Freescale Semiconductor
Advance Information
Document Number: MC33789
Rev. 4.0, 9/2014
Airbag System Basis Chip (SBC) with
Power Supply and PSI5 Sensor
Interface
33789
AUTO RESTRAINT
The 33789, a SafeAssure SMARTMOS solution, is a mixed signal IC for
airbag safety applications. The 33789 provides a cost effective and flexible
system IC solution across the range of airbag partitions used in cars and other
vehicles.
The 33789 connects to the 12 V vehicle battery and supplies the multiple
voltages of a typical airbag system. The 33789 can detect switched input states,
communicate with both local and remote crash sensors. It offers an industry
standard interface (SPI) and four PSI5 master interfaces. The 33789 has a
AE SUFFIX (PB-FREE)
dedicated safing state machine that complements the airbag’s MCU hardware/
EXPOSED PAD
software safing approach. Also included are a diagnostic - self protection
98ASA10763D
capability and a programmable analog interface accessible by the system MCU.
64-PIN LQFP
The 33789 is well suited for use in low to high end airbag systems by allowing
the designer to scale a design for the number of firing loops needed while
providing enhanced safety and system reliability.
Applications
Features
• Airbag safety
• Designed to operate 5.2 V VPWR 20 V, up to a 40 V transient
• Safing state machine with programmable sensing thresholds
• Two configurable high-side/low-side drivers with PWM capability
• Four PSI5 satellite sensor master interfaces
• Self-protected and diagnostic capability
• Watchdog and system Power ON Reset (POR)
• Supports complete airbag system power supply architecture, including
system power mode control, supplies for squib firing (33 V), satellite sensors
(6.3 V), and local ECU sensors and ECU logic circuits (5.0 V)
• Nine configurable switch input monitors for simple switch and Hall- effect
sensor interfaces with internal power supply
• 16-bit SPI interface
• LIN 2.1 physical layer interface
33789
VBAT
IN1
IN2
9 Input
Monitors
IN8
IN9
LIN
PSI5_1
4 Satellite
Sensor
Interfaces
Wake Up
WAKE
BSTSW
33 V
VBST
VER
PSI5_2
PSI5_3
VBAT
VPWR
ERSW
PSI5_4
VPWR
OUT1_D
OUT1_S
5.0 V
X/Y Axis
Accel.
Sensor
Sensor SPI
5.0 V
VFIRE_x
SQB_H1
SQB_H1
BUCKSW
VBUCK
VCCDRI
SPI
5.0 V
Energy
Storage
9.0 V
5.0 V
Output
Squib
Driver 1
VCC
SQB_L1
5.0 V
SPI_A
VDD AIN
SQB_L1
AOUT
ARM
RESET
RESET
SPI_B
MCU
Squib
Driver 2
FEN_1
FEN_2
Squib Driver SPI
RESET
SPI
2 ARM_X and ARM_Y for Squib Driver 2 FENs
Figure 1. 33789 Simplified Application Diagram
* This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
© Freescale Semiconductor, Inc., 2010-2014. All rights reserved.
Cross-coupled
Squib
Connections
ORDERABLE PARTS
ORDERABLE PARTS
This section describes the part numbers available to be purchased along with their differences. Valid orderable part numbers are
provided on the web. To determine the orderable part numbers for this device, go to http://www.freescale.com and perform a part number
search for the following device numbers.
Table 1. Orderable Part Variations
Part Number
MCZ33789BAE
Notes
Temperature (TA)
(1)
-40 °C to 125 °C
Package
64 LQFP EP
Notes
1. To order parts in Tape & Reel, add the R2 suffix to the part number.
33789
2
Analog Integrated Circuit Device Data
Freescale Semiconductor
INTERNAL BLOCK DIAGRAM
INTERNAL BLOCK DIAGRAM
SI
Power Mode
Control
SPI
Interface
SO
SCK
VREF
WAKE
VPWR
CS
BSTSW
CS_A
CS_B
CS_C
Boost
Converter
SPI
Monitor
DISARM
VBST
Safing
A_SENSOR
ARM
BSTGND
BSTCOMP1
BSTCOMP2
Safing
Logic
ASST
Configurable
Drivers
OUT1_D
OUT1_S
VER
Energy
Reserve
Control
SCRAP
ERSW
VERDIAG
OUT2_D
VBUCK
OUT2_S
CLK
PSI5
Satellite
Sensor
Interfaces
SATSYNC
PSI5_1
PSI5_2
BUCKSW
Buck
Converter
BUCKGND
VBUCK_R
BUCKCOMP1
BUCKCOMP2
PSI5_3
PSI5_4
CPC1
GND_PSI
IN1
Analog
Multiplexer
IN2
IN3
Quad
Bias
Voltage
Regulator
CPC2
Sync
Supply
VSYNC
CPGND
IN4
IN5
IN6
IN7
Linear
Regulator
&
Watchdog
IN8
IN9
Analog Multiplexer
AOUT
VREF
LIN
Interface
Power Supply
I/O Monitor
GNDA
VCC
VDD
RESET
PPT
Analog Multiplexer
Driver Output
OUTx Monitor
VCCDRI
VSS
TXD
LIN
RXD
GND_LIN
Figure 2. 33789 Simplified Internal Block Diagram
33789
Analog Integrated Circuit Device Data
Freescale Semiconductor
3
PIN CONNECTIONS
VERDIAG
BUCKGND
BUCKSW
VBST
ERSW
BSTGND
BSTSW
VER
WAKE
VPWR
VSYNC
CPC2
CPC1
CPGND
Transparent Top View
VBUCK_R
VBUCK
PIN CONNECTIONS
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
ASST
1
48
BUCKCOMP1
CS_C
2
47
BUCKCOMP2
CS_B
3
46
BSTCOMP1
CS_A
4
45
BSTCOMP2
SCRAP
5
44
VDD
PSI5_1
6
43
VSS
PSI5_2
7
42
VCC
PSI5_3
8
41
GNDA
PSI5_4
9
40
VCCDRI
GND_PSI
10
39
DISARM
SO
11
38
ARM
SI
12
37
RESET
SCK
13
36
AOUT
CLK
14
35
RXD
CS
15
34
TXD
SATSYNC
16
33
A_SENSOR
IN1
IN2
IN3
IN4
IN5
IN6
IN7
IN8
IN9
GND_LIN
LIN
OUT1_D
OUT1_S
PPT
OUT2_S
OUT2_D
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
Figure 3. 33789 Pin Connections
A functional description of each pin can be found in the Functional Pin Description section beginning on page 26.
Table 2. 33789 Pin Definitions
Pin
Number
Pin Name
Pin
Function
Formal Name
1
ASST
Input
Analog Sensor Self-test
2
CS_C
Input
Chip Select C
Active low SPI monitor chip select input dedicated for on-board sensor C.
3
CS_B
Input
Chip Select B
Active low SPI monitor chip select input dedicated for on-board sensor B
4
CS_A
Input
Chip Select A
Active low SPI monitor chip select input dedicated for on-board sensor A
5
SCRAP
Input
Scrap
6
PSI5_1
Input/Output
PSI5 Interface 1
PSI5 standard interface 1 as satellite sensor channel 1
7
PSI5_2
Input/Output
PSI5 Interface 2
PSI5 standard interface 2 as satellite sensor channel 2
8
PSI5_3
Input/Output
PSI5 Interface 3
PSI5 standard interface 3 as satellite sensor channel 3
9
PSI5_4
Input/Output
PSI5 Interface 4
PSI5 standard interface 4 as satellite sensor channel 4
10
GND_PSI
Ground
PSI Ground
11
SO
Output
SPI Data Out
12
SI
Input
SPI Data In
SPI data input
13
SCK
Input
SPI Clock
SPI clock input
14
CLK
Input
Satellite Sensor Clock
15
CS
Input
SPI Chip Select
Definition
Active high input to initiate analog sensor self-test
Scrap command input
Dedicated ground point for PSI5 sensor
SPI data output
Clock input for the PSI5 sensor interface(s) running in synchronous operation mode
Active low SPI chip select input from MCU, also used for satellite channels on SPI
monitor
33789
4
Analog Integrated Circuit Device Data
Freescale Semiconductor
PIN CONNECTIONS
Table 2. 33789 Pin Definitions (continued)
Pin
Number
Pin Name
Pin
Function
Formal Name
16
SATSYNC
Input
Satellite Sync-pulse
Trigger
Satsync command input from MCU to trigger PSI5 Sync-pulse
17
OUT2_D
Output
Output Driver2 Drain
Drain pin of the configurable driver2 outputs
18
OUT2_S
Output
Output Driver2 Source
19
PPT
Input
Production Programming
and Testing
20
OUT1_S
Output
Output Driver1 Source
21
OUT1_D
Output
Output Driver1 Drain
22
LIN
Input/output
LIN Interface
LIN interface. It can be configured as a bi-directional pin which represents the singlewire bus transmitter and receiver
23
GND_LIN
Ground
LIN Ground
Dedicated ground point for a bi-directional pin which represents the single-wire bus
transmitter and receiver
24
IN9
Input
Input Monitor Port 9
Port 9 of input monitor for DC sensor
25
IN8
Input
Input Monitor Port 8
Port 8 of input monitor for DC sensor
26
IN7
Input
Input Monitor Port 7
Port 7 of input monitor for DC sensor
27
IN6
Input
Input Monitor Port 6
Port 6 of input monitor for DC sensor
28
IN5
Input
Input Monitor Port 5
Port 5 of input monitor for DC sensor
29
IN4
Input
Input Monitor Port 4
Port 4 of input monitor for DC sensor
30
IN3
Input
Input Monitor Port 3
Port 3 of input monitor for DC sensor
31
IN2
Input
Input Monitor Port 2
Port 2 of input monitor for DC sensor
32
IN1
Input
Input Monitor Port 1
Port 1 of input monitor for DC sensor
33
A_SENSOR
Input
Analog Sensor Input
Analog sensor input for safing
34
TXD
Input
Data Input from UART
Logic-level data input from MCU UART transmitter for LIN/K-line
35
RXD
Output
Data Output to UART
Logic-level data output to MCU UART receiver for LIN/K-line
36
AOUT
Output
Analog Output
37
RESET
Output
Reset
38
ARM
Output
Arm Enable
Active high safing enable signal to squib driver
39
DISARM
Output
Arm Disable
Active low safing enable signal to squib driver
40
VCCDRI
Output
VCC Bypass Transistor
Drive
41
GNDA
Ground
Analog Ground
42
VCC
Input
VCC Input
43
VSS
Ground
Digital Ground
44
VDD
Output
Digital Power Supply
Output
45
BSTCOMP2
Input
Boost Compensation pin2 Connection 2 to the boost converter compensation network
46
BSTCOMP1
Input
Boost Compensation pin1 Connection 1 to the boost converter compensation network
47
BUCKCOM
P2
Input
Buck Compensation pin2
Connection 2 to the buck converter compensation network
48
BUCKCOM
P1
Input
Buck Compensation pin1
Connection 1 to the buck converter compensation network
Definition
Source pin of the configurable driver2 outputs
Active high input to enable test-mode for production programming and testing. Not for
application
Source pin of the configurable driver1 outputs
Drain pin of the configurable driver1 outputs
Analog output to send MCU scaled, multiplexed and buffered analog signals for
diagnosis
Active low reset output
Linear regulator drive output to control an external PNP transistor for 5.0 V VCC output
Analog ground
5.0 V VCC input for monitoring and internal supply
Digital ground
2.5 V linear regulator output for output capacitor connection.
33789
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
PIN CONNECTIONS
Table 2. 33789 Pin Definitions (continued)
Pin
Number
Pin Name
Pin
Function
Formal Name
49
VERDIAG
Input
Energy Reserve
Diagnosis
50
BUCKGND
Ground
Buck Converter Ground
51
BUCKSW
Output
Buck Switch
52
VBST
Input
Boost Voltage Input
53
ERSW
Output
Energy Reserve Switch
Storage driver output to control the energy reserve capacitor charging
54
BSTGND
Ground
Boost Converter Ground
Ground return of the boost converter, buck switch ground
55
BSTSW
Output
Boost Switch
56
VER
Input
Energy Reserve Voltage
57
WAKE
Input
Wake-up
58
VPWR
Input
Power Supply
59
VSYNC
Input/output
Sensor Sync Power
Supply
60
CPC2
Output
Charge Pump Capacitor
Pin2
Charge pump capacitor pin2
61
CPC1
Output
Charge Pump Capacitor
Pin1
Charge pump capacitor pin1
62
CPGND
Ground
Charge Pump Ground
63
VBUCK_R
Input
Buck Converter
Redundant Input
64
VBUCK
Input
Buck Converter Input
Definition
AC coupled energy reserve diagnostic input
Ground return of the buck converter, buck switch ground
Buck switch driver output to connect buck inductor
Boost voltage input for boost loop feedback and source of buck converter, same
voltage as boost output
Boost switch driver output to connect boost inductor
Energy reserve voltage input for the storage capacitor charge control and energy
reserve monitor
Wake-up signal input to start-up boost and buck converters
Battery voltage power supply input
Satellite sensor sync voltage supply charge/discharge connection
Charge pump ground
Redundant buck converter input to supply current for charge pump
Buck converter input for buck loop feedback and current source of charge pump
33789
6
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage
to the device.
Ratings
Symbol
Value
Unit
Supply Input Voltage
VPWR
-0.3 to 40
V
Wake-up Input Voltage
VWAKE
-16 to 40
V
Supply Voltage - 1
VBST, VBSTSW, VBUCKSW, VERSW, VER
-0.3 to 40
V
Supply Voltage - 2
VSYNC, VCPC2
-0.3 to 20
V
Supply Voltage - 3
VCPC1, VBUCK, VBUCK_R, VCCDRI
-0.3 to 10
V
Supply Voltage - 4
VERDIAG
-0.3 to 7
V
Supply Voltage - 5
VCC
-0.3 to 5.5
V
Supply Voltage - 6
VDD, VBSTCOMP1, VBSTCOMP2, VBUCKCOMP1,
VBUCKCOMP2
-0.3 to 3
V
ELECTRICAL RATINGS
LIN Interface Voltage
VLIN
-27 to 40
V
I/O Voltage - 1
VOUT1_D, VOUT1_S, VOUT2_D, VOUT2_S
-1 to 40
V
I/O Voltage - 2
VIN1 ~ VIN9, VPSI5_1 ~ VPSI5_4
-1 to 20
V
I/O Voltage - 3
VARM, VDISARM, VPPT
-0.3 to 10
V
I/O Voltage - 4
VA_SENSOR, VAOUT, VASST, VSCRAP, VRESET, VTXD,
VRXD, VSI, VSO, VSCK, VCLK, VCS, VCS_A, VCS_B,
VCS_C, VSATSYNC
-0.3 to 5.5
V
VSS, VGND_LIN, VCPGND, VGND_PSI
-0.3 to 0.3
V
GND Shift
LIN Bus Voltage(2)
Normal Operation (DC)
Transient (Coupled Through 1.0 nF Capacitor,
according to ISO7637-2 & ISO7637-3) (See
Table 4 and Figure 4)
- Pulse 1 (test up to the limit for Damage - Class
C(1))
- Pulse 2a (test up to the limit for Damage - Class
C(1))
- Pulse 3a (test up to the limit for Damage - Class
C(1))
- Pulse 3b (test up to the limit for Damage - Class
C(1))
VBUS(SS)
-27 to 40
VBUS(S1)
-100
VBUS(S2A)
+75
VBUS(S3A)
-150
VBUS(S3B)
+100
V
Notes
1. Class C: At least one function of the transceiver stops working properly during the test, and will return to the proper operation automatically when
the exposure to the disturbance has ended. No physical damage of the IC occurs.
2. The LIN bus voltage is applied on the LIN pin as VLIN during tests.
33789
Analog Integrated Circuit Device Data
Freescale Semiconductor
7
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings (continued)
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage
to the device.
Ratings
Symbol
Value
Unit
ESD Capability
AECQ100
Human Body Model - JESD22/A114(3)
All pins
VESD1-1
Charge Device Model - JESD22/C101(3)
Corner pins
VCCDRI pin
All other pins
VESD2-1
VESD2-2
VESD2-3
± 2.0 k
± 750
± 400
V
±500
Additional for LIN Conformance
Contact Discharge, Unpowered(4)
LIN pin without capacitor
LIN pin with 220 pF capacitor
LIN pin with 220 pF capacitor and indirect ESD
coupling (according to ISO10605 - Annex F)
VLIN_ESD1-1
VLIN_ESD1-2
VLIN_ESD1-3
± 6.0 k
± 6.0 k
± 8.0 k
THERMAL RATINGS
Operating Temperature
Junction Temperature
Case (Exposed Pad) Temperature
TJ
TC
-40 to 150
-40 to 125
°C
TSTG
-65 to +150
°C
TPPRT
Note 6
°C
Junction to Ambient (Natural Convection)
JA
26
°C/W
Junction to Case (Exposed Pad)
JC
1.5
°C/W
Storage Temperature
Peak Package Reflow Temperature During
(6)
Reflow(5),
THERMAL RESISTANCE
Notes
3. ESD testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100 pF, RZAP = 1500 ), and the Charge Device Model
(CDM) (CZAP = 4.0 pF).
4.
According to “Hardware Requirements for LIN, CAN, and Flexray Interfaces in Automotive Applications” specification Rev. 1.1/December 2, 2009
(CZAP = 150 pF, RZAP = 330 ).
5.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause
malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature
and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to
view all orderable parts (i.e. MC33xxxD enter 33xxx), and review parametrics.
6.
33789
8
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 4. Limits / Maximum Test Voltage for LIN Pin Transient Immunity Tests
Test Pulse
VS [V]
Pulse Repetition
Frequency [Hz]
(1/T1)
Test Duration [min]
Ri [W]
Remarks
1
-100
2
10
10
t2 = 0s
2a
+75
2
10
2
3a
-150
10
10
50
3b
+100
10
10
50
Notes
7. VSUP is applied on the VPWR pin as a test condition.
The I/V characteristic and leakage of the pin is performed before and after the test.
The supply pins and LIN must pass the VS voltage level specified in Table 4 without damage.
The failure validation during test is evaluated at RxD.
Tests perform in Normal mode on LIN (Failure on RxD), VSUP (Failure on LIN)(7).
The voltage level found is for information only.
Failure criteria on RxD in Normal Mode: 0.9 V and 7.5 µs
DUT
1.0 nF
LIN
Transient Pulse
Generator
(Note)
GND
DUT GND
Note Waveform per ISO 7637-2. Test Pulses 1, 2, 3a, 3b,.
Figure 4. Test Circuit for Transient Test Pulses (LIN)
33789
Analog Integrated Circuit Device Data
Freescale Semiconductor
9
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 5. Static Electrical Characteristics
Characteristics noted under conditions 7.0 V VSUP(8) 18 V, - 40 C TA 125 C, GND = 0 V unless otherwise noted. Typical
values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.
Symbol
Characteristic
Min
Typ
Max
Unit
Notes
POWER MANAGEMENT
VPWR
Power Supply Input Voltage
Normal Operation
5.2
-
20
VWAKE_TH
Wake-up Threshold Voltage
Normal VPWR Range
0.3* VPWR
0.5* VPWR
0.7* VPWR
V
V
RWAKE
Wake-up Input Internal Pull-down Resistance
120
200
320
VBST
Boost Converter Output Voltage
Normal VPWR Range, 0 IBST Max. IBST
31.6
33.3
35
Boost Overvoltage Threshold
36
38
40
V
VBST_OV_CLMP
Boost Overvoltage Clamping
Boost operating with active clamping
40
43
46
V
VBST_OV_HYS
Boost Overvoltage Hysteresis
2.2
2.6
3.0
V
Low VPWR as Boost Undervoltage Lockout Threshold and IGNSTAT
Detect Threshold
4.7
4.95
5.2
V
Boost Undervoltage Hysteresis
0.3
0.5
0.8
V
-
-
550
m
VBST_OV
VBST_UV
VBST_UV_HYS
k
V
RBSTSW_ON
Boost Switch Transistor On Resistance
IBSTSW_LMT
Boost Switch Current Limit
1.3
1.5
1.8
A
TSW_SHDN
Power Switch Thermal Shutdown
155
175
195
°C
TSW_HYST
Power Switch Thermal Shutdown Hysteresis
15
-
30
°C
ESRCERM
Energy Reserve Capacitor ESR Measurement Range
200
-
600
m
-
CER ESR Measurement Tolerance
-50
-
50
m
-
CER Capacitance Measurement Tolerance
-15
-
15
%
CER Charge Transistor On Resistance
3.0
10
14
CER Charge Transistor Overcurrent Shutdown Threshold
400
550
800
mA
CER Discharge Transistor On Resistance
2.0
5.5
8.0
CER Discharge Transistor Overcurrent Shutdown Threshold
350
450
800
mA
ERSW Pin Leakage Current
-
-
250
nA
IVER_LEAK
VER Pin Leakage Current
-
-
200
µA
VER_RESD
CER Residual Voltage after 10 s Discharge
-
-
2.5
V
Buck Converter Output Voltage
10 V VBST 40 V, 100 mA IBUCK IBUCK_C
8.73
9.0
9.27
V
Buck Converter Output Overvoltage Shutdown Threshold
9.6
10
10.8
V
Low VBST as Buck Converter Start-up Threshold
13.5
15.5
17.5
V
-
-
460
mVPP
RERSW_CH_ON
IERSW_CH_SHDN
RERSW_DISCH_ON
IERSW_DISCH_SHDN
IERSW_LEAK
VBUCK
VBUCK_OV_SHDN
VBUCK_UV
VBUCK_RIPL
Buck Converter Output Ripple Voltage
6.0 V VPRW 40 V, 100 mA IBUCK IBUCK_C
Notes
8. VSUP is applied on the VPWR pin as a test condition.
33789
10
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 5. Static Electrical Characteristics (continued)
Characteristics noted under conditions 7.0 V VSUP(8) 18 V, - 40 C TA 125 C, GND = 0 V unless otherwise noted. Typical
values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.
Symbol
Characteristic
Min
Typ
Max
Unit
Buck Converter Output Current Capability
400
-
-
mA
-
5.0
4.0
8.0
6.0
mV
Buck High-side Switch Current Limit
500
800
1100
mA
Sync Supply Output Voltage
6.0 V VPRW 40 V
15
-
2x VBUCK
V
-
-
300
mVPP
Sync Supply Output Current Capability
20
-
-
mA
Sync Switch Overcurrent Protection Limit
65
-
150
mA
Notes
POWER MANAGEMENT (CONTINUED)
IBUCK_C
Buck Converter Load Regulation
VBUCK_LOAD
IBUCKSW_HS_LMT
VSYNC
VSYNC_RIPL
ISYNC_C
ISYNC_OC
IBUCK = 100 mA, IBUCK = 100 mA
IBUCK = 300 mA, IBUCK = 100 mA
Sync Supply Output Ripple Voltage
6.0 V VPRW 40 V
VCC
VCC Supply Output Voltage
6.0 V VBUCK 9.5 V, 0 ICC 200 mA
4.85
5.0
5.15
V
-
VCC Supply Line Regulation
VPWR-AC = 200 mVPP, f PWR-AC 500 kHz
20
-
-
dB
-
-
10
mV
-
5.0
20
mVPP
9.0
13.5
22
mA
VCC_NOISE
VCC Supply Load Regulation
ICC-DC = 0.8* ICC_MAX, ICC = 50 mA
VCC Supply Noise Voltage
IVCCDRI_LMT
VCC Base Driver Current Limit
TA = 25°C, Temperature coefficient = 300 ppm/ °C (typ.)
