502-01

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
2
2
1
1
STYLE 1
STYLE 2
SOD−523
CASE 502−01
ISSUE E
SCALE 4:1
−X−
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS.
−Y−
E
M
2
X Y
DIM
A
b
c
D
E
HE
L
L2
TOP VIEW
A
c
HE
MILLIMETERS
MIN
NOM
MAX
0.50
0.60
0.70
0.25
0.30
0.35
0.07
0.14
0.20
1.10
1.20
1.30
0.70
0.80
0.90
1.50
1.60
1.70
0.30 REF
0.15
0.20
0.25
GENERIC
MARKING DIAGRAM*
SIDE VIEW
2X
XX
L
1
XX
2
1
STYLE 1
2X
XX
M
L2
RECOMMENDED
SOLDERING FOOTPRINT*
PACKAGE
OUTLINE
= Specific Device Code
Date Code
STYLE 1:
PIN 1. CATHODE (POLARITY BAND)
2. ANODE
1.80
0.48
2
STYLE 2
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
BOTTOM VIEW
2X
M
b
0.08
1
M
2X
DATE 28 SEP 2010
2X
STYLE 2:
NO POLARITY
0.40
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON11524D
© Semiconductor Components
Industries,ON
LLC,SEMICONDUCTOR
2002
STATUS:
May, 2002 − Rev. 01O
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
SOD−523
STANDARD
1
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
Outline
Number:
versions are uncontrolled exceptCase
when
stamped
502
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON11524D
PAGE 2 OF 2
ISSUE
REVISION
DATE
A
ADDED CATHODE BAND. REQ. BY M. DEWITT
07 JUL 2004
B
UPDATED FOOTPRINT AND MARKING. REQ. BY S. WEST.
21 FEB 2005
C
CREATED CATHODE AND NON−CATHODE BAND OPTIONS.
REQ. BY J. DAUGHERTY.
13 MAR 2007
D
CHANGED DIMENSION LABELS TO MATCH CURRENT STANDARDS. REQ. BY
D. TRUHITTE.
27 JAN 2009
E
ADDED BOTTOM VIEW/UPDATED SOLDER FOOTPRINT. REQ. BY D. TRUHITTE.
28 SEP 2010
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
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Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
© Semiconductor Components Industries, LLC, 2010
September, 2010 − Rev. 01E
Case Outline Number:
502
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