Plastic Packages for Integrated Circuits Quad Flat No-Lead Plastic Package (QFN) Micro Lead Frame Plastic Package (MLFP) L32.5x6C (One of 10 Packages in MDP0046) 32 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220) A MILLIMETERS D N (N-1) (N-2) B 1 2 3 SYMBOL MIN NOMINAL MAX NOTES A 0.80 0.90 1.00 - A1 0.00 0.02 0.05 - D PIN #1 I.D. MARK E 5.00 BSC - D2 3.50 REF - E 6.00 BSC - E2 (N/2) 2X 0.075 C 2X 0.075 C 0.35 b 0.23 - 0.40 0.45 - 0.25 0.27 - c 0.20 REF - e 0.50 BSC - N 32 REF 4 ND 7 REF 6 NE 9 REF 5 0.10 M C A B b Rev 1, 09/11 NOTES: (N-2) (N-1) N N LEADS TOP VIEW 4.50 REF L L 1. Dimensioning and tolerancing per ASME Y14.5M-1994. PIN #1 I.D. 2. Tiebar view shown is a non-functional feature. 3 1 2 3 3. Bottom-side pin #1 I.D. is a diepad chamfer as shown. 4. N is the total number of terminals on the device. 5. NE is the number of terminals on the “E” side of the package (or Y-direction). (E2) 6. ND is the number of terminals on the “D” side of the package (or X-direction). ND = (N/2)-NE. (N/2) NE 5 7. Inward end of terminal may be square or circular in shape with radius (b/2) as shown. 7 (D2) BOTTOM VIEW PACKAGE OUTLINE 1.0mm 0.45mm 0.5mm 0.10 C e 0.25mm C (c) SEATING PLANE 0.08 C N LEADS & EXPOSED PAD C 4.2mm 2 A 0.3mm (L) SEE DETAIL "X" A1 DETAIL X 3.2mm 0.45mm SIDE VIEW N LEADS TYPICAL RECOMMENDED LAND PATTERN 1