VBUCK_VCC
Minimum VBUCK Voltage for VCC Operation
-
-
6.0
V
Minimum VBST Voltage for VCC Operation
-
-
7.0
V
VDD Supply Voltage
-
2.5
-
V
VBST_VCC
VDD
RESET AND WATCHDOG
VRESET_H
Reset Output High
IRESET = -2.0 mA
VCC - 0.4
-
VCC
VRESET_L
Reset Output Low
IRESET = 2.0 mA
0.0
-
0.4
V
V
VCC_OP
Rising VCC Threshold for Reset Operation
-
-
1.5
V
VCC_OV
VCC Overvoltage for Reset
5.2
-
5.5
V
VCC_UV
VCC Undervoltage for Reset
4.5
-
4.80
V
VCC Voltage Monitor Threshold Hysteresis
30
-
-
mV
VDD_OV
VDD Overvoltage for Reset
2.7
-
3.0
V
VDD_UV
VDD Undervoltage for Reset
1.85
1.90
2.10
V
0.3
-
0.8
V
VCC_VM_HYS
GNDA to GND_LIN Voltage Difference to Activate Open GNDA
VGNDA_GND_LIN_TH Detection
33789
Analog Integrated Circuit Device Data
Freescale Semiconductor
11
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 5. Static Electrical Characteristics (continued)
Characteristics noted under conditions 7.0 V VSUP(8) 18 V, - 40 C TA 125 C, GND = 0 V unless otherwise noted. Typical
values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.
Symbol
Characteristic
Min
Typ
Max
Unit
Notes
SATELLITE SENSOR INTERFACE
ISAT_BUS_SUP_Q
Satellite Bus Supply Quiescent Current
-
-
2.2
mA
ISAT_BUS_SUP
Satellite Bus Supply Operation Current
-
-
4.0
mA
ISAT_SYNC_SUP_Q
Sync Supply Quiescent Current
-
-
1.0
mA
ISAT_SYNC_SUP
Sync Supply Operation Current
-
-
1.0
mA
ISAT_VCC_Q
Satellite Logic Supply Quiescent Current
-
-
1.0
mA
ISAT_VCC
Satellite Logic Supply Operation Current
-
-
3.0
mA
VSAT_OUT
Satellite Interface DC Output Operation Voltage
0 ISAT_OUT 65 mA
5.8
6.3
6.7
-
-
0.5
30
20
-
-
dB
-
-
200
mVPP
10
-
12
V
VSAT_OUT
+ 4.3
-
VSAT_OUT
+ 5.5
V
VSAT_OUT_DIS
PSRRSAT_BUS_SUP
VSAT_RIPL
Satellite Interface DC Output Disable Voltage
ISAT_OUT = 0 mA
Satellite Interface Ripple Rejection from Bus Supply
50 kHz fRIPL 280 kHz
280 kHz fRIPL 560 kHz
Satellite Interface Ripple Voltage due to Current Modulation (typical
application configuration)
VSAT_SYNC_ABS
Sync Pulse Absolute Voltage
VSAT_SYNC_STEP
Sync Pulse Voltage Step
V
V
VSATSYNC_L
SATSYNC Input Low Voltage
-0.3
-
1.0
V
VSATSYNC_H
SATSYNC Input High Voltage
2.0
-
VCC+0.3
V
SATSYNC Input Pull-down Current
10
-
50
µA
Satellite Interface Operational Current Range
0.0
-
65
mA
Satellite Interface Pull-down Current Limit
27
-
60
mA
Satellite Interface Overcurrent Limit
70
-
120
mA
Minimum Satellite Quiescent Current Adaptation Level
1.9
-
3.8
mA
ISAT_Q_RANGE_MAX Maximum Satellite Quiescent Current Adaptation Level
35
-
50
mA
Satellite Quiescent Current for Single Satellite
Synchronous Satsync-steered Mode
4.0
-
18.5
mA
ISAT_Q_DUAL
Satellite Quiescent Current for Dual Satellite
Synchronous Satsync-steered Mode
8.0
-
26.5
mA
ISAT_Q_TOTAL
Total Bus Quiescent Current
Synchronous TDM Mode
4.0
-
35
mA
-10
-6.0
-
10
6.0
%
20
-
30
mA
ISATSYNC_PULLDN
ISAT
ISAT_PD_LIM
ISAT_OC
ISAT_Q_RANGE_MIN
ISAT_Q_SINGLE
ISAT_MOD
Satellite Quiescent Current Detect Accuracy
4.0 mA = Current Threshold = 14 mA
14 mA = Current Threshold = 35 mA
Satellite Sensor Modulation Current
ISAT_TH_RANGE
Satellite Data Comparator Current Threshold Range
15.75
-
48.25
mA
ISAT_TH_OFS
Satellite Data Comparator Threshold Current Offset
11.25
12.5
13.75
mA
ISAT_TH_HYST
Satellite Data Detection Current Threshold Hysteresis
2.0
-
3.5
mA
33789
12
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 5. Static Electrical Characteristics (continued)
Characteristics noted under conditions 7.0 V VSUP(8) 18 V, - 40 C TA 125 C, GND = 0 V unless otherwise noted. Typical
values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.
Symbol
Characteristic
Min
Typ
Max
Unit
Notes
SYNC PULSE LIMITS FOR SYNCHRONOUS TDM MODE (SEE Figure 5. SYNCHRONOUS TDM MODE SYNC PULSE TIMING)
Vt0
Sync Slope Reference Voltage
Vt2
Sync Signal Sustain Voltage
-
0.5
-
V
4.3
-
5.5
V
DC Sensor Supply Regulator Current Limit
30
-
55
mA
Current Difference Between the Regulator Overcurrent Detection
Threshold and the Regulator Current Limit
IDCREG_OC_DIFF = IDCREG_LMT - IDCREG_OC
1.0
9.0
18
V1
Regulated Output Voltage 1
1.35
1.5
1.73
V
V2
Regulated Output Voltage 2
2.25
2.5
2.75
V
V3
Regulated Output Voltage 3
4.5
5.0
5.5
V
V4
Regulated Output Voltage 4
5.85
6.5
7.15
V
-
-
25
%
DC SENSOR INTERFACE
IDCREG_LMT
IDCREG_OC_DIFF
-
Output Voltage Overshoot When Changing the Setting
Measured as Percentage of the Voltage Step
RDCREG_FBK
Regulator Feedback Load Resistance
100
200
300
k
ThDCREG_SD
Regulator Thermal Shutdown Temperature
155
175
195
°C
ThDCREG_HYS
Regulator Thermal Shutdown Hysteresis
15
-
30
°C
INx Load Capacitance
12.5
-
220
nF
KCONV
DC Sensor Interface Current to Voltage Conversion Factor (See
Figure 21)
IINx: 2.5 mA ~ 25 mA
0.163
0.177
0.190
VCONV_NLIN
DC Sensor Interface Current to Voltage Conversion Nonlinearity
-
-
20
mVRMS
0.0
0.0
0.0
0.0
28
29
33
38
50
55
60
65
mV
-
-
1.0
V
-110
-85
-30
µA
CINx
VINx_I_OFS
VINx_OFS
IINx_PULLDN
Current Measurement Output Offset Voltage
IINx = 0, CINx = 0.22 nF, RINx = 1.0 M
V1 = 1.5 V
V2 = 2.5 V
V3 = 5.0 V
V4 = 6.5 V
INx Pin Offset Voltage
Voltage Source not Enable and IINx = 0
INx Active Pull-down Current
2.0 V VINx 7.15 V and INx is not selected
(9)
mA
V/mA
Notes
9. IDCREG_OC is the regulator overcurrent detection threshold to trigger the regulator switch between a voltage source and a current source.
33789
Analog Integrated Circuit Device Data
Freescale Semiconductor
13
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 5. Static Electrical Characteristics (continued)
Characteristics noted under conditions 7.0 V VSUP(8) 18 V, - 40 C TA 125 C, GND = 0 V unless otherwise noted. Typical
values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.
Symbol
Characteristic
Min
Typ
Max
Unit
Notes
ANALOG OUTPUT
VAOUT
Analog Output Voltage
GND
-
VCC
V
Analog Buffer Offset
-20
-
20
mV
A
Analog Output Buffer Gain
For Output Voltage Monitors
For DC Sensor Interface INx Voltage Monitors
0.99
0.48
1.0
0.5
1.01
0.52
K1
Scale Factor of Pin VBST Monitor
VBST 35 V
8.0
8.5
9.1
K2
Scale Factor of Pin VER Monitor
VER 35 V
8.0
8.5
9.1
K3
Scale Factor of Pin VERDIAG Monitor
4.5
5.0
5.5
K4
Scale Factor of Pin VBUCK Monitor
VBUCK 10 V
2.6
2.8
2.9
K5
Scale Factor of Pin VSYNC Monitor
VSYNC 20 V
4.5
5.0
5.5
K6
Scale Factor of Pin VPWR Monitor
VPWR 20 V
5.2
5.6
5.9
K7
Scale Factor of Pin OUTx_D Monitor
5.2
5.6
5.9
K8
Scale Factor of Pin OUTx_S Monitor
5.2
5.6
5.9
VAOUT_OFS
CONFIGURABLE DRIVERS
VOUTx_S_ON_HS
Drain-Source On Voltage in High-side Driver Configuration
VOUTx_D = 18 V, IOUTx_S = 70 mA
VOUTx_D
– 0.5
-
VOUTx_D
V
VOUTx_D_ON_LS
Drain-Source On Voltage in Low-side Driver Configuration
VOUTx_S = 0 V, IOUTx_D = 70 mA
VOUTx_S
-
VOUTx_S
+ 0.5
V
IOUTx_S_LMT
High-side Driver Current Limit
VOUTx_D = 18 V, VOUTx_S = 0 V
70
-
110
mA
IOUTx_D_LMT
Low-side Driver Current Limit
VOUTx_D = 18 V, VOUTx_S = 0 V
-110
-
-70
mA
ThOUTx_SD
Driver Thermal Shutdown Temperature
155
175
195
°C
ThOUTx_HYS
Driver Thermal Shutdown Hysteresis
15
-
30
°C
-1.0
45
-
1.0
100
µA
-1.0
-100
-
1.0
-45
µA
0.4 x VPWR
-
0.6 x VPWR
V
-1.0
50
-
1.0
100
µA
IOUTx_D_LEAK_GND
Drain Leakage to GND
VRESET = 0 V, or in Sleep Mode, VOUTx_D = 0 V
IOUTx_D_LEAK_BAT
Drain Leakage to Battery
VRESET = 0 V, VOUTx_D = VPWR
VOUTx_D_OPEN
IOUTx_S_LEAK_GND
VRESET = 5 V, VPWR = 18 V, Driver Off, VOUTx_D = 0 V
VRESET = 5.0 V, VPWR =18 V, Driver Off, VOUTx_D = 18 V
Open Drain Voltage
VRESET = 5.0 V, Driver Off
Source Leakage to GND
VRESET = 0 V, or in Sleep Mode, VOUTx_S = 0 V
VRESET = 5.0 V, VPWR = 18 V, Driver Off, VOUTx_S = 0 V
33789
14
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 5. Static Electrical Characteristics (continued)
Characteristics noted under conditions 7.0 V VSUP(8) 18 V, - 40 C TA 125 C, GND = 0 V unless otherwise noted. Typical
values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.
Symbol
Characteristic
Min
Typ
Max
Unit
0.0
-100
-
300
-50
µA
Open Source Voltage
VRESET = 5.0 V, Driver Off
0.4 x VPWR
-
0.6 x VPWR
V
VTH_2/3
2/3 VPWR Comparator Threshold for Diagnostics
6.0 V VPWR 18 V
0.6 x VPWR
0.666 x
VPWR
0.734 x
VPWR
V
VTH_1/3
1/3 VPWR Comparator Threshold for Diagnostics
6.0 V VPWR 18 V
0.266 x
VPWR
0.333 x
VPWR
0.4 x VPWR
V
DOUTx
PWM Duty Cycle
Fixed Frequency = 128 Hz, Increment step = 1.6%
0.0
-
100
%
Notes
CONFIGURABLE DRIVERS (CONTINUED)
IOUTx_S_LEAK_BAT
VOUTx_S_OPEN
Source Leakage to Battery
VRESET = 0 V, VOUTx_S = VPWR
VRESET = 5.0 V, VPWR = 18 V, Driver Off, VOUTx_S = 18 V
GENERAL LOGIC INPUTS: CS, CS_X, SCK, SI, ASST, SCRAP, CLK
VLGIN_H
Logic Input High
2.0
-
VCC + 0.3
V
VLGIN_L
Logic Input Low
-0.3
-
1.0
V
10
-
50
µA
-2.0
-
5.0
µA
ILGIN_PULLUP
ILGIN_LEAK
Logic Input Pull-up Current
For CS: VLGIN = VCS 2.0 V
For others: VLGIN 4.5 V
Logic Input Leakage
VLGIN = VDD
SPI (OTHERS) AND SPI MONITOR INTERFACE
VSO_L
SO Voltage Low
ISO = 0.5 mA
-
-
0.4
V
VSO_H
SO Voltage High
ISO = -0.2 mA
VCC - 0.4
-
VCC
V
ANALOG SENSOR INPUT
VIN_ANA
Analog Sensor Input Voltage
0.0
-
VCC
V
IIN_ANA
Analog Sensor Input Pull-down Current
2.0
-
8.0
µA
ARM ENABLE / DISABLE OUTPUTS
VARM_H
ARM / DISARM Output High
VCC - 0.4
-
VCC
V
VARM_L
ARM / DISARM Output Low
0.0
-
0.4
V
ARM / DISARM Output High-impedance Leakage
-2.0
-
2.0
µA
PPT Input Pull-down Resistance
100
230
400
k
PPT Input Test Mode Enable Threshold
4.0
4.5
5.0
V
IARM_LEAK
PRODUCTION PROGRAM AND TEST INPUT
RPPT_IN
VPPT_TEST
33789
Analog Integrated Circuit Device Data
Freescale Semiconductor
15
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 5. Static Electrical Characteristics (continued)
Characteristics noted under conditions 7.0 V VSUP(8) 18 V, - 40 C TA 125 C, GND = 0 V unless otherwise noted. Typical
values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.
Symbol
Characteristic
Min
Typ
Max
Unit
Notes
LIN TRANSCEIVER LOGIC INTERFACE
VRXD_OL
RXD Output Low Level Voltage
IRXD_IN 1.5 mA sinking current
0.0
—
0.9
VRXD_OH
RXD Output High Level Voltage
IRXD_OUT 250 A source current
4.25
—
5.25
V
V
VTXD_IL
TXD Input Low Level Voltage
—
—
0.8
V
VTXD_IH
TXD Input High Level Voltage
2.0
—
—
V
TXD Input Threshold Voltage Hysteresis
100
300
600
mV
TXD Pull-up Current Source
1.0 V < VTXD < 3.5 V
- 60
- 35
- 20
VTXD_IN_HYST
ITXD_PULLUP
A
LIN TRANSCEIVER PHYSICAL LAYER (14),(12)
VBAT
Operating Voltage Range
8.0
–
18
V
VSUP
Operating Supply Voltage Range
7.0
–
18
V
Supply Voltage Range (within which the device is not destroyed)
-0.3
–
40
V
40
90
200
-1.0
–
–
–
–
20
-1.0
–
1.0
VBAT Disconnected; VSUP_DEVICE = GND; 0 V < VBUS < 18 V
–
–
VBUSDOM
Receiver Dominant State
–
VBUSREC
Receiver Recessive State
VBUS_CNT
Receiver Threshold Center
(VTH_DOM + VTH_REC)/2
VSUP_NON_OP
IBUS_LIM
Current Limitation for Driver Dominant State
Driver ON, VBUS = 18 V
IBUS_PAS_DOM
Input Leakage Current at the Receiver
Driver off; VBUS = 0 V; VBAT = 12 V
IBUS_PAS_REC
Leakage Output Current to GND
Driver Off; 8.0 V VBAT 18 V; 8.0 V VBUS 18 V; VBUS VBAT;
IBUS_NO_GND
Control Unit Disconnected from Ground
GNDDEVICE = VSUP; VBAT = 12 V; 0 < VBUS < 18 V
IBUSNO_BAT
VHYS
VBUS VSUP
Receiver Threshold Hysteresis
(VTH_REC - VTH_DOM)
mA
mA
µA
mA
(11)
100
µA
(13)
–
0.4* VSUP
V
0.6* VSUP
–
–
V
0.475*
VSUP
0.5* VSUP
0.525*
VSUP
V
–
–
0.175*
VSUP
V
VSERDIODE
Voltage Drop at the Serial Diode in Pull-up Path
0.4
–
1.0
V
VSHIFT_BAT
VBAT_SHIFT
0.0
–
11.5%
VBAT
VSHIFT_GND
GND_SHIFT
0.0
–
11.5%
VBAT
VUVL, VUVH
LIN Undervoltage Threshold (positive and negative)
5.9
–
6.7
V
–
100
–
mV
VUVHYST
LIN Undervoltage Hysteresis (VUVL - VUVH)
(10)
33789
16
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 5. Static Electrical Characteristics (continued)
Characteristics noted under conditions 7.0 V VSUP(8) 18 V, - 40 C TA 125 C, GND = 0 V unless otherwise noted. Typical
values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.
Symbol
Characteristic
Min
Typ
Max
Unit
Notes
LIN TRANSCEIVER PHYSICAL LAYER (CONTINUED) (14),(12)
VBUSWU
LIN Wake-up Threshold from Sleep Mode
–
4.3
5.0
V
RSLAVE
LIN Pull-up Resistor to VSUP
20
40
60
k
Notes
10. Voltage range at the battery level, including the reverse battery diode.
11. Loss of local ground must not affect communication in the residual network.
12. In this LIN Physical Layer EC section, use VSUP to represent VPWR and use VBUS to represent VLIN, in order to be consistent with the LIN
Protocol Specification, and other Freescale LIN product specifications.
13. Node has to sustain the current that can flow under this condition. The bus must remain operational under this condition.
14. Guaranteed by design.
33789
Analog Integrated Circuit Device Data
Freescale Semiconductor
17
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 6. Dynamic Electrical Characteristics
Characteristics noted under conditions 7.0 V VSUP(15) 18 V, - 40 C TA 125 C, GND = 0 V unless otherwise noted. Typical
values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.
Symbol
Characteristic
Min
Typ
Max
Unit
Notes
POWER MANAGEMENT
tBSTSW
Boost Switch Transistor Switching Time
20
50
150
ns
tSYNCSW
Sync Switch Transistor Switching Time
10
-
250
ns
tVCC_RISE
VCC Voltage Rise Time
From 0.1xVCC to 0.9xVCC
200
-
1800
µs
tVCC_VM_REJ
VCC Voltage Monitor Deglitch Filter Time
45
50
55
µs
tVCC_VM_RST
VCC Voltage Monitor Reset Time Delay
10
-
15
ms
tWDW_MIN
Watchdog Refresh Window Lower Limit
275
-
400
µs
tWDW_MAX
Watchdog Refresh Window Upper Limit
650
-
900
µs
-
Reset Pin Activation Time for Watchdog Error
0.7
-
1.0
ms
fBST/BUCK
Boost and Buck Regulators Switch Frequency
Low Speed Frequency
High Speed Frequency
133
232
140
245
147
258
kHz
fSYNC_CP
Sync Supply Charge Pump Switch Frequency
-
160
-
kHz
3.92
3.98
4.00
4.00
4.08
4.02
MHz
118.75
125
131.25
kHz
45
47
-
55
53
%
(16)
SATELLITE SENSOR INTERFACE PSI5
fCLK
Satellite Interface Input Clock Frequency
Synchronous SATSYNC-steered mode
Synchronous TDM mode
fSAT
Satellite bit Rate Operation Range
DSAT_IMOD
Satellite Sensor Current Modulation Duty Cycle
Synchronous SATSYNC-steered mode
Synchronous TDM mode
tSAT_IMOD_FR
Satellite Sensor Current Signal Rising and Falling Time
From 10% to 90% of Modulation Amplitude
0.5
-
1.0
µs
SRSAT_IMOD
Satellite Sensor Current Signal Slew Rate
16
-
48
mA/µs
tSAT_SYNC_FR
Sync Pulse Rising and Falling Time
3.0
4.0
6.0
µs
tSAT_IQ_FLT
Satellite Quiescent Current Sampling Filter Time Constant
-
60
-
µs
tSAT_IQ_DET
Satellite Quiescent Current Out of Range Detection Time
3/fCLK
-
4/fCLK
µs
tSAT_OC_DET
Satellite Current Overcurrent Detection Time
-
512
-
µs
3.5
-
4.0
ms
tSAT_OC_SDDEL
Satellite Interface Overcurrent Shutdown Delay
tSATSYNC_PER = 500 µs, tSAT_OC_DET = 512 µs
tSAT_TH_DEL_
Satellite Data Detection Delay Difference Between Rising Edge and
Falling Edge
-
-
250
ns
tSAT_IQ_INIT_DEL
Initial Satellite Quiescent Current Measurement Delay
-
10
-
ms
tSAT_IQ_INIT_DUR
Initial Satellite Quiescent Current Measurement Duration
-
35
-
ms
Notes
15. VSUP is applied on the VPWR pin as a test condition.
16.
The switching frequency used for the Boost and Buck supplies is selectable via the SPI with a LIN_CONFIG command at either a low-speed or
high-speed switching mode.
33789
18
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 6. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions 7.0 V VSUP(15) 18 V, - 40 C TA 125 C, GND = 0 V unless otherwise noted. Typical
values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.
Symbol
Characteristic
Min
Typ
Max
Unit
Notes
SATELLITE SENSOR INTERFACE PSI5 (CONTINUED)
tSAT_IQ_ DEL
Satellite Quiescent Current Measurement Delay
-
5.0
-
µs
tSAT_IQ _DUR
Satellite Quiescent Current Measurement Duration
-
3.0
-
µs
Satellite Quiescent Current Measurement Delay with No Bus Activity
-
120
-
µs
tSAT_IQ_ DEL_NA
SYNC PULSE LIMITS FOR SYNCHRONOUS TDM MODE (SEE Figure 5, Synchronous TDM Mode Sync Pulse Timing)
t0
Reference Time Base
-
0.0
-
µs
t1
Sync Signal Earliest Start
-
-3.0
-
µs
t2
Sync Signal Sustain Start
0
7.0
-
µs
-
Sync Rising Slope Slew Rate
0.43
-
1.5
V/µs
-
Sync Falling Slope Slew Rate
-1.5
-
-
V/µs
t3
Sync Signal Sustain Time
-
16
-
µs
t4
Sync Discharge Time Limit
-
35
-
µs
44
-
-
µs
tSLOT1_START
Start of First Sensor Data Word
(Remaining discharge current < 2.0 mA)
SATELLITE TIMING LIMITS FOR SYNCHRONOUS TDM MODE (SEE Figure 6, Synchronous TDM Mode Satellite Interface Timing)
tSYNC
tSATSYNC_WIDTH
Sync Pulse Period
495
500
505
µs
Satsync Input Pulse Width
40
-
-
µs
tSLOT1_START
Slot1 Start Time (relative to t0)
-
44
-
µs
tSLOT2_START
Slot2Start Time (relative to t0)
-
181.3
-
µs
tSLOT3_START
Slot3 Start Time (relative to t0)
-
328.9
-
µs
tSLOT3_END
Slot3 End Time (relative to t0)
-
492
-
µs
-2.1
-
2.1
µs
tEMC
Timing Variation Margin
SATELLITE TIMING LIMITS FOR SYNCHRONOUS SATSYNC-STEERED MODE (SEE Figure 7, Synchronous Satsync-Steered Mode Satellite Interface
Timing)
PSI5_x Activation Time from Rising Edge of Chip Select (1)
1.0
-
10
µs
tSATSYNC_PER
Satsync Period (2)
167
-
µs
tSATSYNC_PH1
Satsync Phase 1 Time (3)
-
200
-
µs
tSATSYNC_PH0
Satsync Phase 0 Time (4)
-
170
-
µs
250
-
750
ns
tSAT_ACT
tSATSYNC_S_DEL
Satsync Sampling Delay Time (5)
(1/ FSAT_CLK to 3/ FSAT_CLK)
tSAT_SYNC_WIDTH
Sync Pulse Width (6)
-
32
34
µs
Channel Stagger Time (7)
(16/ FSAT_CLK)
-
4.0
-
µs
tSAT_STAGGER
tSAT_SYNC_GEN_DEL SYNC Pulse Generation Delay (8)
-
-
2.5
µs
tSAT_SYNC_BLANK
Sync Blanking Time (Decoder disabled) (9)
-
69
-
µs
tSAT_PHASE_BLANK
Phase Transition Blanking Time (Manchester Decoder disabled) (10)
-
10
-
µs
81.48
-
156.5
µs
tSAT_MSG
Message Time (11)
33789
Analog Integrated Circuit Device Data
Freescale Semiconductor
19
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 6. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions 7.0 V VSUP(15) 18 V, - 40 C TA 125 C, GND = 0 V unless otherwise noted. Typical
values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.
