Data Sheet

74LVC1GX04-Q100
X-tal driver
Rev. 1 — 25 September 2013
Product data sheet
1. General description
The 74LVC1GX04-Q100 combines the functions of the 74LVC1GU04-Q100 and
74LVC1G04-Q100 to provide a device optimized for use in crystal oscillator applications.
The integration of the two devices into the 74LVC1GX04-Q100 produces the benefits of a
compact footprint. It provides lower power dissipation and stable operation over a wide
frequency and temperature range.
Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of this
device in a mixed 3.3 V and 5 V environment.
This device is fully specified for partial power-down applications using IOFF.
The IOFF circuitry disables the output, preventing the damaging backflow current through
the device when it is powered down.
This product has been qualified to the Automotive Electronics Council (AEC) standard
Q100 (Grade 1) and is suitable for use in automotive applications.
2. Features and benefits
 Automotive product qualification in accordance with AEC-Q100 (Grade 1)
 Specified from 40 C to +85 C and from 40 C to +125 C
 Wide supply voltage range from 1.65 V to 5.5 V
 5 V tolerant input and a 5 V overvoltage tolerant powered down output
 High noise immunity
 Complies with JEDEC standard:
 JESD8-7 (1.65 V to 1.95 V)
 JESD8-5 (2.3 V to 2.7 V)
 JESD8B/JESD36 (2.7 V to 3.6 V)
 24 mA output drive (VCC = 3.0 V)
 CMOS low power consumption
 Latch-up performance exceeds 250 mA
 Direct interface with TTL levels
 Multiple package options
 ESD protection:
 MIL-STD-883, method 3015 exceeds 2000 V
 HBM JESD22-A114F exceeds 2000 V
 MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 )
74LVC1GX04-Q100
NXP Semiconductors
X-tal driver
3. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature range
Name
Description
Version
74LVC1GX04GW-Q100 40 C to +125 C
SC-88
plastic surface-mounted package; 6 leads
SOT363
40 C to +125 C
SC-74
plastic surface-mounted package (TSOP6); 6 leads SOT457
74LVC1GX04GV-Q100
4. Marking
Table 2.
Marking
Type number
Marking code[1]
74LVC1GX04GW-Q100
VX
74LVC1GX04GV-Q100
VX4
[1]
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
5. Functional diagram
Y
3
X1
X2
6
4
mnb098
Fig 1.
Logic symbol
74LVC1GX04_Q100
Product data sheet
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6. Pinning information
6.1 Pinning
/9&*;4
QF
<
*1'
9&&
;
;
DDD
Fig 2.
Pin configuration SOT363 and SOT457
6.2 Pin description
Table 3.
Pin description
Symbol
Pin
Description
n.c.
1
not connected
GND
2
ground (0 V)
X1
3
data input
X2
4
data output
VCC
5
supply voltage
Y
6
data output
7. Functional description
Table 4.
Function table[1]
Input
Output
X1
X2
Y
H
L
H
L
H
L
[1]
H = HIGH voltage level;
L = LOW voltage level.
74LVC1GX04_Q100
Product data sheet
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8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
VCC
supply voltage
IIK
input clamping current
VI
input voltage
IOK
output clamping current
Conditions
VI < 0 V
[1]
Max
Unit
0.5
+6.5
V
50
-
mA
0.5
+6.5
V
-
50
mA
Active mode
[1][2]
0.5
VCC + 0.5
V
Power-down mode
[1][2]
0.5
+6.5
V
-
50
mA
VO > VCC or VO < 0 V
output voltage
VO
Min
IO
output current
VO = 0 V to VCC
ICC
supply current
-
100
mA
IGND
ground current
100
-
mA
Tstg
storage temperature
65
+150
C
Ptot
total power dissipation
-
250
mW
Tamb = 40 C to +125 C
[3]
[1]
The minimum input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2]
When VCC = 0 V (Power-down mode), the output voltage can be 5.5 V in normal operation.
