Full Material Declaration for attached parts list Full Material Declaration for attached parts list Report generated: 26 February 2016, 07:54 GMT Diotec Semiconductor AG DUNS number: 330866844 -, Kreuzmattenstr. 4, Heitersheim, B.-W., 79423, Germany Declarations authorised by: Udo Steinebrunner, Product Manager, - Declaration effective from: 1 January 2004 [Approved on 30 January 2015, 15:09 GMT] Materials and substances Use/Location Chip (die) Die attach Encapsulation Leadfinish Leadframe Page 1 Material group Other inorganic materials Lead and Lead alloys EP (Epoxy resin) Tin plating Copper (e.g. copper amounts in cable harnesses) % w/w of material in the part 3.40000% 2.10000% 16.70000% 6.80000% 71.00000% Substances in the material CAS Number % w/w of substance in the material Nickel 7440-02-0 1.00000% Gold 7440-57-5 11.50000% Polydimethyl siloxane 63148-62-9 25.00000% Silicon 7440-21-3 62.50000% Silver 7440-22-4 2.50000% Tin 7440-31-5 5.00000% Lead 7439-92-1 92.50000% Carbon black 1333-86-4 0.30000% ANTIMONY TRIOXIDE 1309-64-4 0.80000% Tetrabromobisphenol A (TBBPA) 79-94-7 0.99000% Epoxy resin 89 26335-32-0 27.61000% Quartz sand 60676-86-0 70.30000% Copper 7440-50-8 0.80000% Silver 7440-22-4 3.70000% Tin 7440-31-5 95.50000% Nickel 8049-31-8 0.40000% Copper 7440-50-8 99.60000% Report generated: 26 February 2016, 07:54 GMT Full Material Declaration for attached parts list Attached parts list Part number Part name Part Mass Part Mass UoM DO-213AB/MELF Diode SMD 0.12 g Page 2 Report generated: 26 February 2016, 07:54 GMT