Symbol
Characteristic
Min
Typ
Max
Unit
Notes
DC SENSOR INTERFACE AND ANALOG OUTPUT
tMEAS
DC Sensor Measurement Duration
0.5
-
2.0
ms
tDCREG_SET
Supply Regulator Setting Time
VINx = 90% x V4 = 90% x 6.5 V,
-
-
70
µs
|dVInx/dt|
Regulator Output Switch Slew Rate
0.08
5.0
7.0
V/µs
-
-
40
70
135
190
210
mV/µs
-
248
-
µs
tAOUT_SETL
IInx = 20 mA, CInx = 10 nF
Analog Output Settling Time
CL = 0.22 nF, RL = 1.0 M
AOUT = 90% final value
AOUT = 99% final value
µs
CONFIGURABLE DRIVERS
|dVOUTx/dt|
tLATCH_DELAY
Driver Output Switching Slew Rate Control
6.0 V < VOUTx <18 V, RLOAD = 273 , CLOAD = 100 nF
Delay for Comparator Latch (992/FCLK)
SPI AND SPI MONITOR INTERFACE (SEE Figure 8. SPI TIMING, WITH AN EXTERNAL PULL-UP OF 47 k OR 110 ΜA ON DO)
fSCK
SCK Frequency
-
-
8.08
MHz
tSCK _H
SCK High Time (A)
1/2 tSCK
- 13
-
-
ns
tSCK _L
SCK High Time (B)
1/2 tSCK
- 13
-
-
ns
123.7
-
-
ns
tSCK
SCK Period (C)
tFALL
SCK Falling Time (D)
5.5
-
13
ns
tRISE
SCK Rising Time (E)
5.5
-
13
ns
tSET
SI Setup Time (F)
37
-
-
ns
tHOLD
SI Hold Time (G)
49
-
-
ns
tACC
SO Access Time (H)
-
-
43
ns
SO Valid Time after SCK (I)
-
-
30
ns
0.0
-
-
ns
-
-
750
ns
tVALID
tLAG
SO Lag Time (J)
tDISABLE
SO Disable Time (K)
tCS_LEAD
CS Lead Time (L)
1/2 tSCK
-
-
ns
tCS_LAG
CS Lag Time (M)
1/2 tSCK
-
-
ns
Sequential Data Transfer Delay (N)
3/ FCLK
-
-
µs
tTD
ADDITIONAL COMMUNICATION LINE (ACL) INPUT FOR SCRAP
tKEY_TOUT
Scrap KEY Timeout
-
-
600
µs
ACL Period
180
200
220
ms
tACL_H
ACL Pulse High Time
126
140
154
ms
tACL_L
ACL Pulse Low Time
54
60
66
ms
tACL
33789
20
Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 6. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions 7.0 V VSUP(15) 18 V, - 40 C TA 125 C, GND = 0 V unless otherwise noted. Typical
values noted reflect the approximate parameter means at TA = 25°C under nominal conditions unless otherwise noted.
Symbol
Characteristic
Min
Typ
Max
Unit
Notes
LIN PHYSICAL LAYER: DRIVER CHARACTERISTICS FOR NORMAL SLEW RATE - 20.0 KBIT/SEC ACCORDING TO THE LIN PHYSICAL LAYER
SPECIFICATION(17), (18)
D1
Duty Cycle 1:
THREC(MAX) = 0.744 * VSUP
THDOM(MAX) = 0.581 * VSUP
%
D1 = tBUS_REC(MIN)/(2 x tBIT), tBIT = 50 µs, 7.0 V VSUP18 V
D2
39.6
—
—
Duty Cycle 2:
THREC(MIN) = 0.422 * VSUP
THDOM(MIN) = 0.284 * VSUP
%
D2 = tBUS_REC(MAX)/(2 x tBIT), tBIT = 50 µs, 7.6 V VSUP18 V
—
—
58.1
LIN PHYSICAL LAYER: DRIVER CHARACTERISTICS FOR SLOW SLEW RATE - 10.4 KBIT/SEC ACCORDING TO LIN PHYSICAL LAYER
SPECIFICATION(17), (19)
D3
Duty Cycle 3:
THREC(MAX) = 0.778 * VSUP
THDOM(MAX) = 0.616 * VSUP
%
D3 = tBUS_REC(MIN)/(2 x tBIT), tBIT = 96 µs, 7.0 V VSUP18 V
41.7
—
—
Duty Cycle 4:
THREC(MIN) = 0.389 * VSUP
D4
%
THDOM(MIN) = 0.251 * VSUP
D4 = tBUS_REC(MAX)/(2 x tBIT), tBIT = 96 µs, 7.6 V VSUP18 V
LIN PHYSICAL LAYER: RECEIVER CHARACTERISTICS
t REC_PD
t REC_SYM
—
—
59
(20)
Propagation Delay and Symmetry
Propagation Delay of Receiver, tREC_PD = MAX (tREC_PDR,
tREC_PDF)
Symmetry of Receiver Propagation Delay, tREC_PDF - tREC_PDR
—
—
6.0
- 2.0
—
2.0
TXD Permanent Dominant State Delay
3.75
5.0
—
50
s
(21)
6.25
ms
(22)
80
s
(23)
TXD TIMING
t TXDDOM
t LIN_1STDOM
First Dominant bit Delay
The transmitter delay before sending the first dominant bit, after
the transceiver is activated
Notes
17. Bus load RBUS and CBUS 1.0 nF / 1.0 k, 6.8 nF / 660 , 10 nF / 500 . Measurement thresholds: 50% of TXD signal to LIN signal threshold defined
at each parameter. See Figure 9. In Figure 9, use VSUP to represent the VPWR pin, and use GND to represent both the GND and GND_LIN VLIN
pins, in order to be consistent with LIN Protocol Specification, and other Freescale LIN product specifications.
18. See Figure 10.
19. See Figure 11.
20. VSUP from 7.0 to 18 V, bus load RBUS and CBUS 1.0 nF / 1.0 k, 6.8 nF / 660 , 10 nF / 500 . Measurement thresholds: 50% of TXD signal to
LIN signal threshold defined at each parameter. See Figure 9.
21. See Figure 12.
22. The LIN is in Recessive state and the receiver is still active.
23. The First Dominant bit delay normally has no impact to LIN communication, but may need additional care on the software for ISO 9141 (K-line)
communication initialization.
33789
Analog Integrated Circuit Device Data
Freescale Semiconductor
21
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
TIMING DIAGRAMS
Figure 5. Synchronous TDM Mode Sync Pulse Timing
tSAT_SYNC
Figure 6. Synchronous TDM Mode Satellite Interface Timing
33789
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Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
Voltages
SPI CS
Satsync
Satsync
(Internal)
PSI5_1
Current
PSI5_2
Figure 7. Synchronous Satsync-Steered Mode Satellite Interface Timing
Figure 8. SPI Timing
33789
Analog Integrated Circuit Device Data
Freescale Semiconductor
23
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
VSUP
VSUP
TXD
R0
LIN
RXD
GND
C0
Note R0 and C0: 1.0 k/1.0 nF, 660 /6.8 nF, and 500 /10 nF.
Figure 9. Test Circuit for Timing Measurements
TXD
TBIT
VLIN_REC
TBIT
tBUS_DOM(MAX)
tBUS_REC(MIN)
THREC(MAX) 74.4% VSUP
Thresholds of
receiving node 1
THDOM(MAX) 58.1% VSUP
LIN
Thresholds of
receiving node 2
THREC(MIN) 42.2% VSUP
THDOM(MIN) 28.4% VSUP
tBUS_DOM(MIN)
tBUS_REC(MAX)
RXD
Output of receiving Node 1
tREC_PDF(1)
tREC_PDR(1)
RXD
Output of receiving Node 2
tREC_PDR(2)
tREC_PDF(2)
Figure 10. LIN Timing Measurements for Normal Baud Rate
33789
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Analog Integrated Circuit Device Data
Freescale Semiconductor
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
TXD
TBIT
TBIT
tBUS_DOM(MAX)
VLIN_REC
tBUS_REC(MIN)
THREC(MAX) 77.8% VSUP
Thresholds of
receiving node 1
THDOM(MAX) 61.6% VSUP
LIN
Thresholds of
receiving node 2
THREC(MIN) 38.9% VSUP
THDOM(MIN) 25.1% VSUP
tBUS_DOM(MIN)
tBUS_REC(MAX)
RXD
Output of receiving Node 1
tREC_PDF(1)
tREC_PDR(1)
RXD
Output of receiving Node 2
tREC_PDF(2)
tREC_PDR(2)
Figure 11. LIN Timing Measurements for Slow Baud Rate
VLIN_REC
VBUSREC
0.6% VSUP
VBUSDOM
0.4% VSUP
VSUP
LIN BUS SIGNAL
RXD
tREC_PDF
tREC_PDR
Figure 12. LIN Receiver Timing
33789
Analog Integrated Circuit Device Data
Freescale Semiconductor
25
FUNCTIONAL DESCRIPTION
INTRODUCTION
FUNCTIONAL DESCRIPTION
INTRODUCTION
The 33789 provides an integrated solution for multiple basic functions in an air bag control module.
As a system basis chip, the 33789 supplies different voltages to a complete airbag system with centralized power management. It
controls the wake-up and power down of the system through the Power Mode Control function. It runs the Watchdog State Machine to
respond to the MCU refresh and controls all of internal and external resets. It operates in Safing mode to prevent inadvertent deployment
of the airbags, and thereby secure the occupants safety. It also operates in Scrap mode, to allow for the disposal of the unused pyrotechnic
devices (squibs) at the end of vehicle life. For different voltage applications, it uses internal switches to boost battery voltage up to 33 V
to supply external squib drivers and to charge the energy reserve. It then combines internal buck switches and the charge pump to create
bus and sync supplies for satellite sensors, and uses an external bipolar transistor to supply VCC for all on-board IC cores.
Safing is another key function of the 33789. There are four SPI5 satellite sensor interfaces, nine DC sensor inputs, and one highly
accurate analog input, equipped on the 33789 for the airbag system acquiring different types of safing data. The SPI Monitor in the safing
block monitors on-board sensor data and satellite sensor data read by the MCU via the SPI. The on-chip safing logic compares all of the
sensor data to the configurable thresholds, and thereby determines whether a safety event (collision) is happening. Whenever a collision
is detected, an arm control will be created in which complementary ARM and DISARM logic outputs are activated.
The 33789 can output two PWM signals with high-side/low-side configurable drivers, which can be used to drive alert indicators. The
33789 outputs a multiplexed analog signal to the MCU for diagnostics on all DC sensors, power supplies, and configurable driver outputs.
A LIN / ISO-9141 physical layer interface can be used to communicate with either LIN based Occupant Classification Systems or
vehicle diagnostics. Its communication mode can be selected by the MCU through the SPI.
FUNCTIONAL PIN DESCRIPTION
POWER SUPPLY INPUT (VPWR)
VPWR is the system power supply input. It takes a protected 12 V vehicle battery input, which should be protected for load dump
and reverse battery. Additional filtering is preferred for better EMC performance.
WAKE-UP INPUT (WAKE)
WAKE is a battery voltage, active high logic input. When activated, it brings the system out of sleep mode by starting the boost and
buck converters.
Internally, the WAKE input is implemented with a 200 k pull-down resistance and a 1.0 ms glitch filter.
BOOST SWITCH OUTPUT (BSTSW)
BSTSW is an internal low-side switch output. When the switch is turned on, its voltage will be pulled down close to GND (VBSTGND),
thus increasing the current in the boost inductor. When the switch is turned off, the un-interrupted current will charge the boost capacitor.
BOOST SUPPLY INPUT (VBST)
The VBST pin is externally connected to the boost capacitor. It inputs VBST as a regulated higher voltage supply, and distributes it
internally for all sub-system applications.
BOOST COMPENSATION CONNECTION (BSTCOMPX)
The two boost compensation pins are used for connecting an external RC filter in the boost converter feedback loop.
ENERGY RESERVE SWITCH OUTPUT (ERSW)
ERSW is an energy reserve control output. It is connected to a charge/discharge switch pair. When the energy reserve voltage across
the energy reserve capacitor CER is lower than the target value, the internal charge switch will be turned on to provide source current from
the boost supply to charge CER. A short discharge pulse can be used for measuring CER capacitance and ESR.
ENERGY RESERVE MONITOR (VER)
VER is a voltage input for the system, to monitor the voltage across CER, to maintain enough energy storage.
ENERGY RESERVE DIAGNOSTIC INPUT (VERDIAG)
VER and VERDIAG both monitor the voltage across CER. However, VERDIAG only takes AC samples coupled by an external capacitor.
The VERDIAG sample will be processed with 10-bit ADC and sent to the MCU for CER diagnostics.
33789
26
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DESCRIPTION
FUNCTIONAL PIN DESCRIPTION
BUCK SWITCH OUTPUT (BUCKSW)
BUCKSW is a synchronous half-bridge switch output for the buck converter, to create VBUCK on CBUCK. When VBUCK is below the
target threshold, the high-side switch is turned on to charge CBUCK, sourcing current from the internal VBST connection. Once VBUCK has
reached the threshold, the high-side switch is turned off and the low-side driver is turned on for the current circulation.
BUCK SUPPLY INPUT (VBUCK, VBUCK_R)
The 33789 uses two pins to input VBUCK. VBUCK provides supply source for the Sync charge pump and other internal applications,
while VBUCK_R shares all applications except Sync.
BUCK COMPENSATION CONNECTION (BUCKCOMPX)
The two buck compensation pins are used for connecting an external RC filter in the buck converter feedback loop.
CHARGE PUMP CAPACITOR CONNECTION (CPCX)
A charge pump capacitor is connected between CPC1 and CPC2.
SYNC SUPPLY CONNECTION (VSYNC)
The internal charge pump outputs current to charge CSYNC, which is externally connected on this pin, to achieve VSYNC. The satellite
sensor interface block sources VSYNC to create sync pulse internally.
DEDICATED GROUND CONNECTIONS FOR SWITCHING POWER SUPPLIES (BSTGND, BUCKGND, CPGND)
There are three dedicated ground connection pins designed for the boost converter, buck converter, and charge pump ground returns
respectively, to shorten their own current loops for the best EMC performance. Eventually, all of ground pins, including GNDA, VSS,
GND_LIN, and GND_PSI, must be connected together and terminated on the circuit board ground.
ANALOG GROUND (GNDA)
The ground return terminal or ground source pin for analog circuits.
DIGITAL GROUND (VSS)
The ground return terminal or ground source pin for logic circuits.
5.0 V VCC TRANSISTOR BASE DRIVER OUTPUT (VCCDRI)
The VCCDRI pin is an internal driver output to control the base pin of an external PNP transistor to regulate 5.0 V VCC.
5.0 V VCC INPUT (VCC)
The VCC pin is used to input 5.0 V VCC, which supplies the internal analog circuit and provides feedback for the linear regulator.
2.5 V VDD CONNECTION (VDD)
2.5 V VDD is converted from VPWR and VBUCK, to supply internal logic circuits. The VDD pin is the connection point between the
internal VDD regulator driver and its external load capacitor.
RESET (RESET)
The RESET pin is the reset driver output to issue global resets to other system ICs.
PRODUCTION PROGRAMMING AND TEST (PPT)
The PPT pin is an active high enable input. It will be only used by manufacturers to program and test the circuit during production.
It should not be connected to any application circuit externally. The PPT pin should be grounded to secure airbag system operation.
LIN INTERFACE (LIN)
The LIN pin is a LIN 2.1 compatible physical layer interface to communicate with devices or diagnostic systems external to the airbag
ECU.
LIN GROUND (GND_LIN)
The dedicated ground for LIN (or K-line) interface.
33789
Analog Integrated Circuit Device Data
Freescale Semiconductor
27
FUNCTIONAL DESCRIPTION
FUNCTIONAL PIN DESCRIPTION
UART CONNECTION (TXD, RXD)
The 33789 uses TXD and RXD ports to receive and transmit 5.0 V logic level LIN bus data through the MCU UART interface.
DC SENSOR INPUTS (INX)
There are nine switch mode analog inputs, IN1 through IN9, on the 33789 to monitor the switch mode sensor status of up to 9
independent DC type sensors. The sensors can be Hall-effect sensors, resistive sensors, on/off switches, or any other regular analog
sensors. The 33789 supplies one of four selectable bias voltages for each channel, multiplexes the sensor inputs, and outputs them in
serial to the MCU through the AOUT pin.
ANALOG DIAGNOSTIC OUTPUT (AOUT)
The AOUT pin outputs multiple scanned, rescaled, and buffered analog signals to the MCU. With the AOUT signal, the MCU can
read DC sensor status, and conduct diagnostics on DC sensors, configurable driver outputs, and all power supplies.
CONFIGURABLE DRIVER OUTPUTS (OUTX_D, OUTX_S)
The 33789 provides two general purpose low current drivers. Each one can be independently configured as either a high-side or a
low-side driver by a SPI command. Both the drain and the source terminals of each driver have dedicated pins for external connections.
SATELLITE SENSOR INTERFACES (PSI5_X)
The four satellite sensor interface pins, PSI5_1 through PSI5_4, provide four PSI5 V 1.3 physical connections. All four channels can
be enabled or disabled via SPI commands. Each channel can be used to connect up to three satellite sensors in PSI5-P10P-500/3L
Synchronous TDM mode, or up to two satellite sensors in Synchronous Satsync-steered mode. The MCU can retrieve the currentmodulated sensor data and query the channel status via the SPI.
SYNC-PULSE ACTIVATION SIGNAL INPUT (SATSYNC)
The MCU provides a periodic Satsync signal to the 33789 at the SATSYNC pin to activate higher voltage sync pulse generation,
The 33789 adds the sync pulses on each satellite channel in sequence, to synchronize the satellite data sampling.
SATELLITE SENSOR INTERFACE CLOCK INPUT (CLK)
The PSI5 interface block receives a 4.0 MHz clock input from the MCU at the CLK pin, and uses it for satellite sensor signal decoding
and synchronizing other internal logic processing.
SATELLITE GROUND (GND_PSI)
GND_PSI is a dedicated common ground connection point for all PSI5 satellite sensor channels.
SERIAL PERIPHERAL INTERFACE (SPI) DATA INPUT (SI)
Since the 33789 is configured as a slave device connected on the Master Out Slave In (SI) line of SPI bus, the SI pin is implemented
as an SPI data serial input pin.
SPI DATA OUTPUT (SO)
SO is a Slave Data Output pin for the 33789 to send serial data out via the SPI bus.
SPI CLOCK (SCK)
The 33789 uses the SCK pin to receive the SPI clock signal from the MCU. The SPI clock is used to synchronize the data transaction
and the logic processing at the SPI interface block.
SPI CHIP SELECTS (CS)
The MCU selects to communicate with the 33789 by pulling CS pin to ground. Once the data transaction is completed, the voltage
level on the CS pin will return high.
33789
28
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DESCRIPTION
FUNCTIONAL PIN DESCRIPTION
CHIP SELECTS FOR SPI MONITOR (CS_X)
When the MCU sends a “sensor request” over the SPI interface, the 33789 SPI Monitor listens to the sensor response and extracts
valid sensor data from up to four sources using additional chip select signals on CS_x:
• CS: dedicated for satellite sensors
• CS_A: Intended for an on-board accelerometer
• CS_B: Intended for an on-board accelerometer or an expansion satellite receiver
• CS_C: Intended for an expansion satellite receiver
ANALOG SENSOR INPUT (A_SENSOR)
There is one analog safing sensor input on the 33789. The analog signal input from the A_SENSOR pin is processed by a 10-bit
ADC and digital filters. The 10-bit sensor data result will be stored in a holding register for the SPI reading.
ANALOG SENSOR SELF-TEST (ASST)
The MCU can run a self-test on the on-board analog sensor without triggering Arming. The MCU would need to issue a disable signal
to the safing block to ignore the analog sensor data during its self-test period. The ASST pin on the 33789 is the digital input to receive
this disable signal. Once the ASST pin is pulled high by the MCU, the internal digit filter will not process the analog sensor data, and the
analog sensor register will not be loaded for comparison.
ARM OUTPUT (ARM, DISARM)
The 33789 uses a pair of digit output pins, ARM and DISARM, with opposite logic, for the Arming output. They can be directly used
by squib drivers as a squib firing enable and/or disable inputs.
Both the ARM and DISARM pins are set to high-impedance under the following conditions:
• During resets
• Arm Lockout
• While the Safing State Machine is in Start-up mode
SCRAP CONTROL (SCRAP)
The SCRAP pin on the 33789, is also called ACL input, for an Additional Communication Line, per the ISO-26021 standard. It is a
digital signal input to receive the ACL signal from either the MCU or an external device. The ACL signal will be used by the 33789 to
determine if it should stay in, or enter into Scrap mode from Arming mode during its scrap handshaking with the MCU.
33789
Analog Integrated Circuit Device Data
Freescale Semiconductor
29
FUNCTIONAL DESCRIPTION
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
MC33789 Function Block Diagram
Power Management
Power Mode
Control
Energy
Reserve
Control
Boost
Converter
Buck
Converter
Sync Supply
Charge Pump
5V Linear
Regulator
2.5V Linear
Regulator
Watchdog
Satellite Sensor Interface PSI5
Quiescent
Current
Monitor
Manchester
Decoder
PSI5 Clock
Mode Control
Sync Pulse
Gernerator
Protection &
Diagnostics
Signal I/Os
DC Sensor Inputs
Selectable
Bias Supplies
Analog MUX
Analog Sensor Input
Analog Diagnostics Output
ADC
Analog MUX
Digital Filter
Com munications
SPI
ACL
Analog Buffer
Amplifier
Configurable Drivers
LIN / K-Line
HSD/LSD
Config.
PWM
Protection &
Diagnostics
Safing
Compare
Logic
Arm Enable
Outputs
Safing
SPI Monitor &
Decoder
Safing state Safing Control
Machine
Counters
Safing
Threshold
Logic
Figure 13. Functional Blocks
BOOST CONVERTER
The boost converter uses an internal power switch combined with external passive components, to create a 33 V boost supply from
the 12 V battery input. The 33 V boost output is used for:
• Charging energy reserve capacitor
• Firing squibs when a safing is detected and the battery input is still available
• Power source for all other lower voltage supplies
The boost switch is activated by a wake-up signal, and its operation is controlled by the MCU through the SPI command.
ENERGY RESERVE CONTROL
The energy reserve is a power backup for the air bag system. When a vehicle accident happens and the battery supply is lost, the
energy reserve can provide sufficient power to support the system to continuously collect sensor information, process safing messages,
and fire squibs, for a time determined by the capacity of the energy reserve.
To secure the energy reserve function, the 33789 has implemented sophisticated controls:
• Monitoring VBST and VER to determining when the energy reserve capacitor CER needs to be charged.
• Controlling the turn on time of the high-side charge switch, to keep VER close to VBST, and limiting the inrush charge current.
• Executing a MCU command to diagnose CER by momentarily turning on the low-side discharge switch (while turning off the highside charge switch), and accurately measuring the VER changes.
33789
30
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DESCRIPTION
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
SPI
WAKE
VPWR
VPWR
LBST
Sleep
Mode
Control
SPI
Interface
BSTSW
BSTGND
Internal Data Exchange
Sleep Reset
AOUT
Boost
Control
V BST
VB ST
Analog MUX
VBAT
33V
VBST
1/ K1
CBST
BSTCOMP1
BSTCOMP2
Figure 14. Boost Converter Block Diagram
SPI
VBST
VBST
33V
SPI
Interface
ERSW
AOUT
Internal Data Exchange
Control through SPI
Energy
Reserve
Control
CER
VER
1/K 2
Analog MUX
Buffer
VERDIAG
K3
A
D
Figure 15. Energy Reserve Control Block Diagram
33789
Analog Integrated Circuit Device Data
Freescale Semiconductor
31
FUNCTIONAL DESCRIPTION
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
BUCK CONVERTER
The buck converter creates a step-down intermediate supply voltage, VBUCK 9.0 V, from the 33 V VBST. It uses a synchronous
buck structure, and controls the internal power switches running at 140 kHz, the same frequency as for the boost switch. The switches are
fully protected against overvoltage, overcurrent and overtemperature.
