CDWBS16

MATERIAL DECLARATION SHEET
Material Number
CDWBS16 Series
Product Line
Diode Products
Compliance Date
1 Jan 2006
RoHS Compliant
Yes
No.
Construction
Element(subpart)
MSL
Homogeneous
Material
1
Material
weight [g]
1
Lead Frame
Copper Alloy
2
Chip
Silicon
0.014340
3
Bond Wire
Gold
0.000352
4
Die Attach
High Temp Solder
0.000808
5
Molding
Component
Epoxy Material
0.057600
Total weight
0.075700
Homogeneous
Material\
Substances
CASRN
if applicable
Copper
7440-50-8
Tin
Silicon
Other material
Materials
Mass %
Material
Mass % of
total unit wt.
48.430
7440-31-5
7440-21-3
95.2
4.8
97.99
1.99
Gold
7440-57-5
99.02
0.2342
Silicon
7440-21-3
0.976
0.0023
Silver
Lead
Tin
Silica fused
Epoxy resin
Phenol resin
7440-22-4
7439-92-1
7440-31-5
60676-86-0
68928-70-1
29690-82-2
1.98
88.011
10
84.99
10
5.99
0.0108
0.4779
0.0543
32.9
3.8710
2.3220
2.4470
9.440
0.1927
Subpart
mass of total
wt. (%)
50.870
9.6370
0.2365
0.5430
38.710
0.148800
This Document was updated on: 18-march 2009
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1.
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