AWF0000CE6

Chip 3-Terminal Capacitor Array
Chip 3-Terminal Capacitor Array
Type:
Discontinued
EZASC
EZANC
GND
GND
■ Features
1.
●
●
2.
●
●
3.
●
●
Suitable for EMI suppression filtering
The low residual inductance at high frequency range provides effective reduction of noise
Equivalent noise reduction to the EMI filters with low cost design
Compact design for high density PWB assembly
EZASC : 4.0 mm ҂ 2.1 mm ҂ 0.65 mm, 0.8 mm pitch
EZANC : 6.4 mm ҂ 3.1 mm ҂ 0.75 mm, 1.27 mm pitch
Flat and square packages suitable for high speed automatic placement machine
Superior mountability with concave terminals
Firm solder joint (2 times that of convex terminal type)
Self-aligning placement during reflow soldering
● RoHS compliant
<Effect of high density placing, PWB space saving>
Digital cordless phone
(4 line mounting)
RF Circuit
(EZA SC)
I/O
I/O
I/O
I/O
Digital Control Circuit
3-Terminal Capacitors or EMI Filters
EZASC: 0.8 mm pitch
EZANC: 1.27 mm pitch
Prevent high frequency harmonic
noise to RF circuits
■ Recommended Applications
●
●
●
●
Digital equipment such as PCs, printers, HDD, PCMCIA cards, PDAs, and word processors
Communication equipment, digital cordless phones, automobile phones, GSM, PHS, DECT
Digital audio and video equipment
Electronic musical instruments, and other digital devices
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Chip 3-Terminal Capacitor Array
Discontinued
■ Explanation of Part Number
1
2
3
4
5
6
7
8
9
10
E
Z
A
N
C
E
1
0
1
M
Dimensions and
Temperature Capacitance Value
Circuit Configuration Characteristics
Product Code
Thick Film Noise
Suppression and
Filtering
Components
4.0 mm
҂2.1 mm Four 3-Terminal
Capacitors
6.4 mm
NC
҂3.1 mm
+20 %/–55 %
E (–25°C to +85 °C)
SC
■ Construction
Capacitance Suffix for Special
Tolerance
Requirement
The first two digits are significant
figures of capacitance value,
and the third one denotes the
number of zeros following
ex. 101촞100 pF
M
±20 %
When less
than 22 pF
+30 %
–20 %
■ Circuit Configuration
Protective coating
Alumina substrate
10
GND
Electrode
(Outer)
11
CIOI
GND
Electrode
(Outer)
9
8
7
GND 1
6 GND
2
Electrode
(Outer)
3
4
5
■ Dimensions in mm (not to scale)
EZASC
0.4±0.2
+0.1
f 0.3 –0.2
3.1±0.2
CIOI
1.27±0.10
+0.20
0.65 –0.10
Size : 1608 inches
Mass (Weight) [1000 pcs.] : 17 g
0.3±0.2
0.56±0.20
+0.20
0.75 –0.10
0.4±0.2
0.45±0.20
6.4±0.2
0.8±0.2
4.0±0.2
0.4±0.2
0.5±0.2
0.7±0.2
0.4±0.2
0.8±0.2
2.1±0.2
CIOI
0.8±0.1
0.4±0.2
f 0.4+–0.1
0.2
0.5±0.2
0.25±0.20
0.5±0.2
0.25±0.20
EZANC
Size : 2512 inches
Mass (Weight) [1000 pcs.] : 52 g
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Discontinued
Chip 3-Terminal Capacitor Array
■ Ratings
Specification
Item
Capacitance Values
(25 °C, 1 kHz(1), 1 Vrms)
EZASC
EZANC
10 pF to 180 pF
Standard : 22 pF, 47 pF, 100 pF
22 pF, 47 pF, 100 pF, 220 pF, 470 pF
±20% (+30%
–20% in the case of Less than 22 pF)
Capacitance Tolerance
Temperature Characteristic
E Characteristic: +20 %/±55 % (±25 °C to +85 °C)
Less than 2 % (25 °C, 1 kHz(1), 1 Vrms)
Dissipation Factor
Rated Voltage
25 V
Rated Current (2)
Resistance
200 mA
300 mA
Less than 1 액
(3)
Category Temperature Range (Operating Temperature Range)
–25 °C to +85 °C
(1) In measuring at 1 MHz, Capacitance Value and Dissipation Factor are different.
