Full Material Declaration for attached parts list Full Material Declaration for attached parts list Report generated: 25 February 2016, 14:03 GMT Diotec Semiconductor AG DUNS number: 330866844 -, Kreuzmattenstr. 4, Heitersheim, B.-W., 79423, Germany Declarations authorised by: Udo Steinebrunner, Product Manager, - Declaration effective from: 1 May 2009 [Approved on 25 February 2016, 14:02 GMT] Materials and substances Use/Location Chip (die) Die attach Encapsulation Material group Other inorganic materials Lead and Lead alloys EP (Epoxy resin) % w/w of material in the part 0.20000% 0.10000% 23.30000% Substances in the material CAS Number % w/w of substance in the material Nickel 7440-02-0 0.90000% Gold 7440-57-5 10.30000% Polydimethyl siloxane 63148-62-9 25.30000% Silicon 7440-21-3 63.50000% Silver 7440-22-4 1.50000% Tin 7440-31-5 5.00000% Lead 7439-92-1 93.50000% Carbon black 1333-86-4 0.30000% ANTIMONY TRIOXIDE 1309-64-4 0.80000% Tetrabromobisphenol A (TBBPA) 79-94-7 0.99000% Epoxy resin 89 26335-32-0 27.61000% Quartz sand 60676-86-0 70.30000% Leadfinish Tin plating 2.40000% Tin 7440-31-5 100.00000% Leadframe Copper (e.g. copper amounts in cable harnesses) 74.00000% Copper 7440-50-8 100.00000% Attached parts list Part number Part name Part Mass Part Mass UoM ~DO-201 Diode axial 0.8 g Page 1 Report generated: 25 February 2016, 14:03 GMT