Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L16.5x5B
16 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 2, 02/08
4X 2.4
5.00
12X 0.80
A
B
13
6
PIN 1
INDEX AREA
6
PIN #1 INDEX AREA
16
12
5.00
1
3 . 10 ± 0 . 15
9
(4X)
4
0.15
5
8
TOP VIEW
0.10 M C A B
+0.15
16X 0 . 60
-0.10
4 0.33 +0.07 / -0.05
BOTTOM VIEW
SEE DETAIL "X"
0.10 C
1.00 MAX
C
BASE PLANE
SEATING PLANE
0.08 C
( 4 . 6 TYP )
SIDE VIEW
(
( 12X 0 . 80 )
3 . 10 )
C
( 16X 0 .33 )
0 . 2 REF
5
( 16 X 0 . 8 )
0 . 00 MIN.
0 . 05 MAX.
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "X"
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal ± 0.05
4. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
1