[3]
Above 87.5 C, the value of Ptot derates linearly with 4.0 mW/K.
9. Recommended operating conditions
Table 6.
Symbol
Recommended operating conditions
Parameter
VCC
supply voltage
VI
input voltage
Conditions
[1]
output voltage
VO
Active mode
ambient temperature
t/V
input transition rise and fall rate
Unit
1.65
-
5.5
V
0
-
5.5
V
-
VCC
V
-
5.5
V
40
-
+125
C
VCC = 1.65 V to 2.7 V
-
-
20
ns/V
VCC = 2.7 V to 5.5 V
-
-
10
ns/V
For use of a regular crystal oscillator, the recommended minimum VCC should be 2.0 V.
[2]
Only for output Y.
Product data sheet
Max
0
[1]
74LVC1GX04_Q100
Typ
0
Power-down mode; VCC = 0 V
Tamb
[2]
Min
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10. Static characteristics
Table 7.
Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Conditions
Min
Typ[1] Max
Unit
Tamb = 40 C to +85 C
VIH
HIGH-level input voltage
VCC = 1.65 V to 5.5 V
0.75  VCC -
-
VIL
LOW-level input voltage
VCC = 1.65 V to 5.5 V
-
-
0.25  VCC V
VOL
LOW-level output voltage VI = VIH or VIL
IO = 100 A; VCC = 1.65 V to 5.5 V
-
-
0.1
V
VOH
HIGH-level output
voltage
V
IO = 4 mA; VCC = 1.65 V
-
-
0.45
V
IO = 8 mA; VCC = 2.3 V
-
-
0.3
V
IO = 12 mA; VCC = 2.7 V
-
-
0.4
V
IO = 24 mA; VCC = 3.0 V
-
-
0.55
V
IO = 32 mA; VCC = 4.5 V
-
-
0.55
V
IO = 100 A; VCC = 1.65 V to 5.5 V
VCC  0.1
-
-
V
IO = 4 mA; VCC = 1.65 V
1.2
-
-
V
VI = VIH or VIL
IO = 8 mA; VCC = 2.3 V
1.9
-
-
V
IO = 12 mA; VCC = 2.7 V
2.2
-
-
V
IO = 24 mA; VCC = 3.0 V
2.3
-
-
V
IO = 32 mA; VCC = 4.5 V
3.8
-
-
V
II
input leakage current
IOFF
power-off leakage current VI or VO = 5.5 V; VCC = 0 V
VCC = 0 V to 5.5 V; VI = 5.5 V or GND
ICC
supply current
CI
input capacitance
[2]
VCC = 1.65 V to 5.5 V; IO = 0 A; VI = 5.5
V or GND;
-
0.1
5
A
-
0.1
10
A
-
0.1
10
A
-
5.0
-
pF
Tamb = 40 C to +125 C
VIH
HIGH-level input voltage
VCC = 1.65 V to 5.5 V
0.8  VCC
-
-
V
VIL
LOW-level input voltage
VCC = 1.65 V to 5.5 V
-
-
0.2  VCC
V
VOL
LOW-level output voltage VI = VIH or VIL
IO = 100 A; VCC = 1.65 V to 5.5 V
-
-
0.1
V
IO = 4 mA; VCC = 1.65 V
-
-
0.7
V
IO = 8 mA; VCC = 2.3 V
-
-
0.45
V
IO = 12 mA; VCC = 2.7 V
-
-
0.6
V
IO = 24 mA; VCC = 3.0 V
-
-
0.8
V
IO = 32 mA; VCC = 4.5 V
-
-
0.8
V
74LVC1GX04_Q100
Product data sheet
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Table 7.