The buck converter operation is under control of the power mode signal and SPI commands from the MCU. The buck converter
status can be read via the SPI, and its output voltage, VBUCK, can be monitored via AOUT by the MCU.
The 33789 provides redundant pins to input VBUCK for the voltage regulation and further power conversions.
SPI
WAKE
VBST
Sleep
Mode
Control
SPI
Interface
LBUCK
BUCKSW
AOU T
Internal Data Exchange
Sleep R eset
Buck
C ontrol
BUC KGN D
V BUC K
V BUC K
Analog MUX
1/K4
C BUC K
VBUCK_R
9V
VBUC K
BUCKCOMP1
BUCKCOMP2
Figure 16. Buck Converter Block Diagram
SYNC SUPPLY FOR PSI5 INTERFACE
To create a regulated sync pulse supply with a voltage at least 5.0 V above the bus voltage for the PSI5 satellite sensor interface,
the 33789 uses a charge pump to “double” VBUCK. The charge pump switches are operated at 160 kHz, with output current limitation.
The MCU enables the sync supply and monitors VSYNC via the AOUT for diagnostics.
LINEAR REGULATORS
The 33789 drives an external PNP transistor to provide a 5.0 V VCC output. This design can reduce the IC power dissipation and
offers the ECU designer system design flexibility.
As the prime core power supply, VCC can be shared by the 33789 with other on-board ICs.
The 2.5 V VDD used for the 33789 internal circuitry is created by an internal linear regulator, using VPWR (for start-up) and VBUCK. It
utilizes an external capacitor through the VDD pin.
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FUNCTIONAL DESCRIPTION
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
WATCHDOG AND RESET
The Watchdog State Machine monitors the system clock by reading refresh messages from the MCU via the SPI, and applies state
control and power mode control accordingly.
The MCU periodically sends watchdog refresh messages within the watchdog time window. If the refresh to the window watchdog
has failed, a system reset will be issued. The RESET pin will be pulled low to drive external reset.
The reset control is also linked to the VCC monitor and the VDD monitor to ensure their output voltages are within the defined
tolerances.
SPI
VBUCK
SPI
Interface
CPC1
AOUT
Internal Data Exchange
C ontrol through SPI
Charge
Pump
Control
CCP
CPC2
Analog MUX
VSYNC
VSYNC
C SYNC
CPGND
1/K5
Figure 17. Sync Supply Block Diagram
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Freescale Semiconductor
33
FUNCTIONAL DESCRIPTION
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
SPI
PPT
WAKE
VBU C K
VBU C K
Internal Data
Exchange
SPI
Interface
Sleep
Reset
Sleep
Mode
Control
V DD V BG
VRE F
OV
VPW R VBU C K
OV
OV
VD D
VD D
UV
UV
VD D
Regulator
UV
External
Reset
Driver
5V
VCC
VCC
Reset
Logic
VC C
VC C
Watchdog
Control
Internal
Resets
RESET
VCCDRI
VC C
Control
VDD
2.5V
Bandgap
Figure 18. Linear Regulators and Watchdog Block Diagram
SATELLITE SENSOR INTERFACE PSI5
The 33789 provides four satellite sensor interface channels to collect data from up to 12 remote satellite sensors. The physical link
is a two-wire pair.
The satellite sensor interface implements the P10P-500/3L mode, as defined in the PSI5 technical specification V1.3 protocol. It also
supports 10-bit Synchronous Satsync-Steered mode operation. The interface receives data in synchronous mode only. In addition, a
method is provided to allow implementation of the bi-directional communication feature, also defined in PSI5 V1.3, under software control.
All four satellite channels can be independently enabled or disabled via SPI commands. The selection of communication mode and the
status acquisition are also controlled by the MCU via the SPI.
The physical layer of the PSI5 interface supplies continuous power and synchronization pulses, created from VBUCK and VSYNC
respectively, to the remote satellite sensors. It senses the satellite current draw to receive the Manchester-encoded current modulation
signals from the sensors. The interface converts the Satsync signal from the MCU to synchronize the sensor data transmission, and uses
the CLK signal from the MCU as a time base for the Manchester decoding.
Each satellite channel has three registers to store decoded messages from up to three satellite sensors. The messages are accessible
to the MCU over the SPI. Each channel’s fault condition is isolated from the others. All four channels are independently protected from
short to GND or battery.
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FUNCTIONAL DESCRIPTION
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
SPI
VSYNC
CLK
PSI5_1
PSI5_2
PSI5_3
Two-Wire
Satellite
Sensor2
SPI
Interface
PSI5
Satellite
Sensor
Interfaces
Internal Data Exchange
Airbag
Control
Module
Satellite
Sensor1
VBUCK
Manchester
Decoder
PSI5_4
GND_PSI
Analog
MUX
A_SENSOR
Satellite
Sensor3
A
D
ASST
Buffer
ADC Control
SATSYNC
Safing
Figure 19. Satellite Sensor Interface and Analog Sensor Input Block Diagram
ANALOG SENSOR INPUT
There is one analog sensor input port provided on the 33789 for a sensitive analog safing sensor signal. The analog input shares a
10-bit A/D converter with the VERDIAG input. The periodic Satsync pulses trigger the A/D conversions.
The digital result of the analog sensor input is saved into a 10-bit analog sensor data register. It can then be read via the SPI and
monitored by the safing logic in the same way as the satellite data from the PSI5 interface. The ASST input receives an inhibit signal from
the MCU during the analog sensor self-test to stop the buffer register updating, thus avoid the Arming output triggered by an Analog Sensor
Self Test fault condition.
DC SENSOR INTERFACE
The DC sensor interface provides 9 channels for Hall-effect sensors, resistive sensors or simple ON/OFF type switching sensors,
such as seat belt buckles, seat track position sensors, etc. All nine inputs are multiplexed and buffered before they are output to the MCU
through the AOUT pin. The multiplexer is controlled by SPI commands.
The DC sensor interface not only monitors the voltages at each input, but also provides a bias supply with four selectable regulated
voltages for each sensor output stage. The supply regulator is capable of measuring and limiting the load current. If the load current
exceeds the overcurrent detection threshold, the voltage regulator will enter into a protection mode and become a current source. During
the transient period, the regulator output voltage will be increased to maintain the supply current near the current limit level, which is
required by the load resistance in the Hall-effect sensor, to establish a sensing signal voltage. The DC sensor load current IINx to the analog
output voltage VAOUT conversion curve for the AOUT monotonic operation can be found in Figure 21.
The DC sensor interface allows dual-point measurement that eliminates common-mode ground offset for implementation of sensors
without a ground return to the ECU. The DC sensor interface system is capable of diagnosing whether a sensor switch is in a valid position,
open circuit, short circuit to other channels, or other vehicle voltage potentials.
There is a low-current active pull-down circuit at each INx input, to discharge the residual voltage after the channel is deselected. The
circuit stays activated as long as the DC sensor interface block is enabled and the channel is unselected until the channel is once again
selected.
To prevent damage caused by external fault conditions, the interface local temperature is monitored with a safety feature of
overtemperature shut down. The bias supply regulator configuration and the current limit functions are controlled by SPI commands, and
the fault conditions including the overtemperature error, can be read via the SPI. An internal reset automatically deactivates the bias supply
regulator and all of multiplexers and switches.
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Freescale Semiconductor
35
FUNCTIONAL DESCRIPTION
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
ANALOG OUTPUT FOR DC SENSOR MONITOR AND ANALOG DIAGNOSTICS
The AOUT pin is for SPI controlled multi-function analog output with an analog buffer amplifier. According to the SPI command, the
instant AOUT voltage can be:
• One of the DC sensor inputs with selected bias supply voltage, or the sensor load current
• One of the system power supply voltages (rescaled), including the energy reserve diagnostic measurement
• One of the output pin voltages from the two configurable drivers
The AOUT signal provides a convenient access for the MCU to extract the DC sensor status and conduct diagnostics for all of above
sub-systems.
VBU CK
V BUC K
SPI
IN1
V BAT
IN2
V1
Bias
V2
Voltage
V3
Supply
IN3
IN4
V4
IN5
9 DC
Sensor
Inputs
IN6
IN7
IN8
IN9
Channel
Select
VBST
1/K1
VER
SPI
Interface
AOU T
A
1/K2
1/K7
VERDIAG
OUT1_S
1/K8
1/K4
1/K7
OUT2_D
1/K5
1/K8
VPWR
OUT1_D
K3
VBU CK
VSYNC
SPI
OUT2_S
1/K6
VAOUT (V)
Figure 20. DC Sensor Interface and Analog Output Block Diagram
IINx (mA)
Figure 21. VAOUT vs. IINx Monotonic Operation
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Freescale Semiconductor
FUNCTIONAL DESCRIPTION
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
SERIAL PERIPHERIAL INTERFACE (SPI)
•
•
•
•
The 33789 SPI interface uses a slave configuration. It features:
16-bit data frame
Up to 8.0 MHz SPI clock
5.0 or 3.3 V compatibility (receives 3.3 V SPI inputs without a level shifter)
Three extra chip selects CS_A, CS_B, and CS_C to support SPI monitor extract on-board digital sensor data for up to four sensors.
SI
SPI
Interface
TXD
LIN
GND_LIN
LIN
Interface
SCK
CS
Internal Data
Exchange
RXD
SO
SPI
Monitor
CS_A
CS_B
SCRAP
Safing
CS_C
Figure 22. Communication Interfaces Block Diagram
LIN Physical Layer
The LIN physical layer is LIN 2.1 compliant, and supports three communication speeds by changing the output slew rate:
• LIN: up to 10.4 kBaud
• LIN: up to 20 kBaud
• ISO 9141 (K-line): up to 100 kBaud
This external communication interface can also be configured to directly output one of four satellite sensor channel's Manchester code.
SAFING LOGIC
The Safing Logic block utilizes a logic structure, which is independent of the MCU, to monitor both on-board sensors and satellite
sensors, to determine the vehicle safety status, and verify the necessity to warrant Arming deployment of the airbag system. The functions
of each section can be summarized as following:
1. SPI Monitor and Decoder:
• Extracts all of the sensor data transferred on the SPI in responding the MCU requests
• Checks the sensor data whether they are in valid ranges and in the correct sequence requested by the MCU
2. Safing State Machine:
• Applies overall safing control
• Supports 5 exclusive operation modes:
•Start-up Mode
•Diagnostic Mode
•Safing Mode
•Scrap Mode
•Arming Mode
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Freescale Semiconductor
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FUNCTIONAL DESCRIPTION
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
3. Safing Control Counters:
Data Valid Counter
•Incremental by each sensor message containing valid data
•Read by the MCU to determine if the safing logic has sufficient sensor data
Sequence Counter
•Incremented by each valid sensor message
•Ensures the sensor data is requested by the MCU in the correct range of values, and aligns the sensor data to the corresponding
safing threshold
4. Safing Threshold Logic:
• Ensures the safing threshold values can be reliably written and read through a secure protocol run by the MCU
5.
•
•
•
Safing Compare Logic:
Compares sensor data with configured threshold aligned by the sequence counter
Increments the incident counter (sample counter) whenever the sampled sensor data value is beyond the thresholds
Checks the incident counter to determine if Arming should be asserted.
6. Arming Enable Output:
• A pair of complementary logical outputs used to enable the external arm circuit and/or squib drivers for deployment.
SI
SO
SCK
Internal Data Exchange
SPI
Interface
CS
Safing
State
Machine
SCRAP
Sequence
Error
CS_A
CS_B
CS_C
SPI
Monitor
&
Decoder
Valid
Sensor Data
Safing
Threshold
Logic
Data Valid
Counter
Sensor
Message Sequence
Counter
Safing
Compare
Logic
ARM
DISARM
Decoded Sensor Data
SATSYNC
Figure 23. Safing Logic Block Diagram
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FUNCTIONAL DESCRIPTION
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
CONFIGURABLE GENERAL PURPOSE DRIVERS
The 33789 offers two general purpose drivers. Each one can be configured as either a high-side driver or a low-side driver via the
SPI. Both drain and source terminals of each driver have connect pins on the package, for external configuration convenience.
The driver output pins can withstand shorts to as low as -1.0 V, as high as VPRW + 1.0 V, and up to 27 V for 5 minutes. They will
survive with 40 V load dump. The driver output current capability is 70 mA with current limitation. The driver has integrated diagnostics
and short-circuit protection. The output status can be checked by the MCU via the SPI. All output pin voltages can be monitored at the
multiplexed analog output pin AOUT.
The driver control block has a built-in 128 Hz 6-bit PWM modulator. Thus, the driver can be used as a dimmable indicator driver
(such as an LED). When this option is selected, the activation of both drivers will be logically synchronized, which means both drivers will
be turned on simultaneously. This allows an application to combine both drivers in parallel to drive a single load with a doubled drive
capability.
The output stage has slew rate control and thermal shut down features to improve performance and reliability.
VPWR
VPWR
Short to
VPWR
VBST
OUT1_D
PWM
(128Hz)
OUT1_S
Control
Logic
Exchange
Short to
GND
Internal Data
Failure
Detection
VPWR
OUT2_S
VPWR
Other Analog
Diagnosis Samples
OUT2_D
SPI
Interface
Analog MUX
AOUT
SPI
Figure 24. Configurable General Purpose Driver Block Diagram
33789
Analog Integrated Circuit Device Data
Freescale Semiconductor
39
FUNCTIONAL DEVICE OPERATION
OPERATING MODES
FUNCTIONAL DEVICE OPERATION
OPERATING MODES
POWER MODE CONTROL
The 33789 Power Mode Control controls the start-up activation of both boost and buck power supplies, based on the voltages on
the VPWR and WAKE pins.
The Wake input is a battery voltage, active-high logic input, and the detection threshold is normally VPWR/2. When the battery input
at the VPWR pin exceeds the low-voltage lockout threshold VBST_UV, and the WAKE state is active (logic high), both the boost and buck
converters are started. This low-voltage lockout threshold is also used as the ignition status threshold. The MCU can receive an indication
that the threshold has been exceeded, when using the SPI STATUS to read the IGNSTSAT status and receiving the signal IGN=1 (see
Table 32).
Hysteresis is applied to prevent inadvertent deactivation of the boost supply. Figure 25 shows the glitch suppression of the Wakeup signal.
WAKE
1
VPWR/2
1.0 ms
3
6
4
2
5
1.0 ms
t
1.0 ms
1.0 ms
10 ms
Figure 25. Wake Glitch Suppression
The suppression results of the above six marked scenarios in Figure 25 are:
1. No change of sleep mode state, but current consumption may exceed specification for sleep mode.
2. The Sleep mode current returns to within specified limits.
3. Power supply exits Sleep mode. Switches start operating if applicable voltages exceed the undervoltage lockout threshold, but the
Sleep Reset is still active, because of its 10 ms delay in response to the Wake-up signal. The system stays in Sleep mode.
4. Sleep Reset is released and the entire system starts operating. After this point, a SPI command to turn off switches would not be
executed, but would be latched and wait for the WAKE signal change to low.
5. The latched SPI command to turn off the switches would not be executed if the Wake signal has turned to a low less than 1.0 ms.
6. After the Wake signal stays low for more than 1.0 ms, the latched SPI command to turn off the switches is executed and the system
is turned off.
To simplify the power supply state diagrams, an internal active low signal Sleep Mode needs to be introduced.
Figure 26 shows the logic relation between the Sleep Mode signal and the Wake signal, SPI Buck_off command, and Sleep_Reset
status.
Delay
WAKE
1
1ms
S
SPI Buck_Off
R
SET
CLR
Q
0
Sleep Mode
Q
Sleep_Reset
Figure 26. Sleep Mode Control Logic
With the Sleep Mode signal, the 33789 power mode control logic can be illustrated in the following diagrams.
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Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
OPERATING MODES
Sleep Mode =1
Boost Thermal Shutdown =0
VPWR > VBST_UV
SPI BOE =1
Internal_
Reset
Boost_ON=1
Boost_ON=0
Sleep Mode =0
Boost Thermal Shutdown =1
VPWR < VBST_UV
SPI BOE =0
Figure 27. Boost Control Logic Diagram
Sleep Mode =1
Buck Thermal Shutdown =0
VBST > VBUCK_UV
VBUCK_OV =0
VCC_OV =0
Internal_
Reset
Buck_ON=0
Buck_ON=1
Sleep Mode =0
Buck Thermal Shutdown =1
VBUCK_OV =1
VCC =0
Figure 28. Buck Control Logic Diagram
Sleep Mode =1
VCC Ramp up
VBUCK_OK =1
Start 5ms T1 Timer
with UV masking
Internal_
Reset
VCC_OFF
Sleep Mode =0
T1 timeout
VCC_UV =0
T1 timeout
VCC_UV =1
VCC_OV =1
T2
timeout
VCC_ON
VCC_UV =1
VCC_OV =1
VCC_OPEN =1
VCC_ON =0
Start 5ms T2 Timer
Sleep Mode =0
Figure 29. VCC Control Logic Diagram
VBUCK DIAGNOSTIC AND VCC RESTART
Figure 29 indicates “VBUCK_OK = 1” is a necessary condition for VCC start. In a specific case, it can be VCC dependent. The situation
could happen during the process of an MCU read of VBUCK from the AOUT pin, via the analog MUX, when VCC is incidentally turned off
and attempted to be turned back on.
VBUCK
AI_CONTROL:
VBUCK
VCC
VCC
AOUT
VBUCK / K4
Analog MUX
VREF_1V
VBUCK_OK = 1
Figure 30. VBUCK Diagnostic and VCC Clamping
33789
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Freescale Semiconductor
41
FUNCTIONAL DEVICE OPERATION
OPERATING MODES
In Figure 30, the analog MUX output is clamped to VCC, to protect the 5.0 V buffer amplifier. When VCC is turned off, both the input and
output of the MUX are clamped to GND, pulling the VBUCK_OK comparator input below 1.0 V, therefore, “VBUCK_OK = 0”. This logic status
will lock out VCC from a restart, as long as the MUX is not changed by an internal reset.
In vehicle applications, when the battery voltage drops very low, VPWR will fluctuate near the VBST_UV threshold. This particular
operation condition will cause both the boost and buck switches to oscillate, resulting in a VCC on-off restart cycle, as described in
Figure 27, Figure 28, and Figure 29 respectively. Other possible conditions causing VCC to turn off, can be found in Figure 29, the VCC
Control Logic Diagram.
If the MCU can always read VBST and show that VBST is in the specified normal operation voltage range, just before reading VBUCK,
the buck capacitor should be able to hold the valid voltage long enough to ensure that VCC will not drop off before the VBUCK diagnostic
read is complete. This software implementation can avoid a VCC restart difficulty in the low VPWR fluctuation condition. Users can also find
other hardware solutions, with external configurations, to prevent VCC from dropping below its threshold, flipping the VBUCK_OK
comparator output.
INTERNAL POWER SUPPLY
The 2.5 V internal supplies are created, based on two voltages: VPRE_HIGH and VPRE_LOW.
VPRE_HIGH Regulator
VPRE_HIGH provides supply for the power switches. The VPRE_HIGH regulator starts operation with the VPWR input. After the VBST
output reaches the normal value, it switches the source to VBST.
VBST
VPWR
0
1
2
8.5V
VP RE_HIGH
Figure 31. VPRE_HIGH to VPRE_HIGH
The VPRE_HIGH switch control logic can be described with the following truth table in Table 7.
Table 7. VPRE_HIGH Switch Control
Internal
Reset
Sleep Mode
Boost_OK
Switch
Position
1
X
X
0
0
0
X
1
0
1
0
1
0
1
1
2
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Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
OPERATING MODES
VPRE_LOW Regulator
VPRE_LOW supplies power for the logic and bandgap circuits. The VPRE_LOW regulator starts operation with the VPWR input. After
the VBUCK output reaches the normal value, it switches the source to VBUCK.
VBUCK
VPWR
0
1
2
Bandgap
Wakeup
4.5V
VP RE_LOW
Figure 32. VPRE_LOW Regulator
The VPRE_LOW switch control logic can be described with Table 8.
Table 8. VPRE_LOW Switch Control
VWAKE >
VPWR/2
Sleep Mode
Buck_OK
Switch
Position
0
0
X
0
X
1
0
1
X
1
1
2
1
0
X
1
V2P5 and VDD Regulators
The 4.5 V VPRE_LOW is used to create a 2.5 V internal supply V2P5, which supplies the analog circuit, and its buffered output VDD
supplies digital circuit.
VPRE_LOW
Ban dga p
1V Ref.
V2P5
VDD
Figure 33. 2.5 V Internal Supply Regulators
VDD Output Capacitor and Diagnostics
The VDD regulator is switched off for about 6.0 µs every 200 ms. Once the capacitor is disconnected or out of tolerance, the output
voltage will drop and the VDD undervoltage error can be detected.
33789
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Freescale Semiconductor
43
FUNCTIONAL DEVICE OPERATION
OPERATING MODES
WATCHDOG STATES AND RESET
Types of Resets and Reset Sources
The reset functions of the 33789 control both its internal resets and the external resets on all of the devices in the system equipped with
a reset input.
The internal reset is triggered by the VDD voltage thresholds and the internal bandgap regulator status.
The external RESET pin is driven by the following reset sources:
• VCC voltage monitor
• Window watchdog
• VDD voltage monitor
• Open ground monitor (for GNDA and VSS)
• Internal bandgap regulator monitor
Figure 34 shows the logic relation between all of the resets and all of the reset sources.
VD D_ UV
Inte rnal_Re set
Ba ndg ap_OK
Band gap VR EF_OK
WSM_Reset
VCC _OV
V CC_UV
Delay
10 ms
WDOG Er ror
SSM_Reset
Delay
1ms
VD D_OV
GNDA Lo ss
WDOG Test
RESET
Anal og_Reset
Slee p_ Rese t
Figure 34. Reset Logic
The functions of the reset signals are:
• Internal_Reset: Resets all internal blocks except Safing and Watchdog
• WSM_Reset: Resets Watchdog State Machine
• SSM_Reset: Resets Safing State Machine
• Analog_Reset: Arm enable for ARM / DISARM
• Sleep_Reset: Resets Sleep_Mode Logic
Start-up Behavior
After wake-up, when VCC ramps up, the internal power supply holds the RESET pin low and keeps the watchdog in a “INITIAL” state
with the 33789 status register bit WDR = 0, which indicates the reset is not caused by any watchdog error. The register is guaranteed by
design to be inactive during the VCC ramp up period.
When the power-on delay has elapsed and VCC has entered into the valid voltage range, the RESET pin is released and the system
operation starts.
The Watchdog State machine (WSM) does not start its operation until the first watchdog feed command is received.
Before the first watchdog refresh, the ARM and DISARM outputs are forced to maintain their high-impedance states.
Watchdog Window
A watchdog window is defined as a time window between two adjacent watchdog refreshes. The 33789 uses software watchdog, it
periodically receives watchdog refresh signals from the MCU through the SPI interface.
A successful watchdog refresh is a SPI command, WDOG_FEED (high or low), followed by another SPI command, WDOG_FEED (low
or high), within a designated watchdog window. (See Figure 35, Watchdog Windows)
Once the 33789 receives the first WDOG_FEED command, the first successful refresh occurs and the watchdog transits from “INITIAL”
state to “DRIVE” state. (See Figure 36, Watchdog State Diagram)
33789
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Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
OPERATING MODES
WDOG
Refr esh
WDOG
Refresh
Refresh
Acceptance
W indow
Refresh
Acceptance
Window
Watchdog
Window
(WDW)
t
t
tWD W_MIN
tW DW_MIN
t WDW_MAX
Last
Refresh
tWDW_M AX
Last
Refresh
Figure 35. Watchdog Windows
Watchdog Error
WDOG Error is defined as:
NOT [WDOG OVERIDE]
AND
[WDOG_FEED with same polarity as the previous feed
OR
WDOG_FEED before the min. window time to the previous feed
OR
WDOG_FEED after the max. window time to the previous feed]
WDOG Refresh OK is defined as:
WDOG_FEED with opposite polarity to the previous feed
AND
WDOG_FEED after the min. window time to the previous feed
AND
WDOG_FEED before the max. window time to the previous feed
If a window watchdog refresh fails, the RESET pin will be pulled down for 1.0 ms to reset the system, and the 33789 internal status
register will set the Watchdog Error Status bit WDR = 1, to indicate a watchdog error is the source of the reset.
