505

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
DFN18 6x5, 0.5P
CASE 505−01
ISSUE D
18
DATE 17 NOV 2006
1
SCALE 2:1
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. DIMENSIONS IN MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
D
B
PIN 1 LOCATION
E
2X
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
0.15 C
2X
0.15 C
TOP VIEW
(A3)
0.10 C
A
18X
0.08 C
A1
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.18
0.30
6.00 BSC
3.98
4.28
5.00 BSC
2.98
3.28
0.50 BSC
0.20
−−−
0.45
0.65
C
SIDE VIEW
SEATING
PLANE
GENERIC
MARKING DIAGRAM*
D2
18X
18X
L
e
1
1
9
XXXXXXXX
XXXXXXXX
AWLYYWW
E2
K
18
10
b
0.10 C A B
18X
BOTTOM VIEW
0.05 C
NOTE 3
SOLDERING FOOTPRINT
5.30
18X
0.75
1
XXXXX
A
WL
YY
WW
G
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
0.50
PITCH
4.19
18X
0.30
3.24
DIMENSIONS: MILLIMETERS
DOCUMENT NUMBER:
98AON11920D
© Semiconductor Components
Industries,ON
LLC,SEMICONDUCTOR
2002
STATUS:
STANDARD
1
November, 2002 − Rev. 01A
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
http://onsemi.com
18 PIN DFN, 6X5 MM. 0.5 MM PITCH
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
Outline
Number:
versions are uncontrolled exceptCase
when
stamped
505
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON11920D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED TO PRODUCTION. REQ. BY P. CHAN
12 SEP 2002
A
MODIFIED SIDE VIEW TO 9 LEAD INSTEAD OF 8. REQ. BY P. CHAN
20 NOV 2002
B
CHANGED DIM b AND L. REMOVED DIM A3. CORRECTED MARKING DIAGRAM.
REQ. BY P. CELAYA.
29 JUN 2002
C
ADDED SOLDERING FOOTPRINT. REQ. BY S. CLARK.
31 MAY 2006
D
CORRECTED PITCH DIMENSION IN SOLDERING FOOTPRINT TO 0.50. REQ. BY
D. TRUHITTE.
17 NOV 2006
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
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© Semiconductor Components Industries, LLC, 2006
November, 2006 − Rev. 01D
Case Outline Number:
505
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