MDS

Full Material Declaration for attached parts list
Full Material Declaration for attached parts list
Report generated: 15 June 2016, 09:39 GMT
Diotec Semiconductor AG
DUNS number: 330866844
-, Kreuzmattenstr. 4, Heitersheim, B.-W., 79423, Germany
Declarations authorised by:
Udo Steinebrunner, Product Manager, -
Declaration effective from: 10 September 2010 [Approved on 15 June 2016, 09:36 GMT]
Materials and substances
Use/Location
Chip (die)
Die attach
Encapsulation
Material group
Other inorganic
materials
Sn-Pb solder
% w/w of
material in
the part
0.06000%
0.03000%
EP (Epoxy resin)
41.58000%
Substances in the
material
CAS Number
% w/w of
substance
in the
material
Nickel
7440-02-0
1.00000%
Gold
7440-57-5
11.50000%
Dow corning 3110
63394-02-5
25.00000%
Silicon
7440-21-3
62.50000%
Silver
7440-22-4
2.50000%
Tin
7440-31-5
5.00000%
Lead
7439-92-1
92.50000%
Carbon black
1333-86-4
0.30000%
ANTIMONY
TRIOXIDE
1309-64-4
0.80000%
Tetrabromobisphenol
A
79-94-7
0.99000%
Epoxy resin 89
26335-32-0
27.61000%
Quartz sand
60676-86-0
70.30000%
Leadfinish
Tin plating
0.48000%
Tin
7440-31-5
100.00000%
Leadframe
Copper (e.g. copper
amounts in cable
harnesses)
57.85000%
Copper
7440-50-8
100.00000%
Attached parts list
Part number
Part name
Part Mass
Part Mass UoM
TO-263AB
Diode/Transistor Power
1.8
g
Page 1
Report generated: 15 June 2016, 09:39 GMT