The value of the WDR bit is latched and can be read by the MCU via the SPI STATUS request command. The WDR bit is cleared by
either a WSM_Reset or a correct WDOG_FEED.
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Freescale Semiconductor
45
FUNCTIONAL DEVICE OPERATION
OPERATING MODES
WSM_Reset
(From any state)
Set ARM_LOCKOUT = 0
Set WDR = 0
VPPT>VPPT_TEST
AND
SPI WDOG_TEST
1.0 ms
INITIAL
WDOG error
Set WDR = 1
Set ARM_LOCKOUT = 1
WDOG OVERRIDE
WDOG refresh OK
Set WDR = 0
WDOG RESET
WDOG error
Set WDR = 1
Set ARM_LOCKOUT = 1
WDOG error
Set WDR = 1
WDOG refresh OK
DRIVE
SPI WDOG_TEST
WDOG refresh OK
WDOG TEST
Figure 36. Watchdog State Diagram
Arm Lockout and WDOG_TEST
During a system reset, both the ARM and DISARM pin outputs are forced to the high-impedance state, which is called Arm Lockout.
To individually test ARM and DISARM (The tests allow both the ARM and DISARM pins to be set to “1” or “0” at same time) while the WSM
is still running in the background, the WSM can be set to the WDOG OVERRIDE state after a WSM reset, or insert the SPI command of
WDOG_TEST from the DRIVE state, to avoid setting ARM_LOCKOUT = 1.
Though watchdog error always causes a system reset, which can be measured at the RESET pin and can be checked by using the SPI
STATUS command to read the bit WDR = 1, it does not always cause an Arm Lockout, which depends on the WSM running in the DRIVE
state, or in the WDOG TEST state before the watchdog error occurs. Regardless whether the watchdog error causes an Arm Lockout, the
WSM_Reset always brings the WSM back to the INITIAL state, with the setting of ARM_LOCKOUT = 0 and WDR = 0 at the end of the
system reset.
To facilitate testing of the watchdog error function, the SPI command WDOG_TEST can be used to prevent the Arm Lockout caused
by a watchdog error. This command is only valid for the next watchdog window: A WDOG_TEST command has to be inserted before a
watchdog error (invalid refresh or missing refresh) within the same watchdog window. Thus, once the error occurs, the consequential
resets would not cause an Arm Lockout. (See Figure 37 for some typical examples of successful and unsuccessful inserted SPI
WDOG_TEST commands)
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Analog Integrated Circuit Device Data
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FUNCTIONAL DEVICE OPERATION
OPERATING MODES
WDOG
Refresh
Refresh
Acceptance
Window
t
Last
Refresh
SPI
WDOG_TEST
received
WDOG
Refresh
Refresh OK
Return to DRIVE
Without watchdog reset
SPI WDOG_TEST did nothing
WDOG
Refresh
Refresh
Acceptance
Window
Refresh
Acceptance
Window
1ms
1ms
t
Last
Refresh
Missing refresh
Set WDR=1 Return to INITIAL
t
Last
Refresh
SPI
WDOG_TEST
received
Early refresh
Set WDR=1
SPI
WDOG_TEST
received
Return to INITIAL
Figure 37. Successful and Unsuccessful WDOG Test Examples
Arming Logic
When an internal Arm signal is created, it shall be output through the ARM and DISARM pins only when the following conditions are
satisfied:
While in WDOG_OVERRIDE state
OR
While in DRIVE state with
[SSM_Reset inactive
AND
Arm_Lockout inactive]
In any other conditions, the internal ARM / DISARM control signal shall never be sent to the output, and the output pins ARM and
DISARM shall be set to high-impedance.
Whenever an Analog_Reset is created, the ARM and DISARM outputs are set to high-impedance to inhibit outputs by an analog
implementation, as a part of failure mode control, the Arming logic result will be ignored.
DRIVE
ARM_LOCKOUT
SSM_Reset
WDOG OVERRIDE
ARM / DISARM
Output Control
Analog_Reset
Implemented in analog
(0: High Impedance
1: Enabled)
Figure 38. Arming Logic
33789
Analog Integrated Circuit Device Data
Freescale Semiconductor
47
FUNCTIONAL DEVICE OPERATION
OPERATING MODES
SATELLITE SENSOR INTERFACE
PSI5 Interface
The satellite sensor interface (see Figure 19) on the 33789 serves as master interface. Each one of its channels independently supplies
a regulated DC voltage VSAT_OUT to its satellite devices. At the same time, it monitors the current draw to receive the sensor signals. The
output current can be limited for fault protection. The satellite sensors transmit Manchester-encoded data with current modulation. The
Manchester coding uses a rising edge to represent logic “0” and a falling edge to represent logic “1”.
Start bits
S1
‘0’
Logic
Data bits
S2
‘0’
D0
‘1’
D1
‘1’
D2
‘0’
ISAT
ISAT_MOD
ISAT_TH
ISAT_Q
ISAT_TH_OFS
t
Bit Time = 1/fSAT
•
•
•
•
•
Figure 39. Current Modulation and Manchester Bit Encoding of Satellite Sensor
The PSI5-P 10P -500/3L mode of PSI5 V1.3 protocol has the following features:
PSI5-P: Peripheral Sensor Interface - Parallel Bus mode
10P: 10 data bits + 1 parity bit
-500: 500 µs nominal synchronization period
/3: three time slots for sensor data
L: 125 kbps
the first transmitted bit
S1 S2 D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 P
0
0
1
1
1
0
0
1
1
1
1
0
1
Manchester code example to transmit 0x1E7 = 01 1110 0111b
Figure 40. Satellite Data Frame Format
The even parity is checked for the entire data transmission except the start bits. If a parity error is detected, an error message will be
sent to the MCU.
The 33789 automatically calibrates the sensor clock, to align the sampling timing of the receiver for the Manchester decoding.
Each channel has implemented an input data filter to remove the glitch from the input signal and recover data from waveform distortion,
to reduce the decoding error. The input data filter includes sampling / holding circuit, shift register, and majority detector.
If one or more of following statements are true, a Manchester Error will be directed to the MCU:
• Two valid start bits are detected, and at least one of the expected 13 mid-bit transitions are not detected.
• Two valid start bits are detected, and more than 13 mid-bit transitions are detected.
• Two valid start bits are detected, and the sampled logic levels before and after any of the 13 expected mid-bit transitions are the same.
Synchronous Operation Modes
To synchronize the sampling of satellite sensor data, the master interface circuitry on the 33789 creates a sync pulse with increased
voltage added on the top of sensor supply voltage VSAT_OUT, to signal the initiation of sampling to the satellites. The MCU periodically
sends a satellite synchronization signal (Satsync) to the 33789, to activate the sync pulses and controls the timing of the satellite data
acquisition.
When the rising edge of the Satsync signal is detected, the master interface outputs four Sync pulses, one for each channel, on
channels PSI5_1 through PSI5_4, in sequence. A 4.0 µs stagger time is inserted from channel to channel, to avoid high peak current.
Figure 41 illustrates the sync signals’ voltage and timing relations.
33789
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Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
OPERATING MODES
V SATSYNC
V CC
t
V PSI5_1
V SAT_OUT
V PSI5_2
t
V SAT_SYNC
t
t SAT_SYNC _STAG
V PSI5_4
tSYNC
t
Figure 41. Satellite Synchronization Pulses
The sync pulse driver can either source or sink bus current. It outputs higher charge current to increase the bus voltage VPSI5_X from
VSAT_OUT to VSAT_SYNC, at the beginning of Sync pulse, and discharges the bus capacitance at the end of sync pulse, to return the bus
voltage back to VSAT_OUT.
The pull-down device to sink the bus current is current limited. The sync pulse output from the interface is wave-shaped to limit the slew
rate for EMC improvement. In the synchronous mode operation, satellite sensors transmit data in response to Sync pulse. Each satellite
has its own assigned time slot for sending data. All of the satellites need to be pre-programmed for timing order, to realize different
communication start times.
The 33789 PSI5 interface supports two types of synchronous operation modes for scheduling satellite data transfer. The operation
mode can be selected channel-by-channel per MCU SPI commands.
1. Synchronous Time-division Multiplexed (TDM) Mode
The PSI5-P 10P -500/3L mode is a synchronous TDM mode of the PSI5 protocol, which supports one to three satellites per channel.
VSATSYNC
tSYNC
VSAT_SYNC
VSAT_OUT
S1
S2
S3
S1
S2
S3
Figure 42. Synchronous TDM Mode
The rising edge of the Satsync signal triggers the generation of the sync pulse, the falling edge of Satsync is ignored.
The time window between two Sync pulses is divided into three time slots, each slot for one of the three satellite sensor’s data. Once
the three Manchester data are received and decoded in sequence at the 33789, they are stored in order into three internal registers A, B,
and C.
All bits of these registers are simultaneously updated upon reception of the satellite message to prevent partial frame data from being
checked out via the SPI interface. A fixed blanking interval, which is triggered by the rising edge of the Satsync signal, is inserted at the
receiver to avoid false triggering of the Manchester decoder.
The PSI5 Sync pulse can also be used for bidirectional communication. This feature allows the 33789 to send commands to satellites,
which is useful to pre-program or re-program the satellite sensors in the system. Once the PSI5 bus is set to bidirectional communication
mode by the MCU via the SPI, in every fixed Satsync period, the appearance of the sync pulse represents a logic “1”, and the missing
pulse represents a logic “0”.
The communications between an airbag ECU (master terminal) and the PSI5 satellite sensors (slave terminals), use two different
modulations:
Sensors ECU: current modulation
ECU Sensors: voltage modulation
33789
Analog Integrated Circuit Device Data
Freescale Semiconductor
49
FUNCTIONAL DEVICE OPERATION
OPERATING MODES
2. Satsync-steered Mode
The Satsync-steered mode is another type of TDM operation. It supports up to two satellites per channel.
VSATSYNC
VSAT_SYNC
VSAT_OUT
ISAT
S1
S2
S1
Figure 43. Satsync-steered Mode
The data from two parallel connected satellite sensors are transferred in serial, and they are time-divided with alignment to the Satsync
edges.
At the 33789, the logic level of the Satsync signal steers the incoming sensor data into two input data registers:
• When the Satsync input is high, the received data is stored in register A
• When the Satsync input is low, the received data is stored in register B.
Quiescent Current Monitoring
The quiescent current on the PSI5 bus has a wide tolerance range. It varies from sensor to sensor, and depends on the number of the
sensors on the bus. Supply voltage and ambient temperature also have an influence on the satellite sensor quiescent current. The 33789
automatically calibrates the interface quiescent current, and resets the adaptive current detection threshold, to achieve the demodulation
accuracy.
The 33789 uses three different timing strategies to monitor quiescent current in different communication states:
1) During Startup
The PSI5 standard V1.3 allows the sensor quiescent current settling time tSET, up to 10 ms.
Figure 44. Sensor Current Consumption During Startup
To ensure a proper measurement, the 33789 starts to measure the bus quiescent current 10 ms after a channel is activated, and inhibits
the Sync pulse generation until the first measurement is completed. The first measurement takes 35 ms.
33789
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Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
OPERATING MODES
S a ts y n c
S ig n a l
S ync
P u ls e
500 µs
500 µs
120 µs
N o S y n c p u ls e u n t il 4 5 m s
S1
PSI Bus
C u rre n t
A d d it io n a l q u ie s c e n t
c u r r e n t s e t t lin g t im e
S e n s o rs p o w e r-u p
Q u ie s c e n t
C u rre n t
M e a s u re m e n t
S2
S3
S2
S3
B u s c h a rg e
D is c h a r g e
F ir s t q u ie s c e n t
c u rre n t m e a s u re m e n t
Q u ie s c e n t c u r r e n t u p d a t e
0
C h a n n e l A c t iv a t io n
5 ms
10 m s
45 m s
t
Figure 45. Quiescent Current Measurement Timing
2) During Run-time with First Data Frame
In every Sync cycle, if there is a data transfer activity during the first time slot, and the parity bit of the first data frame is checked as
correct, the receiver updates the quiescent current 2.0 µs after the end of the parity bit.
3) During Run-time without First Data Frame
If there is no data transfer activity detected in the first time slot, the receiver updates quiescent current 120 µs after the rising edge of
the Satsync signal. The receiver would stop the updating if there is any data bit detected during the update process.
ANALOG / DIGITAL CONVERTER
The 33789 uses a single analog to digital converter, ADC, to measure the two analog input signals:
• A_SENSOR: On-board analog safing sensor input
• VERDIAG: The voltage change across the energy reserve capacitor CER for diagnosis
When the 33789 receives the falling edge of Satsync signal, the ADC Control Logic asserts Start Of Conversion (SOC) signal, which
is synchronized with the analog multiplexer (MUX) input select timing, to trigger the 10-bit A/D conversions for the two input signals in
sequence. When each of conversions is completed, the ADC sends an End Of Conversion (EOC) signal back to the Control Logic, to set
Sensor_val or ER_Val, depending on which input is processed.
Analog Sensor Data
After the A_SENSOR signal conversion, the Control Logic sets Sensor_val to load the data from the ADC into a high-pass digital filter,
HPF, to reduce slow offset drifts caused by aging and environment. This offset remove process is also called Zero Adjust. The output of
HPF is then latched into a 10-bit holding register, ASENSOR_RG.
The MCU can use Sensor Request SPI command to access the 10-bit data from ASENSOR_RG. This allows the SPI Monitor in the
33789 safing block to treat A_SENSOR data exactly same as satellite sensor data. Similar to the satellite sensor data, subsequent SPI
requests of A_SENSOR data before the next Satsync falling edge will result in an error response, with the ND (No Data) bit set for
Exception status.
33789
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Freescale Semiconductor
51
FUNCTIONAL DEVICE OPERATION
OPERATING MODES
SPI
A_SENSOR
10-bit
ADC
0
1
Digital
HPF
ASENSOR_RG
(10-bit)
En
A
D
1
SATSYNC
ASST
En
Clr
Read
VERDIAG
VERDIAG_EN
Satsync
Filter
SOC
Select
ER
Discharge
VERDIAG_RG
(8-bit)
ER_Val
S/H
Sensor_Val
K3
EOC
VERDIAG
Internal Data Exchange
Analog
MUX
ASST_DIS
ADC
Control Logic
ER
Discharge
Energy
Reserve
Control
Internal
Reset
Figure 46. The 33789 ADC Process Diagram
VERDIAG Signal Conversion
To convert the VERDIAG signal, VERDIAG _EN shall be active in advance. At the next Satsync falling edge, the ADC Control Logic
asserts the ER Discharge signal to turn the ER charge switch (the high-side driver) off and the ER discharge switch (the low-side driver)
on, discharging the energy reserve capacitor (see Figure 15, Energy Reserve Control Block Diagram). A sampling and holding circuit
catches the initial VERDIAG voltage drop to have the ER diagnostic signal ready.
When the MUX Select is switched from “0” to “1” (after the A_SENSOR signal conversion), the acquired initial VERDIAG voltage drop
value is passed through and loaded into the ADC. Then the Control Logic set SOC to trigger the conversion.
At the end of conversion, if the VERDIAG_EN signal is still active, following EOC, the ER Discharge signal will be de-asserted to turn
off the ER discharge switch and turn the ER charge switch back on. At the same time, upon receiving EOC, the Control Logic sets ER_Val
to latch the 8 most significant bits (MSB) of the 10-bit ADC output into a holding register VERDIAG_RG. This register will be cleared after
a SPI read.
The internal VERDAIG_EN signal is activated by ESR_DIAG SPI command from the MCU with the EN bit set (EN = ’1’), and it remains
set until a subsequent ESR_DIAG SPI command with EN = ’0’. With this design, the 33789 can automatically repeat the ESR test on the
ER capacitor in every Satsync cycle, using only one SPI command.
33789
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Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
OPERATING MODES
A_SENSOR Signal Conversions
Satsync
SOC
EOC
Select
Sensor_Val
ASENSOR_RG
Output
ER_Val
VERDIAG_RG
Output
VERDIAG_EN
ER_Discharge
VERDIAG
VERDIAG Signal Conversions
Figure 47. ADC Logic Sequence
Analog Sensor Self Test
On-board analog sensor self-test is often used to verify the functionalities and the connection between the sensor and the MCU. To
facilitate the test without activation of the Arming outputs due to a fault possibility, the 33789 monitors the Analog Sensor Self Test control
signal ASST from the MCU. An internal Analog Sensor Self Test Disable signal ASST_DIS is generated when the ASST pin is read logic
high. The ASST_DIS signal is used to block the setting of Sensor_Val, thus inhibit triggering of the HPF and updating of the
ASENSOR_RG, as the result, it suspends safing. The ASST input is filtered to prevent either inadvertent disabling of the safing during
periodic self-test, or inadvertent arming, due to the slow response of the sensor output after the self-test signal deasserted. The filter is
implemented with the following features:
• ASST_DIS is cleared upon an internal reset.
•ASST_DIS is set only after the ASST input is set for 3 consecutive Satsync falling edges.
•Once set, ASST_DIS will be cleared only after the ASST input is cleared for 6 consecutive Satsync falling edges.
33789
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Freescale Semiconductor
53
FUNCTIONAL DEVICE OPERATION
SENSOR MESSAGE, OPERATION COMMAND AND SPI
SENSOR MESSAGE, OPERATION COMMAND AND SPI
The 33789 communicates with the MCU via the SPI bus.
SI and SO are in parallel, to transmit serial data as a bidirectional communication interface when the chip select CS is active (pulled
low), and each bit of both signals is synchronized by the SPI clock SCK. SI data is clocked into the 33789 at the rising edge of SCK, and
SO data is clocked out at the falling edge of SCK.
Following a SI data request from the MCU, the 33789 transmits a SO response in single stage pipeline fashion. The request/response
pattern can be seen in Figure 48.
CS
SCK
SI
Request 1
Request 2
Request 3
Response 0
Response 1
Response 2
SO
Figure 48. SPI Data Frame Latency
MESSAGE FORMATS OF SPI DATA
There are two types of messages communicated on the 33789 SPI bus: a sensor request/response message and a non-sensor request/
response message. After an internal reset, the response on SO to the first SPI command is a non-sensor data error response (with RE=1,
see Table 9). There is a single bit (SEN, bit 13) in the request frame which defines the message type.
Sensor Message Format
The MCU uses the sensor request/response to retrieve sensor data from:
•The 33789 satellite interface block
•On-board digital sensors with SPI interface
These types of messages, as well as the analog sensor data, are also monitored by the Safing Logic block of the 33789.
Table 9. SPI Sensor Data, - Message Format
MSB
15
SI
SQ1
x
LSB
14
13
SQ0 SEN
x
1
12
11
10
9
8
7
6
5
4
3
2
1
SQ2
0
0
0
0
0
0
0
0
LC3
LC2
LC1
x
0
0
0
0
0
0
0
0
a
a
a
MSB
SO
0
LC0 Sensor Data Request
Digital Sensor Data for Logical Channel
‘aaaa’b
a
LSB
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
SQ2
SQ1
SQ0
P
ST1
ST0
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
0
0
Unused
0
1
Sensor Data from Satellite and On-board Sensors
1
0
Self-test Data
1
1
Sensor Data Response
Status Decode:
ES1
ES0
0
0
Unused
Sensor Data
On-board Sensor Self-test
Exception Status
Exception Status Decode:
0
0
OE
ND
CNC
HE
ME
DE
Slave (Receiver/on-board sensor) Error Status
33789
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FUNCTIONAL DEVICE OPERATION
SENSOR MESSAGE, OPERATION COMMAND AND SPI
Table 9. SPI Sensor Data, - Message Format (continued)
MSB
LSB
0
1
x
x
x
x
x
x
x
1
0
x
x
x
x
x
x
x
1
1
x
x
x
x
x
x
x
x
Reserved
Used for Non-sensor Data Responses
x
Reserved
Table 10. SPI Sensor Data, - Message Bit Definition
SENSOR DATA REQUEST SI BIT DEFINITION
Name
Bit Position
SQ2:SQ0
15, 14, 12
Definition
Sequence identifier - used for synchronizing samples
SEN
13
Sensor bit - Defines the request as a sensor data request or a non-sensor data request (1 = sensor data, 0 = non-sensor data)
LC3:LC0
3:0
Logical channel select
SENSOR DATA RESPONSE SO BIT DEFINITION
Name
Bit Position
Definition
SQ2:SQ0
15:13
P
12
ST1:ST0
11:10
ES1:ES0
9:8
OE
5
Overcurrent Error - Overcurrent of the low-side driver (short to battery)
ND
4
No data (channel specific) - Sensor data not available
CNC
3
Conditions Not Correct for operation (channel specific) as defined elsewhere - Request cannot be fulfilled because the channel is off,
or in the wrong mode, etc.
HE
2
Hardware Error in slave (channel/channel pair specific) - caused by hardware errors defined elsewhere, such as overtemperature
overcurrent of the high-side driver (short to GND), reference out of range, etc.
ME
1
Manchester error (channel specific) - incorrect number of bits, timing violation, etc. in Manchester bit-stream
DE
0
Data error (channel specific) - Parity or CRC error in Manchester data
D9:D0
9:0
Sequence identifier - used for synchronizing sensor samples
Parity - Ensures odd parity for bits 15:0 of SO
Status - Identifies the contents in D9:D0 of SO (sensor data, self-test data, error, etc.)
Exception Status - Identifies the contents of exception data (Receiver/On-board Sensor Error Status, or Satellite Error)
Sensor Data - For ST1:ST0 = 01
The Logic Channel Field (LC3:LC0) is used for the address of each of all 12 possible satellite sensors and one analog sensor. Each
sensor address along with its channel and time slot on the bus, is assigned in Table 11.
Table 11. Logic Channel Assignment
Logic Channel
(LC3: LC0)
Physic Channel
Time Slot
Data Register
0000
PSI5_1
1
PSI5_1 RG_A
0001
PSI5_1
2
PSI5_1 RG_B
0010
PSI5_1
3
PSI5_1 RG_C
0011
PSI5_1
-
N/A
0100
PSI5_2
1
PSI5_2 RG_A
0101
PSI5_2
2
PSI5_2 RG_B
0110
PSI5_2
3
PSI5_2 RG_C
0111
PSI5_2
-
N/A
1000
PSI5_3
1
PSI5_3 RG_A
1001
PSI5_3
2
PSI5_3 RG_B
1010
PSI5_3
3
PSI5_3 RG_C
1011
PSI5_3
-
N/A
1100
PSI5_4
1
PSI5_4 RG_A
1101
PSI5_4
2
PSI5_4 RG_B
1110
PSI5_4
3
PSI5_4 RG_C
1111
A_SENSOR
N/A
ASENSOR_RG
33789
Analog Integrated Circuit Device Data
Freescale Semiconductor
55
FUNCTIONAL DEVICE OPERATION
SENSOR MESSAGE, OPERATION COMMAND AND SPI
After the data from a given logic channel is read via the SPI interface, subsequent requests for the data from the same logic channel
will result in an ERROR response with the No Data bit set (ND = ’1’).
The conditions for setting and clearing of status bits in the Sensor Data Request messages are defined in Table 12.
Table 12. SPI Sensor Data Request, - Error and Status Bit Setting
Bit
Description
Setting Condition
Clearing Condition
Channel Behavior
Overcurrent Error
Satellite channel low-side overcurrent
(short to V+ condition) and no
hardware error (HE) detected
Internal reset or
LINE_ENABLED command
with xLE = 0 (OFF) for the
affected channel
Channel is deactivated
ND
No Data
Channel is ON, no Manchester error,
data error or overcurrent error is
detected and a valid satellite frame
has not been received
Cleared after a valid satellite
data frame is received
None
CNC
Conditions Not Correct
Request for undefined channel or
request for a channel not turned ON
Internal reset, or upon
requesting a valid channel
after it has been turned ON
None
Hardware Error
Any of the following:
1. Satellite channel high-side
overcurrent (short to GND condition)
2. Satellite average IQ is out of range
3. Channel overtemperature
conditions
Internal reset, or
LINE_ENABLE command with
xLE = 0 (OFF) for the affected
channel
Channel is deactivated
ME
Manchester Error
Improper Manchester data - incorrect
number of data bits, incorrect data
edge timing, with no overcurrent or
hardware errors detected
Internal reset, or cleared when
read
None
DE
Data Error
Satellite data parity error, with no
overcurrent error or hardware error
detected
Internal reset, or cleared when
read
None
OE
HE
SPI LINE_ENABLE (xLE=0)
CH Short to GND
CH IQ Out of Range
S
SET
Q
HE
CH Overtemp
R
S
CH Short to V+
R
S
CH ON
R
Invalid Bit Count
Invalid Bit Timing
S
R
S
Satellite Parity Error
Correct Start Bits Received
R
CLR
SET
CLR
SET
CLR
SET
CLR
SET
CLR
Q
Q
OE
Q
Q
ND
Q
Q
ME
Q
Q
DE
Q
Figure 49. SPI Sensor Data Response, - Error Bit Logic
Non-sensor Message Format
Non-sensor messages are used for all of configurations, diagnostics, controls, etc. data traffic. Their message formats and bit definitions
are listed in Table 13 and Table 14.
