating so that the difference of the solder temperature and the RC networks chip surface
temperature becomes 100 °C or less. Maintain the temperature difference within 100 °C during rapid cooling by
immersion into solvent after soldering.
4. When soldering with a soldering iron, never touch the RC networks' bodies with the tip of the soldering iron. When
using a soldering iron with a high temperature tip, finish soldering as quickly as possible (within three seconds at
350 °C max.).
5. As the amount of applied solder becomes larger, the mechanical stress applied to the RC networks increases, causing
problems such as cracks and faulty characteristics. Avoid applying an excessive amounts of solder.
6. Do not apply shock to the RC networks or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the RC networks'
protective coatings and bodies may be chipped, affecting their performance.
7. Avoid excessive bending of printed circuit boards in order to protect the RC networks from abnormal stress.
8. The static capacitance may decrease by a few percent from the time of shipment due to the characteristics peculiar to
dielectric materials having a high dielectric constant.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
– 268 –
00 Sep. 2010
Safety Precautions (Common precautions for Fixed Resistors, Noise Suppression Device, ESD Suppressor, fuses, and MR Sensors)
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifications with us in advance. The design and specifications in this catalog are subject
to change without prior notice.
• Do not use the products beyond the specifications described in this catalog.
• This catalog explains the quality and performance of the products as individual components. Before use, check
and evaluate their operations when installed in your products.
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment
where a defect in these products may cause the loss of human life or other significant damage, such as damage to
vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating
appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.
✽ Systems equipped with a protection circuit and a protection device
✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault
(1) Precautions for use
• These products are designed and manufactured for general and standard use in general electronic equipment
(e.g. AV equipment, home electric appliances, office equipment, information and communication equipment)
• These products are not intended for use in the following special conditions. Before using the products,
carefully check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent
2. In direct sunlight, outdoors, or in dust
3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
4. Electric Static Discharge (ESD) Environment (except ESD Suppressors)
These components are sensitive to static electricity and can be damaged under static shock (ESD).
Please take measures to avoid any of these environments.
Smaller components are more sensitive to ESD environment.
5. Electromagnetic Environment
Avoid any environment where strong electromagnetic waves exist.
6. In an environment where these products cause dew condensation
7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with
resin or other materials
• These products generate Joule heat when energized. Carefully position these products so that their heat will
not affect the other components (except Thermal Cutoffs).
• Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating components. Do not mount or place heat-generating components
or inflammables, such as vinyl-coated wires, near these products (except Thermal Cutoffs).
• Note that non-cleaning solder, halogen-based highly active fl ux, or water-soluble flux may deteriorate the
performance or reliability of the products.
• Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance
or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water
residues. Otherwise, the insulation performance may be deteriorated.
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of arrival
at your company, provided that they remain packed as they were when delivered and stored at a temperature
of 5 °C to 35 °C and a relative humidity of 45 % to 85 %.
The performance of EMI Filters is guaranteed for 6 months or a year after our delivery, provided that they are stored
at a temperature of -5 °C to +40 °C and a relative humidity of 40 % to 60 %. Check the guarantee period in the
specifications. The performance of Thermal Cutoffs is guaranteed for a year after our delivery, provided that they are
stored at a temperature of -10 °C to +40 °C and a relative humidity of 30 % to 75 %.
Even within the above guarantee periods, do not store these products in the following conditions. Otherwise,
their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping
materials) may be deformed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
2. In direct sunlight
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
00 Sep. 2010
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