Static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Min
Typ[1] Max
Unit
IO = 100 A; VCC = 1.65 V to 5.5 V
VCC  0.1
-
-
V
IO = 4 mA; VCC = 1.65 V
0.95
-
-
V
IO = 8 mA; VCC = 2.3 V
1.7
-
-
V
IO = 12 mA; VCC = 2.7 V
1.9
-
-
V
IO = 24 mA; VCC = 3.0 V
2.0
-
-
V
IO = 32 mA; VCC = 4.5 V
3.4
-
-
V
-
-
20
A
-
-
20
A
-
-
40
A
Symbol Parameter
Conditions
VOH
VI = VIH or VIL
II
HIGH-level output
voltage
input leakage current
VCC = 0 V to 5.5 V; VI = 5.5 V or GND;
IOFF
power-off leakage current VI or VO = 5.5 V; VCC = 0 V
ICC
supply current
VCC = 1.65 V to 5.5 V; IO = 0 A; VI = 5.5
V or GND;
[1]
Typical values are measured at maximum VCC and Tamb = 25 C.
[2]
VO only for output Y.
74LVC1GX04_Q100
Product data sheet
[2]
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11. Dynamic characteristics
Table 8.
Dynamic characteristics
Voltages are referenced to GND (ground = 0 V); for test circuit, see Figure 5.
Symbol Parameter
propagation delay
tpd
40 C to +85 C
Conditions
40 C to +125 C Unit
Min
Typ[1]
Max
Min
Max
VCC = 1.65 V to 1.95 V
0.5
2.1
5.0
0.5
6.5
ns
VCC = 2.3 V to 2.7 V
0.3
1.7
4.0
0.3
5.0
ns
VCC = 2.7 V
0.3
2.5
4.5
0.3
5.6
ns
VCC = 3.0 V to 3.6 V
0.3
2.1
3.7
0.3
4.5
ns
VCC = 4.5 V to 5.5 V
0.3
1.6
3.0
0.3
3.8
ns
VCC = 1.65 V to 1.95 V
1.0
4.4
10.0
1.0
12.5
ns
[2]
X1 to X2; see Figure 3
X1 to Y; see Figure 3
VCC = 2.3 V to 2.7 V
0.5
2.9
6.0
0.5
7.5
ns
VCC = 2.7 V
0.5
3.0
6.0
0.5
7.5
ns
VCC = 3.0 V to 3.6 V
0.5
2.8
5.5
0.5
6.9
ns
0.5
2.3
4.5
0.5
5.6
ns
-
35
-
-
-
pF
VCC = 4.5 V to 5.5 V
power dissipation
capacitance
CPD
[1]
[3]
VCC = 3.3 V; VI = GND to VCC;
output enabled
Typical values are measured at nominal VCC and at Tamb = 25 C.
[2]
tpd is the same as tPLH and tPHL
[3]
CPD is used to determine the dynamic power dissipation (PD in W).
PD = CPD  VCC2  fi  N + (CL  VCC2  fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
(CL  VCC2  fo) = sum of outputs.
12. Waveforms
VI
VM
X1 input
GND
tPLH
tPHL
VOH
VM
X2 output
VOL
mnb099
Measurement points are given in Table 9.
VOL and VOH are typical output voltage levels that occur with the output load.
Fig 3.
Input X1 to output X2 propagation delay times
74LVC1GX04_Q100
Product data sheet
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VI
VM
X1 input
GND
tPLH
tPHL
VOH
VM
Y output
VOL
mnb100
Measurement points are given in Table 9.
VOL and VOH are typical output voltage levels that occur with the output load.
Fig 4.
Input X1 to output Y propagation delay times
Table 9.
Measurement points
Supply voltage
Input
Output
VCC
VM
VM
1.65 V to 1.95 V
0.5  VCC
0.5  VCC
2.3 V to 2.7 V
0.5  VCC
0.5  VCC
2.7 V
1.5 V
1.5 V
3.0 V to 3.6 V
1.5 V
1.5 V
4.5 V to 5.5 V
0.5  VCC
0.5  VCC
VEXT
VCC
VI
RL
VO
G
DUT
RT
CL
RL
mna616
Test data is given in Table 10.
Definitions test circuit:
RL = Load resistance.
CL = Load capacitance including jig and probe capacitance.
