Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L40.5x5C
40 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 0, 8/10
4X 3.60
5.00
A
B
36X 0.40
6
PIN 1
INDEX AREA
5.00
6
PIN #1 INDEX AREA
(4X)
3.60 ±0.1
0.15
TOP VIEW
0.20
40X 0.4
b
0.10 M
C A B
BOTTOM VIEW
PACKAGE OUTLINE
0.40
1.0 MAX
SEE DETAIL “X”
// 0.10 C
C
BASE PLANE
SEATING PLANE
0.08 C
0.050
3.60
5.00
SIDE VIEW
(36X 0..40)
0.2 REF
C
5
0.00 MIN
0.05 MAX
(40X 0.20)
(40X 0.60)
DETAIL "X"
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal ± 0.05
4. Dimension applies to the metallized terminal and is measured
between 0.15mm and 0.27mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
1