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FUNCTIONAL DEVICE OPERATION
SENSOR MESSAGE, OPERATION COMMAND AND SPI
Table 13. SPI Non-sensor Data, - Message Format
MSB
SI
LSB
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
OP1
OP0
SEN
A4
A3
A2
A1
A0
D7
D6
D5
D4
D3
D2
D1
D0
0
0
0
x
x
x
x
x
x
x
x
x
x
x
x
x
0
1
0
Write Address
1
0
0
Read Address
1
1
0
Operand Decode:
x
x
x
x
Write Data
x
Reserved
Write
x
x
x
x
x
x
x
x
Read
x
x
x
x
x
x
x
x
Test
MSB
LSB
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
0
OP1
OP0
P
ST1
ST0
ES1
ES0
D7
D6
D5
D4
D3
D2
D1
D0
0
0
P
1
1
1
0
0
0
0
0
0
SE
RE
0
0
1
P
1
1
1
0
Slave Status
1
0
P
1
1
1
0
Read Data
1
1
P
1
1
1
0
SO
Slave Data Request
x
x
x
x
x
Slave Data Response
Error Response
Write Response
Read Response
x
x
x
Test Response
Table 14. SPI Non-sensor Data, Message Bit Definition
SLAVE COMMAND SI BIT DEFINITION
Name
Bit Position
Definition
OP1:OP0
15:14
SEN
13
A4:A0
12:8
Address - For read or write operation
D7:D0
7:0
Data - For write operation
Opcode - Defines operation (Read, Write)
Sensor bit - Defines the request as a sensor data request or non-sensor data request (1 = sensor data, 0 = non-sensor data)
SLAVE RESPONSE SO BIT DEFINITION
Name
Bit Position
OP1:OP0
Definition
14:13
p
12
Parity - Ensures odd parity for bits 15:0 of SO
ST1:ST0
11:10
Status - Always ‘11’ for non-sensor response
ES1:ES0
9:8
Exception Status - Always ‘10’ for non-sensor response
D7:D0
7:0
Read Data/ Error Data/ Status
SE
2
SPI Error - set to ‘1’ for request (SI) frame violations (incorrect number of SCK pulses, etc.)
RE
1
Request Error - set to ‘1’ for illegal, or unknown requests
Opcode - Identifies the contents of Read or Write data in D9:D0 - copied from SI if the request is granted
OPERATIONAL-MODE SPI COMMANDS
PSI5 Interface SPI commands
SENSOR_DATA
The SENSOR_DATA command is used to sample sensor data from the PSI5 interface and the analog sensor input. This is the only
command that uses the sensor data request/response format. The details of this command are defined in Table 9, Table 10, Table 11 and
Table 12.
LINE_MODE (0x4F, 0x8F)
The LINE_MODE command is used to configure the PSI5 receiver channels individually, for either Synchronous TDM Mode or SatsyncSteered. The command is latched until a subsequent SPI update or internal reset. The response indicates the current state of the line
mode for each channel.
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FUNCTIONAL DEVICE OPERATION
SENSOR MESSAGE, OPERATION COMMAND AND SPI
Table 15. SPI Command, - LINE_MODE
LINE_MODE (0x4F, 0x8F)
Write
Read
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
SI
0
1
0
0
1
1
1
1
x
x
x
x
LM4
LM3
LM2
LM1
SO
0
0
1
P
1
1
1
0
0
0
0
0
LM4
LM3
LM2
LM1
SI
1
0
0
0
1
1
1
1
x
x
x
x
x
x
x
x
SO
0
1
0
P
1
1
1
0
0
0
0
0
LM4
LM3
LM2
LM1
Default
LM
Line Mode
0
Channel PSI5_x protocol = Synchronous TDM Mode
1
Channel PSI5_x protocol = Satsync-Steered Mode
LINE_ENABLE (0x43, 0x83)
The LINE_ENABLE command is used to activate or deactivate the PSI5 channels individually. The command is latched until a
subsequent SPI update or internal reset. Some incident conditions, such as a thermal or overcurrent shutdown could deactivate the
channel as well. The response indicates the current state of the line activation and the overtemperature status for each channel.
Table 16. SPI Command, - LINE_ENABLE
LINE_ENABLE (0x43, 0x83)
Write
Read
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
SI
0
1
0
0
0
0
1
1
x
x
x
x
4LE
3LE
2LE
1LE
SO
0
0
1
P
1
1
1
0
OT4
OT3
OT2
OT1
4LE
3LE
2LE
1LE
SI
1
0
0
0
0
0
1
1
x
x
x
x
x
x
x
x
SO
0
1
0
P
1
1
1
0
OT4
OT3
OT2
OT1
4LE
3LE
2LE
1LE
OTx
Default
Overtemperature Shutdown Indicator
0
No overtemperature shutdown on channel PSI5_x
1
Overtemperature shutdown on channel PSI5_x
xLE
Default
Line Enable
0
Channel PSI5_x OFF
1
Channel PSI5_x ON
SYNC_ENABLE (0x44, 0x84)
The SYNC_ENABLE command is used to individually enable or disable the Sync pulse generation for the PSI5 channels while in
Synchronous TDM Mode. It can be used to support bidirectional communication between the 33789 and the satellites. The state of the
xSE bits is checked at the rising edge of the Satsync signal for each Satsync period.
In Satsync-steered mode, the SYNC_ENABLE command is latched until subsequent SPI update or reset, but it has no effect on the
Sync pulse output, because the communication back to the satellite via the Sync pulse modulation is disabled.
The internal reset sets xSE = 1 for default.
The response indicates the current state of the Sync pulse enable register for each channel.
33789
58
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
SENSOR MESSAGE, OPERATION COMMAND AND SPI
Table 17. SPI Command, - SYNC_ENABLE
SYNC_ENABLE (0x44, 0x84)
Write
Read
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
SI
0
1
0
0
0
1
0
0
x
x
x
x
4SE
3SE
2SE
1SE
SO
0
0
1
P
1
1
1
0
0
0
0
0
4SE
3SE
2SE
1SE
SI
1
0
0
0
0
1
0
0
x
x
x
x
x
x
x
x
SO
0
1
0
P
1
1
1
0
0
0
0
0
4SE
3SE
2SE
1SE
xSE
Default
Sync Pulse Enable
0
Channel PSI5_x sync pulse disabled
1
Channel PSI5_x sync pulse enabled
LIN Interface Control SPI Commands
LIN_CONFIG (0x50, 0x90)
The LIN_CONFIG command is used to control the LIN physical interface configuration. It supports two functions:
1) LIN signal wave-shaping:
There are three different slew rates that can be selected along with the LIN speed selection for the best EMC performance.
•>20 kBaud: Wave-shaping disabled. For test and production configuration use only
•20 kBaud: For LIN compliant 20 kBaud communications
•10.4 kBaud: For 10.4 kBaud LIN communications. It also can be used for ISO-9141communication.
2) Output Manchester Code at the RXD Pin:
This Manchester code output feature allows one of four PSI5 current/voltage converters to output the voltage modulated Manchester
signal through the RXD pin. The logic level changes of the output voltage represent the detection threshold triggering status of the selected
PSI5_x channel current drawn. This feature provides a convenient access for using test and development tools to acquire satellite sensor
data.
The LIN_CONFIG command is latched until a subsequent SPI update or internal reset. The response indicates the current state of the
LIN_CONFIG bits.
Table 18. SPI Command, - LIN_CONFIG
LIN_CONFIG (0x50, 0x90)
Write
Read
15
14
13
12
11
SI
10
9
8
7
6
5
4
3
2
1
0
0
1
SO
x
0
0
1
0
0
0
0
x
x
REN
RXO1
RXO0
FSEL
LSR1
LSR0
1
P
1
1
1
0
x
x
REN
RXO1
RXO0
0
LSR1
LSR0
SI
1
SO
0
0
1
0
0
0
0
x
x
x
x
x
x
x
x
x
1
0
P
1
1
1
0
x
x
REN
RXO1
RXO0
0
LSR1
LSR0
LIN Slew Rate Select
LSR1 LSR0
Default
Function
0
0
20 kBaud communications
0
1
10.4 kBaud communications
1
0
> 20 kBaud communications (no pulse shaping)
1
1
> 20 kBaud communications (no pulse shaping)
Boost/Buck Frequency Selection
FSEL
Default
Function
0
Low speed switching (140 kHz)
1
High speed switching (245 kHz)
33789
Analog Integrated Circuit Device Data
Freescale Semiconductor
59
FUNCTIONAL DEVICE OPERATION
SENSOR MESSAGE, OPERATION COMMAND AND SPI
Table 18. SPI Command, - LIN_CONFIG (continued)
RX Output Select (for REN = 1)
RXO1 RXO0
Default
Function
0
0
Satellite Channel 1
0
1
Satellite Channel 2
1
0
Satellite Channel 3
1
1
Satellite Channel 4
RXD Output Enable
REN
Default
Function
0
Normal function (RX outputs LIN signal)
1
Satellite monitor (RX outputs satellite Manchester signal)
Power Supply Control SPI Commands
PS_CONTROL (0x51, 0x91)
The PS_CONTROL command is used for the system power management, including controls of boost supply, buck supply, sync supply,
energy reserve, and VCC, as shown in Table 19.
The command is latched until a subsequent SPI update or internal reset occurs. Some incident conditions, such as a thermal or
overcurrent shutdown, could also deactivate the function. The response indicates the current state of system power management.
The charge / discharge fault (CDF) bit is cleared by an internal reset, or by a SPI command attempting to deactivate both switches, by
setting ERC[1:0] to '00'. Unlike other registers that are only set to their default state by an internal reset, the ERC bits are set to their default
state by a Sleep Reset.
V BST
VBST
Boost Enable
Charge SPI Command
V PRE _HIGH = 0
Internal Reset
Discharge SPI Command
V PRE _HIGH = 0
SW CHARGE
CBST
ERSW
V ER
Re xt
SWDISCHARGE
CER
Figure 50. Energy Reserve Charge and Discharge Logic
33789
60
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
SENSOR MESSAGE, OPERATION COMMAND AND SPI
Table 19. SPI Command, - PS_CONTROL
PS_CONTROL (0x51, 0x91)
Write
Read
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
SI
0
1
0
1
0
0
0
1
x
x
SC
BOE
x
BUE
ERC1
ERC0
SO
0
0
1
P
1
1
1
0
BST
CDF
SC
BOE
0
BUE
ERC1
ERC0
SI
1
0
0
1
0
0
0
0
x
x
x
x
x
x
x
x
SO
x
1
0
P
1
1
1
0
x
x
REN
RXO1
RXO0
x
LSR1
LSR0
Boost Status
BST
Default
Function
0
Boost voltage is less than threshold (~80% of target)
1
Boost voltage is greater than threshold (~80% of target)
CER Charge/Discharge Switch Failure Status
CDF
Default
Function
0
No overcurrent/temp fault on charge or discharge switches
1
Overcurrent/temp fault on charge or discharge switches
Sync Supply Control
SC
Default
Function
0
Deactivate sync supply
1
Activate sync supply
Boost Enable
BOE
Default
Function
0
Deactivate boost
1
Activate boost
Buck Enable
BUE
Default
Function
0
Deactivate buck request
1
Activate buck
ERC1
ERC0
Discharge Switch
Charge switch
0
0
OFF
OFF
0
1
OFF
ON
1
0
ON
OFF
1
1
OFF
OFF
Energy Reserve Control
Default
ESR_DIAG (0x42, 0x82)
The ESR_DIAG command is used to initiate the energy reserve capacitor ESR test and read the VERDIAG voltage for the test.
Writing the enable bit (EN = '1') in the command will open the charge switch and close the discharge switch at the next Satsync falling
edge, to allow the measurement of the ESR voltage. The enable state will remain set for repeating ESR test until a subsequent SPI
ESR_DIAG command with EN = '0'. The ESR_DIAG command will respond to a read request with the most recent VERDIAG voltage from
the A/D converter.
33789
Analog Integrated Circuit Device Data
Freescale Semiconductor
61
FUNCTIONAL DEVICE OPERATION
SENSOR MESSAGE, OPERATION COMMAND AND SPI
Table 20. SPI Command, - ESR_DIAG
ESR_DIAG (0x42, 0x82)
Write
Read
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
SI
0
1
0
0
0
0
1
0
x
x
x
x
x
x
x
EN
SO
0
1
0
P
1
1
1
0
x
x
x
x
x
x
x
EN
SI
1
0
0
0
0
0
1
0
x
x
x
x
x
x
x
x
SO
0
1
0
P
1
1
1
0
D7
D6
D5
D4
D3
D2
D1
D0
Boost Status
EN
Default
Function
0
Disable ESR test (VERDIAG_EN = 0)
1
Enable ESR test (VERDIAG_EN = 1)
D7:D0
Function
Data
VERDIAG voltage (ADC[9:2]) 1.95 mV/count
Analog Interface SPI Commands
AI_CONTROL (0x52, 0x92)
The AI_CONTROL command selects an analog voltage source to be routed to the analog diagnostics output AOUT pin. The lower 5
bits of the command are used for the selection to form the multiplexed analog measurement.
The AI_CONTROL command is latched until a subsequent SPI update, or a DIAG_CLR SPI command, or an internal reset occurs. The
response indicates the current state of the analog interface control.
Table 21. SPI Command - AI_CONTROL
AI_CONTROL (0X52, 0X92)
Write
Read
15
14
13
12
11
10
9
8
SI
0
1
0
1
0
0
1
0
X
X
X
AIC4
AIC3
AIC2
AIC1
AIC0
SO
0
0
1
P
1
1
1
0
0
0
0
AIC4
AIC3
AIC2
AIC1
AIC0
SI
1
0
0
1
0
0
1
0
X
X
X
X
X
X
X
X
SO
0
1
0
P
1
1
1
0
0
0
0
AIC4
AIC3
AIC2
AIC1
AIC0
Analog Interface Request Bits
AIC4
AIC3
AIC2
ACIC1
AIC0
HEX
0
0
0
0
0
$00
RSENSE
1
0
0
0
0
1
$01
VERDIAG
x5
0
0
0
1
0
$02
VPWR
5.6
8.5
Function
Multiplier
0
0
0
1
1
$03
VBST
0
0
1
0
0
$04
VER
8.5
0
0
1
0
1
$05
VBUCK
2.8
0
0
1
1
0
$06
VSYNC
5
2
0
0
1
1
1
$07
IN1
0
1
0
0
0
$08
IN2
2
0
1
0
0
1
$09
IN3
2
0
1
0
1
0
$0A
IN4
2
2
0
1
0
1
1
$0B
IN5
0
1
1
0
0
$0C
IN6
2
0
1
1
0
1
$0D
IN7
2
33789
62
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
SENSOR MESSAGE, OPERATION COMMAND AND SPI
Analog Interface Request Bits
Default
0
1
1
1
0
$0E
IN8
2
0
1
1
1
1
$0F
IN9
2
1
0
0
0
0
$10
Unused (High-Z-output)
1
0
0
0
1
$11
OUT1-D
5.6
1
0
0
1
0
$12
OUT1-S
5.6
1
0
0
1
1
$13
OUT2-D
5.6
5.6
1
0
1
0
0
$14
OUT2-S
1
0
1
0
1
$15
Unused (High-Z-output)
1
0
1
1
0
$16
Unused (High-Z-output)
1
0
1
1
1
$17
Unused (High-Z-output)
1
1
0
0
0
$18
Unused (High-Z-output)
1
1
0
0
1
$19
Unused (High-Z-output)
1
1
0
1
0
$1A
Unused (High-Z-output)
1
1
0
1
1
$1B
Unused (High-Z-output)
1
1
1
0
0
$1C
Unused (High-Z-output)
1
1
1
0
1
$1D
Unused (High-Z-output)
1
1
1
1
0
$1E
Unused (High-Z-output)
1
1
1
1
1
$1F
Unused (High-Z-output)
DC Sensor Interface SPI Commands
DCS_CONTROL (0x53, 0x93)
The DCS_CONTROL command is used to control two internal analog multiplexers for the DC sensor input interface activation, which
include:
•Sensor Channel Selection (SS): Determines which DC sensor input shall be connected to the internal regulated bias voltage supply for
the analog diagnostic output AOUT.
•Bias Voltage Selection (VS): Determines which one of four predefined voltages shall be used for the bias supply applied on the selected
DC sensor output stage.
The DCS_CONTROL command is latched until a subsequent SPI update, or a DIAG_CLR SPI command, or an internal reset occurs.
Some incident conditions, such as thermal or overcurrent shutdown could deactivate the selections. The response of the command
indicates the current state of the DC sensor interface control.
Table 22. SPI Command - DCS_CONTROL
DCS_CONTROL (0X53, 0X93)
Write
Read
Default
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
SI
0
1
0
1
0
0
1
1
SS3
SS2
SS1
SS0
VS1
VS0
x
x
SO
0
0
1
P
1
1
1
0
SS3
SS2
SS1
SS0
VS1
VS0
0
0
SI
1
0
0
1
0
0
1
1
X
X
X
X
X
X
X
X
SO
0
1
0
P
1
1
1
0
SS3
SS2
SS1
SS0
VS1
VS0
0
0
Input Sensor Select
SS3
SS2
SS1
SS0
0
0
0
0
Voltage Supply not connected to any INx
0
0
0
1
Voltage Supply connected to IN1
0
0
1
0
Voltage Supply connected to IN2
0
0
1
1
Voltage Supply connected to IN3
0
1
0
0
Voltage Supply connected to IN4
0
1
0
1
Voltage Supply connected to IN5
0
1
1
0
Voltage Supply connected to IN6
0
1
1
1
Voltage Supply connected to IN7
33789
Analog Integrated Circuit Device Data
Freescale Semiconductor
63
FUNCTIONAL DEVICE OPERATION
SENSOR MESSAGE, OPERATION COMMAND AND SPI
Default
Input Sensor Select
SS3
SS2
SS1
SS0
1
0
0
0
Voltage Supply connected to IN8
1
0
0
1
Voltage Supply connected to IN9
1
0
1
0
Voltage Supply not connected to any INx (reserved)
1
0
1
1
Voltage Supply not connected to any INx (reserved)
1
1
0
0
Voltage Supply not connected to any INx (reserved)
1
1
0
1
Voltage Supply not connected to any INx (reserved)
1
1
1
0
Voltage Supply not connected to any INx (reserved)
1
1
1
1
Voltage Supply not connected to any INx (reserved)
VS1
VS0
0
0
Supply Voltage = 1.5 V
0
1
Supply Voltage = 2.5 V
1
0
Supply Voltage = 5.0 V
1
1
Supply Voltage = 6.5 V
Supply Voltage Select
Safing Logic SPI Commands
SAFE_CONTROL (0x58, 0x98)
The SAFE_CONTROL command is used for the following safing logic features:
•Safing State Machine (SSM) operation mode control
•Arming output test mode control, - the Arming outputs (via ARM and DISARM pins) can only be tested while SSM is in Diag mode
•Request of the number of valid data messages received from sensors
•Error status of the safing logic
The Sequence Error (SE) bit is cleared upon the Satsync rising edge.
Once an offset of the digital A_SENSOR data is detected at the HPF, which corresponds to an offset falls outside of 25% of the
expected output, an internal offset error signal will be created and the Offset Error (OE) bit will be set. The HPF will continue process the
A_SENSOR data received from the ACD, but ASENSOR_RG will not be updated with the OE bit set. The OE bit is cleared upon the SPI
read only if the offset error condition is no longer present, which means the A_SENSOR input has returned to the valid range.
Table 23. SPI Command - SAFE_CONTROL
SAFE_CONTROL (0X58, 0X98)
Write
Read
Default
Default
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
SI
0
1
0
1
1
0
0
0
X
X
X
X
MR1
MR0
TEN
LEV
SO
0
0
1
P
1
1
1
0
VD3
VD2
VD1
VD0
MD1
MD0
OE
SE
SI
1
0
0
1
1
0
0
0
X
X
X
X
X
X
X
X
SO
0
1
0
P
1
1
1
0
VD3
VD2
VD1
VD0
MD1
MD0
OE
SE
Mode Request
MR1
MR0
0
0
No mode change requested
0
1
Request change to Safing Mode
1
0
Request change to Scrap Mode
1
1
No mode change requested
TEN
Arming Output Test Enable
0
ARM/DISARM output Test mode disabled
1
ARM/DISARM output Test mode enabled
33789
64
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
SENSOR MESSAGE, OPERATION COMMAND AND SPI
Default
Arming Output Test Level Select
LEV
0
Set ARM=0, DISARM = 0 if TEN = 1 and in Diag mode
1
Set ARMN=1, DISARM = 1 if TEN = 1 and in Diag mode
Valid Data Count
VD3:VD0
xxxx
MD1
Default
Default
Default
Number of digital sensor messages received with valid sensor data
Mode Status
MD0
0
0
Startup Mode or Diag mode
0
1
Safing mode
1
0
Scrap mode
1
1
Arming mode
OE
A_SENSOR Data Offset Error
0
Offset error not detected on analog safing sensor input
1
Offset error detected on analog safing sensor input
SE
Sequence Error
0
Sequence error not detected
1
Sequence error detected
SCRAP_SEED (0x59, 0x99)
The SCRAP_SEED command is a read-only command used to request an 8-bit seed value for the safing state machine to enter into
Arming mode. Upon reception of this command, the 33789 freezes the free-running seed counter, calculates a key value, and populates
the frozen value as the response.
A subsequent command that submits the key value (SCRAP_KEY) will allow the entry into Arming mode.
Table 24. SPI Command, - SCRAP_SEED
SCRAP_SEED (0x59, 0x99)
Write *
Read
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
SI
0
1
0
1
1
0
0
1
x
x
x
x
x
x
x
x
SO
0
0
0
P
1
1
1
0
0
0
0
0
0
0
1
0
SI
1
0
0
1
1
0
0
1
x
x
x
x
x
x
x
x
SO
0
1
0
P
1
1
1
0
S7
S6
S5
S4
S3
S2
S1
S0
S7:S0
SEED
0
Function
8-bit seed value for Scrap Mode entry
* The Write response will always be ERROR with the RE bit set to ‘1’
SCRAP_KEY (0x5A, 0x9A)
The SCRAP_KEY command is a write-only command used to request an 8-bit key value for the Safing state machine to enter into Scrap
mode. Upon reception of this command, the 33789 checks the submitted key value against the internally calculated key value, if they are
equal, enters Arming mode.
Periodic SCRAP_KEY commands are required for the Safing state machine to remain in Arming mode.
33789
Analog Integrated Circuit Device Data
Freescale Semiconductor
65
FUNCTIONAL DEVICE OPERATION
SENSOR MESSAGE, OPERATION COMMAND AND SPI
Table 25. SPI Command, - SCRAP_KEY
SCRAP_KEY (0x5A, 0x9A)
Write
Read *
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
SI
0
1
0
1
1
0
1
0
K7
K6
K5
K4
K3
K2
K1
K0
SO
0
0
1
P
1
1
1
0
0
0
0
0
0
0
0
0
SI
1
0
0
1
1
0
1
0
x
x
x
x
x
x
x
x
SO
0
0
0
P
1
1
1
0
0
0
0
0
0
0
1
0
K7:K0
Function
KEY
8-bit key value for Scrap Mode entry
* The READ response will always be ERROR with the RE bit set to ‘1’
T_UNLOCK (0x4D, 0x8D)
The T_UNLOCK command is a write-only command used to submit an unlock code to the Safing state machine to enable updating of
the safing thresholds. The response from the 33789 is a fixed write response with all of data bits set to '0'.