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
VEXT = External voltage for measuring switching times.
Fig 5.
Test circuit for measuring switching times
74LVC1GX04_Q100
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Table 10.
Test data
Supply voltage
Input
Load
VCC
VI
tr = tf
1.65 V to 1.95 V
VCC
 2.0 ns
2.3 V to 2.7 V
VCC
 2.0 ns
2.7 V
2.7 V
 2.5 ns
3.0 V to 3.6 V
2.7 V
4.5 V to 5.5 V
VCC
VEXT
CL
RL
tPLH, tPHL
30 pF
1 k
open
30 pF
500 
open
50 pF
500 
open
 2.5 ns
50 pF
500 
open
 2.5 ns
50 pF
500 
open
mnb101
160
gfs
(mA/V)
120
Rbias = 560 kΩ
80
VCC
0.47 μF
input
VI
output
40
100 μF
A IO
0
0
1
mna638
2
3
4
5
6
VCC (V)
Tamb = 25 °C
I O
g fs = --------V I
fi = 1 kHz.
VO is constant.
Fig 6.
Test set-up for measuring forward
transconductance
74LVC1GX04_Q100
Product data sheet
Fig 7.
Typical forward transconductance as a
function of supply voltage
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13. Application information
Crystal controlled oscillator circuits are widely used in clock pulse generators because of
their excellent frequency stability and wide operating frequency range. The
74LVC1GX04-Q100 provides the additional advantages of low power dissipation, stable
operation over a wide range of frequency and temperature, and a very small footprint.
This application information describes crystal characteristics, design and testing of crystal
oscillator circuits based on the 74LVC1GX04-Q100.
13.1 Crystal characteristics
Figure 8 is the equivalent circuit of a quartz crystal.
The reactive and resistive component of the impedance of the crystal alone and the
crystal with a series and a parallel capacitance is shown in Figure 9
C1
L1
C0
R1
mnb102
Fig 8.
74LVC1GX04_Q100
Product data sheet
Equivalent circuit of a crystal
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C1
+
resistance
(1)
R1
L1
C0
0
fr
R1
fa
f
∞
reactance
−
+
C1
resistance
RL
(2)
L1
C0
0
fL
fa
f
R1
∞
reactance
CL
−
+
Rp
C1
resistance
(3) CL
C0
L1
0
fr
fL
fa
f
R1
∞
reactance
−
mnb104
(1) resonance
(2) anti-resonance
(3) load resonance
Fig 9.
Reactance and resistance characteristics of a crystal
13.1.1 Design
Figure 10 shows the recommended way to connect a crystal to the 74LVC1GX04-Q100.
This circuit is basically a Pierce oscillator circuit in which the crystal is operating at its
fundamental frequency. The parallel load capacitance of C1 and C2 tune the circuit. C1
and C2 are in series with the crystal and they should be equal (approximately). R1 is the
drive-limiting resistor. It is set to approximately the same value as the reactance of C1 at
the crystal frequency (R1 = XC1). This setting results in an input to the crystal of 50 % of
the rail-to-rail output of X2. It keeps the drive level into the crystal within drive
specifications and the designer should verify it. Overdriving the crystal can cause
damage.
The feedback resistor (Rf = 1 M) provides negative feedback. It sets a bias point of the
inverter near mid-supply, operating the 74LVC1GU04-Q100 portion in the high gain linear
region.
74LVC1GX04_Q100
Product data sheet
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To calculate the values of C1 and C2, the designer can use the formula:
C1  C2
C L = ------------------- + C s
C1 + C2
CL is the load capacitance as specified by the crystal manufacturer. Cs is the stray
capacitance of the circuit (for the 74LVC1GX04-Q100 it is equal to an input capacitance
of 5 pF).
