Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L40.5x5B
40 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 0, 5/10
4X 3.6
5.00
36X 0.40
A
B
40
31
6
PIN 1
INDEX AREA
6
PIN #1
INDEX AREA
1
5.00
30
3 .50
EXP. DAP
21
10
0.15
(4X)
20
TOP VIEW
11
40X 0.40 ± 0.10
4 40X 0.20
0.10 M C A B
BOTTOM VIEW
SEE DETAIL "X"
0.10 C
MAX 1.00
( 4. 80 TYP )
(
SEATING PLANE
0.08 C
( 36X 0.4)
SIDE VIEW
3.50 )
(40X 0.20)
C
0 . 2 REF
5
0 . 00 MIN.
0 . 05 MAX.
(40X 0.60)
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "X"
NOTES:
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to ASME Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.10
4.
Dimension applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5.
Tiebar shown (if present) is a non-functional feature.
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
7.
JEDEC reference drawing: MO220VHHE-1
either a mold or mark feature.
1
C