This command is only valid while the Safing state machine is in Start-up mode, and attempting T_UNLOCK commands while in other
modes will result in an ERROR response with the RE bit set.
Table 26. SPI Command, - T_UNLOCK
T_UNLOCK (0x4D, 0x8D)
Write
Read *
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
SI
0
1
0
0
1
1
0
1
U7
U6
U5
U4
U3
U2
U1
U0
SO
0
0
1
P
1
1
1
0
0
0
0
0
0
0
0
0
SO **
0
0
0
P
1
1
1
0
0
0
0
0
0
0
1
0
SI
1
0
0
0
1
1
0
1
x
x
x
x
x
x
x
x
SO
0
0
0
P
1
1
1
0
0
0
0
0
0
0
1
0
U7:U0
Function
UNLOCK
8-bit key value for safing threshold update
* The Read response will always be ERROR with the RE bit set to ‘1’
** The response to a Write while not in Start-up Mode results in ERROR with RE = 1
SAFE_THx (0x45 ~ 0x4C, 0x85 ~ 0x8C)
The SAFE_THx command is a read/write command used for reading and writing the 8 safing threshold values.
Writing of the safing thresholds can be enabled only if the following conditions are all met:
•The previously received message was a T_UNLOCK command
•The Unlock code in the T_UNLOCK command is correct per definition
•The Safing state machine is in Start-up mode
Reading of the safing thresholds is enabled in any state, and requires no prior unlock message.
A total of eight safing thresholds can be read or written using the eight commands as shown in Table 27.
Table 27. SPI Command, - SAFE_THx
SAFE_THx (0x45~0x4C, 0x85~0x8C)
Write
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
SI
0
1
0
0
A3
A2
A1
A0
DE
T6
T5
T4
T3
T2
T1
T0
SO
0
0
1
P
1
1
1
0
DE
T6
T5
T4
T3
T2
T1
T0
SO **
0
0
0
P
1
1
1
0
0
0
0
0
0
0
1
0
33789
66
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
SENSOR MESSAGE, OPERATION COMMAND AND SPI
Table 27. SPI Command, - SAFE_THx
Read *
SI
1
0
0
0
A3
A2
A1
A0
x
x
x
x
x
x
x
x
SO
0
1
0
P
1
1
1
0
DE
T6
T5
T4
T3
T2
T1
T0
Comman
d
A3
A2
A1
A0
0x45,0x85
0
1
0
1
Safing Threshold 0 Command
0x46,0x86
0
1
1
0
Safing Threshold 1 Command
0x47,0x87
0
1
1
1
Safing Threshold 2 Command
0x48,0x88
1
0
0
0
Safing Threshold 3 Command
0x49,0x89
1
0
0
1
Safing Threshold 4 Command
0x4A,0x8
A
1
0
1
0
Safing Threshold 5 Command
0x4B,0x8
B
1
0
1
1
Safing Threshold 6 Command
0x4C,0x8
C
1
1
0
0
Safing Threshold 7 Command
Function
DE
Default
Dwell Extension
0
Dwell Extension = 255 ms
1
Dwell Extension = 2 s
T6:T0
Safing Threshold
THRESHOLD
7-bit Safing Threshold data
* Response when [T_UNLOCK register value] = [DE, T6:T0]^0xAD
** Response when any of the following conditions exist (ERROR with RE = 1)
1 Previous SPI command was not T_UNLOCK write
2 [T_UNLOCK register value] <> [DE, T6:T0]^0xAD
3 Not in Start-up Mode
Watchdog Control SPI Commands
WDOG_FEED (0x4E, 0x8E)
The WDOG_FEED command is a write-only command used to service the watchdog.
Only watchdog 'high' or watchdog 'low' is accepted, any other values are ignored by the logic.
The 33789 responds to the command is a fixed write response with all data bits set to '0'.
Any attempted read access to WDOG_FEED will result in an ERROR response with the RE bit set to '1'.
Table 28. SPI Command, - WDOG_FEED
WDOG_FEED (0x4E, 0x8E)
Write
Read *
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
SI
0
1
0
0
1
1
1
0
D7
D6
D5
D4
D3
D2
D1
D0
SO
0
0
1
P
1
1
1
0
0
0
0
0
0
0
0
0
SI
1
0
0
0
1
1
1
0
x
x
x
x
x
x
x
x
SO
0
0
0
P
1
1
1
0
0
0
0
0
0
0
1
0
* The READ response will always be ERROR with the RE bit set to ‘1’
D7:D0
Function
0x55
Watchdog feed value LOW
0xAA
Watchdog feed value HIGH
Other
No effect
33789
Analog Integrated Circuit Device Data
Freescale Semiconductor
67
FUNCTIONAL DEVICE OPERATION
SENSOR MESSAGE, OPERATION COMMAND AND SPI
WDOG_TEST (0x55, 0x95)
The WDOG_TEST command is a write-only command used to put the watchdog state machine into the “wait for refresh failure” state.
This can be used to test the watchdog error.
The 33789 responds to the command is a fixed write response with all data bits set to '0'.
Any attempted read access to WDOG_TEST will result in an ERROR response with the RE bit set to '1'.
Table 29. SPI Command, - WDOG_TEST
WDOG_TEST (0x55, 0x95)
Write
Read *
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
SI
0
1
0
1
0
1
0
1
x
x
x
x
x
x
x
x
SO
0
0
1
P
1
1
1
0
0
0
0
0
0
0
0
0
SI
1
0
0
1
0
1
0
0
x
x
x
x
x
x
x
x
SO
0
0
0
P
1
1
1
0
0
0
0
0
0
0
1
0
* The READ response will always be ERROR with the RE bit set to ‘1’
Other SPI Commands
DIAG_CLR (0x54, 0x94)
The DIAG_CLR command is a write-only command used to force all diagnostic controls to their default state. It affects two latched
commands: AI_CONTROL and DCS_CONTROL. The response to the command is a fixed write response with all data bits set to '0'.
Any attempted read access to DIAG_CLR will result in an ERROR response with the RE bit set to '1'.
Table 30. SPI Command, - DIAG_CLR
DIAG_CLR (0x54, 0x94)
Write
Read *
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
SI
0
1
0
1
0
1
0
0
x
x
x
x
x
x
x
0
x
SO
0
0
1
P
1
1
1
0
0
0
0
0
0
0
0
0
SI
1
0
0
1
0
1
0
0
x
x
x
x
x
x
x
x
SO
0
0
0
P
1
1
1
0
0
0
0
0
0
0
1
0
* The READ response will always be ERROR with the RE bit set to ‘1’
STATUS (0x56, 0x96)
The STATUS command is a read-only command used to retrieve the C33789 status for diagnostic purposes. The response to the
command is a read response containing the current 33789 status.
Attempted write access to STATUS will result in an ERROR response with the RE bit set to '1'.
There are two status bits latched in the 33789 after they are set to their 'active' states. Once the bits are read via a STATUS command,
they are set to their 'inactive' states. Only an internal reset and the STATUS read command can set these bits to their 'inactive' states, and
immediately after either of them occur, the states are updated to reflect their true status. This is designed to ensure intermittent error
conditions can be detected by the system.
The following table defines these bits and their 'active' and 'inactive' states:
Table 31. Two Latched Status
Bit Name
Function
Active State
Inactive State
BOT
Boost Supply
Overtemperature
1
0
IGN
IGNSTAT state
0
1
The WDR bit is set whenever the 33789 detects an incorrect watchdog refresh, and can be cleared by a WSM Reset or by a correct
watchdog feed.
33789
68
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
SENSOR MESSAGE, OPERATION COMMAND AND SPI
Table 32. SPI Command - STATUS
STATUS(0x56, 0x96)
Write *
Read
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
SI
0
1
0
1
0
1
1
0
X
X
X
X
X
X
X
X
SO
0
0
0
P
1
1
1
0
0
0
0
0
0
0
1
0
SI
1
0
0
1
0
1
1
0
X
X
X
X
X
X
X
X
SO
0
1
0
P
1
1
1
0
SOT
DCOT
BOT
IGN
WU
WS1
WS0
WDR
SOT
Default
Sync Supply Overtemperature Error
0
Sync supply overtemperature error not detected
1
Sync supply overtemperature error detected
DCOT
Default
DC Sensor Regulator Overtemperature Error
0
DC sensor regulator overtemperature error not detected
1
DC sensor regulator overtemperature error detected
BOT
Default
Boost Supply Overtemperature Error
0
Boost supply overtemperature error not detected
1
Boost supply overtemperature error detected
IGN
Default
IGNSTAT State
0
VPWR < IGNSTAT threshold VBST_UV
1
VPWR IGNSTAT threshold VBST_UV
WU
Default
Wake Pin State
0
WAKE Pin = 0
1
WAKE Pin = 1
Watchdog State
WS1
Default
WS0
Function
0
0
Watchdog State = “INITIAL”
0
1
Watchdog State = “DRIVE” and ARM_LOCKOUT = 0
1
0
Watchdog State = “DRIVE” and ARM_LOCKOUT = 1
1
1
Watchdog State = “WDOG_TEST” or “WDOG_OVERRIDE”
WDR
Default
0
1
Watchdog Error Status
Previous reset was not caused by watchdog error
Previous reset was caused by watchdog error
* The Write response will always be ERROR with RE bit set to “1”
OUT1_CTL (0x5B, 0x9B) and OUT2_CTL (0x5C, 0x9C)
The OUTx_CTL commands are used to activate/deactivate the general purpose drivers. OUT1_CTL is for driver1 (OUT1_D, OUT1_S),
and OUT2_CTL is for driver 2 (OUT2_D, OUT2_S).
They are also used to configure the PWM duty cycle. Setting the duty cycle to 111111b will turn the driver ON without PWM, i.e. 100%
duty cycle. Setting the duty cycle to 000000b will deactivate the driver, i.e. 0% duty cycle, thus it is considered as an “OFF” command.
The OUTx_CTL commands also configure the drivers as a Highside Driver or Low-side Driver.
The response from the command indicates the echo of the driver designation, comparator diagnostics information, and shows if a
thermal shutdown occurred.
33789
Analog Integrated Circuit Device Data
Freescale Semiconductor
69
FUNCTIONAL DEVICE OPERATION
SENSOR MESSAGE, OPERATION COMMAND AND SPI
Table 33. SPI Command, - OUT1_CTL
OUT1_CTL (0x5B, 0x9B)
Write
Read *
Default
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
SI
0
1
0
1
1
0
1
1
DC5
DC4
DC3
DC2
DC1
DC0
HS
x
SO
0
0
1
P
1
1
1
0
TS
0
ON23
ON13
HS
0
SI
1
0
0
1
1
0
1
1
x
x
SO
0
1
0
P
1
1
1
0
TS
0
DC5:D
C0
DC%
DC5:D
C0
DC%
DC5:D
C0
DC%
0 000000
OFF
22 010110
34.9
43 101011
68.3
1 000001
1.6
23 010111
36.5
44 101100
69.8
2 000010
3.2
24 011000
38.1
45 101101
71.4
3 000011
4.8
25 011001
39.7
46 101110
73.0
4 000100
6.3
26 011010
41.3
47 101111
74.6
5 000101
7.9
27 011011
42.9
48 110000
76.2
6 000110
9.5
28 011100
44.4
49 110001
77.8
7 000111
11.1
29 011101
46.0
50 110010
79.4
8 001000
12.7
30 011110
47.6
51 110011
81.0
9 001001
14.3
31 011111
49.2
52 110100
82.5
10 001010
15.9
32 100000
50.8
53 110101
84.1
11 001011
17.5
33 100001
52.4
54 110110
85.7
12 001100
19.0
34 100010
54.0
55 110111
87.3
13 001101
20.6
35 100011
55.6
56 111000
88.9
14 001110
22.2
36 100100
57.1
57 111001
90.5
15 001111
23.8
37 100101
58.7
58 111010
92.1
16 010000
25.4
38 100110
60.3
59 111011
93.7
17 010001
27.0
39 100111
61.9
60 111100
95.2
18 010010
28.6
40 101000
63.5
61 111101
96.8
19 010011
30.2
41 101001
65.1
62 111110
98.4
20 010100
31.7
42 101010
66.7
63 111111
ON
21 010101
33.3
OFF23 OFF13
x
HS
Default
Default
Default
Default
Default
Default
x
OFF23 OFF13
x
x
x
x
ON23
ON13
HS
0
Driver Configuration Select
0
LS Driver
1
HS Driver
ON13 Driver ON 1/3 VPWR Comparator Result
0
Diagnosis below threshold
1
Diagnosis above threshold
ON23 Driver ON 2/3 VPWR Comparator Result
0
Diagnosis below threshold
1
Diagnosis above threshold
OFF13 Driver OFF 1/3 VPWR Comparator Result
0
Diagnosis below threshold
1
Diagnosis above threshold
OFF23 Driver OFF 2/3 VPWR Comparator Result
0
Diagnosis below threshold
1
Diagnosis above threshold
TS
Thermal Shutdown Indicator
0
No shutdown has occurred
1
Thermal shutdown has occurred*
* Status is cleared after OFF command is sent
33789
70
Analog Integrated Circuit Device Data
Freescale Semiconductor
FUNCTIONAL DEVICE OPERATION
SENSOR MESSAGE, OPERATION COMMAND AND SPI
Table 34. SPI Command, - OUT2_CTL
OUT2_CTL (0x5C, 0x9C)
Write
Read *
Default
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
SI
0
1
0
1
1
1
0
0
DC5
DC4
DC3
DC2
DC1
DC0
HS
x
SO
0
0
1
P
1
1
1
0
TS
0
ON23
ON13
HS
0
SI
1
0
0
1
1
1
0
0
x
x
SO
0
1
0
P
1
1
1
0
TS
0
DC5:D
C0
DC%
DC5:D
C0
DC%
DC5:D
C0
DC%
0 000000
OFF
22 010110
34.9
43 101011
68.3
1 000001
1.6
23 010111
36.5
44 101100
69.8
2 000010
3.2
24 011000
38.1
45 101101
71.4
3 000011
4.8
25 011001
39.7
46 101110
73.0
4 000100
6.3
26 011010
41.3
47 101111
74.6
5 000101
7.9
27 011011
42.9
48 110000
76.2
6 000110
9.5
28 011100
44.4
49 110001
77.8
7 000111
11.1
29 011101
46.0
50 110010
79.4
8 001000
12.7
30 011110
47.6
51 110011
81.0
9 001001
14.3
31 011111
49.2
52 110100
82.5
10 001010
15.9
32 100000
50.8
53 110101
84.1
11 001011
17.5
33 100001
52.4
54 110110
85.7
12 001100
19.0
34 100010
54.0
55 110111
87.3
13 001101
20.6
35 100011
55.6
56 111000
88.9
14 001110
22.2
36 100100
57.1
57 111001
90.5
15 001111
23.8
37 100101
58.7
58 111010
92.1
16 010000
25.4
38 100110
60.3
59 111011
93.7
17 010001
27.0
39 100111
61.9
60 111100
95.2
18 010010
28.6
40 101000
63.5
61 111101
96.8
19 010011
30.2
41 101001
65.1
62 111110
98.4
20 010100
31.7
42 101010
66.7
63 111111
ON
21 010101
33.3
OFF23 OFF13
x
HS
Default
Default
Default
Default
Default
Default
x
OFF23 OFF13
x
x
x
x
ON23
ON13
HS
0
Driver Configuration Select
0
LS Driver
1
HS Driver
ON13 Driver ON 1/3 VPWR Comparator Result
0
Diagnosis below threshold
1
Diagnosis above threshold
ON23 Driver ON 2/3 VPWR Comparator Result
0
Diagnosis below threshold
1
Diagnosis above threshold
OFF13 Driver OFF 1/3 VPWR Comparator Result
0
Diagnosis below threshold
1
Diagnosis above threshold
OFF23 Driver OFF 2/3 VPWR Comparator Result
0
Diagnosis below threshold
1
Diagnosis above threshold
TS
Thermal shutdown indicator
0
No shutdown has occurred
1
Thermal shutdown has occurred*
* Status is cleared after OFF command is sent
NOP (0x57, 0x97)
The NOP command is used to retrieve the response from a previous command without altering anything within the 33789.
The response for the command is a fixed write response with all data bits set to '0'. Any attempted read access to NOP will result in an
ERROR response with the RE bit set to '1'.
Table 35. SPI Command, - NOP
NOP (0x57, 0x97)
Write
Read *
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
SI
0
1
0
1
0
1
1
1
x
x
x
x
x
x
x
0
x
SO
0
0
1
P
1
1
1
0
0
0
0
0
0
0
0
0
SI
1
0
0
1
0
1
1
1
x
x
x
x
x
x
x
x
SO
0
0
0
P
1
1
1
0
0
0
0
0
0
0
1
0
* The READ response will always be ERROR with the RE bit set to ‘1’
33789
Analog Integrated Circuit Device Data
Freescale Semiconductor
71
FUNCTIONAL DEVICE OPERATION
SENSOR MESSAGE, OPERATION COMMAND AND SPI
Operational Mode SPI Command Table
All of the 33789 operational mode SPI commands are summarized in Table 36.
Table 36. Operational Mode SPI Command Table
Operational Mode SPI Commands
ADD
R
00
01
02
Command
Function
R/W
ESR_DIAG
03
04
LINE_ENABLE
SYNC_ENABLE
05
06
07
08
09
0A
0B
0C
0D
0E
0F
10
SAFE_TH_0
SAFE_TH_1
SAFE_TH_2
SAFE_TH_3
SAFE_TH_4
SAFE_TH_5
SAFE_TH_6
SAFE_TH_7
T_UNLOCK
WDOG_FEED
LINE_MODE
LIN_CONFIG
Enable ESR Test / Read VERDIAC
Satellite Channel Enable
Satellite Channel Sync Pulse
Enable
Safing Threshold 0 Value
Safing Threshold 1 Value
Safing Threshold 2 Value
Safing Threshold 3 Value
Safing Threshold 4 Value
Safing Threshold 5 Value
Safing Threshold 6 Value
Safing Threshold 7 Value
Safing Threshold Unlock
Watchdog Pet Command
Satellite Synchronization Select
LIN Configuration
11
PS_CONTROL
12
13
14
15
16
AI_CONTROL
DCS_CONTROL
DIAG_CLR
WDOG_TEST
STATUS
17
18
NOP
SAFE_CTL
19
SCRAP_SEED
1A
1B
SCRAP_KEY
OUT1_CTL
1C
OUT2_CTL
Write Data
4
3
7
6
5
R/W
15:08
40
41
42
2
1
0
x
x
x
x
x
x
x
R/W
R/W
43
44
x
x
x
x
x
x
x
x
4LE
4SE
3LE
3SE
2LE
2SE
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
W
W
R/W
R/W
45
46
47
48
49
4A
4B
4C
4D
4E
4F
50
T7
T7
T7
T7
T7
T7
T7
T7
U7
D7
x
x
T6
T6
T6
T6
T6
T6
T6
T6
U6
D6
x
x
T5
T4
T3
T5
T4
T3
T5
T4
T3
T5
T4
T3
T5
T4
T3
T5
T4
T3
T5
T4
T3
T5
T4
T3
U5
U4
U3
D5
D4
D3
x
x
LM4
REN RX01 RXO
0
SC
BOE
x
T2
T2
T2
T2
T2
T2
T2
T2
U2
D2
LM3
x
Energy Reserve Activation Control
Analog Interface Control
DC Sensor Control
Diagnostic Test Clear
Watchdog Test
33789 Status
R/W
51
x
x
BUE
R/W
R/W
W
W
R
52
53
54
55
56
x
SS3
x
x
x
x
SS2
x
x
x
x
SS1
x
x
x
AIC4
SS0
x
x
x
AIC3
VS1
x
x
x
No-Op
ARM/DISARM Output and Mode
Control
Scrapping Function Seed
Request
Scrapping Function Key Submit
General Purpose Driver1 Output
Control
General Purpose Driver2 Output
Control
W
R/W
57
58
x
X
x
X
x
X
x
X
R
59
x
x
x
W
R/W
5A
5B
K7
DC5
K6
DC4
R/W
5C
DC5
DC4
1D
1E
1F
Read Data
4
3
7
6
5
EN
15:08
80
81
82
D7
D6
D5
D4
1LE
1SE
83
84
OT4
0
OT3
0
OT2
0
OT1
0
T1
T0
T1
T0
T1
T0
T1
T0
T1
T0
T1
T0
T1
T0
T1
T0
U1
U0
D1
D0
LM2 LM1
LSR1 LSR0
85
86
87
88
89
8A
8B
8C
8D
8E
8F
90
T7
T7
T7
T7
T7
T7
T7
T7
0
0
0
x
T6
T6
T6
T6
T6
T6
T6
T6
0
0
0
x
ERC
0
AIC0
x
x
x
x
91
BST
CDF
AIC2
VS0
x
x
x
ERC
1
AIC1
x
x
x
x
92
93
94
95
96
0
SS3
0
0
SOT
x
MR1
x
MR0
x
TEN
x
LEV
97
98
x
x
x
x
x
K5
DC3
K4
DC2
K3
DC1
K2
DC0
K1
HS
DC3
DC2
DC1
DC0
HS
5D
5E
5F
2
1
0
D3
D2
D1
D0
4LE
4SE
3LE
3SE
2LE
2SE
1LE
1SE
T5
T4
T3
T5
T4
T3
T5
T4
T3
T5
T4
T3
T5
T4
T3
T5
T4
T3
T5
T4
T3
T5
T4
T3
0
0
0
0
0
0
0
0
lLM4
REN RX01 RXO
0
SC
BOE
0
T2
T2
T2
T2
T2
T2
T2
T2
0
0
LM3
x
T1
T0
T1
T0
T1
T0
T1
T0
T1
T0
T1
T0
T1
T0
T1
T0
1
0
1
0
LM2 LM1
LSR1 LSR0
BUE
0
SS1
0
0
BOT
AIC4
SS0
0
0
IGN
AIC3
VS1
0
0
WU
AIC2
VS0
0
0
WS1
0
VD3
0
SS2
0
0
DCO
T
0
VD2
ERC ERC
1
0
AIC1 AIC0
0
0
1
0
1
0
WS0 WDR
0
VD1
0
VD0
0
MD1
0
MD0
1
OE
0
SE
99
S7
S6
S5
S4
S3
S2
S1
S0
K0
x
9A
9B
0
TS
0
0
1
HS
0
0
x
9C
TS
0
0
ON1
3
ON1
3
HS
0
0
0
0
OFF2 OFF1 ON2
3
3
3
OFF2 OFF1 ON2
3
3
3
9D
9E
9F
TEST-MODE SPI COMMANDS
The 33789 enters Test mode when the PPT pin is driven high, i.e. 5.0 V, and the test-mode entry command is received.
Table 37. SPI Command, - Test Mode Entry
TESTMODE (ADDR=0xD5, DATA=0x52)
TEST
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
SI
1
1
0
1
0
1
0
1
0
1
0
1
0
0
1
0
SO
0
1
1
0
1
1
1
0
0
0
0
0
0
0
0
0
FAILURE MODE REQUIREMENTS
SPI Error
SPI Error is defined as a condition where the SPI frame format is incorrect.
When a SPI error is detected, the 33789 will respond with an error response message on SO with the 'SPI Error' (SE) bit set. When a
SPI error is detected, the 33789 will immediately set SO to a high-impedance state.
SPI errors could be caused by:
•An incorrect number of SPI SCK cycles (>16, or <16 but >0), while CS is active
•Too short of an inter-frame time
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FUNCTIONAL DEVICE OPERATION
SAFING
SPI Request Error
A SPI Request Error is defined as a condition, where the content of a SPI request message is incorrect.
When a SPI Request Error is detected, the 33789 will respond with an error response message on SO with the 'Request Error' (RE) bit
set.
SPI request errors could be caused by:
•An undefined command (e.g. incorrect address in bits [12:8])
•An illegal operation for a defined command (e.g. attempting to write when receiving a read-only command)
•An attempted command request while in the incorrect state for the command (e.g. T_UNLOCK command while not in Start-up mode)
SAFING
SAFING CONCEPT
The safing concept involves the utilization of logic independence of the MCU to monitor both on-board and remote satellite sensors, to
determine if a sufficient inertial activity is present to warrant deployment Arming of the system.