74LVC1GU04
portion
X1
74LVC1G04
portion
X2
Y
system load
Rf
Csys
C2
Xtal
Rsys
C1
mnb103
Fig 10. Crystal oscillator configuration for the 74LVC1GX04-Q100
13.1.2 Testing
After the calculations are performed for a particular crystal, the oscillator circuit should be
tested. The following simple checks verify the prototype design of a crystal controlled
oscillator circuit. Perform the checks after laying out the board:
• Test the oscillator over worst-case conditions (lowest supply voltage, worst-case
crystal and highest operating temperature). Adding series and parallel resistors can
simulate a worst-case crystal.
• Insure that the circuit does not oscillate without the crystal.
• Check the frequency stability over a supply range greater that is likely to occur during
normal operation.
• Check that the start-up time is within system requirements.
As the 74LVC1GX04-Q100 isolates the system loading, once the design is optimized, the
single layout may work in multiple applications for any given crystal.
74LVC1GX04_Q100
Product data sheet
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14. Package outline
Plastic surface-mounted package; 6 leads
SOT363
D
E
B
y
X
A
HE
6
5
v M A
4
Q
pin 1
index
A
A1
1
2
e1
3
bp
c
Lp
w M B
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max
bp
c
D
E
e
e1
HE
Lp
Q
v
w
y
mm
1.1
0.8
0.1
0.30
0.20
0.25
0.10
2.2
1.8
1.35
1.15
1.3
0.65
2.2
2.0
0.45
0.15
0.25
0.15
0.2
0.2
0.1
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
SOT363
JEITA
SC-88
EUROPEAN
PROJECTION
ISSUE DATE
04-11-08
06-03-16
Fig 11. Package outline SOT363 (SC-88)
74LVC1GX04_Q100
Product data sheet
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Plastic surface-mounted package (TSOP6); 6 leads
D
SOT457
E
B
y
A
HE
6
5
X
v M A
4
Q
pin 1
index
A
A1
c
1
2
3
Lp
bp
e
w M B
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
bp
c
D
E
e
HE
Lp
Q
v
w
y
mm
1.1
0.9
0.1
0.013
0.40
0.25
0.26
0.10
3.1
2.7
1.7
1.3
0.95
3.0
2.5
0.6
0.2
0.33
0.23
0.2
0.2
0.1
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
SOT457
JEITA
SC-74
EUROPEAN
PROJECTION
ISSUE DATE
05-11-07
06-03-16
Fig 12. Package outline SOT457 (SC-74)
74LVC1GX04_Q100
Product data sheet
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15. Abbreviations
Table 11.
Abbreviations
Acronym
Description
CMOS
Complementary Metal Oxide Semiconductor
DUT
Device Under Test
ESD
ElectroStatic Discharge
HBM
Human Body Model
MIL
Military
MM
Machine Model
16. Revision history
Table 12.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
74LVC1GX04_Q100 v.1
20130925
Product data sheet
-
-
74LVC1GX04_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 25 September 2013
© NXP B.V. 2013. All rights reserved.
15 of 18
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NXP Semiconductors
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17. Legal information
17.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
17.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
17.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
74LVC1GX04_Q100
Product data sheet
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 25 September 2013
© NXP B.V. 2013. All rights reserved.
16 of 18
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No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
17.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
18. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
74LVC1GX04_Q100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 25 September 2013
© NXP B.V. 2013. All rights reserved.
17 of 18
NXP Semiconductors
74LVC1GX04-Q100
X-tal driver
19. Contents
1
2
3
4
5
6
6.1
6.2
7
8
9
10
11
12
13
13.1
13.1.1
13.1.2
14
15
16
17
17.1
17.2
17.3
17.4
18
19
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Recommended operating conditions. . . . . . . . 4
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
Dynamic characteristics . . . . . . . . . . . . . . . . . . 7
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Application information. . . . . . . . . . . . . . . . . . 10
Crystal characteristics. . . . . . . . . . . . . . . . . . . 10
Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 15
Legal information. . . . . . . . . . . . . . . . . . . . . . . 16
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Contact information. . . . . . . . . . . . . . . . . . . . . 17
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 25 September 2013
Document identifier: 74LVC1GX04_Q100