(2) Rated Current between Input terminal and Output terminal.
(3) Resistance value between Input terminal and Output terminal.
■ Attenuation Characteristics
Measurement Circuit
Measurement Circuit
50 액
1 k액
1 k액
EZANC
50 액
2000 pF
MN74HC04
MN74HC04 MN74HC04
촞
~
8 MHz
EZA
SCE470M
Chip 3-Terminal Capacitor Array (EZANC)
Attenuation (dB)
10
10
22
47 0pF
0p
F
20
22
47 pF
pF
F
0p
30
40
80
60
40
20
50
1M
10M
100M
Frequency (Hz)
1G
100
Electric field intensity (dBµV)
Electric field intensity (dBµV)
100
0
100
200
400
600
800
Frequency (MHz)
1000
80
60
40
20
100
200
400
600
Frequency (MHz)
800
1000
3G
✽ Equivalent to EMI filter
■ Packaging Methods (Taping)
● Standard Quantity
Type
EZASC
EZANC
Kind of Taping
Pitch (P1)
Quantity
Embossed Carrier Taping
4 mm
4000 pcs./reel
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Discontinued
● Embossed Carrier Taping
t1
Chip 3-Terminal Capacitor Array
● Taping Reel
T
Compartment
E
Sprocket hole
fD0
F
W
A
fB
B
fC
fD1
t2
P1
P2
P0
Tape running direction
Chip component
fA
Type
Dimensions
(mm)
B
W
F
E
W
P0
EZASC 2.50±0.20 4.40±0.20
12.00±0.30 5.50±0.20 1.75±0.20 4.00±0.10
EZANC 3.50±0.20 6.80±0.20
Type
Dimensions
(mm)
A
P1
P2
Dimensions
(mm)
fD0
t1
fD1
t2
1.15±0.20
EZASC
+0.10
4.00±0.10 2.00±0.05 1.50−0
0.25±0.05
fB
fC
180+0
−3.0
60 min.
13.0±1.0
Dimensions
(mm)
+0.10
1.50−0
1.30±0.20
EZANC
fA
W
T
13.0±1.0
15.4±2.0
■ Recommended Land Pattern Design
Chip 3-Terminal Capacitor Array
(EZANC/EZASC)
f2
GND
e
a
f1
d
c
b
P
Land pattern
Dimensions
(mm)
Solder resistant
Type
a
b
c
d
e
f1
f2
EZASC
1.2 to 1.4
0.4
3.1 to 3.3 0.4 to 0.5
0.8
2.9 to 3.3 4.8 to 5.2
0.8
EZANC
2.2 to 2.4 0.4 to 0.6 5.7 to 5.9 0.4 to 0.8
1.8
4.2 to 4.6 7.5 to 7.9
1.27
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
P
Feb. 2006
Discontinued
Chip 3-Terminal Capacitor Array
■ Recommended Soldering Conditions
Recommendations and precautions are described below.
● Recommended soldering conditions for reflow
·Reflow soldering shall be performed a maximum of
two times.
·Please contact us for additional information when
used in conditions other than those specified.
·Please measure the temperature of the terminals and
study every kind of solder and printed circuit board
for solderability before actual use.
For soldering (Example : Sn/Pb)
Preheating
Main heating
Peak
Temperature
Time
140 °C to 160 °C
60 s to 120 s
Above 200 °C
30 s to 40 s
235 ± 5 °C
max. 10 s
For lead-free soldering (Example : Sn/Ag/Cu)
Temperature
Peak
Preheating
Preheating
Main heating
Heating
Peak
Temperature
Time
150 °C to 180 °C
60 s to 120 s
Above 230 °C
30 s to 40 s
max. 260 °C
max. 10 s
Time
● Flow Soldering
We do not recommend flow soldering to the Chip 3-Terminal Capacitor Array: EZASC, because solder
bridging may occur due to the narrow 0.8 mm pitch of EZASC. Please contact us regarding flow soldering
of EZANC type.