While in the Safing state, on the rising edge of the SATSYNC input, the MCU will request samples from all digital sensing sources, in
a predetermined sequence with SPI commands. If sensor data in response is valid, the safing logic will compare it to the appropriate safing
threshold. The threshold was arranged based on the expected sequence of sampling. The safing thresholds of the 33789 have been
assigned to pairs of sequence numbers as shown in Table 38.
Table 38. Sequence to Safing Threshold Mapping
Sequence Identifier
0000
0001
0010
0011
0100
0101
0110
0111
1000
1001
1010
1011
1100
1101
1110
Safing Threshold
Threshold 0
Threshold 1
Threshold 2
Threshold 3
Threshold 4
Threshold 5
Threshold 6
Threshold 7
If three consecutive samples from the same sensor exceed the threshold, an internal safing signal is set. This safing signal activation
will assert the Arming outputs (ARM and DISARM) for the duration of the signal, plus a Dwell Extension period after it is cleared. The Dwell
Extension period is defined either 255 ms or 2.0 seconds depending on the safing condition.
To prevent a loss of synchronization between the sampling order and the desired threshold (e.g. a sensor fails to respond), an internal
Sequence Counter is designated to maintain the increments each time a sensor’s data response is received, whether it includes valid data
or not. This Sequence Counter is reset at each rising edge of Satsync to re-synchronize with the next sampling period. If a sequence ID
in the SPI request/response (SQ2:SQ0) does not match the corresponding value in the Sequence Counter, the 33789 will immediately set
a Sequence Error bit and disable safing on digital sensors for the rest of the sample period, until the next Satsync rising edge.
Another counter, Valid Data Counter, which is also reset at each rising edge of Satsync, is used to determine how many SPI data frames
containing valid sensor data have been received in each sampling period. The Valid Data Counter is readable via the SPI for the MCU.
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Analog Integrated Circuit Device Data
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73
FUNCTIONAL DEVICE OPERATION
SAFING
SAFING STATE MACHINE
The Safing State Machine (SSM) is used to control the safing function and provide diagnostics. The control logic of the 33789 Safing
State Machine can be described in Figure 51. This logic provides a high level of robustness to the system architecture by restricting the
primary safing function while diagnostics are performed. It facilitates key-on and run-time diagnostic tests. It also provides a means of
activating safing for the scrap function, which would be useful to safely activate the Arming outputs for disposal of pyrotechnic devices at
the end of vehicle life.
The 33789 Safing State Machine supports five mutually exclusive modes of operation:
Start-up Mode
The Start-up mode is entered upon the release of SSM Reset.
While in Start-up mode, sampling sensor data and activating the ARM/DISARM outputs are inhibited.
Updating the safing thresholds is permitted only while in Start-up mode.
When the watchdog service begins (upon the first successful watchdog feed), the SSM enters the Diagnostic mode.
Diagnostic Mode
When the Diagnostic mode is entered, testing of the ARM and DISARM outputs are enabled, which allows the MCU to activate the
signals both high or both low for testing the interface. It is not possible to set both of the outputs in their active states (ARM=1 and
DISARM=0) in this mode.
The SSM remains in this mode until a SAFE_CTL SPI command is received for either a Safing mode transition or a Scrap mode
transition.
Safing Mode
Upon reception of the SAFE_CTL command with the CTL field set to 'Safing' while in Diagnostic mode, the SSM enters Safing mode.
Safing mode is the primary run-time mode for normal operation. The safing logic can perform all of the safing functions, including
monitoring sensor data and setting the ARM/DISARM signals for Arming output while in this state.
The only means of exiting Safing mode is the assertion of the SSM Reset signal.
Scrap Mode
If the MCU sends the 33789 a SAFE_CTL command with the CTL field set to 'Scrap', while the SSM is in Diagnostic mode, it will force
the SSM enter into Scrap mode.
Once entered into Scrap mode, the SSM stops monitoring the sensor interface, and the safing compare logic is disabled.
From Scrap mode, the SSM can be moved into Arming mode only if the MCU initiates the transition. The only way to move it back from
Scrap mode to Start-up mode is through an SSM Reset.
Arming Mode
While in Arming Mode, the safing outputs are asserted (ARM = 1 and DISARM = 0) to enable firing of squibs.
In order to protect from an inadvertent enter into Arming mode, and to prevent undesired activation of the safing signal, a handshake
is used to control entering into and exiting out of Arming mode.
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FUNCTIONAL DEVICE OPERATION
SAFING
SSM Reset
Start-up Mode
SAFE_CTL = Safing
WSM = DRIVE
(ARM, DISARM
determined by Safing)
WSM = DRIVE
OR
[WSM = WDOG OVERRIDE and SPI WDOG Feed]
(ARM, DISARM can be tested:
ARM = 0 and DISARM = 0, or
ARM = 1 and DISARM = 1)
Diag Mode
SAFE_CTL = Scrap
WSM = DRIVE
First Scrap KEY
Safing Mode
(ARM = 0, DISARM = 1)
Scrap Mode
Invalid Key OR
Key timeout OR
Incorrect ACL
Valid Key:
KEY value correct
AND
KEY received before scrap
timeout is expired
Valid key
AND
Correct ACL
Incorrect ACL
Valid Key
AND
Correct ACL
Arming Mode
(ARM = 1, DISARM = 0)
Figure 51. Safing State Diagram
The handshake sequence for activating the Arming outputs is illustrated in Figures 52. The strategy is:
The 33789 uses a free-running 8-bit counter to generate a seed value;
The MCU read the seed value with the SCRAP_SEED command;
The MCU uses the seed value to generate an 8-bit key;
The MCU submits the key value with the SCRAP_KEY command;
The 33789 freezes the seed value read by the MCU and computes its own key;
Compares two key values at the 33789;
The 33789 receives the ACL signal at the SCRAP pin from the MCU;
If two key values match each other,
AND
the ACL signal is valid,
Transition into Arming mode
To remain in Arming mode, the MCU must periodically refresh the 33789 with SCRAP_KEY command containing correct key value,
and the 33789 must continuously receive a valid ACL signal at the SCRAP pin from either the MCU or another external device, depending
on the application. This must occur before the scrap timeout timer expires (in about 600 µs).
If the periodic scrap key is incorrect, or not been received before timeout, or there is no valid ACL signal at the SCRAP pin, the SSM
reverts back to the Scrap mode, and the Arming outputs are deactivated.
The scrap key is derived from the seed value using a simple logic inversion on the even-numbered bit (0, 2, 4, 6), - equivalent to a bitwise XOR of the seed value with 0x55, logically.
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Freescale Semiconductor
75
FUNCTIONAL DEVICE OPERATION
SAFING
MCU
33789
MCU Reset
Enter Diag mode
Start watchdog service
to enter Diag mode
Enter Scrap mode
Send SAFE_CTL command with
CTL = SCRAP
Request seed value from the 33789
using SCRAP_SEED Command
Calculate key using the seed
received from the 33789,
Submit key using SCRAP_KEY Command
Freeze seed counter, respond with seed,
calculate key using the seed
Receive the first key from the MCU,
compare it to the internally generated key,
start scrap timer
Receive key from the MCU and compare it
to the internally generated key. If they are
equivalent, and scrap timer has not expired
and one valid ACL signal is received,
enter Arming mode (assert safing
signals and resets scrap timer)
Submit key using SCRAP_KEY Command
Continue SCRAP?
Yes
Submit key using SCRAP_KEY Command
If key is received before scrap
timer expires, both key and ACL
signal are correct, reset scrap timer and
continue remain in Arming mode; if not, enter
Scrap mode and deactivate safing signals
Figure 52. Arming Mode Handshake
SPI MONITOR AND DECODER
The SPI Monitor block extracts valid sensor data from the SPI sensor data messages read by the MCU to be able to determine the
safing status. All of the safing related sensor data received by the safing block, including the satellite sensor data from the PSI5 interface,
analog sensor data from A_SENSOR input, and other digital sensor data from local ECU sensors, are monitored for correctness of data
and sequence by the SPI monitor decoder, and will be further used in the safing logic processing.
The SPI monitor is capable of receiving sensor data through the SPI interface from up to 4 sources with 4 specifically assigned chip
select signals:
•CS: Dedicated to the PSI5 satellite channels
•CS_A: Intended for an on-board high-g X, or X/Y accelerometer
•CS_B: Intended for an on-board high-g Y, or expansion of satellite receiver
•CS_C: Intended for an expansion of satellite receiver
While the Safing State Machine is in Safing mode, the SPI Monitor listens to all of the SPI SO responses from satellite receivers and
on-board sensors corresponding to sensor data request from the MCU, and uses predefined sensor message format and data validation
criteria to check the messages. Functions of the SPI Monitor results in generation of three important internal signals within the safing block:
Sensor Message Detection: - generate SENS_MSG
When the SENS_MSG signal is activated, it indicates a valid sensor message is received and the Sequence Counter is not frozen (when
frozen, the counter value equal to '1110').
The SPI Monitor needs to qualify the SPI message frame first by “Frame Check”:
1. SPI data is captured when the chip select is low;
2. The first 16 bits of SO data are captured regardless of the total number of SCK edges detected;
3. A valid frame is detected when the chip select goes high and at least 16 SCK edges have been detected;
4. Frames fewer than 16 SCK edges are ignored;
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FUNCTIONAL DEVICE OPERATION
SAFING
5. If more than one chip select is active at any time during an SPI frame, the SPI frame shall not be validated.
All of the necessary conditions to generate SENS_MSG can be found in Figure 53.
SPI SO Sensor Data Response from Satellite Receiver or on-board Sensor
MSB
15
SQ2
14
SQ1
13
SQ0
12
P
11
ST1
10
ST0
9
D9
8
D8
7
D7
6
D6
5
D5
4
D4
LSB
3
D3
2
D2
1
D1
0
D0
Parity
Check
SO[15:0]
(OK = ‘1’)
Frame
Check
SPI CSx
SCK
SENS_MSG:
STx:ESx = ‘1110’
AND
SPI parity correct
AND
Valid SPI message
AND
SSM = Safing Mode
AND
SEQ_CTR = ‘1110’
(OK = ‘1’)
Safing Mode
Sequence Counter = ‘1110’
D
SET
CLR
Q
Q
Satsync
Figure 53. SPI Decode Logic for SENS_MSG Signal
Sequence Error Detection: - Generate SEQ_ERROR
When a valid sensor message is detected (SENS_MSG = 1), the SPI Monitor compares the SQ2:SQ0 field (sequence number) of the
SPI response message with the expected sequence number determined by the Sequence Counter. If there is a mismatch, the
SEQ_ERROR signal is asserted, as shown in Figure 54.
Activation of SEQ_ERROR will set the Sequence Error bit of the SPI SAFE_CTL command register (SE = 1), and disable the safing
comparison for the affected sensor and all subsequent sensors for the rest of the current sampling period, until the next Satsync rising
edge.
While in Safing mode, the MCU must ensure that the sampling sequence is maintained for every sampling period, regardless of the
state of sensors, to prevent a sequence error from disabling safing on the remaining channels in the sequence. Therefore, if there is a
sensor disabled, the MCU must continue requesting data from the sensor to maintain the sampling sequence. However, it may load a
“dummy” request to fill the SQ2:SQ0 field of the response message.
SPI SO Sensor Data Response from Satellite Receiver or on-board Sensor
MSB
15
SQ2
14
SQ1
13
SQ0
12
P
11
ST1
10
ST0
9
D9
8
D8
7
D7
6
D6
5
D5
4
D4
3
D3
LSB
2
D2
1
D1
0
D0
3-bit Compare:
Output = 1, if equal
Output = 0, if not equal
=
SEQ_ CTR[2:0]
SEQ_ERROR
SENS_MSG
Figure 54. Sequence Error Detection Logic
Sensor Data Validation: - generate DAT_VALID
The DAT_VAL signal is activated whenever a SPI sensor data response message containing valid sensor data is received while in
Safing mode.
All of following conditions must be met to validate the sensor data:
1. ST1:ST0 field of the SO response must be '01', - to confirm this is a sensor data;
2. The SENS_MSG signal must be active, - to confirm it has a qualified message frame;
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FUNCTIONAL DEVICE OPERATION
SAFING
3. The data must be in the valid value range:
• Data (D9:D0) within -480DEC ~ +480DEC inclusive if the sequence counter value >2
•Data (D9:D0) within -512DEC ~ +511DEC inclusive if the sequence counter value <3
4. The Sequence Error (SE) bit is clear.
The SPI decode logic to validate sensor data can be illustrated in Figure 55.
SPI SO Sensor Data Response from Satellite Receiver or on-board Sensor
MSB
15
SQ2
14
SQ1
13
SQ0
12
P
11
ST1
10
ST0
9
D9
8
D8
7
D7
6
D6
5
D5
SENS_MSG
SEQ_ERROR
|SO[9:0]| < 481DEC
4
D4
3
D3
LSB
2
D2
1
D1
0
D0
DAT_VALID:
[ST1:ST0] = ‘01’
AND
SENS_MSG = ‘1’
AND
SO data within the range
|SEQ_ CTR| > 2
Figure 55. SPI Decode Logic for DAT_VAL Signal
SAFING CONTROL COUNTERS
There are two 4-bit Safing control counters in the Safing logic block.
Data Valid
Counter
Satsync
DAT_VALID
(4-bit)
Count
Sequence
Counter
(4-bit)
Reset
SENS_MSG
(4-bit)
Reset
Count
(4-bit)
To SPI Decoder
and SPI Interface
(MCU read SAFE_CTL)
To SPI Monitorr
and
Safing Compare Logic
Figure 56. Safing Control Counters
Sequence Counter
The Sequence Counter increments each time a valid sensor SPI message is received, regardless of whether it contains valid data, an
error message, or self-test data. It is incrementally based on the SENS_MSG signal from the SPI Monitor block, and it resets on each
Satsync rising edge.
Due to the control of SENS_MSG, the Sequence Counter will never advance beyond '1110'. In order to correlate correctly with the
received SPI messages, the Sequence Counter is reset to a value of '1111', so the first sample received causes it to increment to '0000'.
This counter is not read nor write accessible via the SPI interface. The counter contents are used by the SPI Monitor logic to detect
sequence errors, and by the Safing Compare Logic, to correlate sensor samples to the appropriate safing threshold for comparison.
Data Valid Counter
The Data Valid Counter increments each time a sensor SPI message is received that contains valid sensor data (ST1:ST0 = '01'). It is
incrementally based on the DAT_VALID signal from the SPI Monitor block, and resets on each Satsync rising edge.
Due to the control of SENS_MSG, the Data Valid Counter will freeze once the Sequence Counter reaches a value of '1110'. The Data
Valid Counter is reset to a value of '0000' on each Satsync rising edge to accurately reflect the number of samples received.
The count value can be read by the MCU using the SPI SAFE_CTL command to determine whether all digital sensor samples have
been received by safing logic.
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FUNCTIONAL DEVICE OPERATION
SAFING
SAFING THRESHOLD LOGIC
The Safing Threshold logic ensures the safing comparison threshold value can be reliably written and read by the MCU.
The 33789 is capable of storing eight 8-bit safing thresholds. The MSB of threshold data is used to indicate the Dwell Extension pulse
width (either 255 ms or 2.0 s).
The thresholds are correlated to the sampling sequence number pair, as shown in Figure 57.
Safing
Threshold
Sequence
Identifier
Threshold 0
Threshold 1
0000
0001
First sample requested
(normally on-board X)
Second sample requested
(normally on-board Y)
0010
Third sample requested
0011
Forth sample requested
etc.
Threshold 6
Threshold 7
D654321
1100
1101
1110
Fifteenth sample requested
Lower 3 bits are used to
synchronize SPI request/response
Threshold Value
Dwell Extension bit (0 - 255 ms, 1.0 - 2.0 s)
Figure 57. Safing Threshold Storage
Upon the Safing state machine reset, all of the threshold values are rest to default values. Applications may choose to use these default
values or reprogram them.
The default safing thresholds are listed in Table 39:
Table 39. Default Safing Thresholds
Sequence #
(Sampling
Order)
Sequence ID
0
0000
1
0001
2
0010
3
0011
4
0100
5
0101
6
0110
7
0111
8
1000
9
1001
10
1010
11
1011
12
1100
13
1101
14
1110
Desired 10-bit
Threshold Value
(dec)
Desired 10-bit
Threshold Value
(hex)
Dwell
Extension
27
1B
255 ms
42
2A
2.0 s
16
10
255 ms
16
10
16
Targeted
Sensor Type
On-board 50 g X
Targeted Encoded 8-bit
Sensor
Threshold
Threshold
(hex)
2.8 g
0D
30°/s
95
Satellite
240 g
10 g
08
255 ms
Satellite
240 g
10 g
08
10
255 ms
Satellite
pressure
7.8%o
08
16
10
255 ms
Satellite
240 g
10 g
08
8
8
255 ms
Satellite
480 g
10 g
04
8
8
255 ms
Satellite
480 g
10 g
04
On-board 50 g Y
Digital ARS
Analog ARS
33789
Analog Integrated Circuit Device Data
Freescale Semiconductor
79
FUNCTIONAL DEVICE OPERATION
SAFING
SPI Read / Write Access to Safing Thresholds
The MCU has read and write access to the safing thresholds via the SPI interface, using eight SPI SAFE_THx commands.
The application specific safing thresholds are allowed to be written to the safing logic only when the 33789 in Start-up mode, to ensure
the Arming outputs are disabled during the threshold updates and to prevent inadvertent modification of the thresholds during Safing or
Scrap mode.
As additional protection against an undesired safing threshold update, writing an “unlock key” into the T_UNLOCK register prior to
writing thresholds value through the SAFE_THx command is required. The T_UNLOCK command must immediately precede the
SAFE_THx command to correctly update the threshold values.
The unlock key value is calculated by bit-wise XORing the threshold value with the value '0xAD'.
To successfully update the safing threshold registers, all of the following conditions must be met:
•The 33789 is in Start-up mode
•The previous SPI command must be a T_UNLOCK write command
•The SAFE_THx command data field must be equal to the unlock code from the T_UNLOCK command XORed with 0xAD:
•SAFE_THx(data) = [T_UNLOCK(data)] ^ 0xAD
Start
SPI_CMD (n-1)
= ‘T_UNLOCK’?
N
Y
SPI_CMD (n)
= ‘SAFE_THx’?
N
Y
KEY = SPI_DAT(n)^0xAD
KEY =
SPI_DAT (n-1)?
N
Y
THRESHx
SPI_DAT(n)
END
Figure 58. Safing Threshold Write Flowchart
Safing Threshold Encoding
Since the safing comparison involves the 8-bit threshold and a 9-bit magnitude, the desired threshold value must be divided by two
(shift right by one bit) before being stored in the 33789. An additional MS '0 ' bit is then appended to the threshold value used for
comparison.
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FUNCTIONAL DEVICE OPERATION
SAFING
Threshold Encoding Example
Threshold Decoding Example
Unlock Encoding Example
27DEC
Convert to Hex
8DHEX
1BHEX
Convert to Binary
Convert to Binary
0001 1011
0000 1101
Apply MS Dwell
Extension bit
1000 1101
1000 1101
8DHEX
Divide by 2
Bit wise XOR
with 0xAD
Convert to Binary
1000 1101
1000 1101
1010 1101
0010 0000
Strip off Dwell
Extension bit
0000 1101
Multiply by 2
20HEX
0 0001 1010
8DHEX
Value stored in
Threshold Register
9-bit threshold used
for compensation to
the 9-bit sensor data
Unlock Key used for
writing threshold
Figure 59. Safing Threshold and Unlock Key Encoding
SAFING COMPARISON LOGIC
Safing Comparison Enable
The sensor data comparison is conducted under conditions of:
• The SPI message frames are received
• The sensor data is valid
• There is no Sequence Error
Figure 60. Safing Comparison Enable Logic
Safing Magnitude Comparison
All sensor data fed into the Safing Comparison logic is 9-bit, zero-adjusted, positive data, therefore the comparison involves a simple
digital magnitude comparison between two 9-bit data.
The sensor data in the SPI response message frame uses a 10-bit sensor data format. It must be converted into 9-bit magnitude data
for the comparison with the safing threshold.
9-bit Sensor Data D8 D7 D6 D5 D4 D3 D2 D1 D0
9-bit Magnitude Compare
9-bit Threshold Data ‘0’
T6 T5 T4 T3 T2 T1 T0 ‘0’
7-bit threshold
stored in the 33789
Figure 61. Magnitude Comparison
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FUNCTIONAL DEVICE OPERATION
SAFING
Sample Counters
The sensor logic block consists of 16 2-bit Sample Counters to facilitate multi-sample evaluation of sensor data for safing.
Each counter corresponds to a specific Sequence ID in the 33789, and is incremented each time when the received sample exceeds
its associated safing threshold. If there are three consecutive samples from a same sensor exceed the threshold (Sample Counter = '11’b),
the Arming outputs are asserted (ARM = 1, DISARM = 0).
Once the counters reach their maximum value, they are not incremented further. The sample counters are reset upon Safing State
Machine Reset, or whenever the corresponding data falls bellow its threshold.
DWELL EXTENSION
While in Safing mode, whenever the Arming signals is activated, Dwell Extension is used to extend the assertion time.
The Dwell Extension is disabled while in Diagnostic mode, - the Arming outputs could be activated for test.
While in Safing mode, If any of the 16 Sample Counters reach to their maximum value('11'b), the Arming outputs are asserted. They
will be continuously asserted as long as any of the Sample Counters contain '11'b. and additionally, plus the established Dwell Extension
time, after all Sample Counters contain values less than '11'b.
The Dwell Extension time is determined by the MSB (bit 7) of the safing threshold in which safing was met (i.e. the data exceeded the
threshold for three consecutive samples). The Dwell Extension time can be either 255 ms or 2.0 s, based on this bit assigned with the
safing threshold setting.
If safing is met on more than one Sequence ID with threshold(s) containing both 255 ms and 2.0 s Dwell Extension time choices, the
longer (2.0 s) Dwell Extension is used for the safing outputs, which means the longer Dwell Extension time will override the shorter one.
An example of Sample Counter, Dwell Extension time and Arming output is shown in Figure 62.
Safing Threshold
Sensor Magnitude
Sample Counter
0
1
2
0
1
2
3
0
ARM
DISARM
Dwell
Extension
Sample Times
Figure 62. Example of Safing Dwell Extension
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PACKAGING
PACKAGE MECHANICAL DIMENSIONS
PACKAGING
PACKAGE MECHANICAL DIMENSIONS
Package dimensions are provided in package drawings. To find the most current package outline drawing, go to www.freescale.com
and perform a keyword search for the drawing’s document number.
Table 40. Packaging Information
Package
Suffix
64-Pin LQFP-EP
AFE
Package Outline Drawing Number
98ASA10763D
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PACKAGING
PACKAGE MECHANICAL DIMENSIONS
33789
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PACKAGING
PACKAGE MECHANICAL DIMENSIONS
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PACKAGING
REVISION HISTORY
REVISION HISTORY
REVISION
DATE
DESCRIPTION OF CHANGES
1.0
2/2011
•
Initial Release
2.0
12/2011
•
•
•
Revised ESD Capability. Took Human Body Model - JESD22/A114(3) from 6.0 kV to 2.0 kV
Redefined INx Active Pull-down Current. Changed Max. from -50 to -30 µA
Added First Dominant bit Delay
3.0
4/2012
•
Updated datasheet to include SafeAssure branding and technology identification.
9/2014
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Removed MCZ33789AE from the ordering information
Added MCZ33789BAE to the ordering information
Updated IERSW_LEAK parameter in Table 5
Deleted IVDD parameter in Table 5
Updated VCC_UV parameter in Table 5
Updated ISAT_TH_OFS parameter Table 5
Updated ISAT_TH_HYST parameter Table 5
Corrected the parameter label for fBST/BUCK in Table 5
Added Note 16
Added FSEL bit in LIN_CONFIG register in Table 17
Added new table to explain FSEL bit function in Table 17
Corrected Figure 37
Corrected Table 18
Updated format and back page.
4.0
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Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any
and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be
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© 2014 Freescale Semiconductor, Inc.
Document Number: MC33789
Rev. 4.0
9/2014