Safety Precautions
The following are precautions for individual products. Please also refer to the precautions common to EMI Filters,
Fuses, and Sensors(MR Elements) shown on page EX2 of this catalog.
1. Take measures against mechanical stress during and after mounting of Chip 3-Terminal Capacitor Array (hereafter
called the capacitor arrays) so as not to damage their electrodes and protective coatings.
Be careful not to misplace the capacitor arrays on the land patterns. Otherwise, solder bridging may occur.
2. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the capacitors arrays'
per for mance and/or reliability.
3. When soldering with a soldering iron, never touch the capacitor arrays' bodies with the tip of the soldering iron. When
using a soldering iron with a high temperature tip, finish soldering as quickly as possible (within three seconds at 350 °
C max.).
4. As the amount of applied solder becomes larger, the mechanical stress applied to the capacitor arrays increases,
causing problems such as cracks and faulty characteristics. Avoid applying an excessive amounts of solder.
5. Do not apply shock to the capacitor arrays or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the
capacitor arrays' protective coatings and bodies may be chipped, affecting their performance.
6. Avoid excessive bending of printed circuit boards in order to protect the capacitor arrays from abnormal stress.
7. The static capacitance may decrease by a few percent from the time of shipment due to the characteristics peculiar to
dielectric materials having a high dielectric constant.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Safety Precautions (Common precautions for EMI Filters, Fuses, and Sensors[MR Elements])
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifications with us in advance. The design and specifications in this catalog are subject
to change without prior notice.
• Do not use the products beyond the specifications described in this catalog.
• This catalog explains the quality and performance of the products as individual components. Before use, check
and evaluate their operations when installed in your products.
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment
where a defect in these products may cause the loss of human life or other significant damage, such as damage to
vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating
appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.
✽ Systems equipped with a protection circuit and a protection device
✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault
(1) Precautions for use
• These products are designed and manufactured for general and standard use in general electronic equipment
(e.g. AV equipment, home electric appliances, office equipment, information and communication equipment)
• These products are not intended for use in the following special conditions. Before using the products,
carefully check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent
2. In direct sunlight, outdoors, or in dust
3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
4. Electric Static Discharge (ESD) Environment
These components are sensitive to static electricity and can be damaged under static shock (ESD).
Please take measures to avoid any of these environments.
Smaller components are more sensitive to ESD environment.
5. Electromagnetic Environment
Avoid any environment where strong electromagnetic waves exist.
6. In an environment where these products cause dew condensation
7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with
resin or other materials
• These products generate Joule heat when energized. Carefully position these products so that their heat will
not affect the other components.
• Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating components. Do not mount or place heat-generating components
or inflammables, such as vinyl-coated wires, near these products (except Thermal Cutoffs).
• Note that non-cleaning solder, halogen-based highly active fl ux, or water-soluble flux may deteriorate the
performance or reliability of the products.
• Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance
or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water
residues. Otherwise, the insulation performance may be deteriorated.
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of arrival
at your company, provided that they remain packed as they were when delivered and stored at a temperature
of 5 °C to 35 °C and a relative humidity of 45 % to 85 %. (Micro Chip Fuses: Guaranteed for 6 months from the
date of arrival at your company)
The performance of EMI Filters is guaranteed for 6 months or a year from the outgoing inspection date indicated on
the packages, provided that they are stored at a temperature of -5 °C to +40 °C and a relative humidity of 40 %
to 60 %. Check the guarantee period in the specifications. The performance of Thermal Cutoffs is guaranteed for a
year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of
-10 °C to +40 °C and a relative humidity of 30 % to 75 %.
Even within the above guarantee periods, do not store these products in the following conditions. Otherwise,
their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping
materials) may be deformed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
2. In direct sunlight
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
Feb. 2006